3212fb-RGB LED Driver
3212fb-RGB LED Driver
3212fb-RGB LED Driver
1
3212fb
Typical applicaTion
FeaTures
applicaTions
DescripTion
RGB LED Driver and
Charge Pump
The LTC
V
IN
Range: 2.7V to 5.5V
Cellular Phones
Media Players
)
27
31
3.6
3212 G05
23
19
25
29
33
35
21
17
15
3.0 3.3 4.0
85C
C1, C2, C3 = 1F
V
CPO
= 4.8V
25C
40C
CPO CURRENT (mA)
0
4.0
C
P
O
V
O
L
T
A
G
E
(
V
)
4.2
4.4
4.6
4.8
5.2
20 30 40 50
3212 G06
60 10 25 35 45 55 65 70
5.0
3.6V
3.1V
3.2V
3.3V 3.4V
V
IN
= 3.0V
C1, C2, C3 = 1F
3.5V
V
IN
(V)
2.7
F
R
E
Q
U
E
N
C
Y
(
k
H
z
)
888
890
892
3.9 4.7
3212 G07
886
884
3.1 3.5 4.3 5.1 5.5
882
880
V
IN
(V)
2.7
0
I
V
I
N
(
A
)
1
2
3
4
6
3.5 3.1 3.9 4.3 4.7 5.1
3212 G08
5.5
5
V
IN
(V)
2.7
290
V
I
N
C
U
R
R
E
N
T
(
A
)
300
310
320
330
350
3.1 3.5 3.9 4.3
3212 G09
5.1 4.7 5.5
340
Start-Up and Mode Switch
V
IN
(V)
2.7
V
I
N
C
U
R
R
E
N
T
(
m
A
)
3.5
3.9
3212 G10
2.0
1.0
3.1 3.5 4.3
0.5
0
4.0
3.0
2.5
1.5
4.7 5.1 5.5
CPO
1V/DIV
LEDEN
2V/DIV
200s/DIV V
IN
= 3.6V
3212 G11
SOFT-START
DROPOUT
DELAY
1x
MODE
2x
MODE
0V
0V
3.6V
3.6V
5V
TEMPERATURE (C)
40
5.0
5.5
6.5
20 60
3212 G04
4.5
4.0
20 0 40 80
3.5
3.0
6.0
R
E
S
I
S
T
A
N
C
E
(
)
V
IN
= 3V
I
CPO
= 50mA
V
IN
= 3.6V
V
IN
= 4.2V
LTC3212
5
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pin FuncTions
CP, CM (Pins 1, 11): Charge Pump Flying Capacitor Pins.
A 1F X5R or X7R ceramic capacitor should be connected
from CP to CM.
CPO (Pin 2): CPO is the output of the charge pump. A 1F
X5R or X7R ceramic capacitor is required from CPO to
GND. While operating, this pin will supply current to the
LEDs and while in shutdown mode this pin will be high
impedance.
LEDEN (Pin 3): The LEDEN pin is used to program, enable
and shut down the part. A 3A internal current source
pulls this pin to ground.
I
SETB
, I
SETR
, I
SETG
(Pins 4, 5, 6): LED current program-
ming resistor pins. A resistor connected between a pin
and GND is used to set the LED current. A resistor from
I
SETG
to GND is required. Resistors on I
SETR
and I
SETB
are optional. If I
SETR
and/or I
SETB
is not connected to a
resistor I
SETR
s and/or I
SETB
s respective output(s) will be
automatically programmed by the resistor connected to
I
SETG
. If I
SETR
or I
SETB
is unused the pin should be con-
nected to V
IN
.
LEDG, LEDR, LEDB (Pins 7, 8, 9): These pins are
the LED current output pins. The LEDs are connected
from either the charge pump or V
IN
(anode) to LED
(R, G, B) (cathode).
GND (Pin 10): This pin should be connected directly to a
low impedance ground plane.
V
IN
(Pin 12): Supply voltage for the LTC3212. V
IN
should
be bypassed with a low impedance ceramic capacitor to
GND of at least 1F of capacitance.
Exposed Pad (Pin 13): GND. The Exposed Pad must be
soldered to a low impedance ground plane for optimum
performance.
LTC3212
6
3212fb
block DiaGraM
4
+
LED
CURRENT
SOURCE
ENB
LEDB
LEDR
LEDG
3212 BD
I
SETB
ENR ENG ENB
3
LEDEN
3A
12
V
IN
5
+
LED
CURRENT
SOURCE
ENR
I
SETR
6
+
LED
CURRENT
SOURCE
OPEN
DETECTION/
AUTOSET
ENG
I
SETG
10
GND
CONTROL LOGIC
DROPOUT
DETECTION
V
REF
CP
TSD
9
8
7
10k
SHUT
DOWN
CPO
2
1
CM
11
+
900kHz
OSCILLATOR
The LTC3212 uses a switched capacitor charge pump to
power three LEDs with a programmable regulated cur-
rent. The part powers up into 1x mode. In this mode V
IN
is directly connected to CPO. When powering up into 1x
mode, the LTC3212 charges the CPO capacitor to near
V
IN
before directly connecting V
IN
to CPO. This prevents
a large in-rush current. 1x mode provides maximum ef-
fciency and minimum noise. The LTC3212 will remain
in this mode until one of the LED current source drivers
operaTion
begins to drop out of regulation. When this drop out oc-
curs the LTC3212 will switch to 2x mode after a soft-start
period. The part will return to 1x mode when the part is
shut down and reprogrammed.
The current delivered through the LED load is controlled
by an internal programmable low dropout current source.
The current is programmed by resistors connected between
the I
SET(R,G,B)
pins and GND.
LTC3212
7
3212fb
operaTion
An overcurrent shutdown mode on the I
SET
pins will pre-
vent damage to the part and the LED by shutting down
the LED drivers. Choosing an R
SET
value of 5.9k or greater
will ensure that the part stays out of this mode. When in
normal operating mode current, regulation is achieved by
controlling an active current source.
In shutdown mode all internal circuitry is turned off and
the LTC3212 draws very little current from the V
IN
supply.
The LTC3212 enters shutdown mode after the LEDEN pin
is brought low for 350s.
Short-Circuit Protection
When LEDEN is brought high, the part will connect V
IN
to CPO through a weak pull-up until CPO has charged to
near V
IN
. After the LTC3212 detects that the CPO voltage
is near the V
IN
voltage, it then enables 1x mode. If the
CPO is shorted or falls below approximately 1V, then the
LTC3212 is disabled. After falling below 1V the LTC3212
will use the weak pull-up to charge CPO to near V
IN
before
re-enabling the chip.
Soft-Start
To prevent excessive inrush during start-up and mode
switching, the LTC3212 employs built-in soft-start circuitry.
Soft-start is achieved by increasing the current available
to the CPO capacitor over a period of approximately
100s.
Charge Pump Strength
When the LTC3212 operates in 2x mode, the charge
pump can be modeled as a Thevenin equivalent circuit
to determine the amount of current available from the
effective input voltage and the effective open-loop output
resistance, R
OL
.
+
R
OL
CPO 2V
IN
3212 F01
Figure 1. CPO Equivalent Open-Loop
R
OL
is dependent on a number of factors including the
oscillator frequency, fying capacitor values and switch
resistances. From Figure 1 we can see that the maximum
output current in 2x mode is proportional to:
2V CPO
R
IN
OL
IDEAL
LED
IN
LED LED
BAT LED
LED
P
P
V I
V I
V
V
= = =
2 2
BBAT
In some applications it may be possible to increase the
effciency of the LTC3212. If any of the LEDs maximum
forward voltage is less than the minimum V
IN
supply volt-
age minus I
LED
dropout voltage then the charge pump is
not needed to drive that LED. This is often the case with
the red LED due to its lower forward voltage. Its anode
may be connected directly to V
IN
, bypassing the charge
pumps losses in 2x mode.
Thermal Management
If the junction temperature increases above approximately
140C the thermal shutdown circuitry will automatically
deactivate the output current sources and charge pump.
To reduce maximum junction temperature, a good thermal
connection to the PC board is recommended. Connecting
the Exposed Pad to a ground plane and maintaining a solid
ground plane under the device will reduce the thermal
resistance of the package and PC board considerably.
applicaTions inForMaTion
LTC3212
11
3212fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
packaGe DescripTion
DDB Package
12-Lead Plastic DFN (3mm 2mm)
(Reference LTC DWG # 05-08-1723 Rev )
2.00 0.10
(2 SIDES)
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
0.40 0.10
BOTTOM VIEWEXPOSED PAD
0.64 0.10
(2 SIDES)
0.75 0.05
R = 0.115
TYP
R = 0.05
TYP
2.39 0.10
(2 SIDES)
3.00 0.10
(2 SIDES)
1 6
12 7
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
0 0.05
(DDB12) DFN 0106 REV
0.23 0.05
0.45 BSC
PIN 1
R = 0.20 OR
0.25 45
CHAMFER
0.25 0.05
2.39 0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.64 0.05
(2 SIDES)
1.15 0.05
0.70 0.05
2.55 0.05
PACKAGE
OUTLINE
0.45 BSC
LTC3212
12
3212fb
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900