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A Comparative Analysis of Front-End and Back-End Compatible Silicon Photonic On-Chip Interconnects

Published: 04 June 2016 Publication History

Abstract

Photonic devices fabricated with back-end compatible silicon photonic (BCSP) materials can provide independence from the complex CMOS front-end compatible silicon photonic (FCSP) process, to significantly enhance photonic network-on-chip (PNoC) architecture performance. In this paper, we present a detailed comparative analysis of a number of design tradeoffs for CMOS front-end and back-end compatible devices for silicon photonic interconnects. A cross-layer optimization of multiple device-level and link-level design parameters is performed to enable the design of energy-efficient on-chip photonic interconnects using BCSP devices. The optimized design of BCSP on-chip links renders more energy-efficiency and aggregate bandwidth than FCSP on-chip links, in spite of the inferior opto-electronic properties of BCSP devices. Our experimental analysis compares the use of BCSP and FCSP links at the architecture level, and shows that the optimized design of the BCSP-based Firefly PNoC achieves 1.15x greater throughput and 12.4% less energy-per-bit on average than the optimized design of FCSP-based Firefly PNoC. Similarly, the optimized design of the BCSP-based Corona PNoC achieves 3.5x greater throughput and 39.5% less energy-per-bit on average than the optimized design of FCSP-based Corona PNoC.

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cover image ACM Conferences
SLIP '16: Proceedings of the 18th System Level Interconnect Prediction Workshop
June 2016
57 pages
ISBN:9781450344302
DOI:10.1145/2947357
Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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Publication History

Published: 04 June 2016

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Author Tags

  1. Photonic network on chip
  2. aggregate bandwidth
  3. design tradeoffs
  4. energy efficiency
  5. optimization

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Overall Acceptance Rate 6 of 8 submissions, 75%

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  • (2023)Design of Sparsity Optimized Photonic Deep Learning AcceleratorsEmbedded Machine Learning for Cyber-Physical, IoT, and Edge Computing10.1007/978-3-031-39932-9_13(329-347)Online publication date: 10-Oct-2023
  • (2023)Co-designing Photonic Accelerators for Machine Learning on the EdgeEmbedded Machine Learning for Cyber-Physical, IoT, and Edge Computing10.1007/978-3-031-39932-9_10(249-269)Online publication date: 10-Oct-2023
  • (2022)Photonic Networks-on-Chip Employing Multilevel Signaling: A Cross-Layer Comparative StudyACM Journal on Emerging Technologies in Computing Systems10.1145/348736518:3(1-36)Online publication date: 22-Mar-2022
  • (2021)Design Exploration and Scalability Analysis of a CMOS-Integrated, Polymorphic, Nanophotonic Arithmetic-Logic UnitProceedings of the 19th ACM Conference on Embedded Networked Sensor Systems10.1145/3485730.3494042(628-634)Online publication date: 15-Nov-2021
  • (2020)PROTEUS: Rule-Based Self-Adaptation in Photonic NoCs for Loss-Aware Co-Management of Laser Power and Performance2020 14th IEEE/ACM International Symposium on Networks-on-Chip (NOCS)10.1109/NOCS50636.2020.9241712(1-8)Online publication date: 24-Sep-2020
  • (2020)A Survey of Silicon Photonics for Energy-Efficient Manycore ComputingIEEE Design & Test10.1109/MDAT.2020.298262837:4(60-81)Online publication date: Aug-2020
  • (2018)Securing photonic NoC architectures from hardware trojansProceedings of the Twelfth IEEE/ACM International Symposium on Networks-on-Chip10.5555/3306619.3306634(1-8)Online publication date: 4-Oct-2018
  • (2018)Cross-Layer Thermal Reliability Management in Silicon Photonic Networks-on-ChipProceedings of the 2018 Great Lakes Symposium on VLSI10.1145/3194554.3194608(317-322)Online publication date: 30-May-2018
  • (2018)HYDRA: Heterodyne Crosstalk Mitigation With Double Microring Resonators and Data Encoding for Photonic NoCsIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2017.274996726:1(168-181)Online publication date: Jan-2018
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