Cited By
View all- Clermidy F(2013)Reconfigurable architectures and emerging technologies2013 IEEE Faible Tension Faible Consommation10.1109/FTFC.2013.6577783(1-1)Online publication date: Jun-2013
Can we go towards true 3-D architectures?
Authors: 
Pierre-Emmanuel Gaillardon, Haykel Ben-Jamaa, Paul-Henry Morel, Jean-Philippe Noël, Fabien Clermidy, and Ian O'ConnorAuthors Info & Claims
Pierre-Emmanuel Gaillardon, Haykel Ben-Jamaa, Paul-Henry Morel, Jean-Philippe Noël, Fabien Clermidy, and Ian O'ConnorAuthors Info & ClaimsJune 2011
Pages 282 - 283
Abstract
Thanks to recent technology advances, the exploration of the vertical dimension has been shown to be more than a dream for designers. Among those technologies, the vertical transistor has not been exploited yet. This paper describes a novel implementation of logic gates fully benefiting of nanowire-based vertical transistors embedded within the metal lines. The logic design in this technology is explored and its performance is evaluated. A comparison made on an equivalent technology node shows that our cells reduce area and delay by a factor of 31x and 2x respectively. Large reconfigurable logic circuits have been benchmarked showing an improvement of area and delay by 46% and 48% on average.
References
[1]
G. Van der Plas et al., Design issues and considerations for low-cost 3D TSV IC technology, ISSCC, 2010.
[2]
M. Lin et al., Performance Benefits of Monolithically Stacked 3-D FPGA, IEEE TCAD, vol.26, no.2, 2007.
[3]
V. Renard et al., Catalyst preparation for CMOS-compatible silicon nanowire synthesis, Nature Nanotechnology, 2009.
[4]
J. Goldberger et al., Silicon Vertically Integrated Nanowire Field Effect Transistors, Nano Letters, Vol. 6, No 5, 2006.
[5]
K. Siozios et al., Exploring Alternative 3D FPGA Architectures: Design Methodology and CAD Tool Support, FPL, 2007.
Index Terms
- Can we go towards true 3-D architectures?
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Information & Contributors
Information
Published In
June 2011
1055 pages
ISBN:9781450306362
DOI:10.1145/2024724
- General Chair:
- Leon Stok,
- Program Chairs:
- Nikil Dutt,
- Soha Hassoun
Copyright © 2011 Authors.
Sponsors
- EDAC: Electronic Design Automation Consortium
- SIGDA: ACM Special Interest Group on Design Automation
- IEEE Council on Electronic Design Automation (CEDA)
Publisher
Association for Computing Machinery
New York, NY, United States
Publication History
Published: 05 June 2011
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- Research-article
Conference
DAC '11
Sponsor:
- EDAC
- SIGDA
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Overall Acceptance Rate 1,770 of 5,499 submissions, 32%
Upcoming Conference
DAC '25
- Sponsor:
- sigda
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Cited By
View all- Clermidy F(2013)Reconfigurable architectures and emerging technologies2013 IEEE Faible Tension Faible Consommation10.1109/FTFC.2013.6577783(1-1)Online publication date: Jun-2013
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