World Abstracts on Microelectronlcs and Rehabahty 1337 4. M I C R O E L E C T R O N I C S - - - - G E N E R A L Implementing total quality management at the U.S. Departmeat of Defense. KIMBERLYM McC~THY and AHtvtAVK ELSHENNAW'Y. Comput. and Engng 21(I-4), 153 (1991) This ment and sagn.ficantly improve the development-to-manufacturing transition paper examines Total Quality Management (TQM) as defined by Dr W Edwards Demmg including Demmg's fourteen points and explains how the United States Department of Defense (DOD) defines TQM and why TQM is necessary It also covers how the DOD is planning on implementing TQM and the pohcy that has been estabhshed as gmdance m the ~mplementatlon process Computer integrated manufacturing and networking in advunced IC manufacturing. JEAN B HUGHES and SAM L SUNDERAM IEEE Trans Compon Hybrids mfg Technol Technology Development: focus on manufacturability. FRANK J_ ANASTASlOand DAVIDJ MILLER IEEE Trans Compon Hybrads mfg Technol 14(3), 488 (September 1991) Aggressive ground rule changes continue to increase the complexity of semiconductor technology The reqmrements for designs. processes, equipment, and faclhtles all grow in sophistication from generation to generataon These trends have made at increasingly dafficult to produce a technology m the development laboratory and transfer it to volume manufacturing in a timely and cost-effective manner In addluon, worldwide competmon is placing an unprecedented focus on increasing the rate of technology mtroductaon Major changes m the technology development cycle are required The traditional laboratory role of design and process development has expanded to include a parallel responslblhty for manufacturabdaty Design for manufacturablhty (DFM) and early manufactunng involvement (EMI) concepts are now major components of the development effort designed to maintain and enhance the rate of technology advance- 14(3), 476 (September 1991) The apphcauon of integrated computer control to the manufacture of advanced analog ICs is shown to have a measurable impact on device parameters, wafer throughput, repeatabdaty, and product quahty A representative example based on the evaluataon of device current gain umforrmty resulting from conventaonal control technologies is compared to the results obtained m a digitally controlled furnace The paper discusses a system architecture consastmg of m~croprocessor-based furnace controllers plus a powerful cell controller which handles many error prone functions m the manufactunng process Finally, some future trends in the further development of such systems are discussed Product, technology trends spur interest in IC memory cards. JEE (Japan), 42 (November 1991) Since thear first appearance in the mld-1980s, the use of IC memory cards has expanded yearly to include apphcataons in mformataon, commumcaUon and control eqmpment Owing to the recent introduction of compact personal computers, demand for smaller external memory devices with less power consumption has climbed IC memory cards have estabhshed themselves as products that satisfy these demands 5. M I C R O E L E C T R O N I C S - - - D E S I G N A precision vertical interconnect technology. MICHAEL GREENSTEIN and FARIDMATTA. 1EEE Trans. Comport Hybrads mfg Technol 14(3), 445 (1991) An mterconnection technology is described that utdlzes excamer laser drilled vms and computer-controlled plating to provide vertical (Z-axis) electrical connections in high performance flexable clrcmts Specafically, solid vms and hemispherical microcontacts are created wath a 1 pm nearest-neighbor height precision for the mtcrocontacts. A novel structural architecture is employed which simphfies the ground plane connections for impedance controlled flex circuits The technology as partlcularly suitable m the d c to 2 GHz frequency range, where large numbers of parallel connectaons and or multiple make and break connections are desirable This technology was implemented wRh a polyirmde substrate and mckel contacts, although the technology is applicable to other substrate and contact metallurgies. Analysis of alternative rework strategies for printed wiring assembly m-mffacturiug systems. Mox~s DRIELSand M~OOR JOHN S. KLEGKA IEEE Trans_ Compon Hybrids mfg Technol 14(3), 637 (1991) This paper presents a model for predicting the cost of test, daagnosls, and rework activities in the manufacture of pnnted wrong assemblies (PWAs)_ Rework is defined as all actions taken to correct or improve the basic assembly process. These actmns may include those of inspectors and solder touchup technlcmns who do not add value to the PWA, but whose actaons are required in order to produce acceptable yields from the manufactunng process, Two alternative rework strategies for contemporary PWA manufactunng systems are presented: terminal rework and dIstnbuted rework. Rework may occur after all assembly operations have been accomplished (terminal rework) or at may be dastributed throughout the assembly process This AND CONSTRUCTION paper analyzes the economic basas for deciding between the two rework strategaes The paper assumes that the only reason for utdlzmg dastrthuted rework is to reduce the cost of producing acceptable PWAs, otherwise the cost of the distributed rework effort cannot be justified The paper presents a model of each rework strategy. The effect of each strategy upon first pass yaeld (FPY) of the manufactunng process is discussed The effect on FPY is then used to evaluate the economac benefit of each rework strategy as an aid in deciding which strategy to use The increase in FPY needed to justify dastnbuted rework is calculated Programs/projects management and integrated product/ process development in high technology electronic products industries. L KEN KEYS IEEE Trans Compon HybrMs mfg Technol_ 14(3), 602 (1991) Increasing technological sophtstlcahon of products along wRh a corresponding increasing level of quality and rehabdlty are putting pressures on old manufacturers These pressures have forced a revaew of conventional management processes and evolutaon into a product development/program (project) management (PM) process This paper wall discuss the evolutaon to thas management techmque and tts important elements Grain boundary sliding in surface mount solders during thermal cycling. SEONG-MIN LEE and DONALD S, STONE 1EEE Trcms Compon Hybrids mfg Technol. 14(3), 628 (September 1991) This article reports the growth of fatigue cracks m near-eutectlc surface mount solder joints dunng cyclic, thermal displacement-controlled loading Ceramac leadless chap carriers (LLCCs) and small outhne J-leaded (SOJ) packages undergo thermal dasplacement-mduced fatague wath a frequency of 1/h Two ranges of temperature are utilized -36-125°C and -20-75°C Surfaces and cross