Advanced Composite Materials Applications in Electronics Devices

Within the work, on the basis of previously obtained real components, the design, dimensioning and analysis of hexacopters were performed. The 3D virtual model was developed using the SolidWorks software package, and then the necessary stress analysis by the finite element method was performed. After 3D modeling, an analytical load calculation was performed on the hexacopter landing and take-off mechanism. During the calculation, real loads were used during the landing and take-off of the hexacopter. After the analytical calculation, a numerical analysis was performed using the finite element method, where the mechanisms for landing and taking off hexacopters were observed separately. In FEM analysis, the principal stresses at characteristic places were observed, as well as displacements or deformations on the take - off mechanism. After that, a comparison of analytical calculation and numerical (FEM) analysis of the hexacopter structure was performed. On that occasion, a good match between the results of these two methodswas established, which verified the numerical method used.

MEMS devices are found in many of today’s electronic devices and systems, from air-bag sensors in cars to smart phones, embedded systems, etc. Increasingly, the reduction in dimensions has led to nanometer-scale devices, called NEMS. The plethora of applications on the commercial market speaks for itself, and especially for the highly precise manufacturing of silicon-based MEMS and NEMS. While this is a tremendous achievement, silicon as a material has some drawbacks, mainly in the area of mechanical fatigue and thermal properties. Silicon carbide (SiC), a well-known wide-bandgap semiconductor whose adoption in commercial products is experiening exponential growth, especially in the power electronics arena. While SiC MEMS have been around for decades, in this Special Issue we seek to capture both an overview of the devices that have been demonstrated to date, as well as bring new technologies and progress in the MEMS processing area to the forefront. Thus, this Special Issue seeks to showcase research papers, short communications, and review articles that focus on: (1) novel designs, fabrication, control, and modeling of SiC MEMS and NEMS based on all kinds of actuation mechanisms; and (2) new developments in applying SiC MEMS and NEMS in consumer electronics, optical communications, industry, medicine, agriculture, space, and defense.

We demonstrate the realization of the first liquid nonvolatile rewritable memories relying on a blend of liquid carbazole and silver nanoparticles. When an external bias voltage is applied across this single active layer based structure, a bistable current with an ON/OFF ratio of about 2 x 10^2 is observed. Write–read–erase cycles and recorded information stability are also demonstrated. This study provides evidence that hybrid materials hold unexplored promises for original nonvolatile flash memories and should stimulate strong interest in the area of low-cost, large area, flexible data storage devices.

Organic Electronics 12, 11, 1800 (2011)