Infineon Power Application Note
Infineon Power Application Note
Infineon Power Application Note
Edition 2013-03-14
Published by
Infineon Technologies Austria AG
9500 Villach, Austria
Infineon Technologies Austria AG 2013.
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AN 2013-03
Revision History: date (13-03-14) , V1.0
Previous Version: none
Subjects: none
Authors: IFAT PMM APS SE SL
Di Domenico Francesco
Mente Ren
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Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will
help us to continuously improve the quality of this document. Please send your proposal (including a
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Table of contents
1 Introduction .................................................................................................................................................. 4
2 IFX board and main components ............................................................................................................... 4
3 Principle of operation .................................................................................................................................. 7
4 Design procedure ........................................................................................................................................ 9
4.1
4.2
4.3
4.3.2
4.4
4.5
4.6
5 Summary .................................................................................................................................................... 24
6 List of Abbreviations ................................................................................................................................. 25
Introduction
In modern power electronics applications, there is a growing need for high efficiency combined with high
power density. This combination is not easy to achieve and this definitely represents the most important tradeoff challenge for power converter design. In fact, the simplest way to reduce the size especially of magnetic
components is to increase the switching frequency, but unfortunately this normally involves an increase of
switching losses, and so worse efficiency. One way to improve the trade-off relation is to use soft switching
topologies. The main benefit of these topologies is to minimize the losses generated by the power devices
(1)
(2)
during switching transitions. The ZVS phase shift full bridge used in IFX board achieves this reduction of
(3)
losses due to a zero voltage turn-on of the MOSFET s. In this design the ZVS operation is maintained from
full load down to very light load.
This paper is going to show in a step by step approach how to achieve highest efficiency in a ZVS topology
TM
(IFX board) using the new CoolMOS
IPW65R080CFD. The main features and benefits of this new
TM
Superjunction MOSFET are documented in the application note 650V CoolMOS
CFD2 released by
Infineon in February 2011. All possible adjustments like delay times, dimensioning of the resonant inductance,
(4)
variances of RG,ext , optimization of primary-secondary MOSFETs delays are going to be explained in detail in
the present paper.
The purpose of this paper is to give electrical design engineers with fundamental knowledge of the ZVS phase
shift principle of operation the general guidelines to optimize the design of this topology using the new IFX
TM
CoolMOS CFD2 series. For these reasons the mathematical content and all the design calculation details
will be intentionally not analyzed in this document, whose main focus is on the waveforms analysis in a real
application board.
Before starting with the measurements and optimization for the IPW65R080CFD on a given setup the
following chapter is going to illustrate the IFX board and the main components.
The following figure represents the new developed ZVS DC /DC converter for telecom rectifiers with an
output voltage from 45VDC to 56VDC and an output power of 2kW. This converter works with an input voltage
between 300VDC and 420VDC (typical 385VDC) and a switching frequency of 100kHz on the primary side.
190mm
100mm
Principle of operation
This chapter introduces the principle of operation by describing the different phases of the current flow
through the circuit on a simplified schematic.
(3) After the output capacitance of MOSFET C is discharged the current is commutating to the body
diode of the MOSFET C. This body diode conduction time should be minimized in order to reduce
additional losses.
(4) In phase 4 MOSFET C is actively turned on and the current is flowing through the channel and not
through the body diode anymore. This phase is the so called freewheeling phase
(5) In order to start a new power transfer phase MOSFET B is turned ON. This phase is done in the same
way as phase 2 by turning off MOSFET A. The output capacitance of MOSFET A is charged and the
output capacitance of MOSFET B is discharged before actively switching on the MOSFET.
(6) The body diode conduction time of MOSFET B, which is visible in this phase, should also be reduced
to a minimum as in phase 3.
(7) MOSFET B is actively turned on, the current changes its direction and the next power transfer phase
starts.
(1)
(4)
(7)
(1)
(2)-(3) (5)-(6)
(4)
(7)
(2)-(3) (5)-(6)
Design procedure
4.1
dimensioning of the resonant inductance with reference to the minimum load at which ZVS is
required and the output capacitance of the used MOSFETs
setting of delay or dead time between the conduction of the switches on the same leg.
setting of delay between primary and synchronous rectification MOSFETs conduction, in order to
minimize body diode conduction on secondary side
dimensioning the main transformer in order to guarantee duty cycle availability at any load and input
voltage condition, taking into account the actual duty cycle window determined by the combination of
the total primary inductance (and so the slope of primary current) with the chosen values of delay
(12)
times and RG,ext
setting the transformer turn ratio in a way to minimize the reverse voltage peak on synchronous
(13)
rectification MOSFETs, which allows to use the lowest possible VDS
range and so the lowest
possible RDS(on)
(11)
The main goal of this document is to find the best compromise among these key points based on the
characteristics of the used MOSFETs, the new IFX CFD2 series.
Considering the requirements of all recent worldwide standards in matter of light load efficiency, typically the
first decision is related to the minimum load where full ZVS is achieved. This mainly involves the resonant
inductance design, in combination with delay time and external gate resistances setting.
In order to achieve full ZVS at least at 20% maximum load, the calculated starting values are the following:
LR 52H
RG ,on
(14)
RG ,off
( L R resonant inductance)
(15)
This paper is going to show how these settings, needed for ZVS, impact on the actual duty cycle available for
(16)
the output regulation at any VIN
and load condition and how it is eventually possible to find the best
compromise for the CFD2 devices.
An important role in high efficiency target achievement is played by the secondary synchronous rectification.
In the first design step the synchronous rectification on the secondary side has been disabled, and the
rectification is done by using the body diodes of the MOSFETs. The reason for this is to be initially focused
only on the primary settings by being independent from the secondary side.
4.2
As well known, the two legs of the full bridge behave differently with reference to the ZVS. The right leg starts
its transition at the end of a power transfer phase. This means that there is more energy stored in LR and
therefore more energy available to discharge the MOSFETs output capacitance. The left leg starts the
transition at the end of a free-wheeling phase, which results in less available energy.
There are two ways to identify each of the two legs. The main indicator whether there is a zero voltage
(17)
switching or not is the presence of a Miller-plateau on the VGS
waveform. The following figure represents a
non ZVS behavior of leg A/B clearly visible due to the Miller-plateau.
10
VGS
Miller-plateau
VDS
11
VGS
no Miller-plateau
visible
VDS
12
Vmain_trafo
VDS (B)
VDS (D)
free
wheeling
power transfer
free
wheeling
4.3
To ensure that this stage is able to regulate the output voltage V OUT at 54VDC up to 2kW it is necessary to
check if there is enough duty cycle available. It is possible to predict the available actual duty cycle by
mathematical calculations, but this evaluation is done by the measurement of primary waveforms. In fact, the
available duty cycle can be analyzed by measuring the primary current (Iprim) and the voltage drop over the
(22)
main transformer (Vmain_trafo ) on the primary side.
13
The following figure represents the duty cycle margin available for the regulation at an output load of 8.22A
(POUT443W).
Vmain_trafo
Iprim
available duty cycle
margin for regulation
14
Vmain_trafo
Iprim
reduction of available
duty cycle margin
Vmain_trafo
Iprim
no duty cycle
margin available
15
It is clearly visible that the regulation of VOUT is not possible due to the duty cycle limiting. A possible way to
recover duty cycle is by reducing the turn-on and turn-off delay times. This reduction can be done by reducing
the external RG,on and RG,off.
16
Iprim
Vmain_trafo
di/dt7.5A/s
Iprim
Vmain_trafo
di/dt12.5A/s
gained
duty cycle
Figure 13: Iprim comparison with LR=52H (upper) and 30H (lower)
It is clearly visible that with 52H there is a di/dt of about 7.5A/s in comparison to 30H with a di/dt of about
12.5A/s. This gives enough duty cycle margin for reaching 2kW output power.
Figure 11 represents the primary current and the voltage drop over the main transformer when the converter
is running at 2kW with 54VDC output voltage.
17
Iprim
Vmain_trafo
Figure 14: IFX ZVS phase shift full bridge running at 2kW with 54VDC output voltage
All these measurements were done using diode rectification in order to be firstly focused on primary settings,
without influence from the secondary stage. Now the synchronous rectification is going to be activated.
The next chapter is going to explain how it is possible to optimize the delay times for the synchronous
rectification and by the end the efficiency curve over the whole load range will be represented.
4.4
Synchronous rectification
(23)
In order to optimize the delay time for the synchronous rectification (SR ) MOSFETs, with the goal to finally
get the best possible efficiency, it is necessary to actively switch the MOSFETs on and off so that the current
is flowing as long as possible through the channel and not through the body diode. For safety reasons the
delay time must be adjusted at the minimum load at which the synchronous rectification is activated.
Otherwise there is a risk of destruction of the parts when decreasing the load due to an overlap of VGS and
VDS.
18
VGS (E)
VDS (E)
VDS (F)
Vmain_trafo
VGS(th)
19
VGS (E)
VDS (E)
Vmain_trafo
VGS(th)
97,5
97
96.5%
96,5
IPW65R080CFD
96.2%
96
95.3%
95,5
95
94,5
94
0
500
1000
1500
2000
2500
20
4.5
As mentioned in the introduction, the main benefits of CFD2 technology have been already described in
TM
details in the application note 650V CoolMOS CFD2 released by Infineon in February 2011. In this
paragraph the special features making CFD2 attractive for ZVS phase shift full bridge are highlighted.
(25)
First of all, CFD2 has been introduced with the goal to reduce the typical Qg by 30% over the whole RDS(on)
range compared with previous CFD (see figure 18).
21
3%
2%
14.5%
Conduction Losses
80.5%
Turn on losses
Turn off losses
Driving losses
(26)
Moreover, in the following figure, it is possible to see the losses spread on each full bridge MOSFET at 10% of
maximum load:
22
13%
Conduction Losses
28%
57%
Turn on losses
Turn off losses
Driving losses
(28)
Figure 22: Qrr comparison of low side MOSFET in a half bridge configuration
(29)
23
This second feature brings benefits in efficiency by reducing the losses due to body diode conduction, but also
improves the reliability of this device under critical working conditions, like start-up, overload or short circuit
protection, burst mode operation, in which the body diode is heavily involved. It has been demonstrated, that
in these conditions a key parameter to guarantee safe operation is the trr of the body diode, which must be as
low as possible. This topic has been widely described by the technical literature and is out of the scope of this
paper.
4.6
By using special features available in standard controllers (like the UCC28950 from TI) or DSPs it is possible
to adapt the primary and secondary delay times in function of the output load. In particular, as the load
(30)
increases, the tdel_A/B and tdel_C/D
will be accordingly decreased on the primary side while the delay time on
the synchronous rectification MOSFETs will be increased. This will allow reducing the body diode conduction
time to a minimum, both on the full bridge and the synchronous rectification MOSFETs, helping to further
optimize the efficiency under any load condition. In fact, this adaptive delay has been only simulated in our
investigations by optimizing by trimmer the SR delay time only at the load corresponding to the maximum
efficiency area (800W), which resulted in further ~0.2% increase of efficiency.
The second advantage of the adaptive delay is that it allows gaining additional duty cycle portions, useful for
the regulation at maximum load, therefore increasing the design margin room versus the possible tolerances
in the main transformer construction and coupling.
Summary
TM
In the present paper the performance of the new CFD2 CoolMOS MOSFET (IPW65R080CFD) in a 2kW
ZVS phase shift full bridge converter (IFX board) has been analyzed.
General guidelines about the design optimization have been given with the purpose to get the maximum
possible benefit out of this new devices usage. In fact this document has to be considered as natural
TM
extension of the Application Note - 650V CoolMOS CFD2 released by Infineon in February 2011.
By using fixed delay times both on primary and secondary sides a peak efficiency of 96.42% has been
achieved. It can be increased up to 96.6% using adaptive delay setting. Moreover full ZVS has been
guaranteed down to around 24% of maximum load.
24
List of Abbreviations
(1)
ZVS
(2)
IFX
Infineon Technologies AG
(3)
MOSFET
(4)
RG,ext
(5)
DC
direct current
(6)
PCB
(7)
RDS(on)
(8)
ESR
(9)
V(BR)DSS
(10)
LR
resonant inductance
(11)
RG
gate resistor
(12)
RG,ext
(13)
VDS
drain-source voltage
(14)
RG,on
(15)
RG,off
(16)
VIN
input voltage
(17)
VGS
gate-source voltage
(18)
POUT
output power
(19)
tdel_A/B
(20)
Iprim
primary current
(21)
VOUT
output voltage
(22)
Vmain_trafo
(23)
SR
synchronous rectification
(24)
VGS(th)
(25)
Qg
gate charge
(26)
Pmax
maximum load
(27)
Eoss
(28)
trr
(29)
Qrr
(30)
tdel_C/D
25