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Demonstration of CoilCAM: an Action-Oriented Toolpath Programming System for Clay 3D Printing

Published: 19 April 2023 Publication History

Abstract

Clay 3D printing provides the benefits of digital fabrication automation and reconfigurability through a method that evokes manual clay coiling. Existing design technologies for clay 3D printing reflect the general 3D printing workflow in which solid forms are designed in CAD and then converted to a toolpath. In contrast, in hand-coiling, form is determined by the actions taken by the artist’s hands through space in response to the material. We theorized that an action-oriented approach for clay 3D printing could allow creators to design digital fabrication toolpaths that reflect clay material properties. We present CoilCAM, a domain-specific CAM programming system that supports the integrated generation of parametric forms and surface textures through mathematically defined toolpath operations.

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  1. Demonstration of CoilCAM: an Action-Oriented Toolpath Programming System for Clay 3D Printing

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    cover image ACM Conferences
    CHI EA '23: Extended Abstracts of the 2023 CHI Conference on Human Factors in Computing Systems
    April 2023
    3914 pages
    ISBN:9781450394222
    DOI:10.1145/3544549
    Permission to make digital or hard copies of part or all of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for third-party components of this work must be honored. For all other uses, contact the Owner/Author.

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    New York, NY, United States

    Publication History

    Published: 19 April 2023

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    Author Tags

    1. Artist Residency
    2. Clay 3D Printing
    3. Computer-Aided Machining
    4. Digital Fabrication

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    • Demonstration
    • Research
    • Refereed limited

    Funding Sources

    • NSF IIS Human-Centered Computing Program
    • NSF IIS Future of Work at the Human-Technology Frontier Program

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    CHI '23
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    Overall Acceptance Rate 6,164 of 23,696 submissions, 26%

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    CHI 2025
    ACM CHI Conference on Human Factors in Computing Systems
    April 26 - May 1, 2025
    Yokohama , Japan

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