Tda4866 5
Tda4866 5
Tda4866 5
DATA SHEET
TDA4866
Full bridge current driven vertical
deflection booster
Product specification 2001 Aug 07
Supersedes data of 1999 Jun 14
File under Integrated Circuits, IC02
Philips Semiconductors Product specification
Notes
1. Voltages refer to pin 5 (GND).
2. Up to 60 V ≥ VFB ≥ 40 V a decoupling capacitor CFB = 22 µF (between pin 7 and pin 5) and a resistor RFB = 100 Ω
(between pin 7 and VFB) are required (see Fig.7).
3. Differential input current Iid = I1 − I2.
2001 Aug 07 2
Philips Semiconductors Product specification
ORDERING INFORMATION
TYPE PACKAGE
NUMBER NAME DESCRIPTION VERSION
TDA4866 SIL9P plastic single in-line power package; 9 leads SOT131-2
TDA4866J DBS9P plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); SOT523-1
exposed die pad
BLOCK DIAGRAM
8 3 5 7
TDA4866
GUARD FLYBACK
CIRCUIT GENERATOR
6 OUTA Idefl
AMPLIFIER A
INA 1 CSP vertical
RSP Rp deflection
coil
INPUT STAGE PROTECTION 9 FEEDB
Rref
INB 2 Rm
4 OUTB
AMPLIFIER B
from e.g.
TDA485x,
TDA4841PS
MED750
PINNING
2001 Aug 07 3
Philips Semiconductors Product specification
handbook, halfpage
INA 1 INA 1
INB 2 INB 2
VP 3 VP 3
OUTB 4 OUTB 4
VFB 7 VFB 7
GUARD 8 GUARD 8
FEEDB 9 FEEDB 9
MHB936 MHB937
Fig.2 Pin configuration (SIL version). Fig.3 Pin configuration (DBS version).
FUNCTIONAL DESCRIPTION Therefore the feedback current (I9) through Rref is:
The TDA4866 consists of a differential input stage, two Rm
I 9 ≈ ---------- × I defl
output stages, a flyback generator, a protection circuit for R ref
the output stages and a guard circuit.
The input stage directly compares the driver currents into
Differential input stage pins 1 and 2 with the feedback current I9. Any difference of
this comparison leads to a more or less driver current for
The differential input stage has a high CMRR differential the output stages. The relation between the deflection
current mode input (pins 1 and 2) that results in a high current and the differential input current (Iid) is:
electro-magnetic immunity and is especially suitable for
Rm
driver units with differential (e.g. TDA485x, TDA4841PS) I id = I 9 ≈ ---------- × I defl
and single ended current signals. Driver units with voltage R ref
outputs are simply applicable as well (e.g. two additional
Due to the feedback loop gain (VU loop) and internal
resistors are required).
bondwire resistance (Rbo) correction factors are required
The differential input stage delivers the driver signals for to determine the accurate value of Idefl:
the output stages.
R ref
I defl = I id × ------------------------ × 1 – -----------------
1
Output stages R m + R bo V U loop
2001 Aug 07 4
Philips Semiconductors Product specification
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); voltages referenced to pin 5 (GND); unless
otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VP supply voltage (pin 3) 0 30 V
VFB flyback supply voltage (pin 7) 0 60 V
IFB flyback supply current 0 ±1.8 A
V1, V2 input voltage 0 VP V
I1, I2 input current 0 ±5 mA
V4, V6 output voltage 0 VP V
I4, I6 output current note 1 0 ±1.8 A
V9 feedback voltage 0 VP V
I9 feedback current 0 ±5 mA
V8 guard voltage note 2 0 VP + 0.4 V
I8 guard current 0 ±5 mA
Tstg storage temperature −20 +150 °C
Tamb ambient temperature −20 +75 °C
Tj junction temperature note 3 −20 +150 °C
Ves electrostatic handling voltage note 4 −500 +500 V
Notes
1. Maximum output currents I4 and I6 are limited by current protection.
2. For VP > 13 V the guard voltage V8 is limited to 13 V.
3. Internally limited by thermal protection; switching point ≥150 °C.
4. Equivalent to discharging a 200 pF capacitor through a 0 Ω series resistor.
2001 Aug 07 5
Philips Semiconductors Product specification
THERMAL CHARACTERISTICS
Note
1. To minimize the thermal resistance from mounting base to heatsink [Rth(mb-h)] (DBS version) follow the
recommended mounting instruction: screw mounting preferred; torque = 40 Ncm; use heatsink compound.
CHARACTERISTICS
VP = 15 V; Tamb = 25 °C; VFB = 40 V; voltages referenced to pin 5 (GND); parameters are measured in test circuit
(see Fig.6); unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
VP supply voltage (pin 3) 8.2 − 25 V
VFB flyback supply voltage (pin 7) note 1 VP + 6 − 60 V
IFB quiescent feedback current (pin 7) no load; no signal − 7 10 mA
Input stage
Iid(p-p) differential input current (Iid = I1 − I2) − ±500 ±600 µA
(peak-to-peak value)
I1, 2(p-p) single ended input current note 2 0 ±300 ±600 µA
(peak-to-peak value)
CMRR common mode rejection ratio note 3 − −54 − dB
V1 input clamp voltage I1 = 300 µA 2.7 3.0 3.3 V
V2 input clamp voltage I2 = 300 µA 2.7 3.0 3.3 V
TCi,1 input clamp signal TC on pin 1 0 − ±800 µV/K
TCi,2 input clamp signal TC on pin 2 0 − ±800 µV/K
V1 − V2 differential input voltage Iid = 0 0 − ±10 mV
I9 feedback current − ±500 ±600 µA
V9 feedback voltage 1 − VP − 1 V
Iid(offset) differential input offset current Idefl = 0; Rref = 1.5 kΩ; 0 − ±20 µA
(Iid(offset) = I1 − I2) Rm = 1 Ω
Ci INA input capacity pin 1 referenced to GND − − 5 pF
Ci INB input capacity pin 2 referenced to GND − − 5 pF
Output stages A and B
I4 output current − − ±1 A
I6 output current − − ±1 A
V6 output A saturation voltage to GND I6 = 0.7 A − 1.3 1.5 V
I6 = 1.0 A − 1.6 1.8 V
V6,3 output A saturation voltage to VP I6 = 0.7 A − 2.3 2.9 V
I6 = 1.0 A − 2.7 3.3 V
V4 output B saturation voltage to GND I4 = 0.7 A − 1.3 1.5 V
I4 = 1.0 A − 1.6 1.8 V
2001 Aug 07 6
Philips Semiconductors Product specification
2001 Aug 07 7
Philips Semiconductors Product specification
driver current
I2
from TDA485x, TDA4841PS
on pin 2
V6
output voltage
on pin 6
VFB
VP
V4 output voltage
on pin 4
VP
tflb t
flyback time t flb MHA062
depends on V FB
2001 Aug 07 8
Philips Semiconductors Product specification
VP
TDA4866
VP
5
2
1
VP
9
4
VP
MED755
2001 Aug 07 9
Philips Semiconductors Product specification
I1 TDA4866
(µA)
550 1 2 3 4 5 6 7 8 9
50
t I Rm GUARD
1 1Ω output
from driver circuit
TDA485x,
TDA4841PS
I1
(µA) I2
6Ω
VP
550
Rref
50
t 2 kΩ
VFB MED752
TDA4866
1 2 3 4 5 6 7 8 9
I2 (2)
(2) Rp
VP
220 µF 180 Ω R
ref
RFB 1.6 kΩ
VFB MED753
(1) CFB
(1)
100 µF (VFB < 40 V)
2001 Aug 07 10
Philips Semiconductors Product specification
22 µF 220
vertical kΩ
output
MED754
signal
2001 Aug 07 11
Philips Semiconductors Product specification
Table 2 Calculated values To achieve good noise suppression the following values
for Rp are recommended:
SYMBOL VALUE UNIT
VP 8.6 V Table 3 Recommended values
tflb 270 µs Ldeflcoil Rp
Ptot 3.65 W (mH) (Ω)
Pdefl 0.9 W 3 100
PIC 2.75 W 6 180
Rth(tot) 12 K/W 10 240
Tj(max)(1) +83 °C 15 390
Note
1. Tj(max) = PIC × [Rth(j-mb) + Rth(mb-amb)] + Tamb
2001 Aug 07 12
Philips Semiconductors Product specification
PACKAGE OUTLINES
SIL9P: plastic single in-line power package; 9 leads SOT131-2
non-concave
Dh
x
Eh
d A2
B
seating plane
j E
A1
c
1 9
Z e w M Q
bp
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
95-03-11
SOT131-2
99-12-17
2001 Aug 07 13
Philips Semiconductors Product specification
DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad SOT523-1
q1
non-concave
x
Eh
Dh
D
D1 view B: mounting base side
P A2
k
q2
E B
L3
L2
L1
L
1 9
Z e1 w M Q c v M
bp
e m e2
0 5 10 mm
2.7 0.80 0.58 13.2 6.2 14.7 3.0 12.4 11.4 6.7 4.5 3.4 1.15 17.5 1.65
mm 3.5 3.5 2.54 1.27 5.08 2.8 4.85 3.8 0.8 0.3 0.02
2.3 0.65 0.48 12.8 5.8 14.3 2.0 11.0 10.0 5.5 3.7 3.1 0.85 16.3 3.6 1.10
Notes
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
2. Plastic surface within circle area D1 may protrude 0.04 mm maximum.
98-11-12
SOT523-1
00-07-03
2001 Aug 07 14
Philips Semiconductors Product specification
SOLDERING The total contact time of successive solder waves must not
exceed 5 seconds.
Introduction to soldering through-hole mount
packages The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
This text gives a brief insight to wave, dip and manual
specified maximum storage temperature (Tstg(max)). If the
soldering. A more in-depth account of soldering ICs can be
printed-circuit board has been pre-heated, forced cooling
found in our “Data Handbook IC26; Integrated Circuit
may be necessary immediately after soldering to keep the
Packages” (document order number 9398 652 90011).
temperature within the permissible limit.
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit Manual soldering
board.
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
Soldering by dipping or by solder wave
2 mm above it. If the temperature of the soldering iron bit
The maximum permissible temperature of the solder is is less than 300 °C it may remain in contact for up to
260 °C; solder at this temperature must not be in contact 10 seconds. If the bit temperature is between
with the joints for more than 5 seconds. 300 and 400 °C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods
SOLDERING METHOD
PACKAGE
DIPPING WAVE
DBS, DIP, HDIP, SDIP, SIL suitable suitable(1)
Note
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
2001 Aug 07 15
Philips Semiconductors Product specification
PRODUCT
DATA SHEET STATUS(1) DEFINITIONS
STATUS(2)
Objective specification Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Preliminary specification Qualification This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Product specification Production This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
DEFINITIONS DISCLAIMERS
Short-form specification The data in a short-form Life support applications These products are not
specification is extracted from a full data sheet with the designed for use in life support appliances, devices, or
same type number and title. For detailed information see systems where malfunction of these products can
the relevant data sheet or data handbook. reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
Limiting values definition Limiting values given are in
for use in such applications do so at their own risk and
accordance with the Absolute Maximum Rating System
agree to fully indemnify Philips Semiconductors for any
(IEC 60134). Stress above one or more of the limiting
damages resulting from such application.
values may cause permanent damage to the device.
These are stress ratings only and operation of the device Right to make changes Philips Semiconductors
at these or at any other conditions above those given in the reserves the right to make changes, without notice, in the
Characteristics sections of the specification is not implied. products, including circuits, standard cells, and/or
Exposure to limiting values for extended periods may software, described or contained herein in order to
affect device reliability. improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
Application information Applications that are
the use of any of these products, conveys no licence or title
described herein for any of these products are for
under any patent, copyright, or mask work right to these
illustrative purposes only. Philips Semiconductors make
products, and makes no representations or warranties that
no representation or warranty that such applications will be
these products are free from patent, copyright, or mask
suitable for the specified use without further testing or
work right infringement, unless otherwise specified.
modification.
2001 Aug 07 16
Philips Semiconductors Product specification
NOTES
2001 Aug 07 17
Philips Semiconductors Product specification
NOTES
2001 Aug 07 18
Philips Semiconductors Product specification
NOTES
2001 Aug 07 19
Philips Semiconductors – a worldwide company
Contact information
Printed in The Netherlands 753504/05/pp20 Date of release: 2001 Aug 07 Document order number: 9397 750 08444
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