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Data Sheet: 2 To 6 W Audio Power Amplifier
Data Sheet: 2 To 6 W Audio Power Amplifier
DATA SHEET
Philips Semiconductors
Product specication
TDA1011
The TDA1011 is a monolithic integrated audio amplifier circuit in a 9-lead single in-line (SIL) plastic package. The device is especially designed for portable radio and recorder applications and delivers up to 4 W in a 4 load impedance. The device can deliver up to 6 W into 4 at 16 V loaded supply in mains-fed applications. The maximum permissible supply voltage of 24 V makes this circuit very suitable for d.c. and a.c. apparatus, while the very low applicable supply voltage of 3,6 V permits 6 V applications. Special features are: single in-line (SIL) construction for easy mounting separated preamplifier and power amplifier high output power thermal protection high input impedance low current drain limited noise behaviour at radio frequencies QUICK REFERENCE DATA Supply voltage range Peak output current Output power at dtot = 10% VP = 16 V; RL = 4 VP = 12 V; RL = 4 VP = 9 V; RL = 4 VP = 6 V; RL = 4 Total harmonic distortion at Po = 1 W; RL = 4 Input impedance preamplier (pin 8) power amplier (pin 6) Total quiescent current Operating ambient temperature Storage temperature |Zi| |Zi| Itot Tamb Tstg > typ. typ. 100 k 20 k 14 mA Po Po Po Po dtot typ. typ. typ. typ. typ. 6,5 W 4,2 W 2,3 W 1,0 W 0,2 % VP IOM max. 3,6 to 20 V 3 A
25 to + 150 C 55 to +150 C
PACKAGE OUTLINE 9-lead SIL; plastic (SOT110B); SOT110-1; 1996 July 23.
November 1982
Philips Semiconductors
Product specication
TDA1011
November 1982
Philips Semiconductors
Product specication
TDA1011
24 V 3 A
HEATSINK DESIGN Assume VP = 12 V; RL = 4 ; Tamb = 60 C maximum; Po = 3,8 W. The maximum sine-wave dissipation is 1,8 W. The derating of 10 K/W of the package requires the following external heatsink (for sine-wave drive): 150 60 Rth j-a = Rth j-tab + Rth tab-h + Rth h-a = --------------------- = 50 K/W. 1, 8 Since Rth j-tab = 10 K/W and Rth tab-h = 1 K/W, Rth h-a = 50 (10 + 1) = 39 K/W.
November 1982
Philips Semiconductors
Product specication
TDA1011
A.C. CHARACTERISTICS Tamb = 25 C; VP = 12 V; RL = 4 ; f = 1 kHz unless otherwise specied; see also Fig.3. A.F. output power at dtot = 10% (note 1) with bootstrap: VP = 16 V; RL = 4 VP = 12 V; RL = 4 VP = 9 V; RL = 4 VP = 6 V; RL = 4 without bootstrap: VP = 12 V; RL = 4 Voltage gain: preamplier (note 2) power amplier total amplier Total harmonic distortion at Po = 1,5 W Frequency response; 3 dB (note 3) Input impedance: preamplier (note 4) power amplier Output impedance preamplier Output voltage preamplier (r.m.s. value) dtot < 1% (note 2) Noise output voltage (r.m.s. value; note 5) RS = 0 RS = 10 k Noise output voltage at f = 500 kHz (r.m.s. value) B = 5 kHz; RS = 0 Vn(rms) typ. 8 V Vn(rms) typ. Vn(rms) typ. < 0,2 mV 0,6 mV 1,4 mV Vo(rms) > 0,7 V |Zi1| |Zi2| |Zo1| > typ. typ. typ. 100 k 200 k 20 k 1 k Gv1 Gv2 Gv tot dtot B typ. typ. typ. typ. < 23 dB 21 to 25 dB 29 dB 27 to 31 dB 52 dB 50 to 54 dB 0,3 % 1 % Po typ. 3,0 W Po Po Po Po typ. > typ. typ. typ. 6,5 W 3,6 W 4,2 W 2,3 W 1,0 W
60 Hz to 15 kHz
November 1982
Philips Semiconductors
Product specication
TDA1011
42 dB 35 dB 35 mA
3. Measured at Po = 1 W ; the frequency response is mainly determined by C1 and C3 for the low frequencies and by C4 for the high frequencies. 4. Independent of load impedance of preamplifier. 5. Unweighted r.m.s. noise voltage measured at a bandwidth of 60 Hz to 15 kHz (12 dB/octave). 6. Ripple rejection measured with a source impedance between 0 and 2 k (maximum ripple amplitude: 2 V). 7. The tab must be electrically floating or connected to the substrate (pin 9).
November 1982
Philips Semiconductors
Product specication
TDA1011
November 1982
Philips Semiconductors
Product specication
TDA1011
Fig.6 Track side of printed-circuit board used for the circuit of Fig.4; p.c. board dimensions 62 mm 48 mm.
Fig.7 Component side of printed-circuit board showing component layout used for the circuit of Fig.4.
November 1982
Philips Semiconductors
Product specication
TDA1011
Fig.8
Total harmonic distortion as a function of output power across RL; _____ with bootstrap; without bootstrap; f = 1 kHz; typical values. The available output power is 5% higher when measured at pin 2 (due to series resistance of C10).
Fig.9
Output power across RL as a function of supply voltage with bootstrap; dtot = 10%; typical values. The available output power is 5% higher when measured at pin 2 (due to series resistance of C10).
November 1982
Philips Semiconductors
Product specication
TDA1011
November 1982
10
Philips Semiconductors
Product specication
TDA1011
Fig.13 Noise output voltage as a function of R2 (see Fig.4); measured according to A-curve; capacitor C5 is adapted for obtaining a constant bandwidth.
November 1982
11
Philips Semiconductors
Product specication
TDA1011
Fig.14 Noise output voltage as a function of frequency; curve a: total amplifier; curve b: power amplifier; B = 5 kHz; RS = 0; typical values.
November 1982
12
Philips Semiconductors
Product specication
TDA1011
SOT110-1
D1 q P P1 A2
A3 q1 q2
L 1 Z b2 e b b1 w M 9 Q
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 18.5 17.8 A2 max. 3.7 A3 8.7 8.0 A4 15.8 15.4 b 1.40 1.14 b1 0.67 0.50 b2 1.40 1.14 c 0.48 0.38 D (1) 21.8 21.4 D1 21.4 20.7 E (1) 6.48 6.20 e 2.54 L 3.9 3.4 P 2.75 2.50 P1 3.4 3.2 Q 1.75 1.55 q 15.1 14.9 q1 4.4 4.2 q2 5.9 5.7 w 0.25 Z (1) max. 1.0
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT110-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
November 1982
13
Philips Semiconductors
Product specication
TDA1011
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
This data sheet contains target or goal specications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains nal product specications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specication is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specication. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
November 1982
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