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Terahertz to bits and bits to terahertz: universally programmable chip-scale terahertz systems

Published: 07 October 2020 Publication History

Abstract

The high millimeter-Wave and Terahertz spectrum above 100 GHz will form the underpinning of a broad set of game-changing future technology including high resolution sensing, imaging, robotics, autonomous systems, and wireless communication. In the last decade, we have seen a tremendous surge in efforts towards enabling chip-scale technology to address signal generation and detection in the THz spectrum. However, there lie several fundamental challenges to translate these efforts into versatile technology that can operate in complex environments that requires properties such as dynamic reconfigurability and rapid adaptability. In this paper, we highlight a new design space that emerges by eliminating the classical block-by-bock design approach. The fundamental principle behind this approach is that the unique wavelength scale at THz (of the order of millimeter/sub-millimeter) is comparable to a typical chip dimension. This wavelength/chip dimension equivalence allows the chip to operate in a new electromagnetic (EM) regime with novel scattering and radiating properties, while the integrated active devices have the ability to actively synthesize, manipulate and sense THz EM fields at sub-wavelength scales. This approach opens up the a new design space that can break many of the trade-offs in the classical design regime. In this paper, we provide design examples that aims towards the ultimate programmable THz sensor/source in silicon-based chips that range from fully integrated chip-scale THz spectroscopes to programmable THz sensors, sources and spatio-temporal modulated arrays for physical layer security. These design examples serve to illustrate the unique opportunities enabled through such a holistic design approach.

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Cited By

View all
  • (2021)Electromagnetic-Circuit Co-design approach towards Reconfigurable Terahertz Holographic CMOS Metasurface2021 Fifteenth International Congress on Artificial Materials for Novel Wave Phenomena (Metamaterials)10.1109/Metamaterials52332.2021.9577177(448-450)Online publication date: 20-Sep-2021
  • (2021)Reconfigurable Multifunctional Terahertz Holographic Metasurface using CMOS Chip Tiling2021 IEEE 19th International Symposium on Antenna Technology and Applied Electromagnetics (ANTEM)10.1109/ANTEM51107.2021.9518737(1-3)Online publication date: 8-Aug-2021

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      cover image ACM Other conferences
      NanoCom '20: Proceedings of the 7th ACM International Conference on Nanoscale Computing and Communication
      September 2020
      142 pages
      ISBN:9781450380836
      DOI:10.1145/3411295
      Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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      Published: 07 October 2020

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      Author Tags

      1. 5G
      2. 6G
      3. MIMO
      4. imaging
      5. millimeter-wave
      6. phased arrays
      7. security
      8. sensor
      9. spectroscopy
      10. terahertz
      11. wireless communication

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      NanoCom '20 Paper Acceptance Rate 24 of 24 submissions, 100%;
      Overall Acceptance Rate 97 of 135 submissions, 72%

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      • (2021)Electromagnetic-Circuit Co-design approach towards Reconfigurable Terahertz Holographic CMOS Metasurface2021 Fifteenth International Congress on Artificial Materials for Novel Wave Phenomena (Metamaterials)10.1109/Metamaterials52332.2021.9577177(448-450)Online publication date: 20-Sep-2021
      • (2021)Reconfigurable Multifunctional Terahertz Holographic Metasurface using CMOS Chip Tiling2021 IEEE 19th International Symposium on Antenna Technology and Applied Electromagnetics (ANTEM)10.1109/ANTEM51107.2021.9518737(1-3)Online publication date: 8-Aug-2021

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