Data Sheet: TDA1558Q
Data Sheet: TDA1558Q
Data Sheet: TDA1558Q
DATA SHEET
Philips Semiconductors
Product specication
TDA1558Q
Capability to handle high energy on outputs (VP = 0) Protected against electrostatic discharge No switch-on/switch-off plop Flexible leads Low thermal resistance Identical inputs (inverting and non-inverting).
The TDA1558Q is a monolithic integrated class-B output amplifier in a 17-lead single-in-line (SIL) plastic power package. The device contains 4 x 11 W single-ended or 2 x 22 W BTL amplifiers and has been primarily developed for car radio applications.
UNIT V A mA A
Stereo BTL application output power supply voltage ripple rejection noise output voltage input impedance DC output offset voltage closed loop voltage gain 22 200 46 W dB V k mV dB
ORDERING INFORMATION EXTENDED TYPE NUMBER TDA1558Q Note 1. SOT243-1; 1996 August 21. May 1992 2 PACKAGE PINS 17 PIN POSITION DIL MATERIAL plastic CODE SOT243R(1)
Philips Semiconductors
Product specication
TDA1558Q
13
input 1
output 1
CM
output 2
14 stand-by switch
mute/stand-by
4 x1
15 k mute switch 15 k
TDA1558Q
input 3
17 60 k VA 183
mute switch
CM
12
output 3
mute switch 60 k input 4 internal reference voltage 16 VA 15 183 reference voltage 3 signal ground 9 not connected
CM
10
output 4
11
MCD328 - 1
power ground
May 1992
Philips Semiconductors
Product specication
TDA1558Q
handbook, halfpage
1 2 3 4 5 6 7 8 9
TDA1558Q
FUNCTIONAL DESCRIPTION The TDA1558Q contains four identical amplifiers with differential input stages (two inverting and two non-inverting), and can be used for single-ended or BTL applications. The gain of each amplifier is fixed at 40 dB (46 dB in BTL). Special features of this device are: a. mute/stand-by switch low stand-by current (< 100 A) low mute/stand-by switching current (low cost supply switch) mute facility. b. the harmonic distortion at low frequencies can be decreased by connecting two diodes at pin 15 to ground or a zener diode of 1.5 V.
May 1992
Philips Semiconductors
Product specication
TDA1558Q
UNIT V V V V V mJ A A W C C
load dump protected; during 50 ms; rise time 2.5 ms VPSC VPR IOSM IORM Ptot Tstg Tj AC and DC short-circuit safe voltage reverse polarity energy handling capability at outputs non-repetitive peak output current repetitive peak output current total power dissipation storage temperature range junction temperature VP = 0 55
THERMAL RESISTANCE SYMBOL Rth vj-a Rth vj-c PARAMETER from virtual junction to ambient in free air from virtual junction to case (see Fig.3) THERMAL RESISTANCE 40 K/W 1.5 K/W
handbook, halfpage
output 1
4.0 K/W
4.0 K/W
4.0 K/W
4.0 K/W
0.8 K/W
0.8 K/W
MBC041
0.1 K/W
case
May 1992
Philips Semiconductors
Product specication
TDA1558Q
TYP.
MAX.
UNIT
V mA V mV
MUTE CONDITION mute voltage output signal in mute position DC output offset voltage VI = 1 V (max); f = 1 kHz between pins 6-8 and pins 10-12 STAND-BY CONDITION Vsb Isb Isw stand-by voltage DC current in stand-by condition switch-on current 0 12 2 100 40 V A A 3.3 V mV mV
AC CHARACTERISTICS VP = 14.4 V, RL = 4 , f = 1 kHz, Tamb = 25 C, unless otherwise specied. See note 1. SYMBOL PO PARAMETER output power CONDITIONS THD = 0.5% THD = 10% VP = 13.2 V; THD = 0.5% VP = 13.2 V; THD = 10% THD B flow fhigh Gv SVRR total harmonic distortion power bandwidth low frequency roll-off high frequency roll-off closed loop voltage gain supply voltage ripple rejection ON; note 5 MUTE; note 5 stand-by; note 5 45 45 80 dB dB dB PO = 1 W THD = 0.5%; PO = 1 dB with respect to 15 W 1 dB; note 4 1 dB 20 45 MIN. 15 20 TYP. 17 22 12 17 0.1 20 to 15 000 45 46 47 Hz kHz dB MAX. UNIT W W W W % Hz
May 1992
Philips Semiconductors
Product specication
TDA1558Q
TYP. 30
MAX. 38 300 1
UNIT k V V V dB dB
Quad single-ended application (see Fig.5) output power note 8 THD = 0.5% THD = 10% RL = 2 ; THD = 0.5% RL = 2 ; THD = 10% THD flow fhigh Gv SVRR total harmonic distortion low frequency roll-off high frequency roll-off closed loop voltage gain supply voltage ripple rejection note 5 ON MUTE stand-by |ZI| Vno input impedance noise output voltage ON; RS = 0; note 6 RS = 10 k; note 6 MUTE; notes 6 and 7 |Gv| channel separation channel unbalance RS = 10 k 40 150 250 120 230 1 V V V dB dB 44 44 80 50 60 75 dB dB dB k PO = 1 W 3 dB; note 4 1 dB 4 5.5 7.5 10 20 39 5 6 8.5 11 0.1 45 40 41 W W W W % Hz kHz dB
Notes to the characteristics 1. All characteristics are measured using the circuit shown in Fig.4 2. The circuit is DC adjusted at VP = 6 to 18 V and AC operating at VP = 8.5 to 18 V. 3. At 18 V < VP < 30 V, the DC output voltage VP/2. 4. Frequency response externally fixed. 5. Ripple rejection measured at the output with a source-impedance of 0 (max. ripple amplitude of 2 V) and a frequency between 100 Hz and 10 kHz. 6. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz. 7. Noise output voltage independent of RS (Vin = 0). 8. Output power is measured directly at the output pins of the IC.
May 1992
Philips Semiconductors
Product specication
TDA1558Q
+ VP 100 nF 15 14 5 13 2200 F
220 nF input 1
1 6
R L= 4
60 k
TDA1558Q
reference voltage
4
1 2
VP
60 k 12
220 nF input 3
17
60 k 10 input 4 16
R L= 4
11
MCD327 - 1
May 1992
Philips Semiconductors
Product specication
TDA1558Q
VP
+ 14.4 V 2200 F
220 nF input 1
1 6 1000 F 60 k output 1 RL
8 2 1000 F 3 60 k
output 2 RL
TDA1558Q
reference voltage
4 VP 2 17
60 k 12 1000 F 60 k output 3 RL
220 nF input 3
220 nF input 4
10 16 1000 F
output 4 RL
11
MCD326 - 1
not connected
May 1992
Philips Semiconductors
Product specication
TDA1558Q
SOT243-1
non-concave D x Dh
Eh
A2
B j E A
L3
Q c
1 Z e e1 bp w M
17 m e2 v M
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 17.0 15.5 A2 4.6 4.2 bp 0.75 0.60 c 0.48 0.38 D (1) 24.0 23.6 d 20.0 19.6 Dh 10 E (1) 12.2 11.8 e 2.54 e1 e2 Eh 6 j 3.4 3.1 L 12.4 11.0 L3 2.4 1.6 m 4.3 Q 2.1 1.8 v 0.8 w 0.4 x 0.03 Z (1) 2.00 1.45
1.27 5.08
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT243-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
May 1992
10
Philips Semiconductors
Product specication
TDA1558Q
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
This data sheet contains target or goal specications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains nal product specications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specication is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specication. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
May 1992
11