Abstract: An innovative 3D stackable wing-shaped Via RRAM is firstly proposed, featuring logic embedded ultra-high memory density (>0.1Gb/mm 2 ) and full ...
In this study, the new 3D stackable Via. RRAM is fully compatible with logic process which leads it to be a very promising area-efficient solution in high- ...
The 3-D Via RRAM cell is vertically structured as a 1T10R configuration; these ten switchable resistive unit cells stacked across five copper layers. Notably, ...
Mar 28, 2024 · A novel 3D stackable Via resistive random access memory (RRAM) latch and Via RRAM logic gates implemented in 16-nm FinFET logic process for ...
Introducing a groundbreaking high-density 3D Via Resistive Random Access Memory (RRAM) architecture seamlessly compatible with Fin Field-Effect Transistors ...
Missing: MCU | Show results with:MCU
Cheng-Jun Lin, Chrong-Jung Lin and Ya-Chin King*, “3D Stackable Via RRAM Cells by Cu BEOL Process in FinFET CMOS Technologies,” in 2020 International Symposium ...
Oct 15, 2014 · If an embedded system designer needs more RAM, they merely get an external RAM chip and use peripheral memory interfaces that microcontrollers ...
Missing: RRAM | Show results with:RRAM
May 9, 2016 · We discuss the two main proposed 3D integration schemes—3D horizontally stacked ReRAM vs 3D Vertical ReRAM and their respective advantages and ...
Missing: MCU | Show results with:MCU
Panasonic realized an embedded application of RRAM on MCU in 2013. Crossbar ... RRAM achieved through understanding-based stack-engineering. In ...
Missing: Via | Show results with:Via