In this study, a Cu/Ni porous composite was introduced during the brazing of sapphire with Inconel 600 by using a special active filler metal of BAg-8 with 2%Ti. The aim of the research is to investigate the distribution of Ni and Ti in... more
In this study, a Cu/Ni porous composite was introduced during the brazing of sapphire with Inconel 600 by using a special active filler metal of BAg-8 with 2%Ti. The aim of the research is to investigate the distribution of Ni and Ti in the Cu/Ni porous composite and brazed layer. The brazing was carried out at the brazing temperature of 865°C for 30 minutes in a vacuum environment (10 -4 Pa). The interface of sapphire/brazed layer and brazed layer/Inconel 600 were observed by an SEM analysis facilitated with EDX and elements mapping. The analysis showed the diffusion behavior of Ti and Ni elements. Ti tends to diffuse to the interface of sapphire and Inconel 600 in Cu area and Ni distribute evenly in the brazed layer either from porous composite or Inconel. The diffusion of Ti depends on its thermodynamic behavior. From the EDX and elemental mapping analysis, the Ni-Ti intermetallics compound was found at brazed layer. The Ni-Ti phase has a proven, resistance to corrosion.
