Results of this study, in which shielding efficiencies are measured for a number of blends contai... more Results of this study, in which shielding efficiencies are measured for a number of blends containing various conductive fillers including intrinsically conductive polymers, are reported. It is shown that a very high level of shielding performance can be achieved by use of intrinsically conductive polymers in thermoplastic blends and that the most reliable measure of this performance is obtained from far‐field shielding measurements. However, near‐field measurements provide a useful method for comparing the relative shielding effectiveness of different samples. A PVC blend containing nearly uniformly dispersed intrinsically conductive polymer proved to be the best performing sample.
As an alternative to hot air levelling, a fundamentally new surface finish chemistry and process ... more As an alternative to hot air levelling, a fundamentally new surface finish chemistry and process for solderability preservation of printed circuit boards is described: a pretreatment of the copper followed by an optimized formulation of an immersion tin. The precise and reproducible surface finish formation offers reliable solderability, economic and technical advantages for all kinds of PCBs, even for those with the most modern miniaturized structures. The deposition chemistry and ageing properties of the new Organic Metal/tin surface is discussed, based on electrochemical, wet chemical and electron microscopy studies. The results culminate in an almost complete basic understanding of the tin chemistry and the surface finish performance.
Although polyaniline (PAni) has been proposed for use as a hole injection layer (HIL) in organic ... more Although polyaniline (PAni) has been proposed for use as a hole injection layer (HIL) in organic light emitting diodes (OLEDs) and polymeric light emitting diodes (PLEDs) from very early on, the material does not seem to have found widespread use on a (pre)commercial scale. Recent results will be presented showing that PAni can be efficiently used as HIL, and that
The present invention (i) one or more non-(非) an electrically conductive base layer; (Ii) one or ... more The present invention (i) one or more non-(非) an electrically conductive base layer; (Ii) one or more copper and / or copper alloy layer; And (iii) a tin-containing layer includes the layer (ii) is directed to a coated article that will interposed between the layer (i) and layer (iii). The coated article according to the present invention is characterized in that it contains the tin-containing layer (iii) is at least one other metal. Printed wiring board, solder coating, whisker formation, complex-forming agent, an electrically conductive polymer
ABSTRACT We present an analysis of electron spin resonance, magnetic susceptibility, and de condu... more ABSTRACT We present an analysis of electron spin resonance, magnetic susceptibility, and de conductivity measurements on polyaniline and polyaniline-PMMA blend to understand the reason for enhanced N(E-F) in the case of the blend. A number of experiments performed under different conditions can be understood using a model in which metallic particles are surrounded by disordered regions or shells. Our results are in agreement with an earlier investigation that found different structural arrangement in the blend compared with polyaniline.
Polyaniline (PAni) dispersions can be efficiently used as hole injection layers (HIL) for passive... more Polyaniline (PAni) dispersions can be efficiently used as hole injection layers (HIL) for passive and active matrix display applications. In earlier work the influence of conductivity and work function of HILs spin coated from water based PAni/PSS dispersions on device performance had already been presented. Recent investigations on hole transport mechanism in polyaniline systems now show the necessity of a
Polyaniline doped with polystyrene-sulfonic-acid (PAN-PSSA), such that y =[sulfonate]/[aniline] =... more Polyaniline doped with polystyrene-sulfonic-acid (PAN-PSSA), such that y =[sulfonate]/[aniline] = 1, exhibits a dc conductivity of 0.1 S/cm. On increasing the dopant concentration to y = 6, the conductivity drops by four orders of magnitude. Poly(3,4-ethylenedioxythiophene) doped with polystyrene-sulfonic-acid (PEDOT-PSSA) also exhibits a similar behavior on doping. The results of a study involving heat capacity, magnetic susceptibility, EPR, and dc conducting measurements will be reported.
Results of this study, in which shielding efficiencies are measured for a number of blends contai... more Results of this study, in which shielding efficiencies are measured for a number of blends containing various conductive fillers including intrinsically conductive polymers, are reported. It is shown that a very high level of shielding performance can be achieved by use of intrinsically conductive polymers in thermoplastic blends and that the most reliable measure of this performance is obtained from far‐field shielding measurements. However, near‐field measurements provide a useful method for comparing the relative shielding effectiveness of different samples. A PVC blend containing nearly uniformly dispersed intrinsically conductive polymer proved to be the best performing sample.
As an alternative to hot air levelling, a fundamentally new surface finish chemistry and process ... more As an alternative to hot air levelling, a fundamentally new surface finish chemistry and process for solderability preservation of printed circuit boards is described: a pretreatment of the copper followed by an optimized formulation of an immersion tin. The precise and reproducible surface finish formation offers reliable solderability, economic and technical advantages for all kinds of PCBs, even for those with the most modern miniaturized structures. The deposition chemistry and ageing properties of the new Organic Metal/tin surface is discussed, based on electrochemical, wet chemical and electron microscopy studies. The results culminate in an almost complete basic understanding of the tin chemistry and the surface finish performance.
Although polyaniline (PAni) has been proposed for use as a hole injection layer (HIL) in organic ... more Although polyaniline (PAni) has been proposed for use as a hole injection layer (HIL) in organic light emitting diodes (OLEDs) and polymeric light emitting diodes (PLEDs) from very early on, the material does not seem to have found widespread use on a (pre)commercial scale. Recent results will be presented showing that PAni can be efficiently used as HIL, and that
The present invention (i) one or more non-(非) an electrically conductive base layer; (Ii) one or ... more The present invention (i) one or more non-(非) an electrically conductive base layer; (Ii) one or more copper and / or copper alloy layer; And (iii) a tin-containing layer includes the layer (ii) is directed to a coated article that will interposed between the layer (i) and layer (iii). The coated article according to the present invention is characterized in that it contains the tin-containing layer (iii) is at least one other metal. Printed wiring board, solder coating, whisker formation, complex-forming agent, an electrically conductive polymer
ABSTRACT We present an analysis of electron spin resonance, magnetic susceptibility, and de condu... more ABSTRACT We present an analysis of electron spin resonance, magnetic susceptibility, and de conductivity measurements on polyaniline and polyaniline-PMMA blend to understand the reason for enhanced N(E-F) in the case of the blend. A number of experiments performed under different conditions can be understood using a model in which metallic particles are surrounded by disordered regions or shells. Our results are in agreement with an earlier investigation that found different structural arrangement in the blend compared with polyaniline.
Polyaniline (PAni) dispersions can be efficiently used as hole injection layers (HIL) for passive... more Polyaniline (PAni) dispersions can be efficiently used as hole injection layers (HIL) for passive and active matrix display applications. In earlier work the influence of conductivity and work function of HILs spin coated from water based PAni/PSS dispersions on device performance had already been presented. Recent investigations on hole transport mechanism in polyaniline systems now show the necessity of a
Polyaniline doped with polystyrene-sulfonic-acid (PAN-PSSA), such that y =[sulfonate]/[aniline] =... more Polyaniline doped with polystyrene-sulfonic-acid (PAN-PSSA), such that y =[sulfonate]/[aniline] = 1, exhibits a dc conductivity of 0.1 S/cm. On increasing the dopant concentration to y = 6, the conductivity drops by four orders of magnitude. Poly(3,4-ethylenedioxythiophene) doped with polystyrene-sulfonic-acid (PEDOT-PSSA) also exhibits a similar behavior on doping. The results of a study involving heat capacity, magnetic susceptibility, EPR, and dc conducting measurements will be reported.
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Papers by B. Wessling