World Abstracts on Microelectronlcs and Rehabahty
1337
4. M I C R O E L E C T R O N I C S - - - - G E N E R A L
Implementing total quality management at the U.S. Departmeat of Defense. KIMBERLYM McC~THY and AHtvtAVK
ELSHENNAW'Y. Comput. and Engng 21(I-4), 153 (1991) This
ment and sagn.ficantly improve the development-to-manufacturing transition
paper examines Total Quality Management (TQM) as
defined by Dr W Edwards Demmg including Demmg's
fourteen points and explains how the United States Department of Defense (DOD) defines TQM and why TQM is
necessary It also covers how the DOD is planning on
implementing TQM and the pohcy that has been estabhshed
as gmdance m the ~mplementatlon process
Computer integrated manufacturing and networking in advunced IC manufacturing. JEAN B HUGHES and SAM L
SUNDERAM IEEE Trans Compon Hybrids mfg Technol
Technology Development: focus on manufacturability. FRANK
J_ ANASTASlOand DAVIDJ MILLER IEEE Trans Compon
Hybrads mfg Technol 14(3), 488 (September 1991) Aggressive ground rule changes continue to increase the complexity
of semiconductor technology The reqmrements for designs.
processes, equipment, and faclhtles all grow in sophistication from generation to generataon These trends have
made at increasingly dafficult to produce a technology m the
development laboratory and transfer it to volume manufacturing in a timely and cost-effective manner In addluon,
worldwide competmon is placing an unprecedented focus on
increasing the rate of technology mtroductaon Major
changes m the technology development cycle are required
The traditional laboratory role of design and process development has expanded to include a parallel responslblhty for
manufacturabdaty Design for manufacturablhty (DFM)
and early manufactunng involvement (EMI) concepts are
now major components of the development effort designed
to maintain and enhance the rate of technology advance-
14(3), 476 (September 1991) The apphcauon of integrated
computer control to the manufacture of advanced analog
ICs is shown to have a measurable impact on device
parameters, wafer throughput, repeatabdaty, and product
quahty A representative example based on the evaluataon
of device current gain umforrmty resulting from conventaonal control technologies is compared to the results obtained m a digitally controlled furnace The paper discusses
a system architecture consastmg of m~croprocessor-based
furnace controllers plus a powerful cell controller which
handles many error prone functions m the manufactunng
process Finally, some future trends in the further development of such systems are discussed
Product, technology trends spur interest in IC memory cards.
JEE (Japan), 42 (November 1991) Since thear first appearance in the mld-1980s, the use of IC memory cards has
expanded yearly to include apphcataons in mformataon,
commumcaUon and control eqmpment Owing to the recent
introduction of compact personal computers, demand for
smaller external memory devices with less power consumption has climbed IC memory cards have estabhshed themselves as products that satisfy these demands
5. M I C R O E L E C T R O N I C S - - - D E S I G N
A precision vertical interconnect technology. MICHAEL
GREENSTEIN and FARIDMATTA. 1EEE Trans. Comport Hybrads mfg Technol 14(3), 445 (1991) An mterconnection
technology is described that utdlzes excamer laser drilled vms
and computer-controlled plating to provide vertical (Z-axis)
electrical connections in high performance flexable clrcmts
Specafically, solid vms and hemispherical microcontacts are
created wath a 1 pm nearest-neighbor height precision for
the mtcrocontacts. A novel structural architecture is employed which simphfies the ground plane connections for
impedance controlled flex circuits The technology as partlcularly suitable m the d c to 2 GHz frequency range,
where large numbers of parallel connectaons and or multiple
make and break connections are desirable This technology
was implemented wRh a polyirmde substrate and mckel
contacts, although the technology is applicable to other
substrate and contact metallurgies.
Analysis of alternative rework strategies for printed wiring
assembly m-mffacturiug systems. Mox~s DRIELSand M~OOR
JOHN S. KLEGKA IEEE Trans_ Compon Hybrids mfg Technol 14(3), 637 (1991) This paper presents a model for
predicting the cost of test, daagnosls, and rework activities
in the manufacture of pnnted wrong assemblies (PWAs)_
Rework is defined as all actions taken to correct or improve
the basic assembly process. These actmns may include those
of inspectors and solder touchup technlcmns who do not
add value to the PWA, but whose actaons are required in
order to produce acceptable yields from the manufactunng
process, Two alternative rework strategies for contemporary
PWA manufactunng systems are presented: terminal rework
and dIstnbuted rework. Rework may occur after all assembly operations have been accomplished (terminal rework) or
at may be dastributed throughout the assembly process This
AND
CONSTRUCTION
paper analyzes the economic basas for deciding between the
two rework strategaes The paper assumes that the only
reason for utdlzmg dastrthuted rework is to reduce the cost
of producing acceptable PWAs, otherwise the cost of the
distributed rework effort cannot be justified The paper
presents a model of each rework strategy. The effect of each
strategy upon first pass yaeld (FPY) of the manufactunng
process is discussed The effect on FPY is then used to
evaluate the economac benefit of each rework strategy as an
aid in deciding which strategy to use The increase in FPY
needed to justify dastnbuted rework is calculated
Programs/projects management and integrated product/
process development in high technology electronic products
industries. L KEN KEYS IEEE Trans Compon HybrMs mfg
Technol_ 14(3), 602 (1991) Increasing technological sophtstlcahon of products along wRh a corresponding increasing
level of quality and rehabdlty are putting pressures on old
manufacturers These pressures have forced a revaew of
conventional management processes and evolutaon into a
product development/program (project) management (PM)
process This paper wall discuss the evolutaon to thas management techmque and tts important elements
Grain boundary sliding in surface mount solders during
thermal cycling. SEONG-MIN LEE and DONALD S, STONE
1EEE Trcms Compon Hybrids mfg Technol. 14(3), 628
(September 1991) This article reports the growth of fatigue
cracks m near-eutectlc surface mount solder joints dunng
cyclic, thermal displacement-controlled loading Ceramac
leadless chap carriers (LLCCs) and small outhne J-leaded
(SOJ) packages undergo thermal dasplacement-mduced fatague wath a frequency of 1/h Two ranges of temperature are
utilized -36-125°C and -20-75°C Surfaces and cross