Tda 1517
Tda 1517
DATA SHEET
Philips Semiconductors
Product specication
TDA1517; TDA1517P
GENERAL DESCRIPTION The TDA1517 is an integrated class-B dual output amplifier in a plastic single in-line medium power package with fin (SIL9MPF), a plastic rectangular-bent single in-line medium power package with n (RBS9MPF) or a plastic heat-dissipating dual in-line package (HDIP18). The device is primarily developed for multi-media applications.
MIN. 6.0
UNIT V A mA A A k W W dB dB dB V C
ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA1517/N3 TDA1517/N3/S5 TDA1517P SIL9MPF RBS9MPF HDIP18 DESCRIPTION plastic single in-line medium power package with n; 9 leads plastic rectangular-bent single in-line medium power package with n; 9 leads plastic heat-dissipating dual in-line package; 18 leads VERSION SOT110-1 SOT352-1 SOT398-1
2004 Feb 18
Philips Semiconductors
Product specication
TDA1517; TDA1517P
non-inverting input 1
1 60 k
mute switch
Cm
4 VA 2 k 18 k power stage
output 1
VP 8 stand-by switch VA 15 k x1 supply voltage ripple rejection output 3 15 k mute reference voltage 18 k mute switch stand-by reference voltage mute/stand-by switch input
TDA1517
2 k non-inverting input 2 VA 9 60 k input reference voltage mute switch signal ground 2 SGND 7 VP Cm power stage power ground 5 (substrate)
MLC351
output 2
PGND
2004 Feb 18
Philips Semiconductors
Product specication
TDA1517; TDA1517P
DESCRIPTION
supply voltage ripple rejection output output 1 power ground output 2 supply voltage mute/standby switch input non-inverting input 2
handbook, halfpage
1 2 3 4 5 6 7 8 9
MLC352
handbook, halfpage
1 2 3 4 5 6 7 8 9
MLC353
18 17 16 15 TDA1517P 14 13 12 11 10
TDA1517
Fig.2
FUNCTIONAL DESCRIPTION The TDA1517 contains two identical amplifiers with differential input stages. The gain of each amplifier is fixed at 20 dB. A special feature of the device is the mute/standby switch which has the following features: Low standby current (<100 A) Low mute/standby switching current (low cost supply switch) Mute condition. 2004 Feb 18 4
Philips Semiconductors
Product specication
TDA1517; TDA1517P
MIN. 55 40
UNIT
mJ A A W C C C
THERMAL RESISTANCE SYMBOL Rth(j-c) Rth(j-p) Rth(j-a) TYPE NUMBER TDA1517/N3; TDA1517/N3/S5 TDA1517P PARAMETER thermal resistance from junction to case thermal resistance from junction to pins VALUE 8 15 50 UNIT K/W K/W K/W
handbook, halfpage
18
MLC354
P (W) 12 (1)
(2) 6
2004 Feb 18
Philips Semiconductors
Product specication
TDA1517; TDA1517P
MIN.
TYP.
MAX.
UNIT
6.0
14.4 40 6.95 12
18.0 80 2
V mA V
2004 Feb 18
Philips Semiconductors
Product specication
TDA1517; TDA1517P
AC CHARACTERISTICS VP = 14.4 V; RL = 4 ; f = 1 kHz; Tamb = 25 C; measured in Fig.6; unless otherwise specied. SYMBOL Po THD flr fhr Gv SVRR PARAMETER output power total harmonic distortion low frequency roll-off high frequency roll-off closed loop voltage gain supply voltage ripple rejection on mute standby |Zi| Vno input impedance noise output voltage on on mute cs |Gv| Notes 1. Output power is measured directly at the output pins of the IC. 2. Frequency response externally fixed. 3. Ripple rejection measured at the output with a source impedance of 0 , maximum ripple amplitude of 2 V (p-p) and a frequency between 100 Hz and 10 kHz. 4. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz. 5. Noise output voltage independent of Rs (VI = 0 V). channel separation channel unbalance Rs = 0 ; note 4 Rs = 10 ; note 4 note 5 Rs = 10 40 50 70 50 0.1 100 1 V V V dB dB note 3 48 48 80 50 60 75 dB dB dB k CONDITIONS THD = 0.5%; note 1 THD = 10%; note 1 Po = 1 W at 3 dB; note 2 at 1 dB 4 5.5 20 19 MIN. 5 6.0 0.1 45 20 TYP. 21 MAX. UNIT W W % Hz kHz dB
2004 Feb 18
Philips Semiconductors
Product specication
TDA1517; TDA1517P
handbook, halfpage
18 V11 (V)
8.5 6.4
3.3 2 0
ON (IP = 40 mA)
standby (I P
100 A)
APPLICATION INFORMATION
standby switch 100 F 3 input reference voltage internal 1/2 V P 8 7 VP 100 nF 2200 F
TDA1517
220 nF input 1 60 k 1 20 dB 20 dB 60 k 9 220 nF input 2
5 1000 F
6
MLC356
signal ground
power ground
1000 F
2004 Feb 18
Philips Semiconductors
Product specication
TDA1517; TDA1517P
SOT110-1
D1 q P P1 A2
A3 q1 q2
A A4
seating plane
E pin 1 index
L 1 Z b2 e b b1 w M 9 Q
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 18.5 17.8 A2 max. 3.7 A3 8.7 8.0 A4 15.8 15.4 b 1.40 1.14 b1 0.67 0.50 b2 1.40 1.14 c 0.48 0.38 D (1) 21.8 21.4 D1 21.4 20.7 E (1) 6.48 6.20 e 2.54 L 3.9 3.4 P 2.75 2.50 P1 3.4 3.2 Q 1.75 1.55 q 15.1 14.9 q1 4.4 4.2 q2 5.9 5.7 w 0.25 Z (1) max. 1
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT110-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION
2004 Feb 18
Philips Semiconductors
Product specication
TDA1517; TDA1517P
RBS9MPF: plastic rectangular-bent single in-line medium power package with fin; 9 leads
SOT352-1
L 1 Z b2 e b b1 w M 9
D1 q P P1 Q A2
A3 q1 q2
A E pin 1 index c
seating plane v M 0 5 scale DIMENSIONS (mm are the original dimensions) UNIT A (1) mm 14.45 13.95 A2 max. 3.7 A3 8.7 8.0 b 1.40 1.14 b1 0.67 0.50 b2 1.40 1.14 c 0.48 0.38 D (2) 21.8 21.4 D1 21.4 20.7 E (2) 6.48 6.20 e 2.54 L 3.8 3.3 P 2.75 2.50 P1 3.4 3.2 Q 1.75 1.55 q 15.1 14.9 q1 4.4 4.2 q2 5.9 5.7 v 0.6 w 0.25 Z (2) max. 1 10 mm
Notes 1. Dimension is specified at seating plane. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT352-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION
2004 Feb 18
10
Philips Semiconductors
Product specication
TDA1517; TDA1517P
SOT398-1
ME
seating plane
A2
A1 L
b1 b b2 10
w M
c (e 1) MH
18
pin 1 index E
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.7 0.19 A1 min. 0.51 0.02 A2 max. 3.7 0.15 b 1.40 1.14 0.06 0.04 b1 0.67 0.50 0.03 0.02 b2 1.05 0.75 0.04 0.03 c 0.47 0.38 0.02 0.01 D (1) 21.85 21.35 0.87 0.84 E (1) 6.5 6.2 0.26 0.24 e 2.54 0.1 e1 7.62 0.3 L 3.9 3.1 0.15 0.12 ME 8.32 8.02 0.33 0.32 MH 8.7 7.7 0.34 0.30 w 0.25 0.01 Z (1) max. 1 0.04
Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT398-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION
2004 Feb 18
11
Philips Semiconductors
Product specication
TDA1517; TDA1517P
The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Manual soldering Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods SOLDERING METHOD PACKAGE DIPPING CPGA, HCPGA DBS, DIP, HDIP, RDBS, SDIP, SIL PMFP(2) Notes 1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 2. For PMFP packages hot bar soldering or manual soldering is suitable. suitable suitable suitable(1) not suitable WAVE
2004 Feb 18
12
Philips Semiconductors
Product specication
TDA1517; TDA1517P
DEFINITION This data sheet contains data from the objective specication for product development. Philips Semiconductors reserves the right to change the specication in any manner without notice. This data sheet contains data from the preliminary specication. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specication without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specication. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notication (CPCN).
II
III
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status Production), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2004 Feb 18
13
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales ofces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
SCA76
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
R30/05/pp14
Feb 18