INTEGRATED CIRCUITS

DATA SHEET

TDA8541
1 W BTL audio amplifier
Product specification 1998 Apr 01
Supersedes data of 1997 Feb 19
NXP Semiconductors Product specification

1 W BTL audio amplifier TDA8541

FEATURES GENERAL DESCRIPTION

• Flexibility in use The TDA8541(T) is a one channel audio power amplifier
• Few external components for an output power of 1 W with an 8 Ω load at a 5 V
supply. The circuit contains a BTL amplifier with a
• Low saturation voltage of output stage complementary PNP-NPN output stage and standby/mute
• Gain can be fixed with external resistors logic. The TDA8541T comes in an 8 pin SO package and
• Standby mode controlled by CMOS compatible levels the TDA8541 in an 8 pin DIP package.
• Low standby current
• No switch-on/switch-off plops APPLICATIONS

• High supply voltage ripple rejection • Portable consumer products

• Protected against electrostatic discharge • Personal computers
• Outputs short-circuit safe to ground, VCC and across the • Telephony.
load
• Thermally protected.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

VCC supply voltage 2.2 5 18 V
Iq quiescent current VCC = 5 V − 8 12 mA
Istb standby current − − 10 μA
Po output power THD = 10%; RL = 8 Ω; VCC = 5 V 1 1.2 − W
THD total harmonic distortion Po = 0.5 W − 0.15 − %
SVRR supply voltage ripple rejection 50 − − dB

ORDERING INFORMATION

TYPE PACKAGE
NUMBER NAME DESCRIPTION VERSION
TDA8541T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
TDA8541 DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1

1998 Apr 01 2
NXP Semiconductors Product specification

1 W BTL audio amplifier TDA8541

BLOCK DIAGRAM PINNING

SYMBOL PIN DESCRIPTION

MODE 1 operating mode select (standby,
mute, operating)
handbook, halfpage
SVR 2 half supply voltage, decoupling
TDA8541
− ripple rejection
4 5
IN− − OUT− IN+ 3 positive input
3
IN+ + IN− 4 negative input
R
VCC
6
R
OUT− 5 negative loudspeaker terminal
VCC 6 supply voltage
GND 7 ground
−
20 kΩ − 8 OUT+ 8 positive loudspeaker terminal
OUT+

2
+
SVR

20 kΩ handbook, halfpage
MODE 1 8 OUT+
1
MODE STANDBY/MUTE LOGIC SVR 2 7 GND
7
TDA8541
IN+ 3 6 VCC
GND
MGB972
IN− 4 5 OUT−

MGB971

Fig.1 Block diagram. Fig.2 Pin configuration.

FUNCTIONAL DESCRIPTION Mode select pin

The TDA8541(T) is a BTL audio power amplifier capable The device is in standby mode (with a very low current
of delivering 1 W output power to an 8 Ω load at consumption) if the voltage at the MODE pin is
THD = 10% using a 5 V power supply. Using the MODE >(VCC − 0.5 V), or if this pin is floating. At a MODE voltage
pin the device can be switched to standby and mute level of less than 0.5 V the amplifier is fully operational.
condition. The device is protected by an internal thermal In the range between 1.5 V and VCC − 1.5 V the amplifier
shutdown protection mechanism. The gain can be set is in mute condition. The mute condition is useful to
within a range from 6 dB to 30 dB by external feedback suppress plop noise at the output, caused by charging of
resistors. the input capacitor.

Power amplifier
The power amplifier is a Bridge Tied Load (BTL) amplifier
with a complementary PNP-NPN output stage.
The voltage loss on the positive supply line is the
saturation voltage of a PNP power transistor, on the
negative side the saturation voltage of an NPN power
transistor. The total voltage loss is <1 V and with a 5 V
supply voltage and an 8 Ω loudspeaker an output power of
1 W can be delivered.

1998 Apr 01 3
NXP Semiconductors Product specification

1 W BTL audio amplifier TDA8541

LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VCC supply voltage operating −0.3 +18 V
VI input voltage −0.3 VCC + 0.3 V
IORM repetitive peak output current − 1 A
Tstg storage temperature non-operating −55 +150 °C
Tamb operating ambient temperature −40 +85 °C
Vpsc AC and DC short-circuit safe voltage − 10 V
Ptot total power dissipation SO8 − 0.8 W
DIP8 − 1.2 W

QUALITY SPECIFICATION
In accordance with “SNW-FQ-611-E”. The number of the quality specification can be found in the “Quality Reference
Handbook”. The handbook can be ordered using the code 9397 750 00192.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

Rth j-a thermal resistance from junction to ambient in free air
TDA8541T (SO8) 160 K/W
TDA8541 (DIP8) 100 K/W

DC CHARACTERISTICS
VCC = 5 V; Tamb = 25 °C; RL = 8 Ω; VMODE = 0 V; measured in test circuit Fig.3; unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

VCC supply voltage operating 2.2 5 18 V
Iq quiescent current RL = ∞; note 1 − 8 12 mA
Istb standby current VMODE = VCC − − 10 μA
VO DC output voltage note 2 − 2.2 − V
⎪VOUT+ − VOUT−⎪ differential output voltage offset − − 50 mV
IIN+, IIN− input bias current − − 500 nA
VMODE input voltage mode select operating 0 − 0.5 V
mute 1.5 − VCC − 1.5 V
standby VCC − 0.5 − VCC V
IMODE input current mode select 0 < VMODE < VCC − − 20 μA

Notes
1. With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal
to the DC output offset voltage divided by RL.
2. The DC output voltage with respect to ground is approximately 0.5 × VCC.

1998 Apr 01 4
NXP Semiconductors Product specification

1 W BTL audio amplifier TDA8541

AC CHARACTERISTICS
VCC = 5 V; Tamb = 25 °C; RL = 8 Ω; f = 1 kHz; VMODE = 0 V; measured in test circuit Fig.3; unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Po output power THD = 10% 1 1.2 − W
THD = 0.5% 0.6 0.9 − W
THD total harmonic distortion Po = 0.5 W − 0.15 0.3 %
Gv closed loop voltage gain note 1 6 − 30 dB
Zi differential input impedance − 100 − kΩ
Vno noise output voltage note 2 − − 100 μV
SVRR supply voltage ripple rejection note 3 50 − − dB
note 4 40 − − dB
Vo output voltage in mute condition note 5 − − 200 μV

Notes
1. Gain of the amplifier is 2 × R2/R1 in test circuit of Fig.3.
2. The noise output voltage is measured at the output in a frequency range from 20 Hz to 20 kHz (unweighted), with a
source impedance of RS = 0 Ω at the input.
3. Supply voltage ripple rejection is measured at the output, with a source impedance of RS = 0 Ω at the input.
The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS), which is applied to
the positive supply rail.
4. Supply voltage ripple rejection is measured at the output, with a source impedance of RS = 0 Ω at the input.
The ripple voltage is a sine wave with a frequency between 100 Hz and 20 kHz and an amplitude of 100 mV (RMS),
which is applied to the positive supply rail.
5. Output voltage in mute position is measured with an input voltage of 1 V (RMS) in a bandwidth of 20 kHz, so including
noise.

1998 Apr 01 5
NXP Semiconductors Product specification

1 W BTL audio amplifier TDA8541

TEST AND APPLICATION INFORMATION SE application

Test conditions Tamb = 25 °C if not specially mentioned, VCC = 7.5 V,
f = 1 kHz, RL = 4 Ω, Gv = 20 dB, audio band-pass
Because the application can be either Bridge-Tied Load
22 Hz to 22 kHz.
(BTL) or Single-Ended (SE), the curves of each application
are shown separately. The SE application diagram is shown in Fig.13.
The thermal resistance = 100 K/W for the DIP8 envelope; The capacitor value of C3 in combination with the load
the maximum sine wave power dissipation for impedance determines the low frequency behaviour.
Tamb = 25 °C is: The total harmonic distortion as a function of frequency
150 – 25 was measured with low-pass filter of 80 kHz. The value of
---------------------- = 1.25 W . capacitor C2 influences the behaviour of the SVRR at low
100
frequencies, increasing the value of C2 increases the
For Tamb = 60 °C the maximum total power dissipation is: performance of the SVRR.
150 – 60
---------------------- = 0.9 W .
100 General remark
The frequency characteristic can be adapted by
BTL application connecting a small capacitor across the feedback resistor.
Tamb = 25 °C if not specially mentioned, VCC = 5 V, To improve the immunity of HF radiation in radio circuit
f = 1 kHz, RL = 8 Ω, Gv = 20 dB, audio band-pass applications, a small capacitor can be connected in parallel
22 Hz to 22 kHz. with the feedback resistor (56 kΩ); this creates a low-pass
filter.
The BTL application diagram is shown in Fig.3.
The quiescent current has been measured without any
load impedance. The total harmonic distortion as a
function of frequency was measured with a low-pass filter
of 80 kHz. The value of capacitor C2 influences the
behaviour of the SVRR at low frequencies, increasing the
value of C2 increases the performance of the SVRR.
The figure of the mode select voltage (Vms) as a function
of the supply voltage shows three areas; operating, mute
and standby. It shows, that the DC-switching levels of the
mute and standby respectively depends on the supply
voltage level.

1998 Apr 01 6
NXP Semiconductors Product specification

1 W BTL audio amplifier TDA8541

BTL APPLICATION

handbook, full pagewidth

VCC
R2 56 kΩ
C1 6 100 nF 100 μF
R1 IN−
4 OUT−
1 μF 11 kΩ IN+ 5
3
Vin SVR TDA8541 RL
2 OUT+
C2 MODE 8
47 μF 1
7

GND MBH881

R2
Gain = 2 × --------
R1

Fig.3 BTL application.

MGD876 MGD877
15 10
handbook, halfpage handbook, halfpage
Iq
(mA) THD
(%)
(1) (2)
10 1

5 10−1

0 10−2
0 4 8 12 16 20 10−2 10−1 1 10
VCC (V) Po (W)

f = 1 kHz, Gv = 20 dB.
(1) VCC = 5 V, RL = 8 Ω.
RL = ∞. (2) VCC = 9 V, RL = 16 Ω.

Fig.4 Iq as a function of VCC. Fig.5 THD as a function of Po.

1998 Apr 01 7
NXP Semiconductors Product specification

1 W BTL audio amplifier TDA8541

MGD878 MGD879
10 −20
handbook, halfpage handbook, halfpage

THD SVRR
(%) (dB)

1 −40

(1)
(1) (2)

(2)
10−1 −60 (3)

10−2 −80
10 102 103 104 105 10 102 103 104 105
f (Hz) f (Hz)

VCC = 5 V, 8 Ω, Rs = 0 Ω, Vi = 100 mV.

Po = 0.5 W, Gv = 20 dB. (1) Gv = 30 dB.
(1) VCC = 5 V, RL = 8 Ω. (2) Gv = 20 dB.
(2) VCC = 9 V, RL = 16 Ω. (3) Gv = 6 dB.

Fig.6 THD as a function of frequency. Fig.7 SVRR as a function of frequency.

MGD880 MGD881
2.5 2
handbook, halfpage handbook, halfpage
Po P
(W) (W)
2
1.5

(1) (2)
1.5
(1) (2)
1

0.5
0.5

0 0
0 4 8 12 0 4 8 12
VCC (V) VCC (V)

THD = 10%. (1) RL = 8 Ω.

(1) RL = 8 Ω. (2) RL = 16 Ω.
(2) RL = 16 Ω.
Fig.9 Worst case power dissipation as a function
Fig.8 Po as a function of VCC. of VCC.

1998 Apr 01 8
NXP Semiconductors Product specification

1 W BTL audio amplifier TDA8541

MGD882 MGD883
1.6 10
handbook, halfpage handbook,
V halfpage
o
P (V)
(1)
(W) 1

1.2
10−1

10−2 (1) (2) (3)

0.8 (2)
10−3

10−4
0.4

10−5

0 10−6
0 0.5 1 1.5 2 2.5 10−1 1 10 102
Po (W) Vms (V)

Band-pass = 22 Hz to 22 kHz.
Sine wave of 1 kHz. (1) VCC = 3 V.
(1) VCC = 9 V, RL = 16 Ω. (2) VCC = 5 V.
(2) VCC = 5 V, RL = 8 Ω. (3) VCC = 12 V.

Fig.10 P as a function of Po. Fig.11 Vo as a function of Vms.

MGL070
16
handbook, halfpage
Vms
(V)

12
standby

mute

operating
0
0 4 8 12 16
VP (V)

Fig.12 Vms as a function of VP.

1998 Apr 01 9
NXP Semiconductors Product specification

1 W BTL audio amplifier TDA8541

SE APPLICATION

handbook, full pagewidth VCC

R2 110 kΩ
C1 6 100 nF 100 μF
R1 IN−
4
1 μF 11 kΩ C3
IN+ OUT−
3 5
Vin SVR TDA8541 470 μF
2 RL
C2 MODE OUT+
1 8
47 μF
7

GND MBH882

Gain = R2
--------
R1

Fig.13 SE application.

MGD884 MGD885
10 10
handbook, halfpage handbook, halfpage

THD THD
(%) (%)

1 1

(1)

(2) (1)

10−1 (3) 10−1 (2)

(3)

10−2 10−2
10−2 10−1 1 10 10 102 103 104 105
Po (W) f (Hz)

f = 1 kHz, Gv = 20 dB. Po = 0.5 W, Gv = 20 dB.

(1) VCC = 7.5 V, RL = 4 Ω. (1) VCC = 7.5 V, RL = 4 Ω.
(2) VCC = 9 V, RL = 8 Ω. (2) VCC = 9 V, RL = 8 Ω.
(3) VCC = 12 V, RL = 16 Ω. (3) VCC = 12 V, RL = 16 Ω.

Fig.14 THD as a function of Po. Fig.15 THD as a function of frequency.

1998 Apr 01 10
NXP Semiconductors Product specification

1 W BTL audio amplifier TDA8541

MGD886 MGD887
−20 2
handbook, halfpage handbook, halfpage
Po
SVRR (W)
(dB) 1.6

−40
(1) (2) (3)
1.2

(1)
0.8
(2)
−60

(3) 0.4

−80 0
10 102 103 104 105 0 4 8 12 16
f (Hz) VCC (V)

VCC = 7.5 V, RL = 4 Ω, Rs = 0 Ω, Vi = 100mV.

(1) Gv = 24 dB. (1) THD = 10%, RL = 4 Ω.
(2) Gv = 20 dB. (2) THD = 10%, RL = 8 Ω.
(3) Gv = 0 dB. (3) THD = 10%, RL = 16 Ω.

Fig.16 SVRR as a function of frequency. Fig.17 Po as a function of VCC.

MGD888 MGD889
1.6 1.2
handbook, halfpage handbook, halfpage
P
P (1)
(W)
(W) (2)
1.2
0.8
(3)
(1) (2) (3)
0.8

0.4
0.4

0 0
0 4 8 12 16 0 0.4 0.8 1.2 1.6
VCC (V) Po (W)

(1) RL = 4 Ω.
(1) VCC = 7.5 V, RL = 4 Ω.
(2) RL = 8 Ω. (2) VCC = 12 V, RL = 16 Ω.
(3) RL = 16 Ω.
(3) VCC = 9 V, RL = 8 Ω.

Fig.18 Worst case power dissipation as a function

Fig.19 Power dissipation as a function of Po.
of VCC.

1998 Apr 01 11
NXP Semiconductors Product specification

1 W BTL audio amplifier TDA8541

handbook, full pagewidth

a. Top view.

MS 6.8 kΩ
6.8 kΩ
1 8
OUT+
IN 1 μF 11 kΩ
TDA8541
OUT−
4 5
56 kΩ
100 nF
47 μF

100 μF

+VP

MBH920

b. Component side.

Fig.20 Printed-circuit board layout (BTL and SE).

1998 Apr 01 12
NXP Semiconductors Product specification

1 W BTL audio amplifier TDA8541

PACKAGE OUTLINES
SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

D E A
X

y HE v M A

8 5

Q
A2
(A 3) A
A1
pin 1 index
θ
Lp

1 4 L

e w M detail X
bp

0 2.5 5 mm
scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A
UNIT max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ

0.25 1.45 0.49 0.25 5.0 4.0 6.2 1.0 0.7 0.7
mm 1.75 0.25 1.27 1.05 0.25 0.25 0.1
0.10 1.25 0.36 0.19 4.8 3.8 5.8 0.4 0.6 0.3 8o
o
0.010 0.057 0.019 0.0100 0.20 0.16 0.244 0.039 0.028 0.028 0
inches 0.069 0.01 0.05 0.041 0.01 0.01 0.004
0.004 0.049 0.014 0.0075 0.19 0.15 0.228 0.016 0.024 0.012

Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

OUTLINE REFERENCES EUROPEAN

ISSUE DATE
VERSION IEC JEDEC JEITA PROJECTION

99-12-27
SOT96-1 076E03 MS-012
03-02-18

1998 Apr 01 13
NXP Semiconductors Product specification

1 W BTL audio amplifier TDA8541

DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1

D ME
seating plane

A2 A

L A1

c
Z w M
b1
e (e 1)

MH
b b2
8 5

pin 1 index
E

1 4

0 5 10 mm
scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT
A A1 A2
b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1)
max. min. max. max.
1.73 0.53 1.07 0.36 9.8 6.48 3.60 8.25 10.0
mm 4.2 0.51 3.2 2.54 7.62 0.254 1.15
1.14 0.38 0.89 0.23 9.2 6.20 3.05 7.80 8.3

inches 0.068 0.021 0.042 0.014 0.39 0.26 0.14 0.32 0.39
0.17 0.02 0.13 0.1 0.3 0.01 0.045
0.045 0.015 0.035 0.009 0.36 0.24 0.12 0.31 0.33

Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

OUTLINE REFERENCES EUROPEAN

ISSUE DATE
VERSION IEC JEDEC JEITA PROJECTION

99-12-27
SOT97-1 050G01 MO-001 SC-504-8
03-02-13

1998 Apr 01 14
NXP Semiconductors Product specification

1 W BTL audio amplifier TDA8541

SOLDERING Several techniques exist for reflowing; for example,

thermal conduction by heated belt. Dwell times vary
Introduction
between 50 and 300 seconds depending on heating
There is no soldering method that is ideal for all IC method. Typical reflow temperatures range from
packages. Wave soldering is often preferred when 215 to 250 °C.
through-hole and surface mounted components are mixed
Preheating is necessary to dry the paste and evaporate
on one printed-circuit board. However, wave soldering is
the binding agent. Preheating duration: 45 minutes at
not always suitable for surface mounted ICs, or for
45 °C.
printed-circuits with high population densities. In these
situations reflow soldering is often used.
WAVE SOLDERING
This text gives a very brief insight to a complex technology.
Wave soldering techniques can be used for all SO
A more in-depth account of soldering ICs can be found in
packages if the following conditions are observed:
our “IC Package Databook” (order code 9398 652 90011).
• A double-wave (a turbulent wave with high upward
DIP pressure followed by a smooth laminar wave) soldering
technique should be used.
SOLDERING BY DIPPING OR BY WAVE
• The longitudinal axis of the package footprint must be
The maximum permissible temperature of the solder is parallel to the solder flow.
260 °C; solder at this temperature must not be in contact • The package footprint must incorporate solder thieves at
with the joint for more than 5 seconds. The total contact
the downstream end.
time of successive solder waves must not exceed
5 seconds. During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
The device may be mounted up to the seating plane, but applied by screen printing, pin transfer or syringe
the temperature of the plastic body must not exceed the
dispensing. The package can be soldered after the
specified maximum storage temperature (Tstg max). If the
adhesive is cured.
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the Maximum permissible solder temperature is 260 °C, and
temperature within the permissible limit. maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
REPAIRING SOLDERED JOINTS 6 seconds. Typical dwell time is 4 seconds at 250 °C.
Apply a low voltage soldering iron (less than 24 V) to the A mildly-activated flux will eliminate the need for removal
lead(s) of the package, below the seating plane or not of corrosive residues in most applications.
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in REPAIRING SOLDERED JOINTS
contact for up to 10 seconds. If the bit temperature is
Fix the component by first soldering two diagonally-
between 300 and 400 °C, contact may be up to 5 seconds. opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
SO
time must be limited to 10 seconds at up to 300 °C. When
REFLOW SOLDERING using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
Reflow soldering techniques are suitable for all SO
270 and 320 °C.
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

1998 Apr 01 15
NXP Semiconductors Product specification

1 W BTL audio amplifier TDA8541

DATA SHEET STATUS

DOCUMENT PRODUCT
DEFINITION
STATUS(1) STATUS(2)
Objective data sheet Development This document contains data from the objective specification for product
development.
Preliminary data sheet Qualification This document contains data from the preliminary specification.
Product data sheet Production This document contains the product specification.

Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.

DISCLAIMERS property or environmental damage. NXP Semiconductors

accepts no liability for inclusion and/or use of NXP
Limited warranty and liability ⎯ Information in this
Semiconductors products in such equipment or
document is believed to be accurate and reliable.
applications and therefore such inclusion and/or use is at
However, NXP Semiconductors does not give any
the customer’s own risk.
representations or warranties, expressed or implied, as to
the accuracy or completeness of such information and Applications ⎯ Applications that are described herein for
shall have no liability for the consequences of use of such any of these products are for illustrative purposes only.
information. NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
In no event shall NXP Semiconductors be liable for any
specified use without further testing or modification.
indirect, incidental, punitive, special or consequential
damages (including - without limitation - lost profits, lost Customers are responsible for the design and operation of
savings, business interruption, costs related to the their applications and products using NXP
removal or replacement of any products or rework Semiconductors products, and NXP Semiconductors
charges) whether or not such damages are based on tort accepts no liability for any assistance with applications or
(including negligence), warranty, breach of contract or any customer product design. It is customer’s sole
other legal theory. responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the
Notwithstanding any damages that customer might incur
customer’s applications and products planned, as well as
for any reason whatsoever, NXP Semiconductors’
for the planned application and use of customer’s third
aggregate and cumulative liability towards customer for
party customer(s). Customers should provide appropriate
the products described herein shall be limited in
design and operating safeguards to minimize the risks
accordance with the Terms and conditions of commercial
associated with their applications and products.
sale of NXP Semiconductors.
NXP Semiconductors does not accept any liability related
Right to make changes ⎯ NXP Semiconductors
to any default, damage, costs or problem which is based
reserves the right to make changes to information
on any weakness or default in the customer’s applications
published in this document, including without limitation
or products, or the application or use by customer’s third
specifications and product descriptions, at any time and
party customer(s). Customer is responsible for doing all
without notice. This document supersedes and replaces all
necessary testing for the customer’s applications and
information supplied prior to the publication hereof.
products using NXP Semiconductors products in order to
Suitability for use ⎯ NXP Semiconductors products are avoid a default of the applications and the products or of
not designed, authorized or warranted to be suitable for the application or use by customer’s third party
use in life support, life-critical or safety-critical systems or customer(s). NXP does not accept any liability in this
equipment, nor in applications where failure or malfunction respect.
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe

1998 Apr 01 16
NXP Semiconductors Product specification

1 W BTL audio amplifier TDA8541

Limiting values ⎯ Stress above one or more limiting Quick reference data ⎯ The Quick reference data is an
values (as defined in the Absolute Maximum Ratings extract of the product data given in the Limiting values and
System of IEC 60134) will cause permanent damage to Characteristics sections of this document, and as such is
the device. Limiting values are stress ratings only and not complete, exhaustive or legally binding.
(proper) operation of the device at these or any other
Non-automotive qualified products ⎯ Unless this data
conditions above those given in the Recommended
sheet expressly states that this specific NXP
operating conditions section (if present) or the
Semiconductors product is automotive qualified, the
Characteristics sections of this document is not warranted.
product is not suitable for automotive use. It is neither
Constant or repeated exposure to limiting values will
qualified nor tested in accordance with automotive testing
permanently and irreversibly affect the quality and
or application requirements. NXP Semiconductors accepts
reliability of the device.
no liability for inclusion and/or use of non-automotive
Terms and conditions of commercial sale ⎯ NXP qualified products in automotive equipment or
Semiconductors products are sold subject to the general applications.
terms and conditions of commercial sale, as published at
In the event that customer uses the product for design-in
http://www.nxp.com/profile/terms, unless otherwise
and use in automotive applications to automotive
agreed in a valid written individual agreement. In case an
specifications and standards, customer (a) shall use the
individual agreement is concluded only the terms and
product without NXP Semiconductors’ warranty of the
conditions of the respective agreement shall apply. NXP
product for such automotive applications, use and
Semiconductors hereby expressly objects to applying the
specifications, and (b) whenever customer uses the
customer’s general terms and conditions with regard to the
product for automotive applications beyond NXP
purchase of NXP Semiconductors products by customer.
Semiconductors’ specifications such use shall be solely at
No offer to sell or license ⎯ Nothing in this document customer’s own risk, and (c) customer fully indemnifies
may be interpreted or construed as an offer to sell products NXP Semiconductors for any liability, damages or failed
that is open for acceptance or the grant, conveyance or product claims resulting from customer design and use of
implication of any license under any copyrights, patents or the product for automotive applications beyond NXP
other industrial or intellectual property rights. Semiconductors’ standard warranty and NXP
Semiconductors’ product specifications.
Export control ⎯ This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.

1998 Apr 01 17
 NXP Semiconductors
provides High Performance Mixed Signal and Standard Product
solutions that leverage its leading RF, Analog, Power Management,
Interface, Security and Digital Processing expertise

Customer notification

This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.

Contact information

For additional information please visit: http://www.nxp.com

For sales offices addresses send e-mail to: salesaddresses@nxp.com

© NXP B.V. 2010

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands 545102/00/05/pp18 Date of release: 1998 Apr 01 Document order number: 9397 750 03352