ATS692 H Datasheet
ATS692 H Datasheet
ATS692 H Datasheet
Description
The ATS692LSH in an optimized Hall-effect integrated circuit (IC) and rare earth pellet combination that provides a userfriendly solution for direction detection and true zero-speed, digital gear tooth sensing. The small package can be easily assembled and used in conjunction with a wide variety of gear tooth sensing applications. The IC employs patented algorithms for the special operational requirements of automotive transmission applications. The speed and direction of the target are communicated through a variable pulse width output protocol. The ATS692 is particularly adept at handling vibration without sacrificing maximum air gap capability or creating any erroneous direction information. Even higher angular vibration caused by engine cranking is completely rejected by the device. The advanced vibration detection algorithm systematically calibrates the sensor IC on the initial teeth of true target rotation and not on vibration, always guaranteeing an accurate signal in running mode. Advanced signal processing and innovative algorithms make the ATS692 an ideal solution for a wide range of speed and direction sensing needs. This device is available in a lead (Pb) free 4-pin SIP package with a 100% matte tin plated leadframe.
Not to scale
TEST
Hall Amp
Offset Adjust
AGC
Filter
ADC
Hall Amp
Offset Adjust
AGC
Filter
ADC GND
ATS692LSH1-DS, Rev. 2
ATS692LSH(RSNPH)
Two-Wire, Differential, Vibration Resistant Sensor IC with Speed and Direction Output
Selection Guide
Part Number
ATS692LSHTN-RSNPH-T
Packing*
800 pieces per reel
tw(ND)(nom)
180 s
*Contact Allegro for additional packing options. Configuration ATS692LSHTN-T 100% matte tin leadframe plating Vibration Immunity / Direction Change: H High vibration immunity, with Non-Direction pulses Calibration Pulses: P Pulses during calibration Reverse Pulse Width: N Narrow, 90 s Number of Pulses: S Single, one pulse per tooth / valley Rotation Direction: R Reverse, target movement forward direction from pin 4 to 1 Allegro Identifier and Device Type: ATS692 Operating Temperature Range: L Package Designation: SH Instructions (Packing): TN Tape and reel, 800 pieces per 13-in. reel
Pin-out Diagram
1 2 3 4
*Connection of TEST to VCC and/or GND may cause undesired additional current consumption in the IC.
Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com
ATS692LSH(RSNPH)
Two-Wire, Differential, Vibration Resistant Sensor IC with Speed and Direction Output
OPERATING CHARACTERISTICS Valid at throughout full operating and temperature ranges; using Reference Target 60-0;
unless otherwise specified
Characteristic General Electrical Characteristics Supply Voltage2 Under Voltage Lockout Reverse Supply Current3 Supply Zener Clamp Voltage VCC VCC(UV) IRCC ICC(LOW) Supply Current ICC(HIGH) Operating, TJ < TJ(max) VCC 0 5 V or 5 0 V VCC = VRCC(max) Low-current state (Running mode) High-current state (Running mode) 4.0 28 5.0 12.0 5.0 12.0 1.9 RL = 100 , CL = 10 pF; ICC(HIGH) ICC(LOW) , ICC(LOW) ICC(HIGH) , 10% to 90% points 3.6 6 24 3.95 10 8.0 16.0 8.5 16.5 V V mA V mA mA mA mA V Symbol Test Conditions Min. Typ.1 Max. Unit
ICC(SU)(LOW) Startup current level (Power-On mode) ICC(SU)(HIGH) High-current state (Calibration) ICC(HIGH) / ICC(LOW) VZ(TEST)
Supply Current Ratio Test Pins Zener Clamp Voltage4 Output Stage Output Slew Rate Output Pulse Characteristics5 Pulse Width (Forward Rotation) Pulse Width (Reverse Rotation) Pulse Width (Non-Direction) General Operating Characteristics Operate Point Release Point Operating Frequency (Forward Rotation) Operating Frequency (Reverse Rotation)6 Operating Frequency (Non-Direction Pulses)6 DAC Characteristics Allowable User-Induced Offset Performance Characteristics Air Gap Range Vibration Immunity (Startup) Vibration Immunity (Running Mode)
SROUT
7.0
16
mA / s
tw(FWD) tw(REV) tw(ND) BOP BRP fFWD fREV fND % of peak-to-peak VPROC % of peak-to-peak VPROC
38 76 153 0 0 0
45 90 180 69 31
52 104 207 12 7 4
BOFFSET
Magnitude valid for both differential magnetic channels Using Allegro Reference Target 60-0 See figure 1 See figure 1
60
60
AG errVIB(SU) errVIB
2.75
mm deg. deg.
Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com
ATS692LSH(RSNPH)
Two-Wire, Differential, Vibration Resistant Sensor IC with Speed and Direction Output
OPERATING CHARACTERISTICS (continued) Valid at throughout full operating and temperature ranges; using Reference Target
60-0; unless otherwise specified
Characteristic Input Magnetic Characteristics Allowable Differential Sequential Signal Variation7 Calibration Amount of target rotation (constant direction) following power-on until first electrical output pulse of either tw(FWD) or tw(REV) , see figure 1 NCD AG 0.5 mm AG < 2.25 mm AG 2.25 mm AG 2.75 mm 2 TTARGET 2.5 TTARGET 2 TTARGET 2 TTARGET <3 TTARGET <4 TTARGET <3 TTARGET <3 TTARGET deg. BSEQ(n+1) / Signal cycle-to-cycle variation (see figure 2) BSEQ(n) 0.6 Symbol Test Conditions Min. Typ.1 Max. Unit
Pulse8
1 TTARGET 1 TTARGET
deg.
First Direction Pulse Output Following Direction Change First Direction Pulse Output Following Running Mode Vibration
1Typical 2Maximum
Amount of target rotation (constant direction) following event until first electrical output pulse of either tw(FWD) or tw(REV) , see figure 1 Amount of target rotation (constant direction) following event until first electrical output pulse of either tw(FWD) or tw(REV) , see figure 1
deg.
deg.
values are at TA = 25C and VCC = 12 V. Performance may vary for individual units, within the specified maximum and minimum limits. voltage must be adjusted for power dissipation and junction temperature; see Power Derating section. 3Negative current is defined as conventional current coming out of (sourced from) the specified device terminal. 4Sustained voltages beyond the clamp voltage may cause permanent damage to the IC. 5Load circuit is R = 100 and C = 10 pF. Pulse duration measured at a threshold of (I L L CC(HIGH) + ICC(LOW)) / 2. 6Maximums of both Operating Frequency (Reverse Rotation) and Operating Frequency (Non-Direction Pulses) are determined by satisfactory separation of output pulses: ICC(LOW) of tw(FWD)(min). If the customer can resolve lower low-state durations, maximum fREV and fND may be increased. 7If the minimum signal phase separation is not maintained during or after a signal variation event, output may be blanked or non-direction pulses may occur. A signal variation event during power-on may increase the quantity of edges required to get correct direction pulses. 8Power-on frequency 200 Hz. Higher power-on frequencies may require more input magnetic cycles until output edges are achieved.
BSEQ(n) BSEQ(n+1) Target Valley Tooth TTARGET TVPROC VPROC VPROC = the processed analog signal of the sinusoidal magnetic input (per channel) TTARGET = period between successive sensed target mechanical edges of the same orientation (either both rising or both falling)
Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com
ATS692LSH(RSNPH)
Two-Wire, Differential, Vibration Resistant Sensor IC with Speed and Direction Output
Thermal Characteristics may require derating at maximum conditions, see Power Derating section
Characteristic
Package Thermal Resistance
Symbol
RJA
Test Conditions*
Single layer PCB, with copper limited to solder pads Single layer PCB, with copper limited to solder pads and 3.57 (23.03 cm2) copper area each side in.2
Value
126 84
Unit
C/W C/W
VCC(min)
80
100
120
140
160
180
Temperature (C)
Power Dissipation, PD (m W)
JA
= 84 C/W
JA
= 126 C/W
40
60
160
180
Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com
ATS692LSH(RSNPH)
Reference Target 60-0 (60 Tooth Target) Characteristics
Outside Diameter Face Width Angular Tooth Thickness Angular Valley Thickness Tooth Whole Depth Material
Two-Wire, Differential, Vibration Resistant Sensor IC with Speed and Direction Output
Test Conditions
Outside diameter of target Breadth of tooth, with respect to branded face Length of tooth, with respect to branded face Length of valley, with respect to branded face
Symbol
Do F t tv ht
Typ.
120 6 3 3 3
Units
mm mm deg. deg. mm
Symbol Key
t Do F ht
tv
1.0
1.5
2.0
2.5
3.0
Air Gap
(mm) 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 2.75 3.00
Differential B* (G)
3.00 mm AG
-300
0.50 mm AG
-400 -500 0 2 4 6 8 10 12
Gear Rotation ()
Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com
ATS692LSH(RSNPH)
Two-Wire, Differential, Vibration Resistant Sensor IC with Speed and Direction Output
Functional Description
Sensing Technology The sensor IC contains a single-chip Hall-effect circuit that supports a trio of Hall elements. These elements are used in differential pairs to provide electrical signals containing information regarding edge position and direction of target rotation. The ATS692 is intended for use with ferromagnetic targets. After proper power is applied to the sensor IC, it is capable of providing digital information that is representative of the magnetic features of a rotating target. The waveform diagrams in figure 3 present the automatic translation of the target profiles, through their induced magnetic profiles, to the digital output signal of the sensor IC. Direction Detection The sensor IC compares the relative phase of its two differential channels to determine in which direction the target is moving. The relative switching order is used to determine the direction, which is communicated through the output protocol. Data Protocol Description When a target passes in front of the device (opposite the branded face of the package case), the ATS692 generates an output pulse for each tooth of the target. Speed information is provided by the output pulse rate, while direction of target rotation is provided by the duration of the output pulses. The sensor IC can sense target movement in both the forward and reverse directions.
Forward Rotation (see panel A in figure 2) When the target is rotating such that a tooth near the sensor IC passes from pin 4 to pin 1, this is referred to as forward rotation. Forward rotation is indicated on the output by a tw(FWD) (45 s typical) pulse width. Reverse Rotation (see panel B in figure 2) When the target is rotating such that a tooth passes from pin 1 to pin 4, it is referred to as reverse rotation. Reverse rotation is indicated on the output by pulse widths of tw(REV) (90 s typical).
Target
ICE2
E1
(Pin 1 Side)
A Channel
Target (Ferromagnetic)
Pin 4
Pin 1
BOP
Rotating Target (Ferromagnetic) Branded Face of Package
B Channel
BRP
BRP
B Channel
(B) Reverse Rotation Figure 2. Target rotation Figure 3. The magnetic profile reflects the features of the target, allowing the sensor IC to present an accurate digital output.
Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com
ATS692LSH(RSNPH)
Two-Wire, Differential, Vibration Resistant Sensor IC with Speed and Direction Output
slightly before the sensed magnetic edge traverses the package branded face. For targets in forward rotation, this shift, fwd, results in the pulse corresponding to the valley with the sensed mechanical edge, and for targets in reverse rotation, the shift, rev, results in the pulse corresponding to the tooth with the sensed edge. The sensed mechanical edge that stimulates output pulses is kept the same for both forward and reverse rotation by using only one channel to control output switching. Direction Validation Following a direction change in running mode, output pulses have a width of tw(ND) until direction information is validated. An example of the waveforms is shown in figure 5.
Tooth
Output Pulse (Forward Rotation) t rev tw(REV) 90 s Output Pulse (Reverse Rotation)
tW(FWD)
tW(FWD)
tW(ND)
tW(REV)
Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com
ATS692LSH(RSNPH)
Two-Wire, Differential, Vibration Resistant Sensor IC with Speed and Direction Output
Start-Up Detection / Calibration When power is applied to the ATS692, the sensor IC internally detects the profile of the target. The gain and offset of the detected signals are adjusted during the calibration period, normalizing the internal signal amplitude for the air gap range of the device. The Automatic Gain Control (AGC) feature ensures that operational characteristics are isolated from the effects of installation air gap variation. Automatic Offset Adjustment (AOA) is circuitry that compensates for the effects of chip, magnet, and installation offsets. This circuitry works with the AGC during calibration to adjust VPROC in the internal A-to-D range to allow for acquisition of signal peaks. AOA and AGC function separately on the two
Target Rotation
Valley Tooth
differential signal channels. Direction information is available after calibration is complete. Output pulses of tw(ND) are supplied during calibration. Figure 6 shows where the first output edges may occur for various starting target phases. Vibration Detection Algorithms embedded in the IC digital controller detect the presence of target vibration through analysis of the two magnetic input channels. In the presence of vibration, output pulses of tw(ND) may occur or no pulses may occur, depending on the amplitude and phase of the vibration (figure 7). Output pulses have a width of tw(ND) until direction information is validated on constant target rotation.
ICC
tW(ND) tW(ND)
Vibration
ATS692LSH(RSNPH)
Two-Wire, Differential, Vibration Resistant Sensor IC with Speed and Direction Output
Application Information
Power Derating The device must be operated below the maximum junction temperature of the device, TJ(max). Under certain combinations of peak conditions, reliable operation may require derating supplied power or improving the heat dissipation properties of the application. This section presents a procedure for correlating factors affecting operating TJ. (Thermal data is also available on the Allegro website.) The Package Thermal Resistance, RJA, is a figure of merit summarizing the ability of the application and the device to dissipate heat from the junction (die), through all paths to the ambient air. Its primary component is the Effective Thermal Conductivity, K, of the printed circuit board, including adjacent devices and traces. Radiation from the die through the device case, RJC, is relatively small component of RJA. Ambient air temperature, TA, and air motion are significant external factors, damped by overmolding. The effect of varying power levels (Power Dissipation, PD), can be estimated. The following formulas represent the fundamental relationships used to estimate TJ, at PD. PD = VIN IIN T = PD RJA TJ = TA + T For example, given common conditions such as: TA= 25C, VCC = 12 V, ICC = 6.5 mA, and RJA = 126 C/W, then: PD = VCC ICC = 12 V 6.5 mA = 78 mW T = PD RJA = 78 mW 126 C/W = 9.8C TJ = TA + T = 25C + 9.8C = 34.8C A worst-case estimate, PD(max), represents the maximum allowable power level (VCC(max), ICC(max)), without exceeding TJ(max), at a selected RJA and TA. (1) (2) (3)
Example: Reliability for VCC at TA = 150C, package SH, using a single-layer PCB. Observe the worst-case ratings for the device, specifically: RJA = 126 C/W, TJ(max) = 165C, VCC(max) = 24 V, and ICC(mean) = 13 mA. (Note: At maximum target frequency, ICC(LOW) = 8 mA, ICC(HIGH) = 16 mA, and maximum pulse widths, the result is a duty cycle of 62.4% and a worst case ICC(mean) of 13 mA.) Calculate the maximum allowable power level, PD(max). First, invert equation 3: Tmax = TJ(max) TA = 165 C 150 C = 15 C This provides the allowable increase to TJ resulting from internal power dissipation. Then, invert equation 2: PD(max) = Tmax RJA = 15C 126 C/W = 119 mW Finally, invert equation 1 with respect to voltage: VCC(est) = PD(max) ICC(max) = 119 mW 13 mA = 9.2 V The result indicates that, at TA, the application and device can dissipate adequate amounts of heat at voltages VCC(est). Compare VCC(est) to VCC(max). If VCC(est) VCC(max), then reliable operation between VCC(est) and VCC(max) requires enhanced RJA. If VCC(est) VCC(max), then operation between VCC(est) and VCC(max) is reliable under these conditions.
V CC 1 VCC
ATS692
2 TEST GND 4 TEST 3 0.01 F CBYPASS
RL 100
CL
Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com
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ATS692LSH(RSNPH)
Two-Wire, Differential, Vibration Resistant Sensor IC with Speed and Direction Output
Package SH, 4-Pin SIP
1.75 1.75 F
5.500.05
E B
Branded Face
YYWW
Standard Branding Reference View = Supplier emblem L = Lot identifier N = Last three numbers of device part number Y = Last two digits of year of manufacture W = Week of manufacture
For Reference Only, not for tooling use (reference DWG-9003) Dimensions in millimeters 24.650.10 A Dambar removal protrusion (16X)
B Metallic protrusion, electrically connected to pin 4 and substrate (both sides) C Thermoplastic Molded Lead Bar for alignment during shipment D Branding scale and appearance at supplier discretion E Active Area Depth 0.43 mm REF F
13.100.10
1.000.10
1.270.10 5.500.10
0.710.10
0.710.10
Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com
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ATS692LSH(RSNPH)
Two-Wire, Differential, Vibration Resistant Sensor IC with Speed and Direction Output
Revision History
Revision Rev. 2 Revision Date July 10, 2012 Description of Revision Upgrades to select graphics
Copyright 2010-2012, Allegro MicroSystems, Inc. Allegro MicroSystems, Inc. reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. Allegros products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the failure of that life support device or system, or to affect the safety or effectiveness of that device or system. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use.
For the latest version of this document, visit our website: www.allegromicro.com
Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com
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