TDA8941P: 1. General Description
TDA8941P: 1. General Description
TDA8941P: 1. General Description
1. General description
The TDA8941P is a single-channel audio power amplier with an output power of 1.5 W at an 16 load and a 9 V supply. The circuit contains a Bridge Tied Load (BTL) amplier with an all-NPN output stage and standby/mute logic. The TDA8941P comes in a 8-pin dual in-line (DIP8) package. The TDA8941P is printed-circuit board (PCB) compatible with all other types in the TDA894x family. One PCB footprint accommodates both the mono and the stereo products.
2. Features
s s s s s s s s s Few external components Fixed gain Standby and mute mode No on/off switching plops Low standby current High supply voltage ripple rejection Outputs short-circuit protected to ground, supply and across the load Thermally protected Printed-circuit board compatible.
c c
3. Applications
s Mains fed applications (e.g. TV sound) s PC audio s Portable audio.
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplier
Quick reference datacontinued Conditions THD = 10%; RL = 16 ; VCC = 9 V Po = 0.5 W Min 1.2 31 50 Typ 1.5 0.03 32 65 Max 0.3 33 Unit W % dB dB output power total harmonic distortion voltage gain supply voltage ripple rejection
Symbol Parameter
5. Ordering information
Table 2: Ordering information Package Name TDA8941P DIP8 Description plastic dual in-line package; 8 leads (300 mil) Version SOT97-1 Type number
6. Block diagram
idth
VCC 1
TDA8941P
7 IN IN+ 5 3 2 VCC MODE SVR 4 6 20 k 8
MGL579
OUT
OUT+
20 k
GND
Product specication
2 of 21
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplier
7. Pinning information
7.1 Pinning
handbook, halfpage
1 2
8 7
TDA8941P
3 4
MGR892
6 5
8. Functional description
The TDA8941P is a mono BTL audio power amplier capable of delivering 1.5 W output power to an 16 load at THD = 10%, using a 9 V power supply. The voltage gain is xed at 32 dB. With the three-level MODE input the device can be switched from standby to mute and to operating mode. The TDA8941P outputs are protected by an internal thermal shutdown protection mechanism and a short-circuit protection.
Product specication
3 of 21
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplier
The input cut-off frequency is: 1 f i ( cut off ) = ---------------------------2 ( Ri C i ) For Ri = 45 k and Ci = 220 nF: 1 f i ( cut off ) = ---------------------------------------------------------------- = 16 Hz 3 9 2 ( 45 10 220 10 ) As shown in Equation 1 and 2, large capacitor values for the inputs are not necessary; so the switch-on delay during charging of the input capacitors, can be minimized. This results in a good low frequency response and good switch-on behaviour. Remark: To prevent HF oscillations do not leave the inputs open, connect a capacitor of at least 1.5 nF across the input pins close to the device. (2) (1)
8.2.1
Lower peak value of the supply current The ripple frequency on the supply voltage is twice the signal frequency No expensive DC-blocking capacitor Good low frequency performance.
Output power measurement The output power as a function of the supply voltage is measured on the output pins at THD = 10%; see Figure 8. The maximum output power is limited by the maximum power dissipation in the plastic package.
8.2.2
Headroom Typical CD music requires at least 12 dB (factor 15.85) dynamic headroom compared to the average power output for transferring the loudest parts without distortion. At VCC = 9 V, RL = 16 and Po = 1 W at THD = 1% (see Figure 6), the Average Listening Level (ALL) music power without any distortion yields: Po(ALL) = 1 W/15.85 = 63 mW. The power dissipation can be derived from Figure 11 on page 10 for 0 dB respectively 12 dB headroom.
Product specication
4 of 21
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplier
Power rating as function of headroom Power output (THD = 1%) Po = 1 W Po(ALL) = 63 mW Power dissipation (P) 1.15 W 0.6 W
Table 4: 0 dB 12 dB
Headroom
For the average listening level a power dissipation of 0.6 W can be used for calculation of the maximum ambient temperature.
Product specication
5 of 21
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplier
9. Limiting values
Table 5: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCC VI IORM Tstg Tamb Ptot VCC(sc) Parameter supply voltage input voltage repetitive peak output current storage temperature operating ambient temperature total power dissipation supply voltage to guarantee short-circuit protection non-operating Conditions no signal operating Min 0.3 0.3 0.3 55 40 Max +25 +18 2 +150 +85 1.25 12 Unit V V A C C W V
VCC + 0.3 V
Product specication
6 of 21
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplier
Parameter supply voltage quiescent supply current standby supply current DC output voltage differential output voltage offset mode selection input voltage
Typ 9 14 4.5 -
Unit V mA A V mV V V V A
IMODE
[1] [2] [3]
With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal to the differential output voltage offset (VOUT) divided by the load resistance (RL). The DC output voltage with respect to ground is approximately 0.5VCC. VOUT = | VOUT+ VOUT |.
handbook, I halfpage
30
MGU022
q (mA) 25
handbook, halfpage
20 Iq 16
MGU023
(mA)
VCC = 11 V 20 12 15 8 10 4 9V
0 0
12
20 16 VCC (V)
0 0
10 12 VMODE (V)
Product specication
7 of 21
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplier
Unit W W % dB k V dB dB V
output voltage
mute mode
[3]
The noise output voltage is measured at the output in a frequency range from 20 Hz to 20 kHz (unweighted), with a source impedance RS = 0 at the input. Supply voltage ripple rejection is measured at the output, with a source impedance RS = 0 at the input. The ripple voltage is a sine wave with a frequency fripple and an amplitude of 700 mV (RMS), which is applied to the positive supply rail. Output voltage in mute mode is measured with an input voltage of 1 V (RMS) in a bandwidth of 20 kHz, so including noise.
10
MGU025
Vo (V)
101
102
103
105
Product specication
8 of 21
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplier
MGU018
MGU019
(1)
101
(2)
101
(1)
(2)
102 102
101
Po (W)
10
102 102
101
Po (W)
10
a.
VCC = 9 V; RL = 16 ; f = 1 kHz.
b.
VCC = 11 V; RL = 25 ; f = 1 kHz.
(1) Measured on the standard printed-circuit board without an additional heatsink (see Figure 14). These curves Inuence of thermal feedback caused by the high power dissipation in combination with the high thermal resistance of the plastic package. (2) Measured with a small heatsink on top of the plastic package body; Rth(h-a) = 30 K/W.
handbook, halfpage
10
MGU021
handbook, halfpage
10
MGU020
THD (%) 1
THD (%) 1
(1)
101
(1)
101
(2)
(2)
102 10
102
103
104
f (Hz)
105
102 10
102
103
104
f (Hz)
105
a.
VCC = 9 V; RL = 16 ; Po = 0.1 W.
No bandpass lter applied.
b.
VCC = 9 V; RL = 16 ; Po = 0.5 W.
(1) Measured on the standard printed-circuit board without an additional heatsink (see Figure 14). These curves Inuence of thermal feedback caused by the high power dissipation in combination with the high thermal resistance of the plastic package. (2) Measured with a small heatsink on top of the plastic package body; Rth(h-a) = 30 K/W.
Product specication
9 of 21
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplier
handbook, P halfpage
3 o (W) 2.5
MGU026
handbook, halfpage
MGU027
1.5
RL = 16
25
1 0.5 0.5
0 0
10
12 14 VCC (V)
0 0
10
12 14 VCC (V)
THD = 1%.
handbook, halfpage
100
MGU029
handbook, halfpage
(%) 80
P (W) 1.5
60
(1) (2)
(1) (2)
1 40
0.5 20
0 0
0.5
1.5
2.5 Po (W)
0 0
0.5
1.5
2 Po (W)
2.5
Product specication
10 of 21
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplier
MGU024
SVRR (dB) 20
B 40
60 A
80 10
102
103
104
f (Hz)
105
VCC = 9 V; RS = 0 ; Vripple = 700 mV (RMS); no bandpass lter applied. Curve A: inputs short-circuited Curve B: inputs short-circuited and connected to ground (asymmetrical application)
Product specication
11 of 21
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplier
Equivalent circuit
VCC
1.5 k
1.5 k
VCC
45 k
45 k
7 and 2
MODE
VCC VCC
20 k VCC
1 k
1 k
SVR
VCC Standby
20 k 6 20 k
MGU084
Product specication
12 of 21
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplier
100 nF
1000 F
7 OUT RL 16 2 OUT+
TDA8941P
R signal GND
Product specication
13 of 21
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplier
idth
54 mm
56 mm
VCC
100 nF
1000 F
GND
MGU017
14.1.2
Power supply decoupling Proper supply bypassing is critical for low-noise performance and high supply voltage ripple rejection. The respective capacitor locations should be as close as possible to the device and grounded to the power ground. Proper power supply decoupling also prevents oscillations. For suppressing higher frequency transients (spikes) on the supply line a capacitor with low ESR typical 100 nF has to be placed as close as possible to the device. For suppressing lower frequency noise and ripple signals, a large electrolytic capacitor e.g. 1000 F or greater must be placed close to the device. The bypass capacitor on the SVR pin reduces the noise and ripple on the midrail voltage. For good THD and noise performance a low ESR capacitor is recommended.
Product specication
14 of 21
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplier
Product specication
15 of 21
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplier
D seating plane
ME
A2
A1
c Z e b1 w M (e 1) b2 5 MH
b 8
pin 1 index E
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.14 0.068 0.045 b1 0.53 0.38 0.021 0.015 b2 1.07 0.89 0.042 0.035 c 0.36 0.23 0.014 0.009 D (1) 9.8 9.2 0.39 0.36 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 1.15 0.045
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT97-1 REFERENCES IEC 050G01 JEDEC MO-001 EIAJ SC-504-8 EUROPEAN PROJECTION
Product specication
16 of 21
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplier
17. Soldering
17.1 Introduction to soldering through-hole mount packages
This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board.
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
Product specication
17 of 21
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplier
Table 1 on page 1:THD: Max value 0.1% changed to 0.3%; SVRR: Typ value 65 dB added Ordering options removed Section 8 Functional description: Section 8.1 Input conguration on page 3 added. Section 8.2 Power amplier on page 4: ........, capable of delivering a peak output current of 1.5 A changed to 2 A. Section 8.2.1 Output power measurement on page 4 added Section 8.2.2 Headroom on page 4 added
Section 8.3 Mode selection: Standby mode: VMODE > (VCC 0.5 V) changed to (VCC 0.5 V) < VMODE < VCC; The power consumption of the TDA8941P will be reduced to <0.18 mW added. Mute mode: the DC level of the input and output pins remain on half the supply voltage added; 2.5 V < VMODE < (VCC 1.5 V) changed to 3 V < VMODE < (VCC 1.5 V) Section 8.3.1 Switch-on and switch-off on page 5 added.
Section 8.4 Supply Voltage Ripple Rejection (SVRR) on page 5 added Section 8.5 Built-in protection circuits on page 6 added Table 5 on page 6: Ptot value added 1.25 W VCC(sc) value added 12 V
Table 7 on page 7: VMODE - mute mode - value Min 2.5 changed to 3 V Table 8 on page 8: THD: Max value 0.1% changed to 0.3% SVRR; Typ values 65 and 60 dB added Rsource changed to RS in table and associated table notes Table note [2]: .... 100 mV (RMS).... changed to ... 700 mV (RMS)....
01 19990414 -
Figure 3 to 12: gures added Section 13 Internal circuitry on page 12: added Figure 13: gure modied Section 14.1 Printed-circuit board (PCB) on page 13: added Figure 14: gure added Section 14.2 Thermal behaviour and Tamb(max) calculation on page 15: added Section 15 Test information on page 15: Section 15.1 updated Section 15.2 Test conditions on page 15: added.
Product specication
18 of 21
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplier
Product specication
Production
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
20. Denitions
Short-form specication The data in a short-form specication is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values denition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specication is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specied use without further testing or modication.
21. Disclaimers
Life support These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specied.
Product specication
19 of 21
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplier
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 272 4825
Internet: http://www.semiconductors.philips.com
(SCA69)
Product specication
20 of 21
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplier
Contents
1 2 3 4 5 6 7 7.1 7.2 8 8.1 8.2 8.2.1 8.2.2 8.3 8.3.1 8.4 8.5 8.5.1 8.5.2 9 10 11 12 13 14 14.1 14.1.1 14.1.2 14.2 15 15.1 15.2 16 17 17.1 17.2 17.3 17.4 18 19 20 21 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Input configuration . . . . . . . . . . . . . . . . . . . . . . 3 Power amplifier . . . . . . . . . . . . . . . . . . . . . . . . . 4 Output power measurement . . . . . . . . . . . . . . . 4 Headroom . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Mode selection . . . . . . . . . . . . . . . . . . . . . . . . . 5 Switch-on and switch-off. . . . . . . . . . . . . . . . . . 5 Supply Voltage Ripple Rejection (SVRR) . . . . . 5 Built-in protection circuits . . . . . . . . . . . . . . . . . 6 Short-circuit protection . . . . . . . . . . . . . . . . . . . 6 Thermal shutdown protection . . . . . . . . . . . . . . 6 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 6 Static characteristics . . . . . . . . . . . . . . . . . . . . . 7 Dynamic characteristics . . . . . . . . . . . . . . . . . . 8 Internal circuitry . . . . . . . . . . . . . . . . . . . . . . . . 12 Application information. . . . . . . . . . . . . . . . . . 13 Printed-circuit board (PCB). . . . . . . . . . . . . . . 13 Layout and grounding . . . . . . . . . . . . . . . . . . . 13 Power supply decoupling . . . . . . . . . . . . . . . . 14 Thermal behaviour and Tamb(max) calculation . 15 Test information . . . . . . . . . . . . . . . . . . . . . . . . 15 Quality information . . . . . . . . . . . . . . . . . . . . . 15 Test conditions . . . . . . . . . . . . . . . . . . . . . . . . 15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Introduction to soldering through-hole mount packages . . . . . . . . . . . . . . . . . . . . . . 17 Soldering by dipping or by solder wave . . . . . 17 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 17 Package related soldering information . . . . . . 17 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 19 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 7 April 2000 Document order number: 9397 750 06864