Materials testing of an adhesive for bonding Silicon to a substrate is presented. Test results in... more Materials testing of an adhesive for bonding Silicon to a substrate is presented. Test results include Young’s Modulus, Poisson’s Ratio, and the coefficient of thermal expansion at temperatures ranging from room temperature to 100 K. Data for 3 epoxies (Tra-Con F113, Epotek 301-2, Hysol 9361) are presented.
Materials testing of an adhesive for bonding Silicon to a substrate is presented. Test results in... more Materials testing of an adhesive for bonding Silicon to a substrate is presented. Test results include Young’s Modulus, Poisson’s Ratio, and the coefficient of thermal expansion at temperatures ranging from room temperature to 100 K. Data for 3 epoxies (Tra-Con F113, Epotek 301-2, Hysol 9361) are presented.
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