Data Sheet: 8-Bit A/D and D/A Converter

INTEGRATED CIRCUITS
DATA SHEET
PCF8591 8-bit A/D and D/A converter

Product specication Supersedes data of 2001 Dec 13 2003 Jan 27
Philips Semiconductors
Product specication
8-bit A/D and D/A converter

CONTENTS 1 2 3 4 5 6 7 7.1 7.2 7.3 7.4 7.5 7.6 8 8.1 8.2 8.3 8.4 8.5 9 10 11 12 13 14 15 16 17 17.1 17.2 17.3 17.4 18 19 20 21 FEATURES APPLICATIONS GENERAL DESCRIPTION ORDERING INFORMATION BLOCK DIAGRAM PINNING FUNCTIONAL DESCRIPTION Addressing Control byte D/A conversion A/D conversion Reference voltage Oscillator CHARACTERISTICS OF THE I2C-BUS Bit transfer Start and stop conditions System configuration Acknowledge I2C-bus protocol LIMITING VALUES HANDLING DC CHARACTERISTICS D/A CHARACTERISTICS A/D CHARACTERISTICS AC CHARACTERISTICS APPLICATION INFORMATION PACKAGE OUTLINES SOLDERING Introduction to soldering through-hole mount packages Soldering by dipping or by solder wave Manual soldering Suitability of through-hole mount IC packages for dipping and wave soldering methods DATA SHEET STATUS DEFINITIONS DISCLAIMERS PURCHASE OF PHILIPS I2C COMPONENTS
PCF8591
2003 Jan 27
Product specication

1 FEATURES
PCF8591
Single power supply Operating supply voltage 2.5 V to 6 V Low standby current Serial input/output via I2C-bus Address by 3 hardware address pins Sampling rate given by I2C-bus speed 4 analog inputs programmable as single-ended or differential inputs Auto-incremented channel selection Analog voltage range from VSS to VDD On-chip track and hold circuit 8-bit successive approximation A/D conversion Multiplying DAC with one analog output. 2 APPLICATIONS 3 GENERAL DESCRIPTION
The PCF8591 is a single-chip, single-supply low power 8-bit CMOS data acquisition device with four analog inputs, one analog output and a serial I2C-bus interface. Three address pins A0, A1 and A2 are used for programming the hardware address, allowing the use of up to eight devices connected to the I2C-bus without additional hardware. Address, control and data to and from the device are transferred serially via the two-line bidirectional I2C-bus. The functions of the device include analog input multiplexing, on-chip track and hold function, 8-bit analog-to-digital conversion and an 8-bit digital-to-analog conversion. The maximum conversion rate is given by the maximum speed of the I2C-bus.
Closed loop control systems Low power converter for remote data acquisition Battery operated equipment Acquisition of analog values in automotive, audio and TV applications. 4 ORDERING INFORMATION TYPE NUMBER PCF8591P PCF8591T
PACKAGE NAME DIP16 SO16 DESCRIPTION plastic dual in-line package; 16 leads (300 mil) plastic small outline package; 16 leads; body width 7.5 mm VERSION SOT38-4 SOT162-1
2003 Jan 27
Product specication

5 BLOCK DIAGRAM
PCF8591
handbook, full pagewidth
SCL SDA A0 A1 A2 EXT VDD VSS OSC
I2C BUS INTERFACE
PCF8591
STATUS REGISTER
DAC DATA REGISTER
ADC DATA REGISTER
POWER ON RESET OSCILLATOR
CONTROL LOGIC
AIN0 AIN1 AIN2 AIN3
ANALOGUE MULTIPLEXER
SAMPLE AND HOLD
COMPARATOR
SUCCESSIVE APPROXIMATION REGISTER/LOGIC
AOUT
SAMPLE AND HOLD
DAC
VREF AGND
MBL821
Fig.1 Block diagram.
PINNING SYMBOL PIN 1 2

handbook, halfpage
DESCRIPTION analog inputs (A/D converter)

AIN0 1 AIN1 2 16 VDD 15 AOUT 14 VREF 13 AGND
AINO AIN1 AIN2 AIN3 A0 A1 A2 VSS SDA SCL OSC EXT AGND VREF AOUT VDD
3 4 5 6 7 8 9 10 11 12 13 14 15 16 negative supply voltage I2C-bus data input/output I2C-bus clock input oscillator input/output external/internal switch for oscillator input analog ground voltage reference input analog output (D/A converter) positive supply voltage hardware address
AIN2 3 AIN3 4
PCF8591P
A0 5 A1 6 A2 7 VSS 8
MBL822
12 EXT 11 OSC 10 SCL 9 SDA
Fig.2 Pinning diagram (DIP16).
2003 Jan 27
Product specication
PCF8591
handbook, halfpage msb
lsb 0 0 1 A2 A1 A0 R/W
fixed part
handbook, halfpage
programmable part
MBL824
AIN0 AIN1 AIN2 AIN3 A0 A1 A2 VSS
1 2 3 4
16 VDD 15 AOUT 14 VREF 13 AGND
Fig.4 Address byte.
PCF8591T
5 6 7 8
MBL823
12 EXT 11 OSC 10 SCL 9 SDA
7.2
Control byte
The second byte sent to a PCF8591 device will be stored in its control register and is required to control the device function. The upper nibble of the control register is used for enabling the analog output, and for programming the analog inputs as single-ended or differential inputs. The lower nibble selects one of the analog input channels defined by the upper nibble (see Fig.5). If the auto-increment flag is set, the channel number is incremented automatically after each A/D conversion. If the auto-increment mode is desired in applications where the internal oscillator is used, the analog output enable flag in the control byte (bit 6) should be set. This allows the internal oscillator to run continuously, thereby preventing conversion errors resulting from oscillator start-up delay. The analog output enable flag may be reset at other times to reduce quiescent power consumption. The selection of a non-existing input channel results in the highest available channel number being allocated. Therefore, if the auto-increment flag is set, the next selected channel will be always channel 0. The most significant bits of both nibbles are reserved for future functions and have to be set to logic 0. After a Power-on reset condition all bits of the control register are reset to logic 0. The D/A converter and the oscillator are disabled for power saving. The analog output is switched to a high-impedance state.
Fig.3 Pinning diagram (SO16).
7 7.1
FUNCTIONAL DESCRIPTION Addressing
Each PCF8591 device in an I2C-bus system is activated by sending a valid address to the device. The address consists of a fixed part and a programmable part. The programmable part must be set according to the address pins A0, A1 and A2. The address always has to be sent as the first byte after the start condition in the I2C-bus protocol. The last bit of the address byte is the read/write-bit which sets the direction of the following data transfer (see Figs 4, 16 and 17).
2003 Jan 27
Product specication
PCF8591
msb 0 X X X 0 X X
lsb X CONTROL BYTE A/D CHANNEL NUMBER: 00 channel 0 01 channel 1 10 channel 2 11 channel 3 AUTO-INCREMENT FLAG: (active if 1) ANALOGUE INPUT PROGRAMMING: 00 Four single-ended inputs AIN0 channel 0 AIN1 channel 1 AIN2 channel 2 AIN3 channel 3 01 Three differential inputs AIN0 channel 0
AIN1 channel 1
AIN2 channel 2 AIN3
10
Single-ended and differential mixed AIN0 channel 0 AIN1 channel 1 AIN2 channel 2 AIN3
11
Two differential inputs AIN0 channel 0 AIN1 AIN2 channel 1 AIN3
ANALOGUE OUTPUT ENABLE FLAG: (analogue output active if 1)

MBL825
Fig.5 Control byte.
2003 Jan 27
Product specication

7.3 D/A conversion
PCF8591
control register. In the active state the output voltage is held until a further data byte is sent. The on-chip D/A converter is also used for successive approximation A/D conversion. In order to release the DAC for an A/D conversion cycle the unity gain amplifier is equipped with a track and hold circuit. This circuit holds the output voltage while executing the A/D conversion. The output voltage supplied to the analog output AOUT is given by the formula shown in Fig.7. The waveforms of a D/A conversion sequence are shown in Fig.8.
The third byte sent to a PCF8591 device is stored in the DAC data register and is converted to the corresponding analog voltage using the on-chip D/A converter. This D/A converter consists of a resistor divider chain connected to the external reference voltage with 256 taps and selection switches. The tap-decoder switches one of these taps to the DAC output line (see Fig.6). The analog output voltage is buffered by an auto-zeroed unity gain amplifier. This buffer amplifier may be switched on or off by setting the analog output enable flag of the
VREF R256
DAC out
R255
FF
D7 R3 D6 TAP DECODER D0 R1 AGND 00

MBL826
R2
02
01
Fig.6 DAC resistor divider chain.
2003 Jan 27
Product specication
PCF8591
msb D7 D6 D5 D4 D3 D2 D1
lsb D0 DAC data register
MBL827
VAOUT VDD VREF
VAOUT = VAGND +
VREF - VAGND 7 Di 2i 256 i=0
VAGND VSS 00 01 02 03 04 HEX code FE FF
Fig.7 DAC data and DC conversion characteristics.
MBL828
PROTOCOL
ADDRESS
CONTROL BYTE
DATA BYTE 1
DATA BYTE 2
SCL 1 2 8 9 1 9 1 9 1
SDA
VAOUT
high impedance state or previous value held in DAC register
previous value held in DAC register
value of data byte 1
time
Fig.8 D/A conversion sequence.
2003 Jan 27
Product specication

7.4 A/D conversion
PCF8591
converted to the corresponding 8-bit binary code. Samples picked up from differential inputs are converted to an 8-bit twos complement code (see Figs 10 and 11). The conversion result is stored in the ADC data register and awaits transmission. If the auto-increment flag is set the next channel is selected. The first byte transmitted in a read cycle contains the conversion result code of the previous read cycle. After a Power-on reset condition the first byte read is a hexadecimal 80. The protocol of an I2C-bus read cycle is shown in Chapter 8, Figs 16 and 17. The maximum A/D conversion rate is given by the actual speed of the I2C-bus.
The A/D converter makes use of the successive approximation conversion technique. The on-chip D/A converter and a high-gain comparator are used temporarily during an A/D conversion cycle. An A/D conversion cycle is always started after sending a valid read mode address to a PCF8591 device. The A/D conversion cycle is triggered at the trailing edge of the acknowledge clock pulse and is executed while transmitting the result of the previous conversion (see Fig.9). Once a conversion cycle is triggered an input voltage sample of the selected channel is stored on the chip and is
PROTOCOL
ADDRESS
DATA BYTE 0
DATA BYTE 1
DATA BYTE 2
SCL 1 2 8 9 1 9 1 9 1
SDA
sampling byte 1
sampling byte 2
sampling byte 3
conversion of byte 1 transmission of previously converted byte
conversion of byte 2 transmission of byte 1
conversion of byte 3 transmission of byte 2
MBL829
Fig.9 A/D conversion sequence.
2003 Jan 27
Product specication
PCF8591
HEX code FF FE VREF VAGND 256
MBL830
Vlsb =
04 03 02 01 00 0 1 2 3 4 254 255 VAIN VAGND Vlsb
Fig.10 A/D conversion characteristics of single-ended inputs.
HEX CODE 7F 7E
MBL831
02 01 00 128 127 2 1 0 FF FE VREF VAGND 256 1 2 126 127 VAIN + VAIN Vlsb
Vlsb = 81 80
Fig.11 A/D conversion characteristics of differential inputs.
2003 Jan 27
10
Product specication

7.5 Reference voltage 7.6 Oscillator
PCF8591
For the D/A and A/D conversion either a stable external voltage reference or the supply voltage has to be applied to the resistor divider chain (pins VREF and AGND). The AGND pin has to be connected to the system analog ground and may have a DC off-set with reference to VSS. A low frequency may be applied to the VREF and AGND pins. This allows the use of the D/A converter as a one-quadrant multiplier; see Chapter 15 and Fig.7. The A/D converter may also be used as a one or two quadrant analog divider. The analog input voltage is divided by the reference voltage. The result is converted to a binary code. In this application the user has to keep the reference voltage stable during the conversion cycle.
An on-chip oscillator generates the clock signal required for the A/D conversion cycle and for refreshing the auto-zeroed buffer amplifier. When using this oscillator the EXT pin has to be connected to VSS. At the OSC pin the oscillator frequency is available. If the EXT pin is connected to VDD the oscillator output OSC is switched to a high-impedance state allowing the user to feed an external clock signal to OSC.
2003 Jan 27
11
Product specication

8 CHARACTERISTICS OF THE I2C-BUS
PCF8591
The I2C-bus is for bidirectional, two-line communication between different ICs or modules. The two lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor. Data transfer may be initiated only when the bus is not busy. 8.1 Bit transfer
One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period of the clock pulse as changes in the data line at this time will be interpreted as a control signal.
SDA
SCL data line stable; data valid change of data allowed
MBC621
Fig.12 Bit transfer.
8.2
Start and stop conditions
Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW transition of the data line, while the clock is HIGH, is defined as the start condition (S). A LOW-to-HIGH transition of the data line while the clock is HIGH, is defined as the stop condition (P).
SDA
SDA
SCL S START condition P STOP condition
SCL
MBC622
Fig.13 Definition of START and STOP condition.
2003 Jan 27
12
Product specication

8.3 System conguration
PCF8591
A device generating a message is a transmitter, a device receiving a message is the receiver. The device that controls the message is the master and the devices which are controlled by the master are the slaves.
SDA SCL MASTER TRANSMITTER / RECEIVER SLAVE TRANSMITTER / RECEIVER MASTER TRANSMITTER / RECEIVER
MBA605
SLAVE RECEIVER
MASTER TRANSMITTER
Fig.14 System configuration.
8.4
Acknowledge
The number of data bytes transferred between the start and stop conditions from transmitter to receiver is not limited. Each data byte of eight bits is followed by one acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter whereas the master also generates an extra acknowledge related clock pulse. A slave receiver which is addressed must generate an acknowledge after the reception of each byte. Also a master must generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter. The device that acknowledges has to pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse. A master receiver must signal an end of data to the transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. In this event the transmitter must leave the data line HIGH to enable the master to generate a stop condition.
DATA OUTPUT BY TRANSMITTER not acknowledge DATA OUTPUT BY RECEIVER acknowledge SCL FROM MASTER S START condition clock pulse for acknowledgement
MBC602
Fig.15 Acknowledgement on the I2C-bus.
2003 Jan 27
13
Product specication

8.5 I2C-bus protocol
PCF8591
After a start condition a valid hardware address has to be sent to a PCF8591 device. The read/write bit defines the direction of the following single or multiple byte data transfer. For the format and the timing of the start condition (S), the stop condition (P) and the acknowledge bit (A) refer to the I2C-bus characteristics. In the write mode a data transfer is terminated by sending either a stop condition or the start condition of the next data transfer.
acknowledge from PCF8591
ADDRESS
CONTROL BYTE
DATA BYTE
P/S
N = 0 to M data bytes
MBL833
Fig.16 Bus protocol for write mode, D/A conversion.
acknowledge from master
no acknowledge
ADDRESS
DATA BYTE
LAST DATA BYTE
N = 0 to M data bytes
MBL834
Fig.17 Bus protocol for read mode, A/D conversion.
2003 Jan 27
14
Product specication

9 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VDD VI II IO IDD, ISS Ptot PO Tamb Tstg 10 HANDLING PARAMETER supply voltage (pin 16) input voltage (any input) DC input current DC output current VDD or VSS current total power dissipation per package power dissipation per output operating ambient temperature storage temperature MIN. 0.5 0.5 40 65 MAX. +8.0 VDD + 0.5 10 20 50 300 100 +85 +150
PCF8591
UNIT V V mA mA mA mW mW C C
Inputs and outputs are protected against electrostatic discharge in normal handling. However it is good practice to take normal precautions appropriate to handling MOS devices (see Handling MOS devices ).
2003 Jan 27
15
Product specication

11 DC CHARACTERISTICS VDD = 2.5 V to 6 V; VSS = 0 V; Tamb = 40 C to +85 C unless otherwise specied. SYMBOL Supply VDD IDD supply voltage (operating) supply current standby operating, AOUT off operating, AOUT active VPOR VIL VIH IL Power-on reset level VI = VSS or VDD; no load fSCL = 100 kHz fSCL = 100 kHz note 1 0.8 1 125 0.45 100 15 2.5 PARAMETER CONDITIONS MIN. TYP.
PCF8591
MAX.
UNIT
6.0
V A A mA V
250 1.0 2.0 0.3 VDD VDD +250 +1 5 VDD +250 250 1.25
Digital inputs/output: SCL, SDA, A0, A1, A2 LOW level input voltage HIGH level input voltage leakage current A0, A1, A2 SCL, SDA Ci IOL VREF VAGND ILI RREF ILI fOSC Notes 1. The power on reset circuit resets the I2C-bus logic when VDD is less than VPOR. 2. A further extension of the range is possible, if the following conditions are fulfilled: V REF + V AGND V REF + V AGND ------------------------------------- 0.8V, V DD ------------------------------------- 0.4V 2 2 input capacitance LOW level SDA output current VOL = 0.4 V reference voltage analog ground voltage input leakage current input resistance pins VREF and AGND VREF > VAGND; note 2 VREF > VAGND; note 2 VI = VSS to VDD VI = VSS to VDD 250 1 3.0 nA A pF mA 0 0.7 VDD V V
Reference voltage inputs VSS + 1.6 VSS 250 0.75 V nA k nA MHz VDD 0.8 V
Oscillator: OSC, EXT input leakage current oscillator frequency
2003 Jan 27
16
Product specication
PCF8591
12 D/A CHARACTERISTICS VDD = 5.0 V; VSS = 0 V; VREF = 5.0 V; VAGND = 0 V; RL = 10 k; CL = 100 pF; Tamb = 40 C to +85 C unless otherwise specied. SYMBOL Analog output VOA ILO Accuracy OSe Le Ge tDAC fDAC SNRR offset error linearity error gain error settling time conversion rate supply noise rejection ratio f = 100 Hz; VDDN = 0.1 VPP no resistive load to
1 LSB 2
PARAMETER
CONDITIONS
MIN. 40
TYP.
MAX.
UNIT
output voltage output leakage current
no resistive load RL = 10 k AOUT disabled Tamb = 25 C
VSS VSS
VDD 0.9 VDD 250
V V nA
50 1.5 1 90 11.1
mV LSB % s kHz dB
full scale step
13 A/D CHARACTERISTICS VDD = 5.0 V; VSS = 0 V; VREF = 5.0 V; VAGND = 0 V; RS = 10 k; Tamb = 40 C to +85 C unless otherwise specied. SYMBOL Analog inputs VIA ILIA CIA CID VIS VID analog input voltage analog input leakage current analog input capacitance differential input capacitance single-ended voltage differential voltage measuring range measuring range; VFS = VREF VAGND VSS VAGND V FS -----------2 Vi = 16 LSB f = 100 Hz; VDDN = 0.1 VPP 10 10 VDD 100 VREF +V FS ------------2 V nA pF pF V V PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Accuracy OSe Le Ge GSe CMRR SNRR tADC fADC offset error linearity error gain error small-signal gain error common-mode rejection ratio supply noise rejection ratio conversion time sampling/conversion rate Tamb = 25 C 60 40 20 1.5 1 5 90 11.1 mV LSB % % dB dB s kHz
2003 Jan 27
17
Product specication
PCF8591
handbook, halfpage
200
MBL835
handbook, halfpage
160
MBL836
IDD (A) 150
IDD (A) 120
40 c +27 c
100
80
50
40
+85 c
0 2 3 4 5 VDD (V) 6
0 2 3 4 5 VDD (V) 6
a. Internal oscillator; Tamb = +27 C.
b. External oscillator.
Fig.18 Operating supply current as a function of supply voltage (analog output disabled).
D/A output impedance ()
handbook, halfpage
500
MBL837
D/A output impedance ()
handbook, halfpage
500
MBL838
400
400
300
300
200
200
100
100
0 00
02
04
06
08 hex input code
0A
0 BO
CO
DO
EO
FO hex input code
FF
a. Output impedance near negative power rail; Tamb = +27 C.

The x-axis represents the hex input-code equivalent of the output voltage.
b. Output impedance near positive power rail; Tamb = +27 C.
Fig.19 Output impedance of analog output buffer (near power rails).
2003 Jan 27
18
Product specication
PCF8591
14 AC CHARACTERISTICS All timing values are valid within the operating supply voltage and ambient temperature range and reference to VIL and VIH with an input voltage swing of VSS to VDD. SYMBOL I2C-bus timing (see Fig.20; note 1) fSCL tSP tBUF tSU;STA tHD;STA tLOW tHIGH tr tf tSU;DAT tHD;DAT tVD;DAT tSU;STO Note 1. A detailed description of the I2C-bus specification, with applications, is given in brochure The I2C-bus and how to use it. This brochure may be ordered using the code 9398 393 40011. SCL clock frequency tolerable spike width on bus bus free time START condition set-up time START condition hold time SCL LOW time SCL HIGH time SCL and SDA rise time SCL and SDA fall time data set-up time data hold time SCL LOW-to-data out valid STOP condition set-up time 4.7 4.7 4.0 4.7 4.0 250 0 4.0 100 100 1.0 0.3 3.4 kHz ns s s s s s s s ns ns s s PARAMETER MIN. TYP. MAX. UNIT
PROTOCOL
START CONDITION (S)
BIT 7 MSB (A7)
BIT 6 (A6)
BIT 0 LSB (R/W)
ACKNOWLEDGE (A)
STOP CONDITION (P)
t SU;STA
t LOW
t HIGH
1 / f SCL
SCL
BUF
tr
tf
SDA
t HD;STA
t SU;DAT
HD;DAT
t VD;DAT
MBD820
t SU;STO
Fig.20 I2C-bus timing diagram; rise and fall times refer to VIL and VIH.
2003 Jan 27
19
Product specication

15 APPLICATION INFORMATION
PCF8591
Inputs must be connected to VSS or VDD when not in use. Analog inputs may also be connected to AGND or VREF. In order to prevent excessive ground and supply noise and to minimize cross-talk of the digital to analog signal paths the user has to design the printed-circuit board layout very carefully. Supply lines common to a PCF8591 device and noisy digital circuits and ground loops should be avoided. Decoupling capacitors (>10 F) are recommended for power supply and reference voltage inputs.
VDD V0
VDD
VDD
VDD + +
VDD AOUT AIN0 VREF AIN1 AGND AIN2 EXT AIN3 OSC A0 PCF8591 SCL A1 SDA A2 VSS
VOUT
VDD
V0
V1 VDD
VDD AOUT AIN0 VREF AIN1 AGND AIN2 EXT AIN3 OSC A0 PCF8591 SCL A1 SDA A2 VSS
VOUT
V2
VDD
MASTER TRANSMITTER ANALOGUE GROUND I2C bus

MBL839
DIGITAL GROUND
Fig.21 Application diagram.
2003 Jan 27
20
Product specication

16 PACKAGE OUTLINES DIP16: plastic dual in-line package; 16 leads (300 mil)
PCF8591
SOT38-4
D seating plane
ME
A2
A1
c Z e b1 b 16 9 b2 MH w M (e 1)
pin 1 index E
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.30 0.068 0.051 b1 0.53 0.38 0.021 0.015 b2 1.25 0.85 0.049 0.033 c 0.36 0.23 0.014 0.009 D (1) 19.50 18.55 0.77 0.73 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 0.76 0.030
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT38-4 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-01-14
2003 Jan 27
21
Product specication
PCF8591
SO16: plastic small outline package; 16 leads; body width 7.5 mm
SOT162-1
A X
c y HE v M A
Z 16 9
Q A2 A1 pin 1 index Lp L 1 e bp 8 w M detail X (A 3) A
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 10.5 10.1 0.41 0.40 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8o 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT162-1 REFERENCES IEC 075E03 JEDEC MS-013 EIAJ EUROPEAN PROJECTION
ISSUE DATE 97-05-22 99-12-27
2003 Jan 27
22
Product specication

17 SOLDERING 17.1 Introduction to soldering through-hole mount packages
PCF8591
The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 17.3 Manual soldering
This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board. 17.2 Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joints for more than 5 seconds. 17.4
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods SOLDERING METHOD PACKAGE DIPPING WAVE suitable(1)
DBS, DIP, HDIP, SDIP, SIL Note
suitable
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
2003 Jan 27
23
Product specication

18 DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development DEFINITION
PCF8591
This data sheet contains data from the objective specication for product development. Philips Semiconductors reserves the right to change the specication in any manner without notice. This data sheet contains data from the preliminary specication. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specication without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specication. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notication (CPCN).
II
Preliminary data Qualication
III
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 19 DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 20 DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status Production), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2003 Jan 27
24
Product specication

21 PURCHASE OF PHILIPS I2C COMPONENTS
PCF8591
Purchase of Philips I2C components conveys a license under the Philips I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
2003 Jan 27
25
Product specication

NOTES
PCF8591
2003 Jan 27
26
Product specication

NOTES
PCF8591
2003 Jan 27
27
Philips Semiconductors a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales ofces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
Koninklijke Philips Electronics N.V. 2003
SCA75
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
403512/06/pp28
Date of release: 2003
Jan 27
Document order number:
9397 750 10464

Data Sheet: 8-Bit A/D and D/A Converter

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INTEGRATED CIRCUITS

PCF8591 8-bit A/D and D/A converter

8-bit A/D and D/A converter

8-bit A/D and D/A converter

8-bit A/D and D/A converter

handbook, full pagewidth

SCL SDA A0 A1 A2 EXT VDD VSS OSC

I2C BUS INTERFACE

DAC DATA REGISTER

ADC DATA REGISTER

POWER ON RESET OSCILLATOR

AIN0 AIN1 AIN2 AIN3

SAMPLE AND HOLD

SUCCESSIVE APPROXIMATION REGISTER/LOGIC

SAMPLE AND HOLD

Fig.1 Block diagram.

PINNING SYMBOL PIN 1 2

DESCRIPTION analog inputs (A/D converter)

12 EXT 11 OSC 10 SCL 9 SDA

Fig.2 Pinning diagram (DIP16).

8-bit A/D and D/A converter

handbook, halfpage msb

AIN0 AIN1 AIN2 AIN3 A0 A1 A2 VSS

16 VDD 15 AOUT 14 VREF 13 AGND

Fig.4 Address byte.

12 EXT 11 OSC 10 SCL 9 SDA

Fig.3 Pinning diagram (SO16).

FUNCTIONAL DESCRIPTION Addressing

8-bit A/D and D/A converter

handbook, full pagewidth

AIN2 channel 2 AIN3

Two differential inputs AIN0 channel 0 AIN1 AIN2 channel 1 AIN3

ANALOGUE OUTPUT ENABLE FLAG: (analogue output active if 1)

Fig.5 Control byte.

8-bit A/D and D/A converter

handbook, full pagewidth

D7 R3 D6 TAP DECODER D0 R1 AGND 00

Fig.6 DAC resistor divider chain.

8-bit A/D and D/A converter

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lsb D0 DAC data register

VAOUT VDD VREF

VREF - VAGND 7 Di 2i 256 i=0

VAGND VSS 00 01 02 03 04 HEX code FE FF

Fig.7 DAC data and DC conversion characteristics.

handbook, full pagewidth

high impedance state or previous value held in DAC register

previous value held in DAC register

value of data byte 1

Fig.8 D/A conversion sequence.

8-bit A/D and D/A converter

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conversion of byte 1 transmission of previously converted byte

conversion of byte 2 transmission of byte 1

conversion of byte 3 transmission of byte 2

Fig.9 A/D conversion sequence.

8-bit A/D and D/A converter

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HEX code FF FE VREF VAGND 256