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IPC A 610DC Telecom Addendum

This document provides specifications for heat staking and mounting connectors. It defines requirements for heat staked connector heads, including that they cannot have loose flash or pieces. Connectors can be missing up to 1 heat stake if the others meet requirements. Figures 7-1 and 7-2 define acceptable heat stake dimensions and appearance. Figures 7-3 to 7-5 provide examples of acceptable versus defective heat stakes. The document also specifies that soldered connectors must be flush mounted with less than 0.25mm spacing from the board.

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468 views

IPC A 610DC Telecom Addendum

This document provides specifications for heat staking and mounting connectors. It defines requirements for heat staked connector heads, including that they cannot have loose flash or pieces. Connectors can be missing up to 1 heat stake if the others meet requirements. Figures 7-1 and 7-2 define acceptable heat stake dimensions and appearance. Figures 7-3 to 7-5 provide examples of acceptable versus defective heat stakes. The document also specifies that soldered connectors must be flush mounted with less than 0.25mm spacing from the board.

Uploaded by

fenriz666
Copyright
© Attribution Non-Commercial (BY-NC)
Available Formats
Download as PDF, TXT or read online on Scribd
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Telecom Addendum

7.1.8.1 Connector Mounting Heat Staking


Added criteria in this addendum.
Heat Stake/Press Peg Appearance After heat staking, the heat staked heads shall meet the requirements shown on Figure 7-1 of this specification.

The heat staked heads shall not have any loose flash or loose fractured pieces.

PWB conductor paths and solder-resist areas adjacent to the heat staked heads shall not be damaged by the heat staking process.
Missing or Nonconforming Heat Stakes On any connector, heat stakes (press pegs) may be missing or not conforming to the requirements provided that they are not higher than 1.6 mm [0.062 in] above the PWB, and each nonconforming heat stake (press peg) is bounded on either side by two heat stakes (press pegs) that are conforming. The outer two heat stakes (press pegs) on either end of the connector must conform to production requirements.

B
IPC-610D-C07-001

Figure 7-1
A. 1.680 0.20 mm max. height B. Max. diameter of 4.0 0.2 mm

Target

Figure 7-2

August 2009

A-610DC

Telecom Addendum

7.1.8.1 Connector Mounting Heat Staking (cont.)


Acceptable

50% of the heat stake is present. No loose or fractured flash pieces.

Figure 7-3

Defect

<50% of the heat stake is present. Loose flashing from heat stake process (see Figure 7-5).

Figure 7-4

A-610DC

August 2009

Telecom Addendum

7.1.8.1 Connector Mounting Heat Staking (cont.)

Figure 7-5

7.1.8.2 Connector Mounting Soldered Connectors Right Angle Pin Spacing 2.5 mm [0.098 in]
Added criteria in this addendum.

Target

Connector is mounted flush with the surface of the board.

Figure 7-6 Acceptable

Connector-to-board spacing is equal to or less than 0.25 mm [0.010 in] (not shown).
Defect

Connector to board spacing is greater than 0.25 mm [0.010 in] (not shown).

August 2009

A-610DC

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