poster

3D Human Pose Estimation Using Ultra-low Resolution Thermal Images

Authors:

Tatsuki Arai,

Mariko Isogawa,

Kuniharu Sakurada,

Maki SugimotoAuthors Info & Claims

SA '24: SIGGRAPH Asia 2024 Posters

Article No.: 53, Pages 1 - 2

https://doi.org/10.1145/3681756.3697916

Published: 02 December 2024 Publication History

Get Access

Abstract

Can we estimate 3D human pose from ultra-low resolution thermal images (e.g., 8 × 8 pixels)? This study explores this possibility. Thermal images capture radiation intensity, minimizing personal information exposure, and are commonly used in devices like air conditioners. We propose a framework that uses 8 × 8 thermal images for 3D human pose estimation, enhancing privacy and efficiency. To overcome challenges from subject and ambient temperature variations, we employ adversarial learning with discriminators for subject and temperature, ensuring robust and invariant feature extraction.

Supplemental Material

MP4 File

"Appendix and inference result video demonstrating the 3D human pose estimation process from ultra-low resolution thermal images. The appendix provides additional details on the methodology while the video showcases real-time inference results."

Download
15.56 MB

PDF File

Download
219.01 KB

References

[1]

I-Chien Chen, Chang-Jen Wang, Chao-Kai Wen, and Shiow-Jyu Tzou. 2020. Multi-Person Pose Estimation Using Thermal Images. IEEE Access 8 (2020), 174964–174971.

Crossref

Google Scholar

[2]

Yiming Wang, Lingchao Guo, Zhaoming Lu, Xiangming Wen, Shuang Zhou, and Wanyu Meng. 2021. From Point to Space: 3D Moving Human Pose Estimation Using Commodity WiFi. IEEE Communications Letters 25, 7 (2021), 2235–2239.

Crossref

Google Scholar

[3]

Cunyi Yin, Xiren Miao, Jing Chen, Hao Jiang, Deying Chen, Yixuan Tong, and Shaocong Zheng. 2023. Human Activity Recognition With Low-Resolution Infrared Array Sensor Using Semi-Supervised Cross-Domain Neural Networks for Indoor Environment. IEEE Internet of Things Journal 10, 13 (2023), 11761–11772.

Crossref

Google Scholar

Index Terms

3D Human Pose Estimation Using Ultra-low Resolution Thermal Images
1. Computing methodologies
  1. Artificial intelligence
    1. Computer vision
      1. Computer vision problems
        Object detection
      2. Computer vision tasks
        Scene understanding
  2. Computer graphics
    1. Image manipulation
      1. Image processing
2. Security and privacy
  1. Security services
    1. Authentication
      1. Biometrics

Recommendations

A Human Thermal Comfort Level Estimating Method Using Thermal Image and Sensor Data
iiWAS2021: The 23rd International Conference on Information Integration and Web Intelligence

Recently, it has become a trend to construct a thermal environment with human thermal comfort. The advantage of human thermal comfort is that we could adjust the environment through the thermal sensation of human. Since human thermal comfort is ...
Hybrid 3D-IC Cooling System Using Micro-fluidic Cooling and Thermal TSVs
ISVLSI '12: Proceedings of the 2012 IEEE Computer Society Annual Symposium on VLSI

3D-ICs bring about new challenges to chip thermal management due to their high heat densities. Micro-channel based liquid cooling and thermal through-silicon-vias (TSVs) have been adopted to alleviate the thermal issues in 3D-ICs. Thermal TSV (which ...
Thermal shock modeling of Ultra-High Temperature Ceramics under active cooling

Thermal shock resistance is one of the most important parameters in Ultra-High Temperature Ceramics (UHTCs) since it determines their performance in various applications. In this paper, due to the fact that the material parameters of UHTCs are very ...

Comments

Information & Contributors

Information

Published In

SA '24: SIGGRAPH Asia 2024 Posters

December 2024

260 pages

ISBN:9798400711381

DOI:10.1145/3681756

Permission to make digital or hard copies of part or all of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for third-party components of this work must be honored. For all other uses, contact the owner/author(s).

Publisher

Association for Computing Machinery

New York, NY, United States

Publication History

Published: 02 December 2024

Check for updates

Qualifiers

Poster

Funding Sources

JST PRESTO

Conference

SA '24

Sponsor:

SIGGRAPH

SA '24: SIGGRAPH Asia 2024 Posters

December 3 - 6, 2024

Tokyo, Japan

Acceptance Rates

Overall Acceptance Rate 178 of 869 submissions, 20%

Contributors

Other Metrics

View Article Metrics

Bibliometrics & Citations

Bibliometrics

Article Metrics

0
Total Citations
169
Total Downloads

Downloads (Last 12 months)169
Downloads (Last 6 weeks)9

Reflects downloads up to 25 Feb 2025

Other Metrics

View Author Metrics

Citations

View Options

Login options

Check if you have access through your login credentials or your institution to get full access on this article.

Full Access

Get this Publication

View options

PDF

View or Download as a PDF file.

PDF

eReader

View online with eReader.

eReader

Full Text

View this article in Full Text.

Full Text

HTML Format

View this article in HTML Format.

HTML Format

Abstract

Supplemental Material

References

Index Terms

Recommendations

A Human Thermal Comfort Level Estimating Method Using Thermal Image and Sensor Data

Hybrid 3D-IC Cooling System Using Micro-fluidic Cooling and Thermal TSVs

Thermal shock modeling of Ultra-High Temperature Ceramics under active cooling

Comments

Information

Published In

Sponsors

Publisher

Publication History

Check for updates

Qualifiers

Funding Sources

Conference

Acceptance Rates

Contributors

Other Metrics

Bibliometrics

Article Metrics

Other Metrics

Citations

Login options

Full Access

View options

PDF

eReader

Full Text

HTML Format

Share

Share this Publication link

Share on social media

Affiliations