Work in Progress

MakeDevice: Evolving Devices Beyond the Prototype with Jacdac

Authors:

Peli De Halleux,

Gabriele D'AmoneAuthors Info & Claims

TEI '23: Proceedings of the Seventeenth International Conference on Tangible, Embedded, and Embodied Interaction

Article No.: 37, Pages 1 - 7

https://doi.org/10.1145/3569009.3573106

Published: 26 February 2023 Publication History

Abstract

Embedded devices are now commonplace, and hardware prototyping toolkits have become a popular approach for hobbyists and professionals to create embedded hardware prototypes. However, moving from prototype into small scale manufacture use introduces complexity and cost, restricting embedded device development ’beyond the prototype’. Challenges include the need to design custom PCB for manufacture, and the design and fabrication of a device enclosure to ensure the robust enough for deployment. In response, we present MakeDevice : a web-based tool that leverages an existing modular hardware prototyping platform, Jacdac, to enable low-complexity route to generate a custom ‘carrier’ PCB upon which modules can be mounted and electrically connected. MakeDevice also automatically generates CAD files for custom enclosures with apertures to suit. We show how such enclosures can be generated using 3D printing and 2D stencils. In this way, MakeDevice lowers the barriers in moving from prototype to viable low-volume deployment of embedded hardware.

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Cited By

Devine JHodges SBall TMoskal Mde Halleux PD'Amone GGakure DFinney JUnderwood LHartley KOppenheim MKos P(2024)Plug-and-Play Physical Computing and Device Prototyping with JacdacGetMobile: Mobile Computing and Communications10.1145/3686138.368614928:2(38-43)Online publication date: 31-Jul-2024
https://dl.acm.org/doi/10.1145/3686138.3686149

Index Terms

MakeDevice: Evolving Devices Beyond the Prototype with Jacdac
1. Hardware
  1. Electronic design automation
    1. Methodologies for EDA
      1. Software tools for EDA
  2. Printed circuit boards
    1. PCB design and layout
2. Human-centered computing
  1. Human computer interaction (HCI)
    1. Interactive systems and tools
      1. User interface management systems

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cover image ACM Conferences

TEI '23: Proceedings of the Seventeenth International Conference on Tangible, Embedded, and Embodied Interaction

February 2023

709 pages

ISBN:9781450399777

DOI:10.1145/3569009

Copyright © 2023 Owner/Author.

Permission to make digital or hard copies of part or all of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for third-party components of this work must be honored. For all other uses, contact the Owner/Author.

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SIGCHI: ACM Special Interest Group on Computer-Human Interaction

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Association for Computing Machinery

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Publication History

Published: 26 February 2023

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Engineering and Physical Sciences Research Council

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TEI '23

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TEI '23: Seventeenth International Conference on Tangible, Embedded, and Embodied Interaction

February 26 - March 1, 2023

Warsaw, Poland

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Overall Acceptance Rate 393 of 1,367 submissions, 29%

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Cited By

Devine JHodges SBall TMoskal Mde Halleux PD'Amone GGakure DFinney JUnderwood LHartley KOppenheim MKos P(2024)Plug-and-Play Physical Computing and Device Prototyping with JacdacGetMobile: Mobile Computing and Communications10.1145/3686138.368614928:2(38-43)Online publication date: 31-Jul-2024
https://dl.acm.org/doi/10.1145/3686138.3686149

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