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High-impedance multi-conductor transmission-lines for integrated applications at millimeter-wave frequency

Published: 28 August 2017 Publication History
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  • Abstract

    This paper describes novel integrated transmission lines based on slotted-floating shield for ultra-wide band operation at millimeter-wave frequencies. The designed structures consist of two main conductors used for signal and ground, along with a floating conductor, which improves the performance of the line. The implemented designs increase the line-impedance and reduce the wavelength of the guided signal with respect to normal CPW and microstrip solutions, while retaining low propagation losses. Four different designs with different floating conductor geometries are realized and presented. All configurations aim at avoiding the penetration of the electromagnetic field into the process substrate and flow of return currents into the thinnest metals of the process. Both effects are known to be the main source of propagation losses for integrated transmission lines. Experimental demonstration is provided with the fabrication of test-structures in a 130 nm SiGe BiCMOS process. The simulation results have been validated against on-chip measurements, de-embedded with an Open-Short technique. Agreement between measurements and simulations is demonstrated in the frequency range of 1 GHz to 50 GHz. Simulations of the cross-section field-distribution are also shown, confirming the reduction of return currents into the lossy substrate. An increase in line impedance of 18% and 44% against conventional CPW and microstrip is measured for equal cross-section area and conductors width. At the same time, the propagation losses are lowered by 7% and 15%, and the slow-wave nature of the lines reduces the guided wavelength by 21% and 26% against the two conventional structures.

    References

    [1]
    A. Arbabian and A. M. Niknejad, "A tapered cascaded multi-stage distributed amplifier with 370GHz GBW in 90nm CMOS," Dig. Pap. - IEEE Radio Freq. Integr. Circuits Symp., pp. 57--60, 2008.
    [2]
    T. S. D. Cheung, J. R. Long, K. Vaed, R. Volant, A. Chinthakindi, C. M. Schnabel, J. Florkey, and K. Stein, "On-chip interconnect for mm-wave applications using an all-copper technology and wavelength reduction," Solid-State Circuits Conference, 2003. Digest of Technical Papers. ISSCC. 2003 IEEE International, pp. 396--501 vol.1, 2003.
    [3]
    G. Tretter, D. Fritsche, C. Carta, J. Leufker, and F. Ellinger, "Zero-Ohm transmission lines for millimetre-wave circuits in 28 nm digital CMOS," Electronics Letters, vol. 51, no. 11, pp. 845--847, 2015.
    [4]
    G. Ghione, "A CAD-Oriented Analytical Model for the Losses of General Asymmetric Coplanar Lines in Hybrid and Monolithic MICs," IEEE Trans. Microw. Theory Tech., vol. 41, no. 9, pp. 1499--1510, 1993.
    [5]
    B. Heinemann, R. Barth, D. Bolze, J. Drews, G. G. Fischer, A. Fox, O. Fursenko, T. Grabolla, U. Haak, D. Knoll, R. Kurps, M. Lisker, S. Marschmeyer, H. Ruecker, D. Schmidt, J. Schmidt, M. A. Schubert, B. Tillack, C. Wipf, D. Wolansky, and Y. Yamamoto, "SiGe HBT technology with fT/fmax of 300GHz/500GHz and 2.0 ps CML gate delay," Technical Digest - International Electron Devices Meeting, IEDM, pp. 688--691, 2010.
    [6]
    H. Ito and K. Masu, "A simple through-only de-embedding method for on-wafer S-parameter measurements up to 110 GHz," IEEE MTT-S International Microwave Symposium Digest, pp. 383--386, 2008.
    [7]
    A. Sayag, D. Ritter, and D. Goren, "Compact Modeling and Comparative Analysis of Silicon-Chip Slow-Wave Transmission Lines With Slotted Bottom Metal Ground Planes," IEEE Trans. Microw. Theory Tech., vol. 57, no. 4, pp. 840--847, 2009.
    [8]
    X. L. Tang, A. L. Franc, E. Pistono, A. Siligaris, P. Vincent, P. Ferrari, and J. M. Fournier, "Performance improvement versus CPW and loss distribution analysis of slow-wave CPW in 65 nm HR-SOI CMOS technology," IEEE Transactions on Electron Devices, vol. 59, no. 5, pp. 1279--1285, 2012.
    [9]
    A. L. Franc, E. Pistono, D. Gloria, and P. Ferrari, "High-performance shielded coplanar waveguides for the design of CMOS 60-GHz bandpass filters," IEEE Transactions on Electron Devices, vol.59, no. 5, pp. 1219--1226, 2012.
    [10]
    M. A. Najam, W. Zhigong, and L. Zhiqun, "A high performance slow-wave elevated microstrip line with slot-type floating shields," in 2015 Asia-Pacific Microwave Conference (APMC), vol. 1, pp. 1--3, 2015.
    [11]
    G. Belfiore, P. V. Testa, R. Henker, and F. Ellinger, "Design and measurements of 50 Ohm on-chip slow-wave conductor-backed coplanar transmission lines up to 220 GHz," SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference Proceedings, 2015.
    [12]
    L. F. Tiemeijer and R. J. Havens, "A calibrated lumped-element de-embedding technique for on-wafer RF characterization of high-quality inductors and high-speed transistors," IEEE Trans. Electron Devices, vol. 50, no. 3, pp. 822--829, 2003.

    Cited By

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    • (2021)A 130 nm-SiGe-BiCMOS Low-Power Receiver Based on Distributed Amplifier Techniques for Broadband Applications From 140 GHz to 200 GHzIEEE Open Journal of Circuits and Systems10.1109/OJCAS.2021.31036042(508-519)Online publication date: 2021
    • (2021)Semiconductor technologies for 5G implementation at millimeter wave frequencies – Design challenges and current state of workEngineering Science and Technology, an International Journal10.1016/j.jestch.2020.06.01224:1(205-217)Online publication date: Feb-2021
    • (2020)Synthetic Transmission Lines in Cutoff Operation for Wideband High-Impedance DC SuppliesIEEE Transactions on Circuits and Systems II: Express Briefs10.1109/TCSII.2020.3022159(1-1)Online publication date: 2020

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    Published In

    cover image ACM Conferences
    SBCCI '17: Proceedings of the 30th Symposium on Integrated Circuits and Systems Design: Chip on the Sands
    August 2017
    238 pages
    ISBN:9781450351065
    DOI:10.1145/3109984
    Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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    Publication History

    Published: 28 August 2017

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    Author Tags

    1. density fillers
    2. high-impedance transmission lines
    3. slow-wave transmission lines

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    • Research-article

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    • German Research Foundation (DFG)

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    SBCCI '17
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    SBCCI '17: 30th Symposium on Integrated Circuits and Systems Design
    August 28 - September 1, 2017
    Ceará, Fortaleza, Brazil

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    Overall Acceptance Rate 133 of 347 submissions, 38%

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    View all
    • (2021)A 130 nm-SiGe-BiCMOS Low-Power Receiver Based on Distributed Amplifier Techniques for Broadband Applications From 140 GHz to 200 GHzIEEE Open Journal of Circuits and Systems10.1109/OJCAS.2021.31036042(508-519)Online publication date: 2021
    • (2021)Semiconductor technologies for 5G implementation at millimeter wave frequencies – Design challenges and current state of workEngineering Science and Technology, an International Journal10.1016/j.jestch.2020.06.01224:1(205-217)Online publication date: Feb-2021
    • (2020)Synthetic Transmission Lines in Cutoff Operation for Wideband High-Impedance DC SuppliesIEEE Transactions on Circuits and Systems II: Express Briefs10.1109/TCSII.2020.3022159(1-1)Online publication date: 2020

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