Automation Systems at Intel Fab
Automation Systems at Intel Fab
Automation Systems at Intel Fab
AGENDA
Ireland
Systems Mfg
China
Fab 14/24
Pudong/Chendu A/T
Sub-con Mfg
Colorado
Fab 23
Oregon
Israel
Mass.
Dev D1C/D1D
Fab 15/20
Board Mfg
Fab 8/18/28
Fab 17
California
Dev D2
New Mexico
Fab 7/11/11X
Arizona
Fab12/22/32
A/T Dev
Wafer
Wafer Fab
Fab
Assembly/Test
Assembly/Test
Taiwan
Thailand
Costa Rica
Sub-con Mfg
Vietnam-AT
Malaysia
Penang A/T
Kulim A/T
Kulim Board/Module Mfg
Brazil
Sub-con Mfg
Sub-con Mfg.
Sub-con Mfg
Philippines
Manila A/T
Cavite A/T
Systems/Sub-con
Systems/Sub-con
Global
18 month
cycles dispersion
Computing
security
Automation
reliability
Affordability
Competitive
challenges
Quality
expectations
Cost of
excursions
Supply
chain
optimization
Complexity
Exploitation of security vulnerabilities
Explosive usage growth of products and
services
Equates to continued cost pressures
AGENDA
High
Equipment
Availability &
Utilization
Zero set
up time
Rapid New
Product Switch
over
WIP Matched
to Current
Needs
Higher
People
Productivity
Lot size
reduction
Error free
processing
Optimized Space
Management
7
AGENDA
Pervasive
FDC / SPC
Automated
Dispatching
Remote Diagnostics
Communication Bus
CYBER SECURITY
Process Equipment
OHT
New MES
Yield Analysis
Wafer/Unit Trace
Process Equipment
Litho
Etch
Films
Real Time
Tool View
AMHS Components
Interbay
transport
OHV
Stocker
Equipment
Process Equipment
Intrabay
Key Points:
I/Fs
controller
Process or
Interbay
E-5-SECS II
Metrology
1. Production Equipment
standards
and
capabilities
controller
Equipment
E-30-GEM
E-37 HSMS
were Critical to achieving 100% Intrabay
E-87 Carrier Mgmt
AMHS
Equipment
I/Fs
Automation
Tool
E-90 Substrate Tracking
Embedded
E5 SECS II E82 IBSEM
E-40 Process Job Mgmt
Controller
E84
Parallel
I/O
E30
GEM
2. AMHS E88
Standards
enable mix and matchE-84
ofParallel
supplier
I/O for
Stocker SEM
E37 HSMS
tools to get Best In Class equipment E-94OHV
Control Job Mgmt
Material Control
Execution
Station
3. Major
time
focus
was
spent
integrating
software
System
(MCS)
Control (EC)
Controllers
capabilities with Production and AMHS Equipment
Information
Bus equipment must
4. All in-line process
and metrology
be [and
has
to Manufacturing
the AMHSExecution
Reticle
Scheduler
/ been] connected
FOUP
Dispatcher
Tracking
System (MES)
11
12
AMHS Summary
14
Step N-1
Essential Data
standards include SEMI
E40, E94, E90 for wafer
level control & tracking
UI
Metrology
Equipment
Step N+1
UI
Process
Equipment
UI
Metrology
Equipment
15
300mm
Gen 2
200mm
Gen 3
200mm
Gen 1
200mm Wafers
1st Generation
(1993)
200mm Wafers
3rd Generation
(1999)
300mm Wafers
2nd Generation
(2006)
Time axis
16
300mm Wafers
4th Generation
(2007)
SUMMARY
Questions
18
References