Lmx31X Precision Voltage-To-Frequency Converters: 1 Features 3 Description
Lmx31X Precision Voltage-To-Frequency Converters: 1 Features 3 Description
Lmx31X Precision Voltage-To-Frequency Converters: 1 Features 3 Description
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LM231, LM331
SNOSBI2C JUNE 1999 REVISED SEPTEMBER 2015
3 Description
2 Applications
Device Information(1)
PART NUMBER
LM231
LM331
PACKAGE
PDIP (8)
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM231, LM331
SNOSBI2C JUNE 1999 REVISED SEPTEMBER 2015
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Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Description continued ...........................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
4
7.1
7.2
7.3
7.4
7.5
7.6
7.7
4
4
5
5
5
6
7
19
19
19
19
19
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (March 2013) to Revision C
Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
Page
Page
LM231, LM331
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5 Description continued
Further, the LMx31A attain a new high level of accuracy versus temperature which could only be attained with
expensive voltage-to-frequency modules. Additionally the LMx31 are ideally suited for use in digital systems at
low power supply voltages and can provide low-cost analog-to-digital conversion in microprocessor-controlled
systems. And, the frequency from a battery-powered voltage-to-frequency converter can be easily channeled
through a simple photo isolator to provide isolation against high common-mode levels.
The LMx31 uses a new temperature-compensated band-gap reference circuit, to provide excellent accuracy over
the full operating temperature range, at power supplies as low as 4 V. The precision timer circuit has low bias
currents without degrading the quick response necessary for 100-kHz voltage-to-frequency conversion. And the
output are capable of driving 3 TTL loads, or a high-voltage output up to 40 V, yet is short-circuit-proof against
VCC.
LM231, LM331
SNOSBI2C JUNE 1999 REVISED SEPTEMBER 2015
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Pin Functions
PIN
NAME
NO.
IOUT
IREF
FOUT
I/O
DESCRIPTION
Current Output
Reference Current
Frequency Output. This output is an open-collector output and requires a pullup resistor.
GND
Ground
RC
THRESH
Threshold input
COMPIN
Comparator Input
VS
Supply Voltage
7 Specifications
7.1 Absolute Maximum Ratings (1) (2) (3)
MIN
MAX
UNIT
40
+VS
260
Supply Voltage, VS
Output Short Circuit to Ground
Continuous
Continuous
0.2
Input Voltage
Lead Temperature (Soldering, 10 sec.)
(1)
(2)
(3)
PDIP
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are measured with respect to GND = 0 V, unless otherwise noted.
If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
Electrostatic discharge
VALUE
UNIT
500
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
Human body model, 100 pF discharged through a 1.5-k resistor.
LM231, LM331
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MIN
MAX
LM231, LM231A
25
85
LM331, LM331A
70
40
UNIT
All voltages are measured with respect to GND = 0 V, unless otherwise noted.
P (PDIP)
UNIT
8 PINS
RJA
(1)
100
C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
VFC Non-Linearity
TEST CONDITIONS
MIN
TYP
MAX
UNIT
4.5 V VS 20 V
0.003
0.01
% FullScale
TMIN TA TMAX
0.006
0.02
% FullScale
VS = 15 V, f = 10 Hz to 11 kHz
0.024
0.14
%FullScale
0.95
1.05
kHz/V
0.9
1.1
kHz/V
TMIN TA TMAX
4.5 V VS 20 V
30
150
ppm/C
20
50
ppm/C
4.5 V VS 10 V
0.01
0.1
%/V
10 V VS 40 V
0.006
0.06
%/V
(1)
LM231, LM231A
VIN = 10 V, RS = 14 k
LM331, LM331A
LMx31
LMx31A
VIN = 10 V
TMIN TA TMAX
VIN = 11 V
10.0
kHz
% FullScale
0.02
10%
INPUT COMPARATOR
Offset Voltage
LM231/LM331
TMIN TA TMAX
LM231A/LM331A
TMIN TA TMAX
Bias Current
Offset Current
Common-Mode Range
TMIN TA TMAX
10
mV
14
mV
10
mV
80
300
nA
100
nA
VCC 2
0.2
TIMER
Timer Threshold Voltage, Pin 5
Input Bias Current, Pin 5
0.667 VS
0.7 VS
All Devices
0V VPIN 5 9.9 V
10
100
nA
LM231/LM331
VPIN
= 10 V
200
1000
nA
LM231A/LM331A
VPIN
5 = 10 V
200
500
nA
0.22
0.5
0.63 VS
VS = 15 V
I = 5 mA
Non-linearity is defined as the deviation of fOUT from VIN (10 kHz/10 VDC) when the circuit has been trimmed for zero error at 10 Hz
and at 10 kHz, over the frequency range 1 Hz to 11 kHz. For the timing capacitor, CT, use NPO ceramic, Teflon, or polystyrene.
LM231, LM331
SNOSBI2C JUNE 1999 REVISED SEPTEMBER 2015
www.ti.com
TEST CONDITIONS
MIN
TYP
MAX
UNIT
126
135
144
116
136
156
0.2
0.02
10
nA
50
nA
Output Current
0V VPIN 1 10 V
RS = 14 k, VPIN 1 = 0
LM331, LM331A
LM231, LM231A,
LM331, LM331A
All Devices
TA = TMAX
(10 to 500)
1.76
1.89
2.02
LM331, LM331A
1.7
1.89
2.08
60
VDC
VDC
ppm/C
0.1%
0.15
0.5
0.1
0.4
0.05
mA
VS = 40 V
2.5
mA
VS = 5 V
1.5
mA
mA
OFF Leakage
SUPPLY CURRENT
LM231, LM231A
LM331, LM331A
VS = 5 V
VS = 40 V
VALUE
UNIT
1.25
The absolute maximum junction temperature (TJmax) for this device is 150C. The maximum allowable power dissipation is dictated by
TJmax, the junction-to-ambient thermal resistance (JA), and the ambient temperature TA, and can be calculated using the formula
PDmax = (TJmax - TA) / JA. The values for maximum power dissipation will be reached only when the device is operated in a severe
fault condition (e.g., when input or output pins are driven beyond the power supply voltages, or the power supply polarity is reversed).
Obviously, such conditions should always be avoided.
LM231, LM331
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LM231, LM331
SNOSBI2C JUNE 1999 REVISED SEPTEMBER 2015
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LM231, LM331
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8 Detailed Description
8.1 Overview
8.1.1 Detail of Operation, Functional Block Diagram
The Functional Block Diagram shows a band gap reference which provides a stable 1.9-VDC output. This 1.9 VDC
is well regulated over a VS range of 3.9 V to 40 V. It also has a flat, low temperature coefficient, and typically
changes less than % over a 100C temperature change.
The current pump circuit forces the voltage at pin 2 to be at 1.9 V, and causes a current i = 1.90 V/RS to flow.
For RS=14 k, i=135 A. The precision current reflector provides a current equal to i to the current switch. The
current switch switches the current to pin 1 or to ground, depending upon the state of the R-S flip-flop.
The timing function consists of an R-S flip-flop and a timer comparator connected to the external RtCt network.
When the input comparator detects a voltage at pin 7 higher than pin 6, it sets the R-S flip-flop which turns ON
the current switch and the output driver transistor. When the voltage at pin 5 rises to VCC, the timer comparator
causes the R-S flip-flop to reset. The reset transistor is then turned ON and the current switch is turned OFF.
However, if the input comparator still detects the voltage on pin 7 as higher than pin 6 when pin 5 crosses
VCC, the flip-flop will not be reset, and the current at pin 1 will continue to flow, trying to make the voltage at pin 6
higher than pin 7. This condition will usually apply under start-up conditions or in the case of an overload voltage
at signal input. During this sort of overload the output frequency will be 0. As soon as the signal is restored to the
working range, the output frequency will be resumed.
LM231, LM331
SNOSBI2C JUNE 1999 REVISED SEPTEMBER 2015
www.ti.com
10
LM231, LM331
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11
LM231, LM331
SNOSBI2C JUNE 1999 REVISED SEPTEMBER 2015
www.ti.com
*Use stable components with low temperature coefficients. See Application Information.
**0.1 F or 1 F, See Typical Applications.
LM231, LM331
www.ti.com
13
LM231, LM331
SNOSBI2C JUNE 1999 REVISED SEPTEMBER 2015
www.ti.com
Figure 16. Standard Test Circuit and Applications Circuit, Precision Voltage-to-Frequency Converter
14
LM231, LM331
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15
LM231, LM331
SNOSBI2C JUNE 1999 REVISED SEPTEMBER 2015
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16
LM231, LM331
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17
LM231, LM331
SNOSBI2C JUNE 1999 REVISED SEPTEMBER 2015
www.ti.com
11 Layout
11.1 Layout Guidelines
Bypass capacitors must be placed as close as possible to the supply pin. As the LM331 is a through-hole device,
it is acceptable to place the bypass capacitor on the bottom layer.
If an input capacitor to ground is used to clean the input signal, the capacitor should be placed close to the
supply pin.
Use of a ground plane is recommended to provide a low-impedance ground across the circuit.
GND
2
GND
1
COMP-OUT
8
VS
O
M
P-
O
U
2
IREF
7
VINF
3
FOUT
6
COMP-OUT
4
GND
5
RC_TIME
1
VINF
1
COMP-OUT
2
LOAD
1
RC_TIME
2
GND
18
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12.3 Trademarks
E2E is a trademark of Texas Instruments.
Teflon is a registered trademark of E.
All other trademarks are the property of their respective owners.
12.5 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
19
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8-Aug-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Eco Plan
Lead/Ball Finish
(2)
(6)
(3)
Op Temp (C)
Device Marking
(4/5)
LM231AN/NOPB
ACTIVE
PDIP
40
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
-25 to 85
LM
231AN
LM231N/NOPB
ACTIVE
PDIP
40
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
-25 to 85
LM
231N
LM331AN/NOPB
ACTIVE
PDIP
40
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
LM331N/NOPB
ACTIVE
PDIP
40
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
0 to 70
LM
331N
RC4151NB
OBSOLETE
PDIP
TBD
Call TI
Call TI
0 to 70
LM
331N
RV4151NB
OBSOLETE
PDIP
TBD
Call TI
Call TI
-25 to 85
LM
231N
LM
331AN
(1)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
Samples
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(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
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