research-article

Sensock: 3D Foot Reconstruction with Flexible Sensors

Authors:

Yong MaAuthors Info & Claims

CHI '20: Proceedings of the 2020 CHI Conference on Human Factors in Computing Systems

Pages 1 - 13

https://doi.org/10.1145/3313831.3376387

Published: 23 April 2020 Publication History

Abstract

Capturing 3D foot models is important for applications such as manufacturing customized shoes and creating clubfoot orthotics. In this paper, we propose a novel prototype, Sensock, to offer a fully wearable solution for the task of 3D foot reconstruction. The prototype consists of four soft stretchable sensors, made from silk fibroin yarn. We identify four characteristic foot girths based on the existing knowledge of foot anatomy, and measure their lengths with the resistance value of the stretchable sensors. A learning-based model is trained offline and maps the foot girths to the corresponding 3D foot shapes. We compare our method with existing solutions using red-green-blue (RGB) or RGBD (RGB-depth) cameras, and show the advantages of our method in terms of both efficiency and accuracy. In the user experiment, we find that the relative error of Sensock is lower than 0.55%. It performs consistently across different trials and is considered comfortable and suitable for long-term wearing.

Supplementary Material

ZIP File (paper260aux.zip)

The zip file contains three file. Each line of the file resistance value-stretch length.xlsx represents the resistance value at current length. The origin sensor length is 10cm. The file 2000 cycles of stretching.xlsx represents resistance values at different stretching. The result shows the resistance of the sensor is changed a little after 2000 cycles of stretching. The file circuit board design.PNG is the schematic of circuit board.

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Cited By

Ying EXiong TZhu GQiu MQin YGuo S(2024)WristSketcher: Creating 2D Dynamic Sketches in AR With a Sensing WristbandInternational Journal of Human–Computer Interaction10.1080/10447318.2024.2301857(1-17)Online publication date: 22-Jan-2024
https://doi.org/10.1080/10447318.2024.2301857
Wang KXu XZheng YZhou DGuo SQin YGuo X(2023)Computational Design of Wiring Layout on Tight Suits with Minimal Motion ResistanceSIGGRAPH Asia 2023 Conference Papers10.1145/3610548.3618200(1-12)Online publication date: 10-Dec-2023
https://dl.acm.org/doi/10.1145/3610548.3618200
Zhou ZChen PLu YCui QPan DLiu YLi JZhang YTao YLiu XSun LWang G(2023)3D Deformation Capture via a Configurable Self-Sensing IMU Sensor NetworkProceedings of the ACM on Interactive, Mobile, Wearable and Ubiquitous Technologies10.1145/35808747:1(1-24)Online publication date: 28-Mar-2023
https://dl.acm.org/doi/10.1145/3580874
Show More Cited By

Index Terms

Sensock: 3D Foot Reconstruction with Flexible Sensors
1. Hardware
  1. Communication hardware, interfaces and storage
    1. Sensor applications and deployments
    2. Sensor devices and platforms

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cover image ACM Conferences

CHI '20: Proceedings of the 2020 CHI Conference on Human Factors in Computing Systems

April 2020

10688 pages

ISBN:9781450367080

DOI:10.1145/3313831

General Chairs:
Regina Bernhaupt
Eindhoven University of Technology, Netherlands
,
Florian 'Floyd' Mueller
Monash University, Australia
,
David Verweij
Newcastle University, UK
,
Josh Andres
RMIT, Australia
,
Program Chairs:
Joanna McGrenere
University of British Columbia, Canada
,
Andy Cockburn
University of Canterbury, New Zealand
,
Ignacio Avellino
University of Maryland Baltimore County, USA
,
Alix Goguey
Grenoble Alpes University, France
,
Pernille Bjørn
University of Copenhagen, Denmark
,
Shengdong (Shen) Zhao
National University of Singapore, Singapore
,
Briane Paul Samson
Future University Hakodate, Japan & De La Salle University, Philippines
,
Rafal Kocielnik
University of Washington, USA

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Published: 23 April 2020

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the Fundamental Research Funds for the Central Universities
National Natural Science Foundation of China
Open Project Program of the State Key Lab of CAD&CG

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CHI '20

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CHI '20: CHI Conference on Human Factors in Computing Systems

April 25 - 30, 2020

HI, Honolulu, USA

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Overall Acceptance Rate 6,199 of 26,314 submissions, 24%

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Cited By

Ying EXiong TZhu GQiu MQin YGuo S(2024)WristSketcher: Creating 2D Dynamic Sketches in AR With a Sensing WristbandInternational Journal of Human–Computer Interaction10.1080/10447318.2024.2301857(1-17)Online publication date: 22-Jan-2024
https://doi.org/10.1080/10447318.2024.2301857
Wang KXu XZheng YZhou DGuo SQin YGuo X(2023)Computational Design of Wiring Layout on Tight Suits with Minimal Motion ResistanceSIGGRAPH Asia 2023 Conference Papers10.1145/3610548.3618200(1-12)Online publication date: 10-Dec-2023
https://dl.acm.org/doi/10.1145/3610548.3618200
Zhou ZChen PLu YCui QPan DLiu YLi JZhang YTao YLiu XSun LWang G(2023)3D Deformation Capture via a Configurable Self-Sensing IMU Sensor NetworkProceedings of the ACM on Interactive, Mobile, Wearable and Ubiquitous Technologies10.1145/35808747:1(1-24)Online publication date: 28-Mar-2023
https://dl.acm.org/doi/10.1145/3580874
Wang HFeng ZYang XZhou LTian JGuo Q(2023)MRLab: Virtual-Reality Fusion Smart Laboratory Based on Multimodal FusionInternational Journal of Human–Computer Interaction10.1080/10447318.2023.2227823(1-14)Online publication date: 4-Jul-2023
https://doi.org/10.1080/10447318.2023.2227823
Shilov LShanshin SRomanov AFedotova AKurtukova AKostyuchenko ESidorov I(2021)Reconstruction of a 3D Human Foot Shape Model Based on a Video Stream Using Photogrammetry and Deep Neural NetworksFuture Internet10.3390/fi1312031513:12(315)Online publication date: 14-Dec-2021
https://doi.org/10.3390/fi13120315
Albaugh LMcCann JHudson SYao LKitamura YQuigley AIsbister KIgarashi TBjørn PDrucker S(2021)Engineering Multifunctional Spacer Fabrics Through Machine KnittingProceedings of the 2021 CHI Conference on Human Factors in Computing Systems10.1145/3411764.3445564(1-12)Online publication date: 6-May-2021
https://dl.acm.org/doi/10.1145/3411764.3445564
Li SRen TZhan L(2021)A novel method for making a one-piece tight-fitting garment2021 IEEE International Conference on Power Electronics, Computer Applications (ICPECA)10.1109/ICPECA51329.2021.9362580(296-299)Online publication date: 22-Jan-2021
https://doi.org/10.1109/ICPECA51329.2021.9362580

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