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    U14

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    Kapildev Kumar
    This document discusses linear integrated circuits. It defines integrated circuits as miniature, low-cost electronic circuits consisting of active and passive components joined together on a single silicon chip. Integrated circuits provide advantages over discrete circuits like lower cost due to mass production, higher performance due to smaller components, and reduced power consumption. Integrated circuits can be classified as digital or linear and are fabricated using monolithic or hybrid technologies.

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    U14

    Uploaded by

    Kapildev Kumar
    188 views20 pages
    This document discusses linear integrated circuits. It defines integrated circuits as miniature, low-cost electronic circuits consisting of active and passive components joined together on a single silicon chip. Integrated circuits provide advantages over discrete circuits like lower cost due to mass production, higher performance due to smaller components, and reduced power consumption. Integrated circuits can be classified as digital or linear and are fabricated using monolithic or hybrid technologies.

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    EEE 2nd Year - Anna University

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    This document discusses linear integrated circuits. It defines integrated circuits as miniature, low-cost electronic circuits consisting of active and passive components joined together on a single silicon chip. Integrated circuits provide advantages over discrete circuits like lower cost due to mass production, higher performance due to smaller components, and reduced power consumption. Integrated circuits can be classified as digital or linear and are fabricated using monolithic or hybrid technologies.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    188 views20 pages

    U14

    Uploaded by

    Kapildev Kumar
    This document discusses linear integrated circuits. It defines integrated circuits as miniature, low-cost electronic circuits consisting of active and passive components joined together on a single silicon chip. Integrated circuits provide advantages over discrete circuits like lower cost due to mass production, higher performance due to smaller components, and reduced power consumption. Integrated circuits can be classified as digital or linear and are fabricated using monolithic or hybrid technologies.

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    LINEARINTEGRATEDCIRCUITS

    CLASSIFICATIONOFINTEGRATEDCIRCUITS
    Isolationtechnique
    Metallization
    Dr. R. Ramaprabha (Sec A)

    HowIntegratedcircuitsweremade?
    Integratedcircuitsweremadepossibleby
    experimentaldiscoverieswhichshowedthat
    semiconductordevicescouldperformthe
    functionsofvacuumtubes.Theintegrationof
    largenumbersoftinytransistorsintoasmall
    chipwasanenormousimprovementoverthe
    manualassemblyofcircuitsusingdiscrete
    electroniccomponents.

    WhatareIntegratedcircuits?
    Icisaminiature,lowcostelectroniccircuit
    consistingofactiveandpassivecomponents
    thatarejoinedtogetheronasinglecrystal
    chipofslicicon

    Advantages
    ThemainadvantagesofICsoverdiscrete
    circuits:
    Cost islowbecausethechips,withalltheir
    components,areprintedasaunitby
    photolithography.
    Performance ishighsincethecomponents
    switchquickly,becausethecomponentsare
    smallandclosetogether.

    Continued...
    Miniaturizationandhenceincreased
    equipmentdensity
    Increasedoperatingspeeds
    Reductioninpowerconsumption.
    Chipareasrangefromafewsqmmtoaround
    350sqmm,withupto1milliontransistors
    persqmm.

    CLASSIFICATION
    ICscanbebroadlyclassifiedbasedontheir
    applicationsas
    DigitalICs
    LinearICs
    Basedupontheaboverequirementstwo
    differentICtechnologiesnamelyMonolithic
    technologyandHybridtechnologyhavebeen
    developed

    Broadclassification
    Integrated Circuits

    Monolithic Circuits

    Bipolar

    Unipolar

    MOSFET
    P-n Junction Isolation

    Hybrid Circuits

    Dielectric Isolation

    JFET

    SomeICS

    MonolithicIntegratedCircuits
    Inmonolithicintegratedcircuitsallcircuit
    components(bothactiveandpassive
    elementsandtheirinterconnections)are
    manufacturedintoortopofasinglechipof
    silicon.
    Themonolithiccircuitisidealforapplication
    whereidenticalcircuitsarerequiredinvery
    largequantitiesandandhenceprovieds
    lowestpriceper unitcostandhighestorder
    ofreliability

    Continued...
    MMICs,orMonolithicMicrowaveIntegrated
    Circuits,areatypeofICdevicesthatoperate
    atmicrowavefrequencies(1GHzto300GHz).
    MMICsaremostoftenfabricatedusingIIIIV
    elementssuchasGalliumarsenide,Indium
    PhosphideorSiliconGermanium

    Hybridcircuit

    Continued..
    AHybridIntegratedCircuit,HybridCircuit,or
    simplyHybrid isaminiaturizedelectronic
    circuitconstructedusingindividualdevices,
    suchassemiconductordevices(e.g.transistors
    anddiodes)andpassivecomponents(e.g.
    resistors,inductorsandcapacitors),bondedto
    asubstrateorPCB

    Continued...
    Inhybridcircuit,separatecomponentparts
    areattachedtoaceramicsubstrateand
    interconnectedbymeansofeither
    metallizationpatternorwirebond
    Thistechnologyismoreadaptabletosmall
    quantitycustomcircuits.

    ISOLATIONTECHNIQUE
    DEFINITION:
    Itisthetechniquedonetoelectricallyisolate
    componentsfabricatedonthesameICchip
    TYPES:
    *PNJUNCTIONISOLATION
    *DIELECTRICISOLATION
    PNJUNCTIONISOLATION

    PNjunctionIsolation
    *p+typeimpuritiesareselectivelydiffusedintontypeepitaxial
    layer
    *itformsislandssurroundedbymoatsseparatedby2backto
    backpnjunctions
    *Ptypesubstrateiskeptatvepotentialso,junctionsareR.B
    betweentheislands
    *usuallyp+iskepthigherinregionbetweentheseislandsto
    preventpenetrationofdepletionregioninp+region
    DISADVANTAGE:
    Parasiticcapacitancethatlimitstheperformanceofcircuitat
    higherfrequency

    DIELECTRICISOLATION
    Eachcomponentissurroundedbysolid
    dielectric(eg.Sio2 orruby)providingboth
    electricalandphysicalisolation
    *easyfabricationofpnp and npn transistors
    witinsamesiliconsubstrate
    *expensive
    *usedinspecialapplicationslikeaerospaceand
    military

    METALLIZATION
    Itistheprocesstoproduceathinmetalfilmlayer
    thatisusedtointerconnectvariouscomponentson
    thechip
    PROCESS:
    *theprocesstakesplaceinthevacuum
    *pressurerange106to107torr
    *evaporatingmaterialisplacedinresistance
    heatedtungstencoilandahighpowerbeam
    isfocussedatthematerialtobeheated

    Continued...
    *Thematerialis
    vapourisedand
    travelsin
    straightline
    pathsandthen
    condensesto
    formthinfilm
    coating

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