research-article

App-Oriented Thermal Management of Mobile Devices

Authors:

Hojung ChaAuthors Info & Claims

ISLPED '18: Proceedings of the International Symposium on Low Power Electronics and Design

Article No.: 36, Pages 1 - 6

https://doi.org/10.1145/3218603.3218622

Published: 23 July 2018 Publication History

Abstract

The thermal issue for mobile devices becomes critical as the devices' performance increases to handle complicated applications. Conventional thermal management limits the performance of the entire device, degrading the quality of both foreground and background applications. This is not desirable because the quality of the foreground application, i.e., the frames per second (FPS), is directly affected, whereas users are generally not aware of the performance of background applications. In this paper, we propose an app-oriented thermal management scheme that specifically restricts background applications to preserve the FPS of foreground applications. For efficient thermal management, we developed a model that predicts the heat contribution of individual applications based on hardware utilization. The proposed system gradually limits system resources for each background application according to its heat contribution. The scheme was implemented on a Galaxy S8+ smartphone, and its usefulness was validated with a thorough evaluation.

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Cited By

Pramanik PPal SChoudhury P(2023)Mobile crowd computing: potential, architecture, requirements, challenges, and applicationsThe Journal of Supercomputing10.1007/s11227-023-05545-080:2(2223-2318)Online publication date: 29-Jul-2023
https://doi.org/10.1007/s11227-023-05545-0
Bandyopadhyay SWeibel J(2022)Performance Optimization by Adaptive Control of Material Properties in Portable Electronic DevicesIEEE Transactions on Components, Packaging and Manufacturing Technology10.1109/TCPMT.2022.322534312:11(1799-1805)Online publication date: Nov-2022
https://doi.org/10.1109/TCPMT.2022.3225343
Hernández-Almudi PSuárez DMontijano EMerino J(2021)Control inteligente mediante escalado dinámico voltaje-frecuencia (DVFS) de la temperatura en procesadores embebidosRevista Iberoamericana de Automática e Informática industrial10.4995/riai.2021.1420018:4(396)Online publication date: 30-Sep-2021
https://doi.org/10.4995/riai.2021.14200
Show More Cited By

Index Terms

App-Oriented Thermal Management of Mobile Devices
1. Computer systems organization
  1. Dependable and fault-tolerant systems and networks
    1. Reliability
  2. Embedded and cyber-physical systems
    1. Embedded systems
      1. Embedded software

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Published In

cover image ACM Conferences

ISLPED '18: Proceedings of the International Symposium on Low Power Electronics and Design

July 2018

327 pages

ISBN:9781450357043

DOI:10.1145/3218603

Copyright © 2018 ACM.

Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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New York, NY, United States

Publication History

Published: 23 July 2018

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ISLPED '18

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SIGDA

ISLPED '18: International Symposium on Low Power Electronics and Design

July 23 - 25, 2018

WA, Seattle, USA

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Overall Acceptance Rate 398 of 1,159 submissions, 34%

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Cited By

Pramanik PPal SChoudhury P(2023)Mobile crowd computing: potential, architecture, requirements, challenges, and applicationsThe Journal of Supercomputing10.1007/s11227-023-05545-080:2(2223-2318)Online publication date: 29-Jul-2023
https://doi.org/10.1007/s11227-023-05545-0
Bandyopadhyay SWeibel J(2022)Performance Optimization by Adaptive Control of Material Properties in Portable Electronic DevicesIEEE Transactions on Components, Packaging and Manufacturing Technology10.1109/TCPMT.2022.322534312:11(1799-1805)Online publication date: Nov-2022
https://doi.org/10.1109/TCPMT.2022.3225343
Hernández-Almudi PSuárez DMontijano EMerino J(2021)Control inteligente mediante escalado dinámico voltaje-frecuencia (DVFS) de la temperatura en procesadores embebidosRevista Iberoamericana de Automática e Informática industrial10.4995/riai.2021.1420018:4(396)Online publication date: 30-Sep-2021
https://doi.org/10.4995/riai.2021.14200
Zhang XVadodaria HLi NKang KLiu Y(2020)A Smartphone Thermal Temperature Analysis for Virtual and Augmented Reality2020 IEEE International Conference on Artificial Intelligence and Virtual Reality (AIVR)10.1109/AIVR50618.2020.00061(301-306)Online publication date: Dec-2020
https://doi.org/10.1109/AIVR50618.2020.00061
Kang SChoi HPark SPark CLee JLee ULee SAgarwal SGreenstein BBalasubramanian AGollakota SZhang X(2019)Fire in Your HandsThe 25th Annual International Conference on Mobile Computing and Networking10.1145/3300061.3300128(1-16)Online publication date: 5-Aug-2019
https://dl.acm.org/doi/10.1145/3300061.3300128

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