Sensor de Temperatura LM50
Sensor de Temperatura LM50
Sensor de Temperatura LM50
July 1999
Applications
n n n n n n n n n Computers Disk Drives Battery Management Automotive FAX Machines Printers Portable Medical Instruments HVAC Power Supply Modules
Features
n n n n n n n n n n Calibrated directly in degree Celsius (Centigrade) Linear + 10.0 mV/C scale factor 2C accuracy guaranteed at +25C Specified for full 40 to +125C range Suitable for remote applications Low cost due to wafer-level trimming Operates from 4.5V to 10V Less than 130 A current drain Low self-heating, less than 0.2C in still air Nonlinearity less than 0.8C over temp
Connection Diagram
SOT-23 Order Number LM50BIM3 LM50CIM3
DS012030-1
Supplied As 1000 Units on Tape and Reel 1000 Units on Tape and Reel 3000 Units on Tape and Reel 3000 Units on Tape and Reel
LM50BIM3X LM50CIM3X
Typical Application
DS012030-3
DS012030
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2000V 250V
Electrical Characteristics
Unless otherwise noted, these specifications apply for VS = +5 VDC and ILOAD = +0.5 A, in the circuit of Figure 1. Boldface limits apply for the specified TA = TJ = TMIN to TMAX; all other limits TA = TJ = +25C, unless otherwise noted. Parameter Conditions Typical Accuracy (Note 6) Nonlinearity (Note 7) Sensor Gain (Average Slope) Output Resistance Line Regulation (Note 8) Quiescent Current (Note 9) Change of Quiescent Current (Note 9) Temperature Coefficient of Quiescent Current Long Term Stability (Note 10) TJ = 125C, for 1000 hours
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating the device beyond its rated operating conditions. Note 2: See AN-450 Surface Mounting Methods and Their Effect on Product Reliability or the section titled Surface Mount found in a current National Semiconductor Linear Data Book for other methods of soldering surface mount devices. Note 3: Human body model, 100 pF discharged through a 1.5 k resistor. Machine model, 200 pF discharged directly into each pin. Note 4: Thermal resistance of the SOT-23 package is specified without a heat sink, junction to ambient. Note 5: Limits are guaranteed to Nationals AOQL (Average Outgoing Quality Level). Note 6: Accuracy is defined as the error between the output voltage and 10mv/C times the devices case temperature plus 500 mV, at specified conditions of voltage, current, and temperature (expressed in C). Note 7: Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the devices rated temperature range. Note 8: Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating effects can be computed by multiplying the internal dissipation by the thermal resistance. Note 9: Quiescent current is defined in the circuit of Figure 1 . Note 10: For best long-term stability, any precision circuit will give best results if the unit is aged at a warm temperature, and/or temperature cycled for at least 46 hours before long-term life test begins. This is especially true when a small (Surface-Mount) part is wave-soldered; allow time for stress relaxation to occur. The majority of the drift will occur in the first 1000 hours at elevated temperatures. The drift after 1000 hours will not continue at the first 1000 hour rate.
Units (Limit)
2.0 3.0
+3.0, 3.5
0.8
+9.7 +10.3 2000 +4.5V VS +10V +4.5V VS +10V +4.5V VS +10V +1.0 4000 2000
C (max) C (max) C (max) C (max) mV/C (min) mV/C (max) (max) mV/V (max) mV/V (max) A (max) A (max) A (max) A/C C
0.8 1.2
130 180 2.0 +2.0
0.8 1.2
130 180 2.0
0.08
0.08
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DS012030-25 DS012030-24
DS012030-26
Accuracy vs Temperature
Noise Voltage
DS012030-28 DS012030-27
DS012030-29
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Start-Up Response
DS012030-31
DS012030-30
as Humiseal and epoxy paints or dips are often used to ensure that moisture cannot corrode the LM50 or its connections. Temperature Rise of LM50 Due to Self-Heating (Thermal Resistance, JA) SOT-23 no heat sink* Still air Moving air 450C/W SOT-23 small heat fin** 260C/W 180C/W
* Part soldered to 30 gauge wire. ** Heat sink used is 12" square printed circuit board with 2 oz. foil with part at-
FIGURE 2. Printed Circuit Board Used for Heat Sink to Generate All Curves. 12" Square Printed Circuit Board with 2 oz. Foil or Similar
1.0 Mounting
The LM50 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued or cemented to a surface and its temperature will be within about 0.2C of the surface temperature. This presumes that the ambient air temperature is almost the same as the surface temperature; if the air temperature were much higher or lower than the surface temperature, the actual temperature of the LM50 die would be at an intermediate temperature between the surface temperature and the air temperature. To ensure good thermal conductivity the backside of the LM50 die is directly attached to the GND pin. The lands and traces to the LM50 will, of course, be part of the printed circuit board, which is the object whose temperature is being measured. These printed circuit board lands and traces will not cause the LM50s temperature to deviate from the desired temperature. Alternatively, the LM50 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or screwed into a threaded hole in a tank. As with any IC, the LM50 and accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such
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DS012030-7
DS012030-8
FIGURE 4. LM50C with Filter for Noisy Environment The LM50 handles capacitive loading very well. Without any special precautions, the LM50 can drive any capacitive load. The LM50 has a nominal 2 k output impedance (as can be seen in the block diagram). The temperature coefficient of the output resistors is around 1300 ppm/C. Taking into account this temperature coefficient and the initial tolerance of the resistors the output impedance of the LM50 will not exceed 4 k. In an extremely noisy environment it may be necessary to add some filtering to minimize noise pickup. It is recommended that 0.1 F be added from VIN to GND to by-
(Continued)
pass the power supply voltage, as shown in Figure 4. In a noisy environment it may be necessary to add a capacitor from the output to ground. A 1 F output capacitor with the 4 k output impedance will form a 40 Hz lowpass filter. Since
the thermal time constant of the LM50 is much slower than the 25 ms time constant formed by the RC, the overall response time of the LM50 will not be significantly affected. For much larger capacitors this additional time lag will increase the overall response time of the LM50.
DS012030-17
DS012030-11
DS012030-13
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(Continued)
DS012030-14
FIGURE 8. Temperature To Digital Converter (Parallel TRI-STATE Outputs for Standard Data Bus to P Interface) (125C Full Scale)
DS012030-16
FIGURE 9. LM50 With Voltage-To-Frequency Converter And Isolated Output (40C to +125C; 100 Hz to 1750 Hz)
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Physical Dimensions
SOT-23 Molded Small Outline Transistor Package (M3) Order Number LM50BIM3, or LM50CIM3 NS Package Number MA03B
LIFE SUPPORT POLICY NATIONALS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user.
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2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
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