Recent Progress on Photoacoustic Imaging Enhanced with Microelectromechanical Systems (MEMS) Technologies
Abstract
:1. Introduction
2. Conventional Silicon MEMS Scanning Mirror for PAI
2.1. First Generation PAI System Based on MEMS Scanning Mirror
2.2. Recent Advances in PAI System Based on MEMS Scanning Mirror
3. Water Immersible MEMS Scanning Mirror for PAI
3.1. 1-Axis Water Immersible MEMS Scanning Mirror
3.2. 2-Axis Water Immersible MEMS Scanning Mirror
4. Micromachined US Detector for PAI
4.1. Micromachined US Transducers (MUTs)
4.2. Microring Resonators (MRRs)
4.3. Micromachined Silicon Acoustic Delay Lines and Multiplexer
5. Conclusions
Author Contributions
Funding
Conflicts of Interest
References
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Scanning Methods | System Size | Imaging Speed (B-Scan Rate) | FOV | SNR | Ref. |
---|---|---|---|---|---|
Mechanical Scanning | Bulky (>300 mm) | 1 Hz | >10 mm | +++ | [12] |
Optical Scanning | Bulky (>200 mm) | 100 Hz | <8 mm | + | [39] |
Silicon MEMS Mirror | Small (<30 mm) | 500 Hz | <3 mm | ++ | [67] |
Water immersible MEMS Mirror | Medium (<100 mm) | 1 axis: 400 Hz 2 axis: 50 Hz | <3 mm <9 mm | +++ | [75,78] |
Handheld PAI Probe | Small (<30 mm) | 35 Hz | <2 mm | +++ | [81] |
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Lee, C.; Kim, J.Y.; Kim, C. Recent Progress on Photoacoustic Imaging Enhanced with Microelectromechanical Systems (MEMS) Technologies. Micromachines 2018, 9, 584. https://doi.org/10.3390/mi9110584
Lee C, Kim JY, Kim C. Recent Progress on Photoacoustic Imaging Enhanced with Microelectromechanical Systems (MEMS) Technologies. Micromachines. 2018; 9(11):584. https://doi.org/10.3390/mi9110584
Chicago/Turabian StyleLee, Changho, Jin Young Kim, and Chulhong Kim. 2018. "Recent Progress on Photoacoustic Imaging Enhanced with Microelectromechanical Systems (MEMS) Technologies" Micromachines 9, no. 11: 584. https://doi.org/10.3390/mi9110584