Cited By
View all- Taskin B(2013)Wireless on Networks-on-Chip2013 ACM/IEEE International Workshop on System Level Interconnect Prediction (SLIP)10.1109/SLIP.2013.6681675(1-2)Online publication date: Jun-2013
Electromagnetic interaction of on-chip antennas and CMOS metal layers for wireless IC interconnects
Authors: 
Ankit More, Baris TaskinAuthors Info & Claims
Ankit More, Baris TaskinAuthors Info & ClaimsPages 413 - 416
Abstract
The electromagnetic interaction of on-chip antennas and metal interconnects modeled in a 250 nm complementary metal-oxide semiconductor (CMOS) technology is investigated. A finite element method (FEM) based 3-D full-wave solver is used to perform the electromagnetic field analysis. It is shown that there can be significant signal coupling between the on-chip transmitting antenna and the metal interconnects on a die (-12.09 dB for a 1.6 mm long, 2 um wide interconnect at a distance of 1 um from the antenna). Design considerations for metal interconnects in the presence of on-chip antennas are presented in order to limit the undesirable electromagnetic coupling.
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Index Terms
- Electromagnetic interaction of on-chip antennas and CMOS metal layers for wireless IC interconnects
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Published In
May 2010
502 pages
ISBN:9781450300124
DOI:10.1145/1785481
- General Chairs:
- R. Iris Bahar,
- Fabrizio Lombardi,
- Program Chairs:
- David Atienza,
- Erik Brunvand
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Published: 16 May 2010
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View all- Taskin B(2013)Wireless on Networks-on-Chip2013 ACM/IEEE International Workshop on System Level Interconnect Prediction (SLIP)10.1109/SLIP.2013.6681675(1-2)Online publication date: Jun-2013
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