TA8050P

TOSHIBA Bipolar Linear Integrated Circuit Silicon Monolithic

TA8050P
1.5 A Motor Driver with Brake Function
The TA8050P is a 1.5 A motor driver that directly drives a bidirectional DC motor. Inputs DI1 and DI2 are combined to select one of forward, reverse, stop, and brake modes. Since the inputs are TTL-compatible, this IC can be controlled directly from a CPU or other control system. The IC also has various protective functions.

Features
Bidirectional DC motor driver Current capacity Four modes Detection functions Plastic HSIP-7 pin : 1.5 A : Forward, Reverse, Stop, and Brake : Overheat Detection, Overcurrent Detection, and Overvoltage Detection Weight: 1.9 g (typ.)

Recommended operating supply voltage range: VCC = 6 V to 16 V Built-in diodes for absorbing counter-electromotive force

Block Diagram and Pin Layout

Overheat detection and overvoltage detection

Control logic

Overcurrent detection

Note :

Some functional blocks, circuits, or constants have been omitted or simplified in the block diagram to clarify the descriptions of the relevant features.

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Pin Description
Pin No. 1 2 3 4 5 6 7 Symbol DI1 DI2 M (+) GND M () NC VCC Description Output status control pin. Connects to a PNP-type voltage comparator. Connects to the DC motor. Both the sink and the source have a current capacity of 1.5 A. Diodes for absorbing counter-electromotive force are contained on the VCC and GND sides. Grounded Connects to the DC motor together with pin 3 and has the same function as pin 3. This pin is controlled by the inputs from pins 1 and 2. Not connected. (Electrically, this pin is completely open.) Power supply pin. This pin has a function to turn off the output when the applied voltage exceeds 27.5 V, thus protecting the IC and the load.

Truth Table
Input DI1 H L H L DI2 H H L L M (+) L L H Output M () L H L (Note) (Note)

OFF (high impedance)

Note:

Brake mode comes into effect when both M (+) and M () go Low; Stop mode comes into effect when both M (+) and M () turn OFF.

Description of Multi-detection Operation

The TA8050P has functions for detecting overvoltage (VSD), overcurrent (ISD), and overheating (TSD). These functions temporarily protect the IC (and the motor load in some cases) from deterioration or destruction due to power-related overstress. The three functions work independently and each function is explained below.

VSD ISD TSD Control logic DI1 DI2

M (+)

M ()

Note 1: These functions are intended to protect the IC from instantaneous faults, including output short circuits, and are not designed to protect the IC from all types of faults. Note 2: If the IC is used beyond the maximum ratings, it may be damaged before the detection circuits are activated. Note 3: These functions are not activated if the operating voltage is less than 6 V. In this range, short-circuiting the output can cause damage to the IC.

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1. Overvoltage detection (VSD)
Basic operation When the voltage supplied to the VCC pin is up to the VSD detection voltage, the output is controlled by the input signals. However, when the VCC voltage exceeds the detection voltage, the output enters high-impedance state regardless of the input signals. Detailed description The VSD voltage is detected by comparing the Zener voltage with the voltage obtained by dividing VCC with a resistor. When the center voltage of the resistor is higher than the Zener voltage, a transistor-off instruction is issued to the control logic. When it is lower than the Zener voltage, the logic is controlled by the input signals from pins 1 and 2.

2. Overheat detection (TSD)

Basic operation When the junction (chip) temperature is up to the TSD detection temperature, the output is controlled by the input signals. When it exceeds the TSD detection temperature, the output enters high-impedance state regardless of the input signals. Detailed description The temperature is detected by monitoring the VF of a diode on the chip. When the diode VF is lower than the internal reference voltage, an output transistor-off instruction is issued to the control logic. When it is higher than the internal reference voltage, the logic is controlled by the input signals from pins 1 and 2.

3. Overcurrent detections (ISD)

Basic operation When the output current (pin 3 or 5, I sink or I source) is up to the ISD detection current, the output is controlled by the input signals. When it exceeds the detection current, the output assumes a switching waveform as shown in Figure 1.

Figure 1. Basic Operation

Detailed description The output current is detected by monitoring the VBE from each output transistor. One detection circuit connects to one of the output transistors and leads to the short-circuit protection circuit. When a current exceeding the ISD detection current flows through one of the four output transistors, the short-circuit protection circuit is activated. This circuit contains a timer. When the overcurrent condition continues for 20 s (typically), the protection circuit places the output in high-impedance mode and, 80 s (typically) later, returns the IC to ON mode. The switching-waveform output is repeated until the overcurrent condition is no longer present.

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Maximum Ratings (Ta = 25C)
Characteristic Supply voltage Input voltage Output current Operation temperature Storage temperature Power dissipation Symbol VCC VCC VIN IO-AVE Topr Tstg PD Rating 30 60 (1s) 0.3 to VCC 1.5 40 to 110 55 to 150 12.5 Unit V V A C C W

Note:

The absolute maximum ratings of a semiconductor device are a set of specified parameter values which must not be exceeded during operation, even for an instant. If any of these levels is exceeded during operation, the devices electrical characteristics may be irreparably altered and the reliability and lifetime of the device can no longer be guaranteed, possibly causing damage to any other equipment with which it is used. Applications using the device should be designed such that the maximum ratings will never be exceeded in any operating conditions. Ensuring that the parameter values remain within these specified ranges during device operation will help to ensure that the integrity of the device is not compromised.

Electrical Characteristics (VCC = 6 to 16 V, Tc = 40 to 110C)

Characteristic Symbol L ICC1 Current consumption ICC2 ICC3 Input voltage VIL VIH IIL IIH Vsat (total) ILEAK-U ILEAK-L VF-U VF-L ISD TSD VSD Rj-c tpLH tpHL DI1 / DI2 DI1 / DI2 M (+) / M () M (+) / M () M (+) / M () VCC Pin Test Circuit VIN = 0.4 V VIN = VCC IO = 1.5 A, Tc = 25C IO = 1.5 A, Tc = 110C VO = 0 V VO = VCC IF = 1.5 A Test Condition Stop Forward / Reverse Brake Min 2.0 1.8 25 Typ. 8 27 16 2.2 2.2 2.6 1.5 3 150 27.5 4 1 1 Max 15 50 30 0.8 100 100 2.9 2.8 100 100 4 30 10 10 V mA Unit

Input current

Output saturation voltage

Output leakage current

Diodes forward voltage Overcurrent detection Shutdown temperature Overvoltage detection Thermal resistance Transfer delay time

V A C V C / W s

Note: The parameter values above are guaranteed in the operating voltage range of 6 V to 16 V. If the guaranteed range is exceeded, the performance of the IC must be tested thoroughly in its application. It is the customers responsibility to evaluate the use of the IC.

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Reference Characteristics

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I / O Equivalent Circuit
VCC 7

M (+) 3

M () 5

GND 4

Overheat detection and overvoltage detection

Control logic

Overcurrent detection

DI1 1

DI2 2

Note: The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.

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Example Application Circuit
5V V * C1

10 F 7 VDD OUTPUT PORT1 PORT2 VSS 1 DI1 2 DI2 VCC M (+) 3

TA8050P
GND 4

M M () 5

Microprocessor

Caution on Wiring
Note 1: The capacitors C1 are for absorbing noise, etc. Connect each capacitor as close to the IC as possible. Note 2: Ensure that the IC is mounted correctly. Failing to do so may result in the IC or target equipment being damaged. Note 3: The application circuit shown above is not intended to guarantee mass production. A thorough evaluation is required when designing an application circuit for mass production.

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Package Dimensions

Weight: 1.9 g (typ.)

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RESTRICTIONS ON PRODUCT USE

The information contained herein is subject to change without notice.

030619EBA

The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the Handling Guide for Semiconductor Devices, or TOSHIBA Semiconductor Reliability Handbook etc.. The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (Unintended Usage). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customers own risk. The products described in this document are subject to the foreign exchange and foreign trade laws. TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced and sold, under any law and regulations.

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