Field Plot Simulation of 2D Steady State Heat Conduction: Heat and Mass Transfer ME 4442
Field Plot Simulation of 2D Steady State Heat Conduction: Heat and Mass Transfer ME 4442
Field Plot Simulation of 2D Steady State Heat Conduction: Heat and Mass Transfer ME 4442
Conduction
Heat and Mass Transfer
ME 4442
Semester 8
University of Moratuwa
Sri Lanka
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Index No :
Date of Submission :
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1 Abstract
The aim of the practical was to give a comprehensive knowledge on simulation methods of
2D steady sate heat conduction. Common applications and importance of simulation
techniques in heat conduction were discussed. Development in simulation techniques during
the past decades were discussed as well. Similarities in heat conduction and electricity
conduction were identified. The general behavior of equipotential lines agrees with the
literature. Though, significant deviation near a side of the paper was identified. Furthermore,
obtained equipotential lines agree with the theoretical plot which was generated by using
MATLAB as well. 5-point finite difference method gave a satisfied result with 100 iterations.
2 Introduction
Computational Simulation techniques has been able to revolutionize the product designing
process by shifting the prototype testing into a virtual environment. Because of this reason
engineers have been able to reduce the time and cost in the designing process. In addition to
that, possibility of finding the optimum solution has been increased as well. Furthermore,
simulation techniques can be used to model where actual systems cant be modelled such as
fire propagation, bio medical testing. In the past years required numerical calculations were
done manually by scientists. Practical apparatuses such as field plotters were used to validate
those calculations.
Beside the development of computational power of computers engineers have got more
degree of freedom to model physical systems as they are. GUI programmes such as ANSYS
and COMSOL were introduced. They have an interface to operate between users and
computer languages such as FOTRAN, C++ which really helps to engineers to model
systems with less effort in a more effective manner. Heat transfer simulations are done in
various industrial applications. Their scale varies from micro meters to meters. Simulations
techniques are highly used in designing of heat exchangers. Many parameters have to be
investigated to get the optimized design. According to the literature complex flow phenomena
can be seen in shell and tube heat exchangers. Therefore, it is required to carry out
simulations to observe the heat transfer rates to get the optimized design. Following figure
depicts a CFD simulation of a shell and tube heat exchanger.
Figure 1CFD simulation of a shell and tube heat exchanger
3 Theory
Energy balance for heat transfer for an infinitesimal element in the field can be written as,
2 2 2 e c T
2
( T ) + 2
( T ) + 2
( T )+ gen =
x y z k k t
Then lets consider the case 2D steady state condition with no heat generation. then the
equation will be,
T
=e ge n=0
t
2 T 2 T
+ =0
x2 y 2
For complicated geometries where obtaining analytical solutions are difficult, a numerical
estimation can be used to evaluate the temperature at each point in a field of a finite number
of points. Using the central difference method to estimate the second order partial derivatives,
we obtain the following finite differences at a discretized point (i, j),
2 T T i +1, j 2T i , j+ T i1, j
( )
x2 i, j
=
(x) 2
+O ( x )
2
2
T i , j +12T i , j+ T i , j1
( )
T
y2 i, j
=
( y ) 2
+O ( y )
2
Neglecting the errors and setting equal discretization intervals, we can obtain the following
relationship to obtain a linear relationship between the adjacent nodes in the temperature
field.
2 E 2 E
+ =0
x2 y 2
One way to accomplish this is to use a commercially available paper that is coated with a thin
conductive film. This paper may be cut to an exact geometric model of the two-dimensional
heat-conduction system. At the appropriate edges of the paper, good electrical conductors are
attached to simulate the temperature boundary conditions on the problem. An electric-
potential difference is then impressed on the model. It may be noted that the paper has a very
high resistance in comparison with the conductors attached to the edges, so that a constant-
potential condition can be maintained at the region of contact. Once the electric potential is
impressed on the paper, an ordinary voltmeter may be used to plot lines of constant electric
potential. With these constant-potential lines available, the flux lines may be easily
constructed since they are orthogonal to the potential lines. These equipotential and flux lines
have precisely the same arrangement as the isotherms and heat flux lines in the corresponding
heat-conduction problem.
4 Equipment
5 Procedure
Programme was created using MATLAB. It follows Dirichlet algorithm to estimate the
temperature values at insulated boundaries. The programme has the capability to check the
convergence in the solution. User has to specify to required convergence that he/she expects.
Code checks the maximum error in each iteration and it plots the convergence vs the
iterations. If the programme couldnt reach to that convergence within 20000 iterations, code
will break and give the result. This limit is set just to avoid infinite looping. In addition,
execution time is optimized by only running the calculation within only the required region.
Furthermore, use can specify the required resolution by changing the mesh size as well.
%%%%%%%%%%%%%%%%%%%%%%Mesh Size%%%%%%%%%%%%%%%
M = Source_height / Meshsize+ 1;
N = Source_width / Meshsize + 1;
m = Sink_height / Meshsize + 1;
n = Sink_width / Meshsize + 1;
%%%%%%%%%%%%%%Initial Conditions%%%%%%%%%%%%%%
T = zeros(M,N);
Tnew = 0;
%%%%%%%%%%%%%%Boundary Conditions%%%%%%%%%%%%%
T(M - m:M, N - n:N) = Ts;
T(:,1) = Th;
T(1,:) = Th;
%%%%%%%%%%%%%%Calcalations%%%%%%%%%%%%%%%%%%%%
k = 1;
error(k) = 0;
while ( error(k) > 1e-2 || k == 1)
maxerror = 0.0001;
for i = 2: M
for j = 2:N
if i > M - m && j > N - n
continue
elseif i == M || j == N
if i == M
Tnew = 1/3*( T(i - 1, j) + T(i,j + 1) + T(i, j -1));
errorcheck = abs((Tnew - T(i,j))/Tnew);
T(i,j) = Tnew;
else
Tnew = 1/3*(T(i+1,j) + T(i - 1, j) + T(i, j -1));
errorcheck = abs((Tnew - T(i,j))/Tnew);
T(i,j) = Tnew;
end
else
Tnew = 1/4*(T(i+1,j) + T(i - 1, j) + T(i,j + 1) + T(i, j -1));
errorcheck = abs((Tnew - T(i,j))/Tnew);
T(i,j) = Tnew;
end
if (errorcheck > maxerror)
maxerror = errorcheck;
end
end
end
k = k + 1;
error(k) = maxerror;
if k == 20000
break
end
end
%%%%%%%%%%%%%%%%%%%%%%%%%%%%%Show Reults%%%%%%%%%%%%%%%%%
subplot(1,2,1)
plot(error)
subplot(1,2,2)
colormap(jet);
image(T)
toc
7 Results
Results for 150 x 150 mm2 ,100 0C source and 50 x 50 mm 2 0 0C sink with resolution for 1
mm mesh seize is depicted below.
8 Discussion
To simulate the actual thermal system is not an easy task, because it is required to maintain
the constant temperatures at the boundaries which would be a highly complex situation. In
addition, it is difficult to perfectly thermally insulate the other two boundaries as well. In
contrast, maintaining constant voltage levels and insulating boundaries for current can be
achieved with less effort. Furthermore, cost and time will reduce and complexity of taking
measurements will also reduce.
8.2 Reasons for discrepancies between the practical and theoretical temperature
distributions
In theoretical analysis, since it is difficult to get an analytical solution due the high
complexity in PDVs, numerical solution was found and in ideal conditions were assumed
which would not be the case in the practical scenario. As an example, conductivity of the
paper would not be isotropic and the metal surface would not be parallel to each other. In
addition to that, errors occurred during connecting the dots to get the equipotential lines
would cause significant deviation as well.
8.3 Solving approach for a problem with convective boundaries instead of insulated
boundaries.
At convective boundaries, the conductive heat flux normal to the boundary is equal to the
convective heat flux [1]. Hence, we can say that,
T
k =h(T T )
x
According to [2], this type of boundary may be treated as follows for the numerical solution.
As seen, when this form is analogous to electrical fields, the relevant factors to represent h
and k must be determined. This condition can be experimentally simulated by the use of a
different isotropic material at the boundary with a significantly different and known value for
the conductivity. The temperature T can be simulated by the application of a voltage
boundary to the second material, which in turn connects the conductive paper to the voltage
boundary.
Other analogies that can be used for heat transfer problems are,
Hydraulic analogy
Membrane analogy
Geometric electrical analogies
Network analogy
Various applications which relate to 2D steady heat conduction can be seen in the industry.
One of the popular applications is heat exchangers. Heat is transferred from one medium to
another medium through conductive surfaces which can be treated as a 2D heat transfer. To
obtain the maximum efficiency diameters of the fins must be optimized. Therefore, it is
required to observe how the heat is transferred. Accordingly, same analogy can be used to
predict the heat transfer in the tubes. Eventually, the overall performance of the heat
exchangers could be predicted.
9 Conclusion
2D steady state heat conduction can be seen in various applications in the industry. Therefore,
it is required to have a good understanding about the how the heat is transferred. Though,
simulation of heat transfer is not an easy task. Hence, similar analogy techniques have been
introduced to obtain required results. In addition, numerical solutions also provide accurate
results but it is not easy to model complex applications by using them. With the development
of computational power, these numerical solutions were boosted up and now they are widely
used instead of experimental setups. Even though, numerical results must be validated
experimentally, before using them to make any decision.
References
[1] Y. A. Cengel and A. J. Ghajar, Heat And Mass Transfer, New York: McGraw-Hill, 2011.
[2] A. K. Mitra, "Finite Difference Method for the Solution of Laplace Equation", Iowa State
University, Iowa State, 2005.