Demo: An Educational Platform to Learn Radio Frequency Wireless Communication
Pages 600 - 601
Abstract
Obtaining hands-on experience with wireless communication can be challenging due to the limited configurability of most commercial off-the-shelf transceivers. We present a low-cost and open-source educational platform designed to help students experiment and investigate wireless concepts through real-world testing. Our platform provides students with the ability to control the physical-layer configuration, design and implement their backscatter system, and conduct link quality experiments to investigate the resulting system performance. This platform offers students a unique opportunity to gain practical experience and deepen their understanding of wireless communication, while also providing a valuable tool for researchers and educators in the field.
References
[1]
Bryce Kellogg et al. 2016. Passive Wi-Fi: Bringing low power to Wi-Fi transmissions. In 13th USENIX Symposium on Networked Systems Design and Implementation.
[2]
Vincent Liu et al. 2013. Ambient Backscatter: Wireless Communication out of Thin Air. ACM SIGCOMM computer communication review.
[3]
Ambuj Varshney et al. 2017. LoRea: A backscatter architecture that achieves a long communication range. In Proceedings of the 15th ACM Conference on Embedded Network Sensor Systems. ACM.
Index Terms
- Demo: An Educational Platform to Learn Radio Frequency Wireless Communication
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Information & Contributors
Information
Published In
June 2023
651 pages
ISBN:9798400701108
DOI:10.1145/3581791
- General Chairs:
- Petteri Nurmi,
- Pan Hui,
- Program Chairs:
- Ardalan Amiri Sani,
- Yunxin Liu
Copyright © 2023 Owner/Author(s).
Permission to make digital or hard copies of part or all of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for third-party components of this work must be honored. For all other uses, contact the owner/author(s).
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In-Cooperation
Publisher
Association for Computing Machinery
New York, NY, United States
Publication History
Published: 18 June 2023
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Author Tags
Qualifiers
- Demonstration
Conference
MobiSys '23
Sponsor:
MobiSys '23: 21st Annual International Conference on Mobile Systems, Applications and Services
June 18 - 22, 2023
Helsinki, Finland
Acceptance Rates
MobiSys '23 Paper Acceptance Rate 41 of 198 submissions, 21%;
Overall Acceptance Rate 274 of 1,679 submissions, 16%
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