Prediction of interconnect adjacency distribution: derivation, validation, and applications
Abstract
References
Index Terms
- Prediction of interconnect adjacency distribution: derivation, validation, and applications
Recommendations
Prediction of interconnect pattern density distribution: derivation, validation, and applications
SLIP '03: Proceedings of the 2003 international workshop on System-level interconnect predictionA rigorous derivation of the interconnect pattern density distribution for random logic networks is presented using the Bernoulli probability distribution. The derived analytical model provides a statistical interconnect pattern density distribution for ...
Interconnect Slew Metric Using Nakagami-M Distribution
ICETET '08: Proceedings of the 2008 First International Conference on Emerging Trends in Engineering and TechnologySlew rate determines the ability of a device to handle the varying signals. Determination of the slew rate to a good proximity is thus essential for efficient design of high speed CMOS integrated circuits. This in turn reduces the output switching ...
Through-silicon-via aware interconnect prediction and optimization for 3D stacked ICs
SLIP '09: Proceedings of the 11th international workshop on System level interconnect predictionIndividual dies in 3D integrated circuits are connected using through-silicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power overhead. However, the effects of TSV overheads have not been studied ...
Comments
Information & Contributors
Information
Published In
Sponsors
Publisher
Association for Computing Machinery
New York, NY, United States
Publication History
Check for updates
Author Tags
Qualifiers
- Article
Conference
Acceptance Rates
Contributors
Other Metrics
Bibliometrics & Citations
Bibliometrics
Article Metrics
- 0Total Citations
- 269Total Downloads
- Downloads (Last 12 months)3
- Downloads (Last 6 weeks)0
Other Metrics
Citations
View Options
Get Access
Login options
Check if you have access through your login credentials or your institution to get full access on this article.
Sign in