NP540U3C

NP540U3C
Lotus-13R-TSP
SERVICE MANUAL
540U3C Contents
1. Precaution
2. Introduction
3. Desassembly and Reassembly
4. Trouble shooting
5. System Wire Diagram
Refer to the service manual in the GSPN (see the rear cover) for more information.
Contents
Contents
1. Precaution........................................................................................................................................ 1 1
1.1. General After-Sales Service Precautions....................................................................................... 1 1
1.2. Safety Precautions ................................................................................................................... 1 2
1.3. Ground .................................................................................................................................. 1 3
1.4. Static Electricity Precautions...................................................................................................... 1 4
2. Introduction ..................................................................................................................................... 2 1
2.1. Product Features ...................................................................................................................... 2 1
2.2. Specification ........................................................................................................................... 2 2
2.3. Comparing product specifications ............................................................................................... 2 8
2.4. Function of Product.................................................................................................................. 2 9
2.5. New Technology / ability .......................................................................................................... 2 13
2.6. Hardware ............................................................................................................................... 2 31
2.7. Software ................................................................................................................................ 2 38
2.8. System Setup (Bios Setup)......................................................................................................... 2 41
2.9. HW & Option Materials ............................................................................................................ 2 48
3. Desassembly and Reassembly.............................................................................................................. 3 1
3.1. MainSystem............................................................................................................................ 3 1
3.2. LCD...................................................................................................................................... 3 4
4. Trouble shooting ............................................................................................................................... 4 1
4.1. General spec ........................................................................................................................... 4 1
4.2. Debugging Flow Chart.............................................................................................................. 4 2
4.3. Hardware Troubleshooting ........................................................................................................ 4 5
4.3.1. LCD ......................................................................................................................... 4 5
4.3.2. Main System .............................................................................................................. 4 6
4.4. Diagnosis application ............................................................................................................... 4 11
4.5. Bios & Micom Update .............................................................................................................. 4 13
4.6. RTC Reset .............................................................................................................................. 4 14
4.7. Battery Use time...................................................................................................................... 4 15
4.8. CPU FAN Control.................................................................................................................... 4 16
4.9. System Diagnosis .................................................................................................................... 4 18
4.10. Hardware Upgrade ................................................................................................................... 4 19
5. System Wire Diagram ........................................................................................................................ 5 1
5.1. System Layout ........................................................................................................................ 5 1
5.2. Board Component .................................................................................................................... 5 4
i Copyright 1995-2012 SAMSUNG. All rights reserved.

1. Precaution
1. Precaution
1.1. General After-Sales Service Precautions
1) Do not let customers repair the product themselves..
There is a danger of injury and the product life time may be shortened.
2) Make sure to disconnect the power cord from the wall outlet before repairing the product (especially for after-sales
service of electric parts).
There is a danger of electric shock.
3) Do not let customers plug several electric home appliances into a single wall outlet at the same time.
There is a danger of fire due to overheating.
4) Check if the power plug or wall outlet are damaged in any way.
If a defect is found, repair or replace it immediately.

(There is a danger of electric shock or fire)
5) Make sure that it is properly grounded.

(Check the ground of the wall outlet)
Electricity leakage may cause electric shock.
(READING S HOULD)
NOT BE ABOVE 0.5mA
LEAKAGE
DEVICE
CURRENT
UNDER
TES TER
TES T
TES T ALL
EXP OS ED METAL
S URFACES
2-WIRE CORD
*ALS O TES T WITH

P LUG REVERS ED
(US ING AC ADAP TER
P LUG AS REQUIRED)
EARTH
GROUND
Figure 1.1 Leakage Current Test Circuit
6) Do not spray water on to the product to clean it.
There is a danger of electric shock or fire and it may shorten the lifetime of the product..
7) Check the assembly status of the product after the after-sales service..
The assembly status of the product must be the same as before the after-sales service.
8) Unplug the power cord holding the power plug (and not the cord).
If the cord is disconnected, it may cause electric shock or fire.
9) Repair the product using only authorized parts
10) Keep the product away from heating devices such as heaters.
Exposure to heaters may cause deformation of the product or fire.
Copyright 1995-2012 SAMSUNG. All rights reserved. 1-1

1. Precaution
1.2. Safety Precautions
1) EMI
This device has been registered regarding EMI for residential use. It can be used in all areas.
2) Circuit Test (Logic Test) Precautions

The LSI and MSI used in this product are semiconductor integrated circuits based on MOS-FET or CMOS. Since
these types of devices are highly susceptible to static electricity or current leakage, an isolation break may be caused.
Therefore read and follow the instructions below.
a) When handling an LSI or MSI, make sure your body is grounded through a few mega-ohms of resistance. In
addition, wear gloves and a jacket made of cotton and not of synthetic fibers that easily generate static electricity.
b) When repairing the product, place a conductive material (e.g. aluminum foil) grounded to the earth on the worktable.
c) You must use a soldering iron without a leakage current.
d) Do not touch the pin of an IC and carefully insert the IC into the black plastic package.
e) When inserting an IC into a PCB, be careful with the direction of the IC. When installing an IC in the wrong
direction, it might become damaged.
f) When carrying an IC, package the IC with conducting material such as aluminum foil or conducting sponge so as to
keep the voltage level of each of the terminals the same.
g) Since the storage temperature of an IC is between -20 ~ +70 degrees, keep it at room temperature, if possible.
h) Since the storage temperature of an IC is between -20 ~ +70 degrees, keep it at room temperature, if possible.
i) When soldering an IC, solder it in as short a time as possible so that unnecessary heat is not applied to the device.
j) Avoid leaving excessive amounts of flux within a custom IC or between the pins when soldering a custom IC.
k) Take care to not damage the board when installing or separating an Option Board.
l) Take care to not break the printed circuit pattern on the PCB when separate an IC.
1-2 Copyright 1995-2012 SAMSUNG. All rights reserved.

1. Precaution
1.3. Ground
The product must be grounded to protect it from static electricity and other dangers. When using a multitap, please use a
multi tap with a ground terminal only.
If you use a 220V wall outlet with a ground terminal, you do not need to ground it additionally. Avoid using wall outlets if
they are not grounded even if they have a ground terminal.
To ground the product, connect the ground to an exclusive ground terminal or metal water pipe. Connect the ground cable to
the ground terminal at the rear of the main body. To ground the product, connect the ground terminal of the product to a
metal water pipe, wall outlet or exclusive ground terminal with an electric wire equal to or thicker than #18.
Never ground the product to a PVC water pipe, phone line, TV, radio antenna, aluminum window or gas pipe, because this
does not actually ground the product and may be dangerous.
The red box of each image is earth with overlap when inserting a plug or multiple-tab into the socket.
Please check that it should be put the outlet completely.

1. Precaution
1.4. Static Electricity Precautions
Many parts of the system are susceptible to static electricity. Using an electrostatic discharge (ESD) device is very important
for the safety of the user and the user's surroundings. Using an ESD device increases the probability of a successful repair
and lowers the expenses for damaged parts.
To prevent static electricity, follow the instructions below.
1) Perform the repair in a location without static electricity.
2) Touch your hands to a metal water pipe or some metal object connected to the ground to discharge any static
Electricity from your body before handling the parts.
3) Touch only the edges of the board, if possible.
4) Do not touch any parts unless absolutely necessary
5) Disassemble the parts on the anti-static-electricity pad.
6) When a board is not installed in the system, package the board with an anti-static-electricity packaging.

2. Introduction
2. Introduction
2.1. Product Features

2. Introduction
2.2. Specification
Processor* and Motherboard

CPU Intel IvyBridge Processor i3 3217U 1.50Hz, 3 MB
Intel IvyBridge Processor i5 3317U 1.70Hz, 3 MB (Up to 2.6 GHz)
Intel IvyBridge Processor i7 3517U 1.9GHz, 4 MB (Up to 3 GHz) - Max Spec
Cache L3:3~4MB
Chipset Intel HM76
BIOS 64 Mbit SPI flash, upgradeable
Thermal Design (TDP) MAX.17W
Memory*
Maximum Capacity MAX. 12GB (on BD 4GB + 8GB x1)
Type (MHz) DDR3 (1333MHz/1600MHz)
Modules 4GB( (on BD 4GB)
6GB(on BD 4GB + 2GB x 1)
8GB(on BD 4GB + 4GB x 1, Later introduction schedule) SODIMM
Sockets 1-slot SODIMM & On-board (up to 4GB) '1 Slot Per Max. 8GB Support'
Upgradeable by users Yes
PC3-10600(1333Mhz), PC3-12800(1600Mhz) confirmed the compatibility test.
Display and Graphics*
LCD 13.3" With TSP(Touch Screen Panel : electrostatic, tempered glass)
* Not support 3 Display
Ratio 16:9
Panel TN
Surface Type Non Glare
Back Light LED
Interface LED
Vendor Samsung
Resolution (Number of Pixel) HD (1366x768) Win7 Support /Win8 Support
(1366 X 768,1360 X768, 1280 X 768,1280 X720,1280 x 600, 1024 X 768, 800 X
600)
Viewable Area 293.42(H) X 164.97(V)
Viewing angle Hor. +45/-45, Ver. +15/-30(typ)
Pixel Pitch 0.2148(H) x 0.2148(V)
Contrast Ratio Min.300, Typ.400
Brightness typ.300 (cd/m2)
Colors 16.2M
Response time Typ.16ms, Max. 25ms (Rising + Falling = LCD response speed)
Graphics Controller 1 1.Intel HD Graphics 4000 (Internal)

2. Introduction
Max. resolution for VGA Max resolution of 2560x 1600 at 60Hz at 85Hz refresh rate (ext.)
Supported resolution (640x480,800x600, 1024x768, 1152x864,
1280x800,1280x960,1280x1024, 1400x1050,1440x900,1600x1024,1600x1200,
1680x1050, 1920x1200, 1920x1440, 2560x1600)
[Ext.monitor resolutions supported by EDID information]
Max. resolution for HDMI Support v1.4a compliant / a resolution of 1920x1200 pixels with 32-bit color
at 60 Hz
Max. Resolution for LFP LVDS dual link resolution of 2560 X 2048 per link / a maximum theoretical pixel rate
of 224 MP/s
(640x480,800x600, 1024x768, 1152x864, 1280x800,1280x960, 1280x1024,
1400x1050, 1440x900,1600x1024,1600x1200, 1680x1050, 2560x2048)
[Ext.monitor resolutions supported by EDID information]
Multimedia
Sound High Definition Audio
Controller HD Audio Codec, ALC269Q-VC2-GR
Conversion Built-in high performance 24-bit ADC & 24-bit DAC
Internal Interfaces Embedded stereo speakers, Internal Mono MIC
Speaker Power Rating 2 Speakers x 2 Watt with enclosure each
External Interfaces Headphone/Mic Combo, Not Support S/PDIF
Controls Keyboard volume control
Camera
Image sensor 1.3 Mega CMOS Color Image Sensor
Still Image Capture Resolution 1280*1024(Max.), 1280*720, 800*600, 640*480, 352*288, 320*240
Video Capture Resolution 1280*1024(Max.), 1280*720, 800*600, 640*480, 352*288, 320*240
Frame Rate 30fps @ HD, 24MHz MCLK
Output Video Format SXGA, HD, SVGA, VGA, CI and QVGA
Interface USB 2.0
UVC Support Supported
Storage*
Hard Disk Drive 7mmH 2.5" HDD, Removable (with Express cache 24GB=iSSD SATA3)
* 9.5mmH 2.5" HDD installation impossibility
Vendor HITACHI (BA59-03210A)
Supports SATA host controller support 48bit LBA
Average Access Time 12m sec.
Interface SATA2 (3.0Gbps) * SATA 1 Support, SATA 3 Not Suppot.
Speed 5400rpm
Capacity 500GB(Max)
Solid State Drive mSATA SSD, Removable
Vendor SanDisk (BA59-03232C)
Supports SATA host controller support 48bit LBA
Average Access Time Read : Up to 450 MB/S Write : Up to 350 MB/s
Interface SATA3 (6.0Gbps) * SATA 1,2 Support.
Speed 6.0Gbps

2. Introduction
Capacity 128GB(Max.256GB)
Network Tools
LAN Integrated 10/100/1000 Mbps Ethernet
Controller RTL8111E
Vendor Realtek
Features RJ45 Output
Wireless LAN Jackson Peak2 2x2 Combo (BA59-03294A) * WiDi Support
Module 802.11a/g/n 2x2 WLAN and BT4.0 (BLE , BT3.0 +HS)
Type Mini Card half size
Interface WLAN(PCI-E), BT(USB2.0)
Chipset Intel Centrino Advanced-N 6235
Max. Link Speed Wi-Fi Rx/Tx Throughput 300Mbps (Link Speed is only standard value, Actually
value will decided by each environmant)
Antenna 2 Antenna Support : WLAN (2Tx/Rx)
Wireless LAN Atheros WB225 (BA92-08418A)
Module 802.11b/g/n 1x1 WLAN and BT 4.0 (BLE , BT3.0 +HS)
Type Mini Card half size
Interface WLAN(PCI-E), BT(USB2.0)
Chipset AR9485(WLAN) + AR3012(Bluetooth)
Max. Link Speed Wi-Fi Rx/Tx Throughput150Mbps (Link Speed is only standard value, Actually
value will decided by each environmant)
Antenna 1 Antenna Support : WLAN (1TX, 1RX), BT(1TX/RX)
I/O Interface
Memory Card Reader 3-in-1( SD/ SDHC/ SDXC)
- maximum support capacity SD (SDHC +SDXC)
SDHC : 32GB
SDXC : 1TB
Controller GL823
Vendor GENESY
Vendor
Express Card Slots N/A
I/O Ports
USB Port 1 X USB 3.0 (Chargeable iphone Recharge), 2 X USB2.0
VGA Port mini VGA Adapter (Option) [BA39-01189A]
Audio Jacks HeadPhone-out, MIC-in Combo (4pole) * US , L/R/G/M
Wired LAN RJ45
HDMI 1 x HDMI
Security Slot N/A
Power 1 x DC-in jack for AC adapter (3Pie)
Input Devices
Keyboard
Type Chicklets

2. Introduction
Specification Travel length : 1.5 mm, height : 3.9 mm, Pitch : 19.05mm
Key numbers 80 - key (US,KOR,RUS,SEK) 81- Key (UK,FRA, GER, SPA, ITA )
Num Keypad N/A
Touchpad Standard Touchpad with 2 buttons (with gesture function), 99.0 x 53.0
LED Indicator Power, AC-in / battery, HDD, WLAN
Security Solutions
TPM(Option) Trusted Platform Module 1.2
Interface LPC
Controller SLB 9635 TT 1.2
Vendor Infineon
Application Omnipass / TPM Host SW
Power and Power Management
System power management
Power management features ACPI V2.0 compliant S0 ~ S5, C1~ C6 Mode
Standard battery
Model code AA-PLWN4AB
Type Li-Polymer
Details of cell 4 cells
Battery capacity 6890mAh
Battery rating 52Wh
Voltage 7.56V
Color Black
Dimension 265.8*104.11*6mm (W x D x H)
Weight approximate 315g
Recharging Time approximate 3 hours
Vendor SDI, Dynapack
AC Adapter
Model Name AD-4019P (BA44-00279A)
Output Power 40W
Dimension 92.5 x 38.5 x 27.5mm (W x H x D)
Weight (AC Adapter) 175g (Max)
Worldwide Compatibility Auto-sensing 100 - 240VAC
Line Frequency 50 / 60Hz
Adapter Rating - Input 100 VAC ~ 240 VAC, 1.0 A
Adapter Rating - Output 19.0VDC / 2.1A
System Dimensions
Pyxical Information
Dimensions (W X D X H) 315.1 x 218.9 x 19.9mm
Weight 1.64Kg (W/ SSD) 1.69Kg(W/ HDD)
- Condition Full System with 4 cell Battery (With Bag: 0.06Kg, WithOut Bag: 0.04)
Package dimensions (W x D x H) All Nation Common (With bag) 386 x 136 x 345 mm (Without bag) 395 x 330
x82 mm

2. Introduction
Design
LCD Back Aluminum
LCD Front Glass
System Top Aluminum
System Bottom PA/GF 50%
OS
Operating system Win8

2. Introduction
Label Location

2. Introduction
2.3. Comparing product specifications

2. Introduction
2.4. Function of Product

2. Introduction

2. Introduction
Keyboard
Keyboard arrangement and size can differ to by each country.
: KBD Water Check sheet Location

2. Introduction

2. Introduction
2.5. New Technology / ability
Inner Battery
Please Refer to the Training manual chapter1.
TPM (Option)

2. Introduction

2. Introduction

2. Introduction

2. Introduction

2. Introduction
USB3.0

2. Introduction
iSSD

2. Introduction
Wireless Display

2. Introduction

2. Introduction
Windows 8

2. Introduction

2. Introduction

2. Introduction

2. Introduction

2. Introduction
Touch Screen (Option)

2. Introduction

2. Introduction

2. Introduction

2. Introduction
2.6. Hardware
New H/W - ISSD

2. Introduction
(1) Intels 2012 Mobile Platform : Cheif River

2. Introduction

2. Introduction

2. Introduction

2. Introduction

2. Introduction
BT 4.0

2. Introduction
2.7. Software
ItmName
Heci(Chief River,SWDESC)_Package 8.1.0.1248 for Win8(8.1.0.1248 )
Touchpad- Elan - (11.7.2.1_WHQL)
Namuga 1.3M(HD) Camera 6.5x56x3.1T FPC (SC-13HDL11431N)(-)
Namuga 1.3M(HD) Camera 6.5x56x3.1T FPC LED VE (SC-13HDL12131N)(-)
QCA Bluetooth Driver Win8- (8.0.0.206)
QCA WLAN Driver Win8- (10.0.0.75 WHQL)
Intel Bluetooth Driver (Win8)(2.5_PV2)
Intel WLAN Driver (e64)(15.5.0.42 PV HF1 BTHS MWT)
ExpressCache (for x64)(1.0.92.0)
Win 8 64bit Professional(v.9200)
Driver
Win 8 64bit Standard(v.9200)
Intel IvyBridge Windows8 GFX driver - 64bit(9.17.10.2817 (WHQL_Generic))
Realtek ALC26X Win8/Win7 Snd Drv(6.0.1.6699Logo)
Intel Rapid Start Technology Driver for Windows 8(2.1.0.1002)
Win8-Realtek LAN Driver[Gigabit](8.2.612.2012)
iRST Win8 for NP(11.5.0.1207PV-W8Inst)
Lotus_Jones_TSP_SS Enable(1.0.0.2)
Infineon TPM Utility (Win8)(4.3.0.3137)
Airplane Mode Control Driver(Win8, 64bit)(6.2.8400.4218)
Intel Wireless Display (3.5.34.0 PV)
Kindle for Metro (Samsung)
Shark Dash for Metro
Photo Editor
MusicHub
FamilyStory
ChatOn
Birzzle for Metro
StumbleUpon for Metro
Application
Netflix
Tuba.FM for Metro
Onet.news for Metro
MS_Mahjong
BugsMusic
WildTangent Games for Metro
CineTrailer for Metro
ilMeteo for Metro

2. Introduction
ItmName
RepubblicaTV for Metro
PagineGialle for Metro
Rai.TV for Metro
Merriam-Webster Dictionary
MusixMatch
TVN Player
Le Monde
Tele7
Allo Cine
Kiosque Relay
Financial Times
Parcel Genie
MS_Adera
MS_Taptiles
National Rail
Fresh Paint
Metro_Layout_for_NotePC_Intel_MS_Featured_Only
MS_Pinball_FX2
Application Dailymotion
ChatON(Canada)
Music Maker Jam
Windows Reader Metro Pinning
SkyNews
Norton Studio
News Republic
Jamie Oliver's Recipe for Metro
Skype(Metro) for Win8
Match'A' Shape for Metro
S Player for Win8 Metro
S Camera for Win8 Metro
S Gallery for Win8 Metro
Evernote Metro for Win8
Accessory Store
IE Default HomePage(MSN)_64bit (Jumpstart'12)
SkyNews
Adobe Reader for Win 8
Sogou 6.2 for Win8

2. Introduction
Software Previous/New
For more information, product descriptions and installation training manuals refer to Chap.1
Development Stage Information

Consultation of development stage (Known Issue&spec)
Please refer that [Consulting Script]->[Consultation].

2. Introduction
2.8. System Setup (Bios Setup)

2. Introduction

2. Introduction

2. Introduction

2. Introduction

2. Introduction

2. Introduction

2. Introduction
2.9. HW & Option Materials
Basic Item

2. Introduction
Optional

2. Introduction

3.1. MainSystem
3. mini SSD card (mSATA)
CAUTION
At first disassemble screw(red circle) change mini SSD
Make sure to separate the AC adapter before card module
disassembling the system.
1. 1.memory door disassembling

- After removing 1 screw up to the remove the memory
door.
4. Cover disassembling
< Picture of system which remove memory door. > - Remove 8 screws for removing Bottom.
- 3 Red Circle : Careful! The hook can be broken.

< Picture of system which removed Bottom >
2. HDD disassembling
Remove 4 (Red circle) Screw, and take out FPC cable
from the connector.

5. Battery disassembling 9. DC jack cable disassembling

-Remove 5 (Red circle) Screw, and take out Battery - DC jack cable(Red Square) Pull and remove it.
Jack from the connector.
10. Memory disassembling

- Loosen both sides of the hook to remove the memory.
6. WLAN disassembling
-After removing 1 screw (Red circle) up to the remove
the Wlan.
7. KBD Membrain TP SUB FFC disassembling 11. Fan disassembling

- KBD Membrain TP SUB FFC is separated by After removing 2 screws, remove the 3 screws in Sink
pulling to the top. outlet.
12. Main Board disassembling

8. LCD Cable and TSP cable disassembling After removing 2 screw up to the remove the Main
- LCD/TSP Cable(Red Square) Pull and remove it. board
- cf) Yellow circle for Lotus-R not Lotus-TSP

13. < After full decomposition appearance. >

3.2. LCD
CAUTION
12.LCD Assy cant disassemble

- TSP do not function when LCD Assydisassembled.

4. Trouble shooting
4. Trouble shooting
4.1. General spec
Tools used for repairing the product

System Diagnostics Disk
MS-DOS Booting Disk
System Diagnostics Card
Screwdrivers (+, )
Tweezers
Multi-meter
Oscilloscope / Logic Analyzer
Replace Units (FRU: Field Replaceable Unit)

DDR3 RAM Module (1 slot)
7mmH SATA 2.0 HDD
Broadcom Wireless LAN + BT Combo Module / Intel Wireless LAN + BT Combo Module
Adapter
System Fan / Heatsink
Touch Pad
Battery
Speaker
Main Board / PWR Sub Board / 3-in-1 Sub Board / USB 2.0 Sub Board
Harness Cable
Harness Cable- DC in Cable, SATA HDD FPC, Main-to-PWR SubBdFFC , USB2.0 FFC, 3-in-1 FFC, LCD Cable,
Touchpad FFC

4. Trouble shooting
4.2. Debugging Flow Chart
Debugging Flow of our company computer product does same as between product universally.
Refer to attachment Debugging Flowchart more content.
Training manual how to use the side of the fault diagnosis please refer.

4. Trouble shooting

4. Trouble shooting

4. Trouble shooting
4.3. Hardware Troubleshooting
4.3.1. LCD
#1. The screen is dark or the colors of the screen are distorted.
Check the connection status
- LCD Module LCD Cable
- LCD Cable and Main board LCD Connector
1 Connect Cable and Connector perfectly
2 Replace the LCD Assy Defectiveness confirmation

Check if there is a part of the LCD that is bent or broken
due to impact
3 Replace the LCD Assy
#2. No picture appears on the screen.

Check the connection status
- LCD Module LCD Cable
- LCD Cable and Main board LCD Connector
1 Connect Cable and Connector perfectly
LCD Assy replace
Check if the System LED of the main board is blinking
3 Check if the memory module is out of order Re-fixation or Replacement other Memory Card
4 Check if the Power button can be normally pressed. Check operating or not
#3. The LCD blinks while the system is in operation.

Check if there is a magnetic body near the touch pad
button or the system or check if there is an exterior defect
to the LCD
1
2 Replace the LCD Assy Defectiveness confirmation

4. Trouble shooting
4.3.2. Main System
#1. The system is not turned on.

Check if the AC adapter LED is lit and if the adapter is Check the adapter LED.
properly connected to the system.
1
If the AC adapter is not connected, check the charge Inner Cell Battery type
status of the battery. Even if the battery is charged, if Cant check external meter
the remaining battery charge is too low, the system may
2 not be turned on.
Check if there are any alien substances in the Power

switch.
3 if have, change the LED
4 Replace Main Board Check operating or not.
#2. the system does not boot or immediately turns off after being turned on
Since this may be a short circuit in the system. Disconnect the power immediately, disassemble the
1 system and check if there are any conducting alien
objects such as a screw inside.
Check the connection status between the CPU and the
RHE.
3 Replace the memory module. *Check if it is out of order.

4 RTC Reset. *Check if it is out of order.
5 Replace Main Board. *Check if it is out of order.

4. Trouble shooting
#3. There is no sound from the speaker.

(Insert the figure of the audio jacks so that the reader can check via the figure.)
Check if the sound is muted after booting up Windows.
Fn + F6 (Mute cancellation)
1 Fn Lock enable + F6
Control panel confirmation.

Speaker Setting.
2
Check the connection status of the speaker cable and

check if the speaker is out of order.
3
Check if there is a magnetic object near the speaker.
#4. I cannot hear sound through the headphones.

Check if the sound is muted after booting up Windows.
Fn + F6 (Mute cancellation)
1 Fn Lock enable + F6
Control panel confirmation .

2 Speaker Setting.
Turn the volume up.

Fn key volume adjustment.
Check the Headphone jack.

4
5 Replace Main Board. *Check if it is out of order

4. Trouble shooting
#5. external/Internal microphone does not work normally.

Check the audio driver settings and change them if
necessary.
1
Check the connection status of the MIC connector and

2 *Check if it is out of order.
check if the speaker is out of order.
Check the Mic jack.
3
#6. HDMI port does not work normally.

System manager confirmation .
(Video / Sound / Controller confirmation)
1
HDMI driver Re-install.
Check the Display Manager work normally.

Display Manager program Re-install.
2
Check the Control panel .

Check HDMI section enable.
#7. The HDD is not recognized.

Check the connection status of the HDD connector. Fix
HDD, check whether the system can be found. if not,
change the connector on the motherboard and check
1 again.
If the 'Operating system not found' message appears

during the booting process even though the HDD is Format the HDD and reinstall the operating System.
2
recognized by CMOS, the operating system of the HDD
may be corrupted or the SSD is out of order. Replace the HDD with a new one.

4. Trouble shooting
#8. Touch Pad does not work normally.
1 Check the connection status of Touch Pad FFC.

2 Check the connection status of Touch Pad I/F B'D.
3 Check the connection status of Touch Pad Module.
Replace Touch-Pad Module.
4
#9. Battery problems.

Check if the AC adapter
Replace suitable Adapter (40W/60W)
1
2 Confirms a battery defective yes or no. *Battery Check reference.

3 Replace Main board *Check if it is out of order.
#10. Camera does not work normally.

Check the driver status of Camera
1 ( Check the system manager )
Check the connection status of camera cable between

2 Camera module
Replace Camera module

3
4 Replace Main Board *Check if it is out of order.
#11. WLAN does not work normally.

Check the damage status of WLAN Cable
Replace WLAN Cable
Check the driver status of WLAN

2 Re-Install WLAN driver.
Check the damage status of WLAN Jack

Replace WLAN module.
3

4. Trouble shooting
#12. The Fan does not work normally.

Check the system by using SAFC(Samsung Advanced *Tool Program referance
1
Fan Control)program.
Check the connection status of Heat sink
Screw fixation 7EA
3 Check the connection status of FAN

4 Replace FAN *Check if it is out of order.
#13. TSP function is abnormal , or does not work.

1 Try Calibrate TSP again in control panel
Make sure TSP cable is connected
3 Change LCD Assy

4. Trouble shooting
4.4. Diagnosis application
WinDiag4
1) WinDiag4 is a Diagnostic tool that tests overall computers H/Ws and functions for Windows 7.
2) Precondition : UAC(User Account Control) should be disabled.
3) Installation : When you double-click SvcDiag.bat file, this program will be installed in C:\WinDiag4.
After installation, WinDiag4 will automatically start testing the system.
4) Uninstallation : After terminating the program, Just delete C:\WinDiag4 folder.
: Group Info
It displays Group Item Name and Test Count. If there is any FAIL or FAULT in the Group Item, the color of title will
be changed to Red.
: Test Item
It displays Test items included in this Group. If there is any FAIL or FAULT in this test item, the color of the test item will
be changed to Red.

4. Trouble shooting
Pyxis
1) Pyxis is a software that diagnose computers H/W components in DOS environment.
2) How to use Pyxis
- First, make Dos bootable USB memory or CD.
- Copy all released files to the Dos bootable device.
- After you boot using the Dos bootable device, Select the menu that you want to execute.

4. Trouble shooting
4.5. Bios & Micom Update
Set-up Method
1) DOS Mode Update
a) Make a Dos booting disk -> Copy Packing file to Disk -> boot from DOS disk ->
b) BIOS update: C:\>phlash16 xxx.wph/c /bbl
c) MICOM update : C:\>up111m XXXX.bin
d) Packing fie : C:\>XXXX.exe /s /c
(XXXX.exe is the packing file merging BIOS and MICOM -> ABXX.exe)
Inform to customer that it is not recommend to update BIOS and Micom in DOS mode.
If not, it can cause fatal error.
2) update in the Windows

Windows boot -> Run Samsung update plus -> check update profile -> Click BIOS update

4. Trouble shooting
4.6. RTC Reset

4. Trouble shooting
4.7. Battery Use time
1) Generally, the battery usage time in advertisements by notebook manufacturers refers to the
maximum battery use time. Since the system specifications and the usage environment may differ, the user's battery
usage time may differ from the advertisement even if there is no problem with the system.
2) Conditions for the company's maximum battery use time
Minimum LCD brightness, base system, the wireless LAN R/F is turned off, BatteryManager-Maximum
Battery Mode.
Measuring Tool: BatteryMark v.4.0.1
3) If a customer complains about the battery usage time, let them know that the battery usage time may differ depending
on the model specifications and the usage environment and recommend the following usage environment for longer
battery time.
Use the company's power-saving program, BatteryManager, and set BatteryManager to Maximum Battery Mode.
LCD brightness: Set to the minimum level as long as the user does not experience inconvenience.
Disable unnecessary devices : Turn the wireless LAN R/F switch off and disable USB devices (DMB, fingerprint
recognition and Bluetooth)
Please Refer to the Training manual chapter4. Trouble Shooting.

4. Trouble shooting
4.8. CPU FAN Control
Checking CPU FAN

1) Check thermal Fan locked well
2) Check FAN cable plugged well
3) change FAN.

4. Trouble shooting
CPU Fan Control

- One can turn the fan on & off and check the fan's operational conditions without system disassembly
Pic (1) Fan off status Pic (2) Fan on status

- SAFC's default setting is "Fan off" or "Minimum Fan Speed".
- Press "ON" in "ON/OFF Control" Fan is turned on to
maximum fan speed.
- Press "OFF" in "ON/OFF Control" Fan returns to default
setting.
>Fan Voltage Measurement
- Read Fan RPM indicated in SAFC.
>Fan Voltage Pass/Fail determination
- If Fan RPM satisfies "rpm spec +/-10%", then Fan test is
"PASS" .

4. Trouble shooting
4.9. System Diagnosis
System Diagnostics Card

The Diagnostics Card shows the system operations during the POST (Power On Self Test) in a 2 digit hexadecimal number
by connecting the cable to the 10 pin connector below the PCMCIA slot after separating the Top part. The card is used to
evaluate the reason for the malfunction without disassembling the system when the system malfunctions and to test if the
system operates normally after replacing a defective FRU.
Debugging Code
In general, if a defect of the circuit or part is detected during the system test, the system stops at a particular code. The error
codes for each part of the system are listed in the following table
Please Refer to the Training manual chapter4. Trouble Shooting.

4. Trouble shooting
4.10. Hardware Upgrade
HDD Upgrade
Four screws (red circle) after removing ,Disconnect the cable from the connector FPC.
mini SSD card Upgrade (mSATA SSD)
- At first disassemble screw (red circle) change mini SSD card module.

4. Trouble shooting
Memory Upgrade

4. Trouble shooting

5.1. System Layout
System Layout
Height Simulation

LCD Layout
Cabling

Keyboard
: KBD Water Check sheet Location

5.2. Board Component
MainBoard
Front
Back

Subboard

GSPN (GLOBAL SERVICE PARTNER NETWORK)
Area Web Site
Europe, MENA,
https://gspn1.samsungcsportal.com
CIS, Africa
E.Asia, W.Asia,
https://gspn2.samsungcsportal.com
China, Japan
N.America, S.America https://gspn3.samsungcsportal.com
This Service Manual is a property of Samsung Electronics

2012 Samsung Electronics Co.,Ltd.
Co.,Ltd.
All rights reserved.
Any unauthorized use of Manual can be punished under
Printed in Korea
applicable International and/or domestic law.
Code No.:

NP540U3C

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3. Desassembly and Reassembly

5. System Wire Diagram

i Copyright 1995-2012 SAMSUNG. All rights reserved.

1.1. General After-Sales Service Precautions

1) Do not let customers repair the product themselves..

There is a danger of electric shock.

There is a danger of fire due to overheating.

If a defect is found, repair or replace it immediately.

5) Make sure that it is properly grounded.

Electricity leakage may cause electric shock.

*ALS O TES T WITH

Figure 1.1 Leakage Current Test Circuit

6) Do not spray water on to the product to clean it.

If the cord is disconnected, it may cause electric shock or fire.

9) Repair the product using only authorized parts

Exposure to heaters may cause deformation of the product or fire.

Copyright 1995-2012 SAMSUNG. All rights reserved. 1-1

1.2. Safety Precautions

2) Circuit Test (Logic Test) Precautions

1-2 Copyright 1995-2012 SAMSUNG. All rights reserved.

Copyright 1995-2012 SAMSUNG. All rights reserved. 1-3

1.4. Static Electricity Precautions

To prevent static electricity, follow the instructions below.

1) Perform the repair in a location without static electricity.

3) Touch only the edges of the board, if possible.

4) Do not touch any parts unless absolutely necessary

5) Disassemble the parts on the anti-static-electricity pad.

1-4 Copyright 1995-2012 SAMSUNG. All rights reserved.

2.1. Product Features

Copyright 1995-2012 SAMSUNG. All rights reserved. 2-1

Processor* and Motherboard

2-2 Copyright 1995-2012 SAMSUNG. All rights reserved.

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2-4 Copyright 1995-2012 SAMSUNG. All rights reserved.

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2-6 Copyright 1995-2012 SAMSUNG. All rights reserved.

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2.3. Comparing product specifications

2-8 Copyright 1995-2012 SAMSUNG. All rights reserved.

2.4. Function of Product

Copyright 1995-2012 SAMSUNG. All rights reserved. 2-9

2-10 Copyright 1995-2012 SAMSUNG. All rights reserved.

: KBD Water Check sheet Location

Copyright 1995-2012 SAMSUNG. All rights reserved. 2-11

2-12 Copyright 1995-2012 SAMSUNG. All rights reserved.

2.5. New Technology / ability

Please Refer to the Training manual chapter1.

Copyright 1995-2012 SAMSUNG. All rights reserved. 2-13

2-14 Copyright 1995-2012 SAMSUNG. All rights reserved.

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2-16 Copyright 1995-2012 SAMSUNG. All rights reserved.

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Copyright 1995-2012 SAMSUNG. All rights reserved. 2-19

Please Refer to the Training manual chapter1.

2-20 Copyright 1995-2012 SAMSUNG. All rights reserved.

Please Refer to the Training manual chapter1.

Copyright 1995-2012 SAMSUNG. All rights reserved. 2-21

2-22 Copyright 1995-2012 SAMSUNG. All rights reserved.