HM13 501 PDF

History Module
Service
HM13-501
LCN Service - 2
History Module
Service
HM13-501
Release 530
CE Compliant
12/02
Copyright, Notices, and Trademarks
© Copyright 1995 - 2002 by Honeywell

Revision 08 – December, 2002
While this information is presented in good faith and believed to be accurate,

Honeywell disclaims the implied warranties of merchantability and fitness for a
particular purpose and makes no express warranties except as may be stated in
its written agreement with and for its customer.
In no event is Honeywell liable to anyone for any indirect, special or consequential
damages. The information and specifications in this document are subject to
change without notice.
TotalPlant and TDC 3000 are U.S. registered trademarks of Honeywell Inc.
Honeywell International
Industry Solutions
16404 N. Black Canyon Highway
Phoenix, AZ 85053
1-800-343-0228
12/02 History Module Service ii

About This Publication
This publication provides instructions for use by the maintenance personnel to service a WREN III
type History Module, a WREN III type History Module that has been upgraded with the 210
megabyte (MB), 445 megabyte (MB), 875 megabyte (MB), 1.8 gigabyte (GB) Winchester disk
drive(s), or a WDA type History Module that contains either the 210 megabyte, 445 megabyte, 875
megabyte, 1.8 gigabyte (GB), dual logical 875 MB or dual logical 1.8 GB Winchester Disk
drive(s).
This publication will assist you in determining how to service the History Module, identifying
spare parts, and disassembling and reassembling the History Module when replacing a defective
part.
This publication supports TotalPlant Solution (TPS) system Release 530 and earlier software
releases. TPS is the evolution of TDC 3000X.
This publication supports CE Compliant equipment. Any equipment designated as “CE

Compliant” complies with the European Union EMC and its health and safety directives. All
equipment entering the European countries after January 1, 1996 require this type of compliance,
denoted by the “CE Mark.”
TECHNICAL ASSISTANCE
If you need assistance If you need technical assistance, contact your local Honeywell Service
Organization, as explained in the following paragraphs.
International Outside of the United States, contact your local Honeywell Service
customers Organization. If you are not sure of the location or telephone number, call
your Honeywell representative for information.
Customers inside the Within the United States, call the Technical Assistance Center (TAC) at
United States the toll free number 1-800-822-7673.
Arizona customers Within Arizona, the local number for TAC is 602-313-5558.
Services provided Calls to TAC are answered by a dispatcher from 7:00 A.M. to 5:00 P.M.,
Mountain Standard Time (6:00 A.M. to 4:00 P.M. when daylight saving
time is in effect). Outside of these hours, emergency calls—those which
affect your ability to control or view a process—will be received by an
answering service, and returned within one hour. TAC maintains its own
TPS system, and frequently can duplicate equipment problems.
Time saving tip It is a good idea to make specific notes about the problem before making
the call. This will help to reduce delays and expedite answers.
12/02 History Module Service iii

Standard Symbols
Scope The standard symbols used in this publication are defined as follows.
ATTENTION Notes inform the reader about information that is required, but not
immediately evident.
CAUTION Cautions tell the user that damage may occur to equipment if proper care
is not exercised.
WARNING Warnings tell the reader that potential personal harm or serious economic
loss may happen if instructions are not followed.
Ground connection to building safety ground.

OR
53893
Ground stake for building safety ground.
53894
Electrical Shock Hazard—can be lethal.
DANGER
SHOCK HAZARD
53895
Electrical Shock Hazard—can be lethal.
DANGER
HIGH VOLTAGE
53896
Rotating Fan—can cause personal injury.
53897
Caution—refer to the appropriate installation document.
!
12/02 History Module Service iv
Table of Contents
SECTION 1 – INTRODUCTION........................................................................................ 15
1.1 Overview..................................................................................................... 15
1.2 Support Services and Documents .............................................................. 17
SECTION 2 – WREN TYPE HISTORY MODULE DESCRIPTION .................................. 19

2.1 Overview..................................................................................................... 19
2.2 Nonredundant Drive History Modules......................................................... 21
2.2.1 WREN III History Module Description......................................................... 21
2.2.2 210/445/875 MB and 1.8 GB History Module Description .......................... 27
2.3 Redundant Drive History Modules .............................................................. 33
2.3.1 Redundant Single Disk Drive Configuration ............................................... 35
2.3.2 Redundant Dual Drive Configuration .......................................................... 38
SECTION 3 – WDA TYPE HISTORY MODULE WITH TYPE I DRIVE............................ 41

3.1 Overview..................................................................................................... 41
3.3 Physical Configuration ................................................................................ 47
3.4 Circuit Board Configuration ........................................................................ 49
3.5 Nonredundant Drive History Module Configuration .................................... 50
3.5.1 Single Disk Drive Configuration.................................................................. 50
3.5.2 Dual Disk Drives Configuration................................................................... 52
3.6 Redundant Drives History Module Configuration........................................ 54
3.6.1 Single Disk Drive Configuration.................................................................. 55
3.6.2 Dual Disk Drives Configuration................................................................... 57
3.7 Field Adjustments ....................................................................................... 59
SECTION 4 – WDA HISTORY MODULE WITH TYPE II DRIVE TRAY........................... 61

4.1 Overview..................................................................................................... 61
4.3 Physical Configuration ................................................................................ 67
4.4 Circuit Board Configuration ........................................................................ 69
4.5 Nonredundant Drive History Module Configuration .................................... 70
4.5.1 Type II Disk DrivesConfiguration ................................................................ 70
4.6 Redundant Drives History Module Configuration........................................ 73
4.6.1 Type II Disk Drives Configuration ............................................................... 74
4.7 Field Adjustments ....................................................................................... 76
SECTION 5 – TEST/TROUBLESHOOTING .................................................................... 77

5.1 Overview..................................................................................................... 77
5.2 Test Strategy .............................................................................................. 77
5.3 Troubleshooting.......................................................................................... 80
5.3.1 Preliminary Checks..................................................................................... 80
5.3.2 Sequential Troubleshooting ........................................................................ 81
5.3.3 Maintenance Recommendations ................................................................ 85
5.3.4 SMCC/Detailed Module Error Messages.................................................... 87
5.3.5 Real Time Journal (RTJ) Messages........................................................... 93
5.3.6 Repair Strategy........................................................................................... 94
5.3.7 Data Error Recovery Technics and Documentation ................................... 96
5.3.8 Nonredundant Drive Data Error Recovery.................................................. 97
5.3.9 Redundant Drive Data Error Recovery.................................................... 103
5.3.10 Control Track Error Recovery for Sectors 1-31 ........................................ 106
5.3.11 Status Detail Display................................................................................. 108
5.3.12 Volume Status Display.............................................................................. 110
5.3.13 Sector Initialization/Reassignment Procedure.......................................... 113
SECTION 6 – WREN TYPE HISTORY MODULE DISASSEMBLY ............................... 117
12/02 History Module Service v

6.1 Overview .................................................................................................. 117
6.2 Electronics Module Disassembly ............................................................. 118
6.3 Nonredundant Winchester Drive Module Disassembly............................ 119
6.3.1 Fan Assembly Removal ........................................................................... 120
6.3.2 Slide Tray Assembly Removal ................................................................. 120
6.3.3 Power Supply/Disk Drive Removal .......................................................... 121
6.4 Redundant Winchester Drive Module Disassembly................................. 122
6.4.2 Slide Tray Assembly Removal ................................................................. 123
6.4.3 Power Supply/Disk Drive Removal .......................................................... 124
SECTION 7 – WDA TYPE I HISTORY MODULE DISASSEMBLY ............................... 125

7.1 Overview .................................................................................................. 125
7.2 History Module Disassembly.................................................................... 126
7.2.1 General Disassembly ............................................................................... 127
7.2.3 Power Supply Removal ............................................................................ 128
7.2.4 Circuit Board Removal ............................................................................. 129
7.2.5 Winchester Disk Assembly Removal ....................................................... 130
7.3 Winchester Drive Tray Disassembly ........................................................ 131
7.3.1 Winchester Disk Drive Removal .............................................................. 134
SECTION 8 – WDA HISTORY MODULE WITH DUAL LOGICAL DRIVE TRAY

DISASSEMBLY ....................................................................................... 151
8.1 Overview .................................................................................................. 151
8.2 History Module Disassembly.................................................................... 152
8.2.1 General Disassembly ............................................................................... 153
8.2.3 Power Supply Removal ............................................................................ 154
8.2.4 Circuit Board Removal ............................................................................. 155
8.2.5 Winchester Disk Assembly Removal ....................................................... 156
8.3 Winchester Drive Tray Disassembly ........................................................ 157
8.3.1 Winchester Disk Drive Removal .............................................................. 160
SECTION 9 – WREN TYPE HISTORY MODULE ASSEMBLY..................................... 161

9.1 Overview .................................................................................................. 161
9.2 Electronics Module Assembly .................................................................. 162
9.3 Winchester Drive Module Assembly ........................................................ 163
9.3.1 Fan Replacement..................................................................................... 164
9.3.2 Power Supply Replacement ..................................................................... 164
9.3.3 Disk Drive Replacement .......................................................................... 164
9.3.4 Slide Tray Assembly................................................................................. 168
9.4 Nonredundant WREN III Drive Installation............................................... 169
9.4.1 Smart Peripheral Controller (SPC) and SPC I/O Boards ......................... 169
9.4.2 Single/Dual WREN III Drive Pinning ........................................................ 170
9.4.3 Single/Dual WREN III Drive Cabling ........................................................ 172
9.5 Nonredundant 210/445/875 MB and 1.8 GB Drive Installation ................ 175
9.5.1 Smart Peripheral Controller (SPC) and SPC I/O Boards ......................... 176
9.5.2 Single/Dual 210 MB Drive Pinning ........................................................... 177
9.5.5 Single/Dual 1.8 GB Drive Pinning ............................................................ 193
9.5.6 Single/Dual 210/445/875 MB or 1.8 GB Drive Cabling............................. 197
9.6 Redundant WREN III Drive Installation.................................................... 202
9.6.1 Single Drive Installation............................................................................ 203
9.6.1.1 Single WREN III Drive Pinning................................................................. 203
9.6.1.2 Single WREN III Drive Cabling................................................................. 205
9.6.2 Dual Drive Installation .............................................................................. 209
9.6.2.1 Dual WREN III Drive Pinning ................................................................... 209
9.6.2.2 Dual WREN III Drive Cabling ................................................................... 211
9.6.2.2 Dual WREN III Drive Cabling, Continued................................................ 213
12/02 History Module Service vi

9.7.1 Redundant Single Drive Installation.......................................................... 214
9.7.1.1 Single 210 MB Drive Pinning .................................................................... 214
9.7.1.4 Single 1.8 GB Drive Pinning ..................................................................... 227
9.7.1.5 Single 210/445/875 MB or 1.8 GB Drive Cabling ..................................... 230
SECTION 10 – WDA TYPE HISTORY MODULE ASSEMBLY...................................... 233

10.1 Overview................................................................................................... 233
10.2 History Module Assembly ......................................................................... 235
10.2.1 General Assembly .................................................................................... 235
10.2.2 Fan Assembly Replacement..................................................................... 236
10.2.4 Circuit Board Replacement....................................................................... 237
10.2.5 Cabling Replacement ............................................................................... 246
10.2.6 Winchester Disk Assembly Replacement ................................................ 247
10.3 Winchester Disk Assembly Reassembly.................................................. 248
10.4 Winchester Drive Tray Assembly ............................................................. 249
10.4.1 General Information.................................................................................. 249
10.4.2 Winchester Disk Drive Replacement........................................................ 251
SECTION 11 – DUAL LOGICAL WDA HISTORY MODULE ASSEMBLY .................... 267

11.1 Overview................................................................................................... 267
11.2 History Module Assembly ......................................................................... 269
11.2.1 General Assembly .................................................................................... 269
11.2.2 Fan Assembly Replacement..................................................................... 270
11.2.4 Circuit Board Replacement....................................................................... 271
11.2.5 Cabling Replacement ............................................................................... 280
11.2.6 Winchester Disk Assembly Replacement ................................................ 281
11.3 Winchester Disk Assembly Reassembly.................................................. 282
11.4 Winchester Drive Tray Assembly ............................................................. 283
11.4.1 General Information.................................................................................. 283
11.4.2 Winchester Disk Drive Replacement........................................................ 285
SECTION 12 – STARTUP .............................................................................................. 287

12.1 Overview................................................................................................... 287
12.2 Visual Checks........................................................................................... 287
12.2.1 WREN Type History Module..................................................................... 287
12.2.2 WDA Type History Module ....................................................................... 288
12.3 Power-on Procedure................................................................................. 289
12.3.1 Component Replacement Startup ............................................................ 290
12.3.2 Nonredundant Drive Replacement Startup............................................... 292
12.3.3 Redundant Drive Replacement Startup.................................................... 294
12.4 Redundant Disk Drive Data Synchronization............................................ 294
12.5 Winchester Disk Drive Formatting............................................................ 296
12.5.1 Drive Formatting Procedure ..................................................................... 297
SECTION 13 – SPARE PARTS ...................................................................................... 301

13.1 Overview................................................................................................... 301
13.2 Replaceable Parts Lists ............................................................................ 301
12/02 History Module Service vii

Figures
Figure 2-1 Dual WREN III Drive History Module (Five-Slot Module) ........................... 21
Figure 2-2 WREN III Drive Positioning and Address Assignments ............................. 23
Figure 2-3 Single WREN III Drive History Module Components and Interconnections24
Figure 2-4 Dual WREN III Drive History Module Components and Interconnections . 26
Figure 2-5 Dual 210/445/875 MB or 1.8 GB Drive History Module.............................. 27
Figure 2-6 210/445/875 MB or 1.8 GB Drive Positioning ............................................ 29
Figure 2-7 Single 210/445/875 MB or 1.8 GB Drive History Module Components...... 30
Figure 2-8 Dual Drive HM Components and Interconnections .................................... 32
Figure 2-9 Redundant Drive Physical Locations and Addresses ................................ 35
Figure 2-10 Redundant Single WREN III Drive Components and Interconnections ..... 36
Figure 2-11 Redundant Single 210/445/875 MB or 1.8 GB Drive Components ............ 37
Figure 2-12 Redundant Dual WREN III Drive Components and Interconnections........ 39
Figure 2-13 Redundant Dual 210/445/875 MB or 1.8 GB Drive Components............... 40
Figure 3-1 Single-Drive TYPE I Winchester Drive Tray .............................................. 41
Figure 3-2 Dual-Drive TYPE I Winchester Drive Tray ................................................. 42
Figure 3-3 WDA History Module – Non-CE Compliant................................................ 44
Figure 3-4 WDA History Module – CE Compliant ....................................................... 45
Figure 3-5 WDA History Module Block Diagram ......................................................... 46
Figure 3-6 SCSI Bus and Termination Interconnections ............................................. 48
Figure 3-7 Nonredundant Single-Drive Configuration ................................................. 50
Figure 3-8 Nonredundant Single-Drive Interconnections ............................................ 51
Figure 3-9 Nonredundant Dual-Drive Configuration .................................................... 52
Figure 3-10 Nonredundant Dual-Drive Interconnections ............................................... 53
Figure 3-11 Redundant Single-Drive Configuration....................................................... 55
Figure 3-12 Redundant Single-Drive History Module Interconnections......................... 56
Figure 3-13 Redundant Dual-Drive Configuration ......................................................... 57
Figure 3-14 Redundant Dual-Drive History Module Interconnections ........................... 58
Figure 4-1 Dual-Drive Type II Winchester Drive Tray ................................................. 61
Figure 4-2 WDA History Module – Non-CE Compliant................................................ 64
Figure 4-3 WDA History Module – CE Compliant ....................................................... 65
Figure 4-4 WDA History Module Block Diagram ......................................................... 66
Figure 4-5 SCSI Bus and Termination Interconnections ............................................. 68
Figure 4-6 Nonredundant Dual-Drive Configuration .................................................... 70
Figure 4-7 Nonredundant Dual-Drive Interconnections ............................................... 72
Figure 4-8 Redundant Dual-Drive Configuration ......................................................... 74
Figure 4-9 Redundant Dual-Drive History Module Interconnections ........................... 75
Figure 5.1 History Module Troubleshooting Flowchart................................................ 81
Figure 5.2 WREN III, 210/445/875 MB, and 1.8 GB Drive .......................................... 87
Figure 5.3 Status Detail Display ................................................................................ 108
Figure 5.4 Status Detail Display (Drive Selected) ..................................................... 110
Figure 5.5 Volume Status Display (Page 1) .............................................................. 111
Figure 5.6 Volume Status Display (Page 2) .............................................................. 111
Figure 5.7 Engineering Personality Main Menu Display............................................ 115
Figure 5.8 SMCC Main Menu Display ....................................................................... 115
Figure 5.9 Sector Initialization/Reassignment Menu Display .................................... 116
Figure 5.10 Sector Initialization/Reassignment Menu (Verification) Display ............... 116
Figure 6-1 Winchester Drive Module Exploded View ................................................ 119
Figure 6-2 Redundant Drive Positioning and Address Assignments......................... 122
Figure 7-1 WDA History Module Exploded View ....................................................... 127
Figure 7-2 Single-Drive Winchester Drive Tray Exploded View ................................ 132
Figure 7-3 Dual-Drive Winchester Drive Tray Exploded View................................... 132
Figure 7-4 210 Megabyte Drive Jumper Block Selections (Bottom View) ................. 136
Figure 7-5 Bottom View of 210 MB Drive with SCSI Bus Terminators ...................... 137
Figure 7-6 445 Megabyte Drive Jumper Block Selections (Bottom View) ................. 139
Figure 7-7 Bottom View of 445 MB Drive with SCSI Bus Terminators ...................... 140
Figure 7-8 875 Megabyte Drive (51196680-100) Jumper Block Selections (Bottom
View) ..................................................................................................... 142
12/02 History Module Service viii

View)...................................................................................................... 145
Figure 7-10 1.8 Gigabyte Drive Jumper Block Selections (Bottom View).................... 148
Figure 8-2 Single-Drive Winchester Drive Tray Exploded View................................. 158
Figure 9-1 Winchester Drive Module Exploded View................................................. 163
Figure 9-2 Assembly of Drive Shock Mount Hardware .............................................. 165
Figure 9-3 Assembly of Adapter Plate to Drive .......................................................... 166
Figure 9-4 Mounting the 210/445/875 MB or 1.8 GB Drive........................................ 167
Figure 9-5 SPC Board Address Pinning for SCSI Bus Address ................................ 169
Figure 9-6 Single WREN III Drive Configuration and Termination (Nonredundant) .. 170
Figure 9-7 Dual WREN III Drive Configuration and Termination (Nonredundant) ..... 171
Figure 9-8 SCSI Cable Routing for Single WREN III Drive........................................ 172
Figure 9-9 Single WREN III Drive SCSI Cable Installation ........................................ 173
Figure 9-10 SCSI Cable Routing for Dual WREN III Drives ........................................ 174
Figure 9-11 SPC Board Address Pinning for SCSI Bus Address ................................ 176
Figure 9-12 Terminated 210 MB Drive 5 Jumper Block Selections (Bottom View) .... 178
Figure 9-13 Bottom View of 210 MB Drive with SCSI Bus Terminator Modules
Installed ................................................................................................. 179
Figure 9-14 Nonterminated 210 MB Drive 3 Jumper Block Selections (Bottom View)181
Figure 9-15 Terminated 445 MB Drive 5 Jumper Block Selections (Bottom View) .... 183
Figure 9-16 Bottom View of 445 MB Drive with SCSI Bus Terminator Modules
Installed ................................................................................................. 184
Figure 9-17 Nonterminated 445 MB Drive 3 Jumper Block Selections (Bottom View)186
Figure 9-18 Terminated 875 MB Drive 5 (51196680-100) Jumper Block Selections .. 188
Figure 9-19 Terminated 875 MB Drive 5 (51196680-200) Jumper Block Selections .. 189
Figure 9-20 Nonterminated 875 MB Drive 3 (51196680-100) Jumper Block Selections191
Figure 9-22 Terminated 1.8 GB Drive 5 Jumper Block Selections (Bottom View)....... 194
Figure 9-23 Nonterminated 1.8 GB Drive 3 Jumper Block Selections (Bottom View) . 196
Figure 9-24 Single 210/445/875 MB or 1.8 GB Drive SCSI Cable Routing (Top View)198
Figure 9-25 Single 210/445/875 MB or 1.8 GB Drive SCSI Bus Cable Routing (Side
View)...................................................................................................... 199
Figure 9-26 Dual 210/445/875 MB or 1.8 GB Drive SCSI Cable Routing (Side View) –200
Figure 9-28 Redundant Drive Positioning and Address Assignments ......................... 202
Figure 9-29 Redundant Single WREN III Drive Configuration ..................................... 204
Figure 9-30 Redundant Single WREN III Drive SCSI Bus Cable Routing (Side View) 205
Figure 9-31 Terminator/Card Guide Assembly ............................................................ 206
Figure 9-32 Redundant Single WREN III Drive SCSI Bus Cable Installation (Front
View)...................................................................................................... 207
Figure 9-33 Redundant Single WREN III Drive SCSI Bus Cable Installation (Top
View)...................................................................................................... 208
Figure 9-34 Redundant Dual WREN III Drive Configuration........................................ 210
Figure 9-35 Redundant Dual WREN III Drive SCSI Bus Cable Routing (Side View) .. 212
Figure 9-36 Redundant Dual WREN III Drive SCSI Cable Installation (Top View)...... 213
Figure 9-37 Redundant 210/445/875 or 1.8 GB Drive Positioning............................... 214
Figure 9-38 Nonterminated 210 MB Drive 5 Jumper Block Selections (Bottom View) 216
Figure 9-48 Redundant Single 210/445/875 MB or 1.8 GB Drive SCSI Bus Cable
Routing .................................................................................................. 231
Figure 9-49 Redundant Single 210/445/875 MB or 1.8 GB Drive SCSI Bus Cable
Installation (Top View) ........................................................................... 232
Figure 10-2 SCSI Bus Address Pinning on SPC Circuit Board.................................... 238
Figure 10-3 K2LCN Board (51401551-x00) LCN Node Address Selection ................. 240
12/02 History Module Service ix

Figure 10-4 K2LCN Board (51402615-x00) LCN Node Address Selection................. 241
Figure 10-5 K4LCN Board (51401946-100) LCN Node Address Selection................. 242
Figure 10-7 LCN I/O Board LCN Node Address Selection.......................................... 244
Figure 10-8 CLCN A/B Board LCN Node Address Selection ...................................... 245
Figure 10-9 Winchester Disk Assembly ...................................................................... 247
Figure 10-10 Winchester Disk Assembly Exploded View .......................................... 248
Figure 10-11 Single-Drive Winchester Drive Tray Exploded View............................. 249
Figure 10-12 Dual-Drive Winchester Drive Tray Exploded View ............................... 249
Figure 10-13 210 Megabyte Drive Jumper Block Selections (Bottom View).............. 252
Figure 10-14 Bottom View of 210 MB Drive with SCSI Bus Terminators................... 253
Figure 10-15 445 Megabyte Drive Jumper Block Selections (Bottom View).............. 255
Figure 10-16 Bottom View of 445 MB Drive with SCSI Bus Terminators................... 256
View) ..................................................................................................... 258
View) ..................................................................................................... 261
Figure 10-19 1.8 Gigabyte Drive Jumper Block Selections (Bottom View) ................ 263
Figure 10-20 210 Megabyte Drive Mounting .............................................................. 265
Figure 10-21 445/875 Megabyte and 1.8 Gigabyte Drive Mounting........................... 265
Figure 11-2 SCSI Bus Address Pinning on SPC Circuit Board ................................... 272
Figure 11-7 LCN I/O Board LCN Node Address Selection.......................................... 278
Figure 11-8 CLCN A/B Board LCN Node Address Selection ...................................... 279
Figure 11-9 Winchester Disk Assembly ...................................................................... 281
Figure 11-10 Winchester Disk Assembly Exploded View .......................................... 282
Figure 11-11 Single-Drive Winchester Drive Tray Exploded View............................. 283
Figure 11-12 Winchester ST39175LW Drive Pinning ................................................ 286
12/02 History Module Service x

Tables
Table 1-1 Winchester Disk Drive Capacities .............................................................. 16

Table 5.1 History Module Reset Procedure................................................................ 78
Table 5.2 Troubleshooting Procedure – History Module Operates Intermittently....... 79
Table 5.3 Troubleshooting Procedure – History Module Will Not Boot ...................... 82
Table 5.4 Troubleshooting Procedure – Kernel Circuit Board Alphanumeric Display
is -1xx ...................................................................................................... 83
Table 5.5 Troubleshooting Procedure – History Module Node Status Errors............. 84
Table 5.6 Maintenance Recommendation Messages ................................................ 86
Table 5.7 WREN III, 210/445/875 MB, and 1.8 GB Drive........................................... 87
Table 5.8 Drive Primary and Secondary Error Codes ................................................ 89
Table 5.9 Drive Sense Keys/Sense Codes................................................................. 90
Table 5.10 WREN III, 210/445/875 MB, and 1.8 GB Drive Recommended
Corrective Action ..................................................................................... 92
Table 5.11 Real Time Journal (RTJ) Messages........................................................ 93
Table 5.12 History Module Error Recovery Reference Manuals ............................... 97
Table 5.13 History Module Personality Loading Procedure ...................................... 98
Table 5.14 Data Error Recovery Procedure – Init/Reload Not Required................. 101
Table 5.15 Data Error Recovery Procedure – Init/Reload Required ....................... 102
Table 5.16 Redundant Drive Data Error Recovery Procedure – ............................. 103
Table 5.17 Redundant Drive Data Error Recovery Procedure – ............................. 104
Table 5.18 Drive 5 or 3 Control Track Error Recovery Procedure – Redundant
Drives .................................................................................................... 106
Table 5.19 Drive 4 or 2 Control Track Error Recovery Procedure – Redundant
Drives .................................................................................................... 106
Table 5.20 Drive 5 or 3 Control Track Error Recovery Procedure – ....................... 107
Table 5.21 Accessing the Status Detail Display Procedure .................................... 108
Table 5.22 Volume Status Display Access Procedure ............................................ 110
Table 5.23 Volume Status Display Status ............................................................... 112
Table 5.24 Initialize/Reassign Sector Procedure .................................................... 114
Table 7-1 210 Megabyte Drive SCSI Device Address Selection .............................. 135
Table 7-2 445 Megabyte Drive SCSI Device Address Selection .............................. 138
Table 7-3 875 MB Drive (51196680-100) SCSI Bus Address Selection................... 141
Table 7-4 875 MB Drive (51196680-200) SCSI Bus Address Selection................... 144
Table 7-5 1.8 Gigabyte Drive SCSI Device Address Selection................................. 147
Table 10-1 210 Megabyte Drive SCSI Device Address Selection ........................... 251
Table 10-2 445 Megabyte Drive SCSI Device Address Selection ........................... 254
Table 10-3 875 MB Drive (51196680-100) SCSI Bus Address Selection ............... 257
Table 10-4 875 MB Drive (51196680-200) SCSI Bus Address Selection ............... 260
Table 10-5 1.8 Gigabyte Drive SCSI Device Address Selection ............................. 262
Table 12-1 Restarting a WREN Type History Module Procedure – Component
Replacement ......................................................................................... 290
Table 12-2 Restarting a WDA Type History Module Procedure – Component
Replacement ......................................................................................... 291
Table 12-3 Restarting a WREN Type History Module Procedure – Nonredundant
Drive Replacement................................................................................ 292
Table 12-4 Restarting a WDA Type History Module Procedure – Nonredundant
Table 12-5 Restarting a WREN Type History Module Procedure – Redundant
Table 12-6 Restarting a WDA Type History Module Procedure – Redundant Drive
Replacement ......................................................................................... 294
Table 12-7 Redundant Drives Data Synchronization Procedure ............................. 295
Table 12-8 HVTS SCMD Test 21 Procedure .......................................................... 297
Table 12-9 SCMD Test 21 Parameters ................................................................... 298
Table 13-1 WREN Type Drive History Module Parts List ........................................ 302
Table 13-2 WDA Type Drive History Module Parts List........................................... 303
12/02 History Module Service xi

Acronyms
Bit Binary 1 or 0
Byte Eight data bits
CRC Cyclic Redundancy Check
ECC Error Correction Code
GB Gigabyte
HMI History Module Initialization
HMO History Module Operating
HVTS Hardware Verification Test System
LCN Local Control Network
LED Light Emitting Diode
NCF Network Configuration File
NCF Network Configuration File
ORU Optimum Replaceable Unit
PWB Printed Wire Board
RTJ Real Time Journal
SCMD Smart Controller Magnetic Disk
SMCC System Maintenance Control Center
TAC Technical Assistance Center
WDA Winchester Disk Assembly
12/02 History Module Service xii

References
Publication Publication Binder Binder

Title Number Title Number
History Module Specification and HM03-500 System Summary - 2 3010-2

Technical Data
LCN System Installation SW20-500 LCN Installation 3025
LCN System Checkout SW20-510 LCN Installation 3025
Engineer’s Reference Manual SW09-505 Implementation/Startup & 3030-2

Reconfiguration - 2
Command Processor Operation SW11-507 Implementation/Startup & 3030-1

Reconfiguration - 1
Five/Ten-Slot Module Service LC13-500 LCN Service - 2 3060-2
System Maintenance Guide SW13-500 LCN Service - 1 3060-1
Maintenance Test Operations SW11-502 LCN Service - 1 3060-1
Universal Station Service US13-500 LCN Service - 1 3060-1
Test System Executive SW13-510 LCN Service - 3 3060-3
Hardware Verification Test System SW13-511 LCN Service - 3 3060-3
12/02 History Module Service xiii

12/02 History Module Service xiv
Section 1 – Introduction
1.1 Overview
Section contents The topics covered in this section are:

Topic See Page
1.1 Overview 17
1.2 Support Services and Documents 19
The manual’s purpose This manual provides instructions and references for maintenance, test,
troubleshooting and repair of the TPS system WREN type or WDA type
History Module (HM).
WREN type History The WREN type History Module includes an electronics module and one
Module description or two Winchester Drive Modules.
The electronics module consists of a Five-Slot Module or one Local

Control Network (LCN) node of a Dual Node Module (original WREN III
type History Modules only). The electronics module interfaces to one or
two Winchester Drive Modules and contains functional circuit boards,
associated I/O circuit boards, a fan assembly, and a power supply.
The Winchester Drive Module contains one or two Winchester Disk

drives, a fan assembly, and a power supply.
WREN III type History Software Release 520 supports only the WREN III type of History
Module Module. The WREN I and WREN II types of History Modules are not
supported by the software or this manual.
WREN III upgrade The WREN III type of History Module can be upgraded to accommodate
one or more 210 megabyte (MB), 445 megabyte (MB), 875 megabyte
(MB), or 1.8 gigabyte (GB) , dual logical 875 MB or 1.8 GB drive(s)
while using WREN III History Module components, such as SPC and SPC
I/O circuit boards, and a SCSI bus ribbon cable.
WDA type History The WDA type History Module, which is packaged in a Five-Slot Module
Module description chassis, includes the following basic components.
• Local Control Network (LCN) node electronics
• Winchester disk drive controller electronics
• one, two, or four 3 1/2-inch Winchester disk drives
Continued on next page
12/02 History Module Service 15

1.1 Overview, Continued
WDA History Module The WDA History Module consists of:

contents
• Functional circuit boards and associated I/O circuit boards
• A Winchester Disk Assembly (WDA) that occupies two card slots and
contains one or two Winchester Drive Trays. One or two 3.5-inch
Winchester disk drives are mounted on the Winchester Drive Trays.
• A fan assembly and an enhanced power supply
WDA Drive Tray One or two Winchester Drive Trays, resident in the Winchester Disk
Assembly, contain one or two 3.5-inch Winchester hard disk drives that
are formatted for 256 bytes per sector. The drive has a maximum storage
capacity of approximately 210 megabytes, 445 megabytes, 875 megabytes,
or 1.8 gigabytes (GB) where a megabyte is a unit of 1,024,000 bytes, and a
gigabyte is 1,024,000,000 bytes.
Type II WDA Drive Each drive tray holds one hard drive that looks like two hard drives when
Tray placed in the WDA HM. A drive pinned as SCSI ID 5 looks like 5/3. A
drive pinned as SCSI ID 4 looks like 4/2. The drive acts as a pair of dual
drives with a capacity of two 875 MB or two 1.8 GB drives and so the
History Module must be configured as a Dual Drive HM.
Drive capacities Although the WREN III type drive is physically much larger in size than
the than the 210 megabyte, 445 megabyte, 875 megabyte, and 1.8 gigabyte
Winchester disk drives, its formatted storage capacity in megabytes (MBs)
is considerably less.
The 210 megabyte, 445 megabyte, 875 megabyte, and 1.8 gigabyte
Winchester disk drives are small in physical size, only 3 1/2 inches, but
they have a much larger storage capacity than the WREN III drive. The
drives’ formatted capacities, where a megabyte is a unit of 1,024,000
bytes, are listed in Table 1-1.
Table 1-1 Winchester Disk Drive Capacities
Drive Type Capacity in Megabytes
Single Drives Dual Drives
Formatted Formatted
WREN III 136.90 273.80
210 Megabyte 215.04 430.08
445 Megabyte 454.13 908.26
875 Megabyte 896.04 1792.08
1.8 Gigabyte 1882.93 3765.86

Redundant drive History Modules with WREN III, 210/445/875 MB, or 1.8 GB drives can
configurations be assembled in a “redundant disk drive” configuration. The
configuration allows software to “synchronize” a redundant drive with its
active primary drive partner in such a way that the same data is written to
both drives almost simultaneously. If one of the drives fails, its partner
becomes the active drive until the failed drive is repaired or replaced. The
design of the redundant disk drive History Module permits power to
remain on the active drive(s) while the failed drive is being replaced.
Troubleshooting, The troubleshooting, disassembly, and assembly procedures presented are

disassembly, and effective down to the replacement part level. A spare parts lists is
assembly
included and is keyed to an exploded figure view that can be used for the
disassembly and assembly procedures.
1.2 Support Services and Documents
Support documents Honeywell support documents are either required or will be of assistance
during checkout, startup, and operation of the system. They are referenced
at the beginning of this publication.
Support services Optional Honeywell power-on support, field services, and technical
support are available during the on-site checkout of the TPS system
equipment.
If you need help A Honeywell Technical Assistance Center (TAC) engineer can often help
isolate hardware failures and procedural errors. Additionally, TAC has
ready access to Shipping Alerts, Product Release Notices, and problem
histories that may help identify the source of a problem.

Section 2 – WREN Type History Module Description
2.1 Overview

Topic See Page
2.1 Overview 21
2.2 Nonredundant Drive History Modules 23
2.2.1 WREN III History Module Description 23
2.2.2 210/445/875 MB and 1.8 GB History Module Description 29
2.3 Redundant Drive History Modules 35
2.3.1 Redundant Single Disk Drive Configuration 37
2.3.2 Redundant Dual Drive Configuration 40
Purpose of this This section describes the four possible configurations for the WREN type
section History Module (HM) hardware, including hardware servicing and
replacement.
Purpose of the History The WREN type History Module provides mass data storage for history
Module files, system software, and customer files for the TPS system. The History
Module is a node on the Local Control Network (LCN) with a specific
address assigned. More than one History Module can reside on the
network.
History Module The History Module consists of a lower Five-Slot or Dual Node
overview electronics module and one or two upper Winchester Drive Modules. The
electronics module contains the electronic control functionality, while
each Winchester Drive Module is capable of containing one or two
Winchester disk drives.
How to use this Use this section to identify the type of WREN History Module you have
section which is based on the type of drive used in it. The types of WREN History
Modules are WREN III or a WREN III History Module that has been
upgraded to accommodate one or more 210 megabyte (MB), 445 megabyte,
875 megabyte, or 1.8 gigabyte (GB) drives. Then, concentrate on the
sections in the manual that meet your needs, such as testing/troubleshooting,
disassembly, assembly, servicing, and History Module startup.

Redundant drive A History Module can have redundant disk drives. History Modules that
configuration contain WREN III, 210 MB, 445 MB, 875 MB, or 1.8 GB disk drives
accommodate redundancy. Data is stored on the redundant hard-disk
drives almost simultaneously. If one hard-disk drive should fail, the other
drive has the identical database stored intact and can support continuous
operation of the History Module until the failed drive is repaired or
replaced. For more information on redundant drives, go to subsection 2.3.
Field Adjustments There are no field adjustments required for the History Module’s
electronics or Winchester disk drives.

2.2 Nonredundant Drive History Modules
2.2.1 WREN III History Module Description
Overview Figure 2-1 illustrates a WREN III History Module containing dual WREN
III Winchester disk drives. The electronics module illustrated is a
standard LCN Five-Slot Module, but a Dual Node Module can also be a
component of a WREN III History Module. Each of the two Winchester
Drive Modules occupy the same space as a Five-Slot Module, but they
contain slide-out tray assemblies on which a WREN III drive is mounted.
Each Winchester Drive Module has its own drive power supply that is
mounted at the left side of the tray assembly.
The WREN III History Module supports both redundant and nonredundant
configurations. Depending upon the configuration, the History Module
consists of one or two Winchester Drive Modules.
Figure 2-1 Dual WREN III Drive History Module (Five-Slot Module)
Winchester
Modules
Electronics
Module
1761

2.2.1 WREN III History Module Description, Continued
WREN III hardware The WREN III drive is identified by the rectangular shape of the hard
configurations drive mounted on top and by the smooth sides of its chassis. As illustrated
in Figure 2-1, there are no cooling holes in the sides.
The Winchester Drive Module and the electronics module are always
mounted one above the other as illustrated in the Figure 2-1. A single
ribbon cable from the SPC I/O circuit board at the rear of the electronics
module enters a slot at the rear of the lower Winchester Drive Module,
routes over the slide tray assembly, and connects to the WREN III drive(s)
on the tray assembly. The cable then exits the lower module and enters
the upper Winchester Drive Module where it connects to the drive(s) on
the tray assembly. In the “standard” nonredundant configurations, the
SCSI (Small Computer Systems Interface—often nicknamed “scuzzy”)
bus ribbon cable interconnects to one or two drives. The drive at the end
of the SCSI bus interface cable has a bus terminator module installed on it.
The SCSI bus ribbon cable is a group of transmission lines that must be
terminated at each end, on the SPC I/O circuit board and at the drive end
of the SCSI bus cable. The actual routing of the SCSI bus ribbon cable for
a particular configuration is illustrated elsewhere in this manual.
If the WREN III drives are installed in a nonredundant drive History

Module, the SCSI bus terminator module is located on the last drive on the
cable. When WREN III drives are installed in a redundant drive History
Module, the SCSI bus termination is located at the physical end of the
ribbon cable. A bus terminator card is fastened to the top of the upper
Winchester Drive Module chassis. This arrangement permits a failed
drive to be disconnected while power is applied without disturbing its
redundant partner on the same SCSI bus.
WREN III electronics A Smart Peripheral Controller (SPC) circuit board and its associated SPC
module configuration I/O circuit board communicate with the WREN III drives. The other
board types in the electronics module vary with the module type, Five-Slot
Module or Dual Node Module. The functional board complement of the
electronics module can also vary with different software releases. Refer to
the Five/Ten-Slot Module Service or Dual Node Module Service manual
for the board complement that matches your equipment.
This is an LCN module using standard LCN cabling. See the Five/Ten-
Slot Module Service or Dual Node Module Service manual for LCN
cabling information.

WREN III drive The drive mounted in the Winchester Drive Module is designated “Drive
configurations 5,” referred to as “Device 5,” and must be pinned (configured) for address
5. It is the only drive. The drive is always assigned address 5 and is
mounted in a single Winchester Drive Module. Figure 2-2 illustrates the
mounting position and address assignment of the drive on the tray
assembly.
Figure 2-2 WREN III Drive Positioning and Address Assignments
Drive 5 Drive 5
Address = 5 Address = 5
Drive 3
Address = 3
Single Drive History Module Dual Drive History Module

16751

Single WREN III drive Figure 2-3 illustrates the components and interconnections between the
interconnections SPC I/O circuit board and a single WREN III drive. A bus terminator
module must be installed at the rear of the drive.
Figure 2-3 Single WREN III Drive History Module Components and Interconnections
SPC I/O (WREN lII)

(51304156-100)
J1
SCSI Bus Cable

(51304379-100)
Power Cord
Power Supply
SCSI Bus Terminator

Installed on Drive 5
(Last Drive on Bus)
Drive 5
(Rear View)
.............
.............
Winchester Drive Module #2

(Top View)
Power Cord
SCSI Bus Terminator

Power Supply
Removed from Drive 3

Winchester Drive
(Top View)
Drive 3
(Rear View)
.............
.............
Winchester Drive Module #1 SCSI Bus Cable

(Top View) Connector DC Power Connector
(Cable 51303536-061)
16753

Dual WREN III drive In a WREN III History Module with dual drives, the drive mounted in the
configuration bottom Winchester Drive Module (module #1) is designated “Drive 3”
and must be pinned for SCSI bus address 3. It is referred to as “Device 3.”
The drive that is mounted in the top Winchester Drive Module (module
#2) is designated “Drive 5” and must be pinned for SCSI bus address 5. It
is referred to as “Device 5.” Figure 2-2 illustrates the drive positions and
address assignments of the drives on the tray assemblies. It is a
conventional practice to have Device 3 in the lower Winchester module
and Device 5 in the upper Winchester module. Electrically, it is possible
for their locations to be reversed. However, to avoid confusion, the
standard configuration is recommended.
Figure 2-4 illustrates the components and interconnections between the

SPC I/O circuit board and the dual WREN III drives. A bus terminator
module must be installed on the drive that is at the end of the SCSI bus
ribbon cable (Drive 5, Device 5). A drive that is in the middle of the SCSI
bus
(Drive 3, Device 3) must not have a bus terminator module installed on it.
It may appear excessive that a separate Winchester Drive Module (with

power supply) is used to house each WREN III drive when a second drive
can be accommodated in a single Winchester Drive Module. If data is
being written to a WREN III drive at the same instant that AC power fails,
there must be a way to provide power to the drive until it has had time to
complete the write cycle and avoid corrupted data. The Winchester disk
drive power supply is designed with sufficient “ride through power” to
sustain power for a single WREN III drive, but not enough capability for
two drives. For this reason, a single power supply is allocated for each
WREN III drive that must record unduplicated data.

Dual WREN III drive

interconnections
Figure 2-4 Dual WREN III Drive History Module Components and Interconnections
SPC I/O (WREN lII)

(51304156-100)
J1
SCSI Bus Cable

(51304379-100)
Power Cord
Power Supply
SCSI Bus Terminator

Installed on Drive 5
(Last Drive on Bus)
Drive 5
(Rear View)
.............
.............

(Top View)
Power Cord
SCSI Bus Terminator

Power Supply
Removed from Drive 3

Winchester Drive
(Top View)
Drive 3
(Rear View)
.............
.............

(Cable 51303536-061)
16753

2.2.2 210/445/875 MB and 1.8 GB History Module Description
Overview Figure 2-5 illustrates a WREN type History Module that has been
upgraded to accommodate dual 210 megabyte, 445 megabyte, 875
megabyte, or 1.8 gigabyte Winchester disk drives.
The drive(s) in a WREN I, WREN II, or WREN III History Module can be
replaced with the 210, 445, or 875 MB drive. The following replacement
kits are available.
• 210 MB drive replacement kit – part number 51196269-100
• 1.8 GB drive replacement kit – part number 51196897-100
A kit contains one drive, installation hardware, and installation
instructions.
The electronics module can be the standard LCN Five-Slot Module or

Dual Node Module. Figure 2-5 illustrates the Five-Slot Module. Each of
the two Winchester Drive Modules occupy the same space as a Five-Slot
Module or Dual Node Module, but they contain a slide-out tray assembly
on which a 210 MB, 445 MB, 875 MB, or 1.8 GB drive is mounted. Each
Winchester Drive Module has its own power supply that is mounted at the
left side of the tray assembly.
Figure 2-5 Dual 210/445/875 MB or 1.8 GB Drive History Module
(Five-Slot Module)
U
D
L
D

2.2.2 210/445/875 MB and 1.8 GB History Module
Description, Continued
Hardware The 210 MB, 445 MB, 875 MB, or 1.8 GB drive is easily identified by its
configurations small size, with the size of the disk only 3 1/2 inches. An adapter plate is
used to adapt the drive directly to the mounting holes on the tray assembly
that are normally used for the WREN III drive. No shock-mounts are
used.
The Winchester Drive Modules and the electronics module are always
mounted one above the other as illustrated in the Figure 2-5. A single
SCSI bus ribbon cable from the SPC I/O circuit board in the I/O cage at
the rear of the electronics module enters a slot at the rear of the lower
Winchester Drive Module, routes over the slide tray assembly, and
connects to the drive(s) on the tray assembly. The cable then exits the
module and enters the upper Winchester Drive Module where it connects
to the drive(s) on the tray assembly. In the standard nonredundant
configurations, the SCSI (Small Computer Systems Interface—often
nicknamed “scuzzy”) bus cable interconnects to one or two drives. The
end drive on the interface has termination resistor modules installed on it.
The SCSI bus ribbon cable is a group of transmission lines that must be
terminated at each end, on the SPC I/O circuit board, and at the drive end
of the SCSI bus cable. The actual routing of the SCSI bus ribbon cable is
illustrated elsewhere in this manual.
If the drives are installed in a nonredundant History Module, three SCSI

bus termination resistor modules are located on the last drive on the cable.
When drives are installed in a redundant History Module, a bus terminator
card provides the termination at the physical end of the SCSI bus ribbon
cable, separate from the last drive on the bus. The bus terminator card is
fastened to the top of the upper Winchester Drive Module chassis. This
arrangement permits a failed drive to be disconnected while power is
applied and not disturb its redundant partner on the same SCSI bus.

Electronics module The functional board complement of the electronics module varies for
configuration different software releases. See the Five/Ten-Slot Module Service or Dual
Node Module Service manual for the board complement that matches your
original hardware.
The Smart Peripheral Controller (SPC) circuit board and its associated
SPC I/O circuit board are used to communicate with the drives. For other
current board types, refer to the Five/Ten-Slot Module Service or Dual
Node Module Service manual.
Drive configurations The drive mounted in the Winchester Drive Module is designated “Drive
5,” referred to as as “Device 5,” and must be pinned (configured) for
address 5. When you have a single drive History Module, this is the only
drive. The drive is always assigned address 5 and is mounted in a single
Winchester Drive Module. Figure 2-6 illustrates the drive position and
address assignment of the drive on the tray assembly.
Figure 2-6 210/445/875 MB or 1.8 GB Drive Positioning
and Address Assignments
Drive 5 Drive 5
Drive 3
Address = 3
Single Drive History Module Dual Drive History Module

16751

Single drive Figure 2-7 illustrates the components and interconnections between the
configuration SPC I/O circuit board and a single drive. Three SCSI bus termination
resistor modules must be installed on the bottom of the 210 MB or 445
MB drive.
Figure 2-7 Single 210/445/875 MB or 1.8 GB Drive History Module Components
and Interconnections
5-Slot Module (HM) 5-Slot Module (HM)
WDC(51400668) SPC (51401052-100) 5

SPC I/O 5
4
3
LCN (51400667-100) 2 Fan
LCN I/O 2
HMPU (51400978-100) 1
1
+ + Power Supply
+ +
Rear View Front View
(Front Panel Omitted)
SPC I/O
(51304156-100)
LCN I/O
J2 J1
(51107403-100)
J1 LCN B
LCN A
Red Line
51190728-105
51190728-105
Fan Assembly Cable SCSI Bus Ribbon Cable

Drive Power Supply (51303549-100) (51304191-100)
Power Cord
Fan Assembly
Drive 5
(Rear View)
........
........ ................
................
DC Power Cable (51303536-061)

Winchester Drive Chassis
(Top View)
Note:
Depending upon the manufacturing date of the History Module, an EMPU, HMPU, or HPK2 could be
installed in slot 1. If an HPK2 is installed in slot 1, the SPC and SPC I/O circuit boards must be installed in
slot 4 because no more than than two empty slots can exist between circuit boards. 16780

Dual drive In a History Module with dual drives, the drive mounted in the front
configuration position in the bottom Winchester Drive Module (module #1) is
designated “Drive 3” and must be pinned for SCSI bus address 3. It is
referred to as “Device 3.” The drive that is mounted in the top Winchester
module (module #2) is designated “Drive 5,” pinned for address 5, and
referred to as “Device 5.” Figure 2-8 illustrates the positions and
addresses of the drives on the tray assemblies.
Figure 2-8 illustrates the components and interconnections between the

SPC I/O circuit board and the dual drives. Three SCSI bus termination
resistor modules must be installed on the bottom of the drive that is at the
end of the SCSI bus ribbon cable (Device 5). The drive that is located in
the middle of the SCSI bus (Device 3) must have no SCSI bus termination
resistor modules installed on it.
It may appear excessive that a separate Winchester Drive Module

(with power supply) is used to house each drive when a second drive can
be accommodated in a single Winchester Drive Module. If data is being
written to a drive at the same instant that AC power fails, there must be a
way to provide power to the drive until it has had time to complete the
write cycle and avoid corrupted data. The Winchester Disk Drive power
supply is designed with sufficient “ride through power” to sustain power
for a single drive, but not enough capability for two drives. For this
reason, a single power supply is allocated for each drive that must record
unduplicated data.

Dual drive
interconnections
Figure 2-8 Dual Drive HM Components and Interconnections
WDC(51400668) SPC (51401052-100) 5

SPC I/O 5
4
3
LCN (51400667-100) 2 Fan
LCN I/O 2
HMPU (51400978-100) 1
1
+ + Power Supply
+ +
SPC I/O
(51304156-100)
LCN I/O
J2 J1
(51107403-100)
J1 LCN B
LCN A
Red Line
51190728-105
51190728-105
Drive Power Supply Fan Assembly Cable
Power Cord (51303549-100)
SCSI Bus Ribbon Cable
(51304192-100)
Fan Assembly
Drive 3
(Rear View)
••••••••••••••••••••••••••••
••••••••••••••••••••••••••••
Lower Winchester Drive Chassis

(Top View) DC Power Cable (51303536-061)
Power Cord (51303549-100)
Fan Assembly
Drive 5
(Rear View)
••••••••••••••••••••••••••••
••••••••••••••••••••••••••••
Upper Winchester Drive Chassis

Note:
slot 4 because no more than two empty slots can exist between circuit boards. 12864

2.3 Redundant Drive History Modules
Overview History Modules are capable of redundant disk drive configurations. The
additional redundant Winchester disk drive(s) is located in a second
Winchester Drive Module that is stacked above the primary Winchester
Drive Module and is physically similar to the WREN III, 210 MB, 445
MB, 875 MB, or 1.8 GB Dual Drive configuration that is illustrated in
Figures 2-1 and 2-5.
What is redundancy? The term “redundancy” is used to describe redundant WREN III, 210 MB,
445 MB, 875 MB, or 1.8 GB drives, not redundant electronics modules,
which is the case with other LCN modules. Although hard drives are
quite reliable, the catastrophic nature by which data is lost during a failure
indicates a possible need for data to be backed-up during normal
operation.
Redundancy drive In a redundant configuration, software does a successful write to one

synchronization WREN III, 210 MB, 445 MB, 875 MB. or 1.8 GB drive, then does an
identical write to its redundant partner to provide two drives with identical
databases. The process is called “data synchronization.” If a hard drive
“crash” occurs, software ignores the failed drive and continues to operate
with its good partner.
The redundant hardware is designed so that a maintenance technician can

remove the failed drive without disturbing or removing power from its
good partner. After the drive has been replaced, the technician performs a
“synchronization” task that copies the data to the new drive and restores
redundant operation.
Drive Redundancy is designed into the hardware so that a service technician can
maintenancewith remove the Winchester Drive Tray that contains the failed drive without
redundancy
disturbing or removing power from its “good” partner mounted on another
tray. After the defective drive has been repaired or replaced, the tray is
reinstalled, and the technician performs a “data synchronization”
procedure that copies the data stored on the “good” (backup) drive to the
repaired or replaced drive. Redundancy operation is then restored.
To recover from an unrecoverable data error on a drive, bad sectors can be

initialized or assigned to the Defect Data List while system operation
continues using the “good” drive.

2.3 Redundant Drive History Modules, Continued
Redundant physical The Winchester Drive Modules and the electronics modules are always
configurations mounted one above the other, as illustrated in Figures 2-1 and 2-5. A
single SCSI bus ribbon cable from the SPC I/O card in the card cage at the
rear of the electronics module enters a slot at the rear of the lower
Winchester Drive Module, routes over the slide-out tray assembly, and
connects to the drive(s) on the tray assembly. The cable then exits the
module and enters the upper Winchester Drive Module where it connects
to the drive(s) on its tray assembly. In redundant configurations, this SCSI
(Small Computer Systems Interface—often nicknamed “scuzzy”) bus
cable interconnects up to four drives in a continuous string before ending
at a bus terminator card in the upper Winchester Drive Module.
The SCSI bus ribbon cable is a group of transmission lines and must be
terminated at each end. The bus is terminated on the SPC I/O circuit
board and also at the drive end of the SCSI bus cable. The actual routing
of the SCSI bus cable is illustrated elsewhere in this manual.
Since a SCSI bus terminator card is located at the physical end of the SCSI
bus ribbon cable where it is fastened to the top of the upper Winchester
Drive Module (module #2), there are no bus terminators installed on the
drives. This arrangement permits a failed drive to be removed and
replaced without disturbing power to its redundant partner on the same
SCSI bus.
Redundant A Smart Peripheral Controller (SPC) circuit board and its associated SPC
electronics module I/O card are used to communicate with the drives. The other board types
configuration
in the electronics module can vary with the type of LCN module, Five-Slot
Module or Dual Node Module, and can be a function of the software
release. For board configuration information, refer to the Five/Ten-Slot
Module Service or Dual Node Module Service manual.
ATTENTION ATTENTION—History Modules with redundant disk drive configurations

do not include redundant electronics modules. History Modules are not
available with redundant electronics.

2.3.1 Redundant Single Disk Drive Configuration
Overview A History Module with redundant single drives is physically similar to a

History Module with nonredundant dual drives as illustrated in Figures 2-
1 and 2-5. The only physical difference is the presence of a bus terminator
card that is mounted underneath the top surface of the upper Winchester
Drive Module (module #2).
Drive pinning The drive mounted in the top Winchester Drive Module (module #2) is
designated “Drive 5” and must be pinned for address 5. It is referred to as
“Device 5.” Its redundant partner that is mounted in the bottom
Winchester Drive Module (module #1) is designated “Drive 4” and must
be pinned for address 4. It is referred to as “Device 4.” Figure 2-9
illustrates the positions and address assignments of the drives on the tray
assemblies, while Figures 2-10 and 2-11 illustrate the components and
interconnections of a History Module with a redundant single drives.
Figure 2-9 Redundant Drive Physical Locations and Addresses
Drive 5 Drive 5 Drive 3

Address = 5 Address = 5 Address = 3
Drive 2
Drive 4 Address = 2
Drive 4
Redundant Single Drives Redundant Dual Drives 16754

2.3.1 Redundant Single Drive Configuration, Continued
Redundant single
WREN III drive
interconnections
Figure 2-10 Redundant Single WREN III Drive Components and Interconnections
SPC I/O (WREN lII)

(51304156-100)
J1
SCSI Bus Terminator Assembly SCSI Bus Cable

Power Cord
(51195178-100), Located in Drive (51304193-100)
Module #2, and Connected at End of Bus
Power Supply
Drive 5
(Rear View)
.............
.............
(Top View)
Power Cord
SCSI Bus Terminators

Removed from Both Drives
Power Supply
Winchester Drive
(Top View)
Drive 4
(Rear View)
.............
.............

(Cable 51303536-061)
16755

2.3.1 Redundant Single Drive Configuration, Continued
Redundant single
drive interconnections
Figure 2-11 Redundant Single 210/445/875 MB or 1.8 GB Drive Components

WDC(51400668) SPC (51401052-100) 5

SPC I/O 5
4
3
LCN (51400667-100) 2 Fan
LCN I/O 2
HMPU (51400978-100) 1
1
+ + Power Supply
+ +
SPC I/O
(51304156-100)
LCN I/O
J2 J1
(51107403-100)
J1 LCN B
LCN A
Red Line
51190728-105
51190728-105
Power Cord (51303549-100)
SCSI Bus Ribbon Cable
(51304193-100)
Fan Assembly
Drive 4
(Rear View)
••••••••••••••••••••••••••••
••••••••••••••••••••••••••••


Power Cord (51303549-100)
Fan Assembly
Drive 5
(Rear View)
••••••••••••••••••••••••••••
••••••••••••••••••••••••••••
Terminator Board
(51195180-100)
Note:
slot 4 because no more than than two empty slots can exist between circuit boards. 11853

2.3.2 Redundant Dual Drive Configuration
Overview A History Module with redundant dual drives is physically similar to a

History Module with a redundant single drive that is discussed in
subsection 2.3.1, but each of the Winchester Drive Module has two
WREN III, 210 MB, 445 MB, 875 MB, or 1.8 GB drives mounted on its
slide-out tray assembly as illustrated in Figure 2-9.
Drive pinning The top Winchester Drive Module (module #2) contains Drive 5 (Device
5), pinned for address 5, and Drive 3 (Device 3), pinned for address 3.
The bottom Winchester Drive Module (module #1) contains Drive 4

(Device 4), pinned for address 4, and Drive 2 (Device 2), pinned for
address 2.
Figure 2-9 illustrates the positions and address assignments of the drives
on the tray assemblies, while Figures 2-12 and 2-13 illustrates the
components and interconnections of the drives.
In subsections 2.2.1 and 2.2.2, it is stated that only one drive should be
mounted in a Winchester Drive Module. The redundant dual drive
configuration seems to contradict that statement. In a redundant dual drive
configuration, there is a remote possibility that data being written to a
drive might be corrupted by a power failure, but it would occur in only one
drive, and not in the redundant partner also. When power eventually
returns, the software will sense the error while synchronizing the
redundant data files and will overwrite the corrupted data.

2.3.2 Redundant Dual Drive Configuration, Continued
Redundant dual
WREN III drive
interconnections
Figure 2-12 Redundant Dual WREN III Drive Components and Interconnections
SPC I/O (WREN lII)

(51304156-100)
J1
SCSI Bus Cable

(51304194-100)
SCSI Bus Terminator Assembly
(51195178-100) Installed
Winchester Drive at End of Bus in Drive Module #2
(Top View)
Power Cord
Drive 3
(Rear View)
Power Supply
.............
.............
Drive 5
(Rear View)
.............
.............

(Top View)
Power Cord Drive 2

(Rear View)
.............
.............
Power Supply
Drive 4
(Rear View)
.............
.............

(Top View) SCSI Bus Cable
Connector DC Power Connector
Note: SCSI Bus Terminators must be removed from all drives. (Cable 51303536-061)
16756

2.3.2 Redundant Dual Drive Configuration, Continued
Redundant dual
210/445/875 MB or |
1.8 GB drive
interconnections
Figure 2-13 Redundant Dual 210/445/875 MB or 1.8 GB Drive Components
WDC(51400668) SPC (51401052-100) 5

SPC I/O 5
4
3
LCN (51400667-100) 2 Fan
LCN I/O 2
HMPU (51400978-100) 1
1
Power Supply
+ +
+ +
SPC I/O
(51304156-100)
LCN I/O
J2 J1
(51107403-100)
J1 LCN B
LCN A
Red Line
51190728-105
51190728-105
(51303549-100) SCSI Bus Ribbon Cable
Power Cord (51304194-100)
Fan Assembly
Drive 2
(Rear View)
••••••••••••••••••••••••••••
••••••••••••••••••••••••••••
Drive 4
(Rear View)
••••••••••••••••••••••••••••
••••••••••••••••••••••••••••

Power Cord (51303549-100)
Fan Assembly
Drive 3
(Rear View)
••••••••••••••••••••••••••••
••••••••••••••••••••••••••••
Drive 5
(Rear View)
••••••••••••••••••••••••••••
••••••••••••••••••••••••••••
Terminator Board
(51195178-100)

Note:
installed in slot 1. If an HPK2 is installed in slot 1, the SPC and SPC I/O circuit boards must be installed
slot 4 because no more than than two empty slots can exist between circuit boards.
11859

Section 3 – WDA Type History Module with Type I Drive
3.1 Overview

Topic See Page
3.1 Overview 43
3.2 Description 45
3.3 Physical Configuration 49
3.4 Circuit Board Configuration 51
3.5 Nonredundant Drive History Module Configuration 52
3.5.1 Single Disk Drive Configuration 52
3.5.2 Dual Disk Drives Configuration 54
3.6 Redundant Drives History Module Configuration 56
3.6.1 Single Disk Drive Configuration 57
3.6.2 Dual Disk Drives Configuration 59
3.7 Field Adjustments 61
Purpose of the This section describes the four possible configurations for the WDA Type
section I History Module hardware, including hardware servicing and
replacement. TYPE II drive trays are described in Section 4 4.
Purpose of the WDA The WDA type History Module (HM) provides mass data storage for
type History Module history files, system software, and customer files for the TPS system. The
WDA History Module is a node on the Local Control Network (LCN)
with a specific address assigned. More than one WDA History Module
can reside on the network.
Figure 3-1 Single-Drive TYPE I Winchester Drive Tray

7
4
1 3
8
6 6769

WDA type History The WDA History Module consists of the electronics necessary to
Module overview interface to the LCN, and the electronics necessary to control one, two, or
four
3.5-inch Winchester hard disk drives. The WDA History Module is
packaged in a Five-Slot Module chassis.
How to use this Use this section to identify the History Module parts and understand the
section operation of the WDA History Module. Then, concentrate on the sections
in the manual that meet your needs, such as testing/troubleshooting,
Redundant drive The physical configuration of the WDA History Module can contain
configuration nonredundant or redundant drives. When configured for redundant drives,
data is written to the redundant drives almost simultaneously. If one of the
drives should fail, the redundant partner has the full database intact and
can continue to provide normal operation capability until the failed drive
is repaired or replaced. For more information on redundant drives, go to
subsection 3.6.
Figure 3-2 Dual-Drive TYPE I Winchester Drive Tray
7
2 4
1 3
8 6
6768
Field Adjustments There are no field adjustments required for the WDA History Module’s

3.2 Description
CE Compliance The design of the Five-Slot Module chassis and the I/O circuit boards that
install in the rear card cage has changed for CE Compliance. Pertinent
information can be found in the Five/Ten-Slot Service manual.
Functionally, the non-CE Compliant and CE Compliant WDA History
Modules are the same. However, the I/O circuit boards that install in the
rear card cages are not interchangeable because of their physical
characteristics.
Overview Figures 3-3 and 3-4 illustrate the front and rear views of the non-CE
Compliant and CE Compliant WDA History Modules that can be
configured for one, two, or four Winchester disk drives. The non-CE
Compliant module illustrated is the enhanced LCN Five-Slot Module.
Besides circuit boards that control the interface to the Local Control
Network (K2LCN or K4LCN) and the drives (SPC), the module also
contains two slide-out trays on which the Winchester disk drives are
mounted. The trays are installed in a Winchester Disk Assembly (WDA)
that occupies circuit board slots 4
and 5 in the module.
Only the right-hand tray is present for a nonredundant drive configuration.

Both trays are present for a redundant drive configuration.
The modules have an enhanced power supply, located at the bottom of the
module, that provides power for the circuit boards, the drive(s), and the
fan assembly. A fan assembly is located at the right-hand side of the
module and provides cooling for the circuit boards, power supply, and the
drive(s).

3.2 Description, Continued
Non-CE Compliant
WDA History Module
Figure 3-3 WDA History Module – Non-CE Compliant
Tray Power Switch
Fan Assembly
Left-Hand Tray Right-Hand Tray
ON ON
5 OFF OFF
SPC 4
3
K2LCN-2
2
1
FRONT VIEW
Power Supply Node Power Switch
Reset Button
Ribbon Cable
5
4
WDI I/O
3
SPCII I/O 2
LCN I/O 1
REAR VIEW 6765

Non-CE Compliant
WDA History Module
Figure 3-4 WDA History Module – CE Compliant
Tray Power Switch
Fan Assembly
ON ON
5 OFF OFF
SPC 4
K2LCN/K4LCN 3
2
1
FRONT VIEW
Reset Button
Ribbon Cable
5
WDI 4
3
SPC2 2
CLCN A/B 1
REAR VIEW
16758

WDA History Module Figure 3-5 is a block diagram of the WDA History Module illustrating the
block diagram path between the LCN and the Winchester disk drives. A functional
description of the enhanced Five-Slot Module chassis that provides the
electronics for the WDA History Module hardware can be found in the
Five/Ten-Slot Module Service manual.
Figure 3-5 WDA History Module Block Diagram
WDI I/O
SCSI Bus
WDI
Drive Drive Ribbon

2* 3* Cables
Drive Drive
4* 5
Left Tray Right Tray
M
O SPC SPCII I/O
D
U
L LCN A Coax
K2LCN LCN I/O
E LCN B Coax
B
U Power Supply
S +5 V
+12 V
+24 V HM
Fan
* Optional Disk Drives 9457

3.3 Physical Configuration
Winchester disk The Winchester hard disk drives (one, two, or four can be present) are
drives mounted on two Winchester Drive Trays, resident in the Winchester Disk
Assembly that occupies the upper two circuit board slots (slots 4 and 5) of
the module as illustrated in Figures 3-2 and 3-3.
SCSI bus Dual Small Computer Systems Interface, (SCSI) bus ribbon cables
interconnections connect the Smart Peripheral Controller I/O (SPCII/SPC2) circuit board,
located at the rear of the Smart Peripheral Controller (SPC) circuit board
(slot 2), to the Winchester Drive Interface I/O (WDI I/O/WDI) circuit
board, located at the rear of the Winchester Disk Assembly (slot 5).
The Winchester Drive Interface (WDI) circuit board, located in the

Winchester Disk Assembly (WDA), extends the SCSI bus through two
printed flex-circuits to the Winchester disk drive(s) mounted on the
Winchester Drive Tray(s) as illustrated in Figure 3-5. The bus “splits” on
the WDI I/O circuit board, providing the bus interface to each Winchester
Drive Tray.
The Smart Peripheral Controller (SPC) circuit board interconnects by the

SCSI bus ribbon cable and printed flex-circuit with one or two drives on
each tray present. The SCSI bus is terminated by termination modules
installed on the last (end) drive.
SCSI bus termination When a tray has one Winchester disk drive mounted on it, the drive is
mounted in the front position and must have three bus termination
modules installed on the drive if it is a 210 megabyte or 445 megabyte
drive. The 875 megabyte and 1.8 gigabyte drives do not have bus
termination modules. Instead, internal bus terminators are enabled
electronically on the drive by jumper block selection. If a second
Winchester disk drive is present on the tray, the second drive is mounted
in the rear position on the tray without SCSI bus termination modules
installed on it as illustrated in Figure 3-5.
The WDI circuit board, resident in the Winchester Disk Assembly, has
two sets of SCSI bus resistor terminators, one set for each tray. The set of
terminators is activated when power is removed from the individual
Winchester Drive Tray by a power switch at the front of the tray. This
arrangement allows a failed drive on a tray to be removed and replaced
without disturbing its redundant partner that is mounted on another tray,
interfacing the same SCSI bus.

3.3 Physical Configuration, Continued
SCSI bus The SCSI bus ribbon cables and printed flex-circuits are a group of
transmission lines and must be resistor terminated at each end of the SCSI
bus. The SPC circuit board contains no bus terminators since it is central
to the bus. Figure 3-6 illustrates the routing of the SCSI bus when both
Winchester Drive Trays are present and both trays contain dual drives.
Figure 3-6 SCSI Bus and Termination Interconnections
Slot 2 (Front) Special Peripheral Controller (SPC) Board
Backplane Connector
Slot 2 (Rear) SPCII I/O Board
SCSI Bus
Ribbon Cable
Slot 5 (Rear) WDI I/O Board
Backplane Connector
Slot 5 (Front) Winchester Drive Interface (WDI) Board
Drive 2 Drive 3
Rear Disk Rear Disk

Drive Drive
SCSI Bus SCSI Bus

Printed Printed
Flex-Circuit Flex-Circuit
Drive 4 Drive 5
Front Disk Front Disk
Drive Drive
Bus Terminators Bus Terminators
Left-Hand Winchester Drive Tray Right-Hand Winchester Drive Tray
Winchester Disk Assembly
Note: A redundant dual-drive configuration is shown. If a tray has a single drive

mounted on it, the drive will always occupy the front position and will either
have SCSI bus termination modules installed on it or have internal bus
terminators enabled. 9466

3.4 Circuit Board Configuration
SPC circuit board The Smart Peripheral Controller (SPC) circuit board provides
communication with, and control of, the Winchester disk drives and the
SPC I/O circuit board.
WDI and WDI I/O The SPC I/O circuit board and the Winchester Drive Interface (WDI)
circuit boards circuit board in the Winchester Disk Assembly with its associated WDI
I/O circuit board provide the SCSI bus interface between the SPC circuit
board and the Winchester disk drives.
SCSI bus terminators are activated when a Winchester Drive Tray is not
present in the WDA or has power removed from it by its power switch.
Any Winchester Drive Tray that does not have power applied to it must be
removed from the WDA.
K2LCN or K4LCN and The K2LCN or K4LCN circuit board and its associated LCN I/O
LCN I/O circuit boards (CLCN A/B) circuit board provide the electronic link between the Local
Control Network (LCN) and the SPC circuit board. The K2LCN and
K4LCN circuit board contain the node processor and supporting memory.
Circuit board For K2LCN, K4LCN, and LCN I/O (CLCN A/B) circuit board
configuration configuration information, refer to the Five/Ten-Slot Module Service
information
manual as well as subsection 8.2.4 in this manual. Configuration of the
SPC circuit board is also covered in subsection 8.2.4.

3.5 Nonredundant Drive History Module Configurations
Overview The History Module can be configured for either nonredundant or

redundant drive operation. When configured nonredundant, the
Winchester Disk Assembly (WDA) will contain a single Winchester Drive
Tray, located at the right-hand side of the assembly. One (single) or two
(dual) drives will be mounted on the tray.
3.5.1 Single Disk Drive Configuration
Overview In a nonredundant single-drive WDA History Module, a single drive is

pinned (configured) and labeled as device 5 (SCSI bus address 5), while
mounted in the front position of the right-hand Winchester Drive Tray as
illustrated in Figure 3-7.
Pinning of the drive is shown in Figure 9-6 in subsection 9.4.2.
Figure 3-7 Nonredundant Single-Drive Configuration
SCSI Bus
Termination
Modules
Drive 5
Drive 5
Nonredundant Dual Drives

12819
SCSI bus termination Three SCSI bus termination modules must be installed on the bottom of
modules 210 megabyte and 445 megabyte drives as illustrated in Figure 3-6.
Internal bus terminators must be enabled on the 875 megabyte and 1.8
gigabyte drives by pinning (configuration). The terminators installed on
Drive 5 terminate the SCSI bus on the right-hand tray. The other end of
the SCSI bus is terminated by resistors on the WDI circuit board, which
are activated when the left-hand Winchester Drive Tray is not present.
See subsection 9.4.2 for detailed installation information.

3.5.1 Single Disk Drive Configuration, Continued
SPC to drive tray Figure 3-8 illustrates the components and interconnections between the
interconnections SPC circuit board and the right-hand (primary) Winchester Drive Tray.
The left-hand Winchester Drive Tray is not present.
Figure 3-8 Nonredundant Single-Drive Interconnections
Backplane Connector
SCSI Bus
Ribbon Cable
Backplane Connector
Bus Terminators
(Secondary)
SCSI Bus
Left-Hand Tray Printed
Not Present Flex-Circuit
Drive 5
Front Disk
Drive
Bus Terminators
(Primary)
Right-Hand Winchester Drive Tray

9466.1

3.5.2 Dual Disk Drives Configuration
Overview In the nonredundant dual-drive configuration, both drives are mounted on

the right-hand (primary) Winchester Drive Tray and labeled “Drive 5” and
“Drive 3” as illustrated in the Figure 3-9. Drive 5, the front-mounted
drive, is pinned (configured) for SCSI bus address 5, and Drive 3, the
rear-mounted drive, is pinned (configured) for SCSI bus address 3.
Pinning of the drives is discussed in subsection 9.4.2.
Figure 3-9 Nonredundant Dual-Drive Configuration
Drive 3
SCSI Bus
Termination Drive 3
Modules
Drive 5
Drive 5
Nonredundant Dual Drives

12820
SCSI bus termination As illustrated in Figure 3-9, SCSI bus termination modules must be
modules installed on the bottom of the front-mounted 210 megabyte and 445
megabyte drives, which is at the end of the SCSI bus printed flex-circuit
(Drive 5). Internal bus terminators must be enabled on the 875 megabyte
and 1.8 gigabyte drives by pinning (configuration). The other end of the
SCSI bus is terminated by resistors on the WDI circuit board that are
activated when the left-hand Winchester Drive Tray is not present.
The drive mounted in the rear position must not have bus termination
modules installed on it.

3.5.2 Dual Disk Drives Configuration, Continued
The
left-hand Winchester Drive Tray is not present.
Figure 3-10 Nonredundant Dual-Drive Interconnections
Backplane Connector
SCSI Bus
Ribbon Cable
Backplane Connector
Bus Terminators
(Secondary) Drive 3
Rear Disk
Drive
SCSI Bus
Left-Hand Tray Printed
Not Present Flex-Circuit
Drive 5
Front Disk
Drive
Bus Terminators
(Primary)
Right-Hand Winchester Drive Tray

9466.2

3.6 Redundant Drives History Module Configurations
Overview The History Module is capable of supporting redundant Winchester Disk

drives that are configured as backups for single or dual drives. The
additional redundant Winchester Disk drive(s) is mounted on the left-hand
(secondary) Winchester Drive Tray that is installed in the Winchester Disk
Assembly.
What is redundancy? The term “redundancy” is used to describe redundant Winchester Disk
drives, not redundant History Modules which is how some LCN nodes can
be configured. Although hard drives are quite reliable, the catastrophic
nature in which data is lost during a failure encourages the need for data to
be backed-up during normal operation.
Redundancy drive In a redundant configuration, if software does a successful write to one

synchronization drive, then it will do an identical write to its redundant partner. Therefore,
identical data is maintained on two drives in the system. This process is
called “data synchronization.”
If a drive fails, software ignores the failed drive and continues to operate
with the “good” redundant partner. If the failure occurs during a data
operation on the primary drive, the operation is completed using the
redundant secondary drive. The System Real Time Journal receives an
entry identifying the specific sector and volume/file name affected.
redundancy
To recover from an unrecoverable data error on a drive, bad sectors can be

initialized or assigned to the Bad Sector List while system operation
continues using the “good” drive.

3.6.1 Single Disk Drive Configuration
Overview The redundant single-drive configuration is physically similar to the

nonredundant single-drive configuration illustrated in Figure 3-7, except
both Winchester Drive Trays in the Winchester Disk Assembly have a
single Winchester disk drive mounted at the front of the tray.
Drive pinning As illustrated in Figure 3-11, the drive mounted on the right-hand
(primary) Winchester Drive Tray is labeled “Drive 5” and must be pinned
(configured) for SCSI bus address 5. The redundant partner, mounted on
the left-hand (secondary) Winchester Drive Tray, is labeled “Drive 4” and
must be pinned (configured) for SCSI bus address 4.
Pinning of the drive is discussed in subsection 9.4.2.
Figure 3-11 Redundant Single-Drive Configuration
SCSI Bus Termination Modules

Drive 4
Drive 5
Drive 4 Drive 5
Redundant Single Drives

12821
SCSI bus termination The SCSI bus termination modules must be installed on the bottom of 210
modules megabyte and 445 megabyte drives as illustrated in Figure 3-11. The
terminators installed on Drives 4 and 5 terminate the two ends of the SCSI
bus. The 875 megabyte and 1.8 gigabyte drives do not have bus
termination modules. Instead internal bus terminators are enabled
electronically on the drive by jumper block selection.

3.6.1 Single Drive Configuration, Continued
interconnections SPC circuit board and both Winchester Drive Trays.
Figure 3-12 Redundant Single-Drive History Module Interconnections
Backplane Connector
SCSI Bus
Ribbon Cable
Backplane Connector
SCSI Bus SCSI Bus

Printed Printed
Drive 4 Drive 5
Drive Drive

(Primary) (Primary)

9466.3

3.6.2 Dual Disk Drives Configuration
Overview The redundant dual-drive configuration is physically similar to the

nonredundant dual-drive configuration illustrated in Figure 3-9, except
both Winchester Drive Trays in the Winchester Disk Assembly have dual
Type I drives or single Type II drives mounted on the tray.
Mounting and pinning The drive mounted at the front on the right-hand (primary) Winchester
the drives Drive Tray is labeled “Drive 5” in Figure 3-13 and must be pinned
(configured) for SCSI bus address 5. The redundant partner, mounted at
the front on the left-hand (secondary) Winchester Drive Tray, is labeled
“Drive 4” and must be pinned (configured) for SCSI bus address 4.
The drive mounted at the rear on the right-hand (primary) Winchester

Drive Tray is labeled “Drive 3” in Figure 3-13 and must be pinned
(configured) for SCSI bus address 3. The redundant partner, mounted at
the rear on the left-hand (secondary) Winchester Drive Tray, is labeled
“Drive 2” and must be pinned for SCSI bus address 2.

Figure 3-13 Redundant Dual-Drive Configuration
SCSI Bus Termination Modules

Drive 2
Drive 3
Drive 2 Drive 3
Drive 5
Drive 4
Drive 4 Drive 5
Redundant Dual Drives

12822
SCSI bus termination The SCSI bus termination modules must be installed on the bottom of
modules front 210 megabyte and 445 megabyte drives. The rear drives must not
have bus termination modules installed on them. The terminators installed
on Drives 4 and 5 terminate the two ends of the SCSI bus. The 875
megabyte and
1.8 gigabyte drives do not have bus termination modules. Instead internal
bus terminators are enabled electronically on the drive by jumper block
selection.

3.6.2 Dual Disk Drives Configuration, Continued
interconnections SPC circuit board and the drives.
Figure 3-14 Redundant Dual-Drive History Module Interconnections
Backplane Connector
SCSI Bus
Ribbon Cable
Backplane Connector
Drive 2 Drive 3
Rear Disk Rear Disk

Drive Drive
SCSI Bus SCSI Bus

Printed Printed
Drive 4 Drive 5
Drive Drive

(Primary) (Primary)

9466.4

3.7 Field Adjustments

Section 4 – WDA History Module With Type II Drive Tray
4.1 Overview

Topic See Page
4.1 Overview 63
4.3 Physical Configuration 69
4.4 Circuit Board Configuration 71
4.5 Nonredundant Drive History Module Configuration 72
4.5.1 Type II Disk DrivesConfiguration 72
4.6 Redundant Drives History Module Configuration 75
4.6.1 Type II Disk Drives Configuration 76
4.7 Field Adjustments 78
Purpose of the This section describes the two possible configurations for the WDA type
section History Module with Type II Drive Tray(s) hardware, including hardware
servicing and replacement.
Purpose of the WDA The WDA type History Module (HM) provides mass data storage for
type History Module history files, system software, and customer files for the TPS system. The
WDA History Module is a node on the Local Control Network (LCN)
with a specific address assigned. More than one WDA History Module
can reside on the network.
Figure 4-1 Dual-Drive Type II Winchester Drive Tray

7
2 4
1 3
8 6
6768

WDA type History The WDA History Module consists of the electronics necessary to
Module overview interface to the LCN, and the electronics necessary to control one or two,
3.5-inch Winchester hard disk drives. The WDA History Module is
packaged in a Five-Slot Module chassis.
How to use this Use this section to identify the History Module parts and understand the
section operation of the WDA History Module. Then, concentrate on the sections
in the manual that meet your needs, such as testing/troubleshooting,
Redundant drive WDA History Modules can be configured as non-redundant or redundant.

configuration When configured for redundant drives, data is written to the redundant
drives almost simultaneously. If one of the drives should fail, the
redundant partner has the full database intact and can continue to provide
normal operation capability until the failed drive is repaired or replaced.
For more information on redundant drives, go to subsection 4.6.

4.2 Description
CE Compliance The design of the Five-Slot Module chassis and the I/O circuit boards that
install in the rear card cage has changed for CE Compliance. Pertinent
information can be found in the Five/Ten-Slot Service manual.
Functionally, the non-CE Compliant and CE Compliant WDA History
Modules are the same. However, the I/O circuit boards that install in the
rear card cages are not interchangeable because of their physical
characteristics.
Overview Figures 4-2 and 4-3 illustrate the front and rear views of the non-CE
Compliant and CE Compliant WDA History Modules that can be
configured for one oer two Winchester disk drives. The non-CE
Compliant module illustrated is the enhanced LCN Five-Slot Module.
Besides circuit boards that control the interface to the Local Control
Network (K2LCN or K4LCN) and the drives (SPC), the module also
contains two slide-out trays on which the Winchester disk drives are
mounted. The trays are installed in a Winchester Disk Assembly (WDA)
that occupies circuit board slots 4
and 5 in the module.
Only the right-hand tray is present for a nonredundant drive configuration.

Both trays are present for a redundant drive configuration.
The modules have an enhanced power supply, located at the bottom of the
module, that provides power for the circuit boards, the drive(s), and the
fan assembly. A fan assembly is located at the right-hand side of the
module and provides cooling for the circuit boards, power supply, and the
drive(s).

Non-CE Compliant
WDA History Module
Figure 4-2 WDA History Module – Non-CE Compliant
Tray Power Switch
Fan Assembly
ON ON
5 OFF OFF
SPC 4
3
K2LCN-2
2
1
FRONT VIEW
Reset Button
Ribbon Cable
5
4
WDI I/O
3
SPCII I/O 2
LCN I/O 1
REAR VIEW 6765

Non-CE Compliant
WDA History Module
Figure 4-3 WDA History Module – CE Compliant
Tray Power Switch
Fan Assembly
ON ON
5 OFF OFF
SPC 4
K2LCN/K4LCN 3
2
1
FRONT VIEW
Reset Button
Ribbon Cable
5
WDI 4
3
SPC2 2
CLCN A/B 1
REAR VIEW
16758

WDA History Module Figure 4-4 is a block diagram of the WDA History Module illustrating the
block diagram path between the LCN and the Winchester disk drives. A functional
description of the enhanced Five-Slot Module chassis that provides the
electronics for the WDA History Module hardware can be found in the
Five/Ten-Slot Module Service manual.
Figure 4-4 WDA History Module Block Diagram

4.3 Physical Configuration
Winchester disk A Winchester hard disk drive is mounted on each Winchester Drive Tray,
drives resident in the Winchester Disk Assembly that occupies the upper two
circuit board slots (slots 4 and 5) of the module as illustrated in Figures 4-
2 and 4-3.
SCSI bus Dual Small Computer Systems Interface, (SCSI) bus ribbon cables
interconnections connect the Smart Peripheral Controller I/O (SPCII/SPC2) circuit board,
located at the rear of the Smart Peripheral Controller (SPC) circuit board
(slot 2), to the Winchester Drive Interface I/O (WDI I/O/WDI) circuit
board, located at the rear of the Winchester Disk Assembly (slot 5).
The Winchester Disk Interface (WDI) circuit board, located in the

Winchester Disk Assembly (WDA), extends the SCSI bus to the
Winchester disk drive(s) mounted on the Winchester Drive Tray(s) as
The Smart Peripheral Controller (SPC) circuit board interconnects by the

SCSI bus ribbon cable to one drive on each tray present. The SCSI bus is
terminated by a termination module installed on the end of the ribbon
cable.
SCSI bus termination The SCSI cable (for each tray) is terminated by a terminator mounted on
the end of the SCSI cable that connects to the disk drive.
The WDI circuit board, resident in the Winchester Disk Assembly, has
two sets of SCSI bus resistor terminators, one set for each end of the bus.
The set of terminators is activated when power is removed from the
individual Winchester Drive Tray by a power switch at the front of the
tray. This arrangement allows a failed drive on a tray to be removed and
replaced without disturbing its redundant partner that is mounted on
another tray, interfacing the same SCSI bus.

4.3 Physical Configuration, Continued
SCSI bus The SCSI bus ribbon cables form a group of transmission lines and must
be resistor terminated at each end of the SCSI bus. The SPC circuit board
contains no bus terminators since it is central to the bus. Figure 4-5
illustrates the routing of the SCSI bus when both Winchester Drive Trays
are present.
Figure 4-5 SCSI Bus and Termination Interconnections

4.4 Circuit Board Configuration
SPC circuit board The Smart Peripheral Controller (SPC) circuit board provides
communication with, and control of, the Winchester disk drives and the
SPC I/O circuit board.
WDI and WDI I/O The SPC I/O circuit board and the Winchester Drive Interface (WDI)
circuit boards circuit board in the Winchester Disk Assembly with its associated WDI
I/O circuit board provide the SCSI bus interface between the SPC circuit
board and the Winchester disk drives.
SCSI bus terminators are activated when a Winchester Drive Tray is not
present in the WDA or has power removed from it by its power switch.
Any Winchester Drive Tray that does not have power applied to it must be
removed from the WDA.
K2LCN or K4LCN and The K2LCN or K4LCN circuit board and its associated LCN I/O
LCN I/O circuit boards (CLCN A/B) circuit board provide the electronic link between the Local
Control Network (LCN) and the SPC circuit board. The K2LCN and
K4LCN circuit board contain the node processor and supporting memory.
Circuit board For K2LCN, K4LCN, and LCN I/O (CLCN A/B) circuit board
configuration configuration information, refer to the Five/Ten-Slot Module Service
information
manual as well as subsection 11.2.4 in this manual. Configuration of the
SPC circuit board is also covered in subsection 11.2.4.

4.5 Nonredundant Drive History Module Configurations
Overview The History Module can be configured for either nonredundant or

redundant drive operation. When configured nonredundant, the
Winchester Disk Assembly (WDA) will contain a single Winchester Drive
Tray, located on the assembly. One (single) drive will be mounted on the
tray.
4.5.1 Type II Disk DrivesConfiguration
Overview The Type II disk drive configuration to appears as two drives to system
software even though there is only one physical drive on the tray (i.e.
addresses 5 and 3 or 4 and 2). In the nonredundant Type II drive
configuration, the drive is mounted on the right-hand (primary)
Winchester Drive Tray and labeled “Drive 5” as illustrated in the Figure 4-
6. Drive 5, is pinned (configured) for SCSI bus address 5.
Figure 4-6 Nonredundant Dual-Drive Configuration
12820

4.5.1 Type II Disk Drives Configuration, Continued
modules the end of the SCSI cable.

The
left-hand Winchester Drive Tray is not present.
Figure 4-7 Nonredundant Dual-Drive Interconnections

4.6 Redundant Drives History Module Configurations
Overview The History Module is capable of supporting a redundant Winchester Disk

drive that is configured as a backup. The additional redundant Winchester
Disk drive is mounted on the left-hand (secondary) Winchester Drive Tray
that is installed in the Winchester Disk Assembly.
What is redundancy? The term “redundancy” is used to describe a redundant Winchester Disk
drive, not redundant History Modules. Although hard drives are quite
reliable, the catastrophic nature in which data is lost during a failure
encourages the need for disk redundancy.
Redundancy drive In a redundant configuration, if software does a successful write to one

synchronization drive, then it will do an identical write to its redundant partner. Therefore,
identical data is maintained on two drives in the system. This process is
called “data synchronization.”
If a drive fails, software ignores the failed drive and continues to operate
with the “good” redundant partner. If the failure occurs during a data
operation on the primary drive, the operation is completed using the
redundant secondary drive. The System Real Time Journal receives an
entry identifying the specific sector and volume/file name affected.
redundancy
With the introduction of this drive, bad sector re-assignment will be

automatic and will be reported to system software.

4.6.1 Type II Disk Drives Configuration
Overview
Mounting and pinning The drive mounted on the right-hand (primary) Winchester Drive Tray is
the drives labeled “Drive 5” in Figure 4-11 and must be pinned (configured) for
SCSI bus address 5. The redundant partner, mounted at the front on the
left-hand (secondary) Winchester Drive Tray, is labeled “Drive 4” and
must be pinned (configured) for SCSI bus address 4.
The drive in Figure 4-8 labeled "Drive 3" is actually the second half of
drive 5. The redundant partner, labeled “Drive 2”is actually the second
half of Drive 4.

Figure 4-8 Redundant Dual-Drive Configuration
12822
modules the end of the SCSI cable.

interconnections SPC circuit board and the drives.
Figure 4-9 Redundant Dual-Drive History Module Interconnections

4.7 Field Adjustments

Section 5 – Test/Troubleshooting 5.1 Overview

Topic See Page
5.1 Overview 79
5.2 Test Strategy 79
5.3 Troubleshooting 82
5.3.1 Preliminary Checks 82
5.3.2 Sequential Troubleshooting 83
5.3.3 Maintenance Recommendations 87
5.3.4 SMCC/Detailed Module Error Messages 89
5.3.5 Real Time Journal (RTJ) Messages 95
5.3.6 Repair Strategy 96
5.3.7 Data Error Recovery Technics and Documentation 98
5.3.8 Nonredundant Drive Data Error Recovery 99
5.3.9 Redundant Drive Data Error Recovery 105
5.3.10 Control Track Error Recovery for Sectors 1-31 108
5.3.11 Status Detail Display 110
5.3.12 Volume Status Display 112
5.3.13 Sector Initialization/Reassignment Procedure 115
Purpose This section analyzes the hardware failure indicators and the software
status displays that are displayed on the Universal Station when a failure
occurs. Troubleshooting tactics are presented in response to each failure
indicator and status display.
5.2 Test Strategy
CAUTION CAUTION—Read all of the following five considerations before

proceeding with the troubleshooting and repair of the History Module.
Consideration 1 DO NOT USE A DISK DRIVE FROM ANOTHER HISTORY

MODULE AS A REPLACEMENT for a drive in a redundant History
Module unless you format the replacement drive using the off-line
Hardware Verification Test System (HVTS). When a drive contains an
existing file system and is used as a replacement, it can corrupt the file
system in the redundant History Module in which it is installed.
Replacement drives received from the factory will not cause this problem
because they are formatted before shipment.

5.2 Test Strategy, Continued
Consideration 2 DO NOT INITIALIZE A REDUNDANT HISTORY MODULE unless

power is applied to all drives. If power is removed from a redundant drive
and the History Module is initialized with a reduced number of volumes
available, the existing file system can be corrupted when power is applied
to the drive after initialization.
Consideration 3 DO NOT REMOVE POWER FROM THE HISTORY MODULE OR

THE DISK DRIVES before you do a node shutdown from the Universal
Station. DO THE PRELIMINARY CHECKS in the next subsection
before you remove power. When power is removed, you may lose
important fault and error information pertinent to the problem.
Consideration 4 DO NOT PRESS THE RESET SWITCH ON THE HISTORY

MODULE POWER SUPPLY WHEN A HISTORY MODULE
PERSONALITY IS ACTIVE. If a write to a drive is in process, the
reset will prevent software from finishing the write and leave corrupted
data on the drive. The proper reset procedure is in Table 5.1.
Table 5.1 History Module Reset Procedure
Step Action
1 Do a node shutdown from the Universal Station.
2 Remove power from the module with the power supply power switch.
3 Wait 30 seconds, and then reapply power to the History Module.
4 Press the reset button once to abort the normal autoboot, which is
needed only during a History Module initialization procedure.
Consideration 5 When reformatting an 875 megabyte drive (51196680-200) or 1.8 gigabyte

drive (51196895-100), you must use a 11.5 or later release of HVTS.
CAUTION CAUTION—OBSERVE ELECTROSTATIC DISCHARGE (ESD)

PROCEDURES. All assemblies used in the History Module contain
electrostatically sensitive devices. Use a personnel grounding strap and grounded
work surface. Store and transport parts in electrostatically safe containers.
Use a strategy Consider a strategy before attempting the repair of the History Module.
How is it used in your system? Is it a system, local, or area History
Module? If the data in your system History Module is not used or updated
often, you can autoboot it with little impact on the process. The loss of a
local History Module containing schematics for the process can be more
severe. However, some installations might consider the loss of system
data, even for a brief time, critical to the plant’s operation.

Are there redundant Does your History Module have redundant drives which allow
drives? uninterrupted operation while you service or replace a drive?
Are fast-load Are fast-load cartridges available to reload critical modules if the History
cartridges available? Module is disabled. Refer to the Engineer’s Reference Manual.
Do you have backup Hopefully, you have made backup copies of your data which must be used
copies of the data? if a drive has “crashed” and destroyed data. Also, you must have
previously used a special procedure that was discussed in the Engineer’s
Reference Manual to backup and restore Continuous History data. If
Continuous History Data was saved without using this procedure, the data
cannot be properly copied to a replacement drive.
Review the SMCC Review SMCC Maintenance Recommendation messages and the Real
messages and the Time Journal (RTJ) for clues to the failure. You may need to refer to the
RTJ
Maintenance Test Operations manual, the System Maintenance Guide, and
the Hardware Verification Test System (HVTS) manual for reference.
Are there transient or The problem can be a transient or intermittent problem. An autoboot can
intermittent bring the History Module back on-line, or it can delay the recurrence of
problems?
the problem to a more favorable time. However, remember the autoboot
can also destroy some status indicators originally set as a result of a fault.
Table 4-2 lists some possible intermittent problems and their correction.
Table 5.2 Troubleshooting Procedure – History Module Operates Intermittently
Indication Possible Cause Solution
The History Module Open or loose cable. Check out the cable connections on all of the
reports an error, but the boards and the drives. Inspect the cables for
reload of the personality damage. Remove the cables and inspect them
software or an autoboot for nicks and cuts caused by pinching. Repair or
temporarily solves the replace damaged cable.
problem. The problem
returns in a day or so.
Intermittent board failure. Remove and reseat all the circuit boards.
Replace the circuit boards one at a time. If the
problem is not corrected after you replace a
circuit board, reinstall the original circuit board.
Damaged backpanel or Replace the History Module chassis.
damaged wiring.
Do a “test run” Finally, do a “test run” through the troubleshooting procedures that follow.
You can more accurately estimate how long it will take to correct a
problem.

TAC is available The Honeywell Technical Assistance Center (TAC) engineers can often
help isolate hardware failures and procedural errors. Additionally, they
have ready access to Shipping Alerts, Product Release Notices, and
problem histories that can help identify the source of a problem. You may
wish to call TAC to confirm a diagnosis you have made. You should
always call TAC if these troubleshooting procedures cause you to reach a
“dead end” or an illogical end result.
5.3 Troubleshooting
Overview The troubleshooting subsection provides an orderly method of diagnosing

a problem. Preliminary checks are suggested, followed by sequential
troubleshooting procedures. Repair methods are suggested.
5.3.1 Preliminary Checks
Overview Before becoming deeply involved in a problem, perform some preliminary

checks. Most of the checks in the steps that follow can be made by
observation without removing power from the History Module. Unless an
indicator observed in these steps clearly points to a repairable problem, for
example, a red LED on the fan assembly, power supply, or a circuit board,
leave power applied and go to subsection 5.3.2 where the status errors on
displays are interpreted.
Remove the front Remove the front panel of the History Module.
panel
Check the power Check the green LED on the power supply. If it is not lit, place the AC
supply indicators power switch in the OFF position and then back to the ON position. If the
green indicator does not illuminate, either the power supply is defective,
power is not being provided to it, or there is a output power overload.
Check the fan If the red LED indicator on the fan assembly is illuminated, the fan
assembly indicator assembly is defective. It indicates a lack of air flow.
Check the circuit All the green or yellow indicators on the circuit boards must be lit. No red
board indicators indicators should be lit. The Alphanumeric display on the
EMPU/HMPU/HPK2/K2LCN/K4LCN circuit board must illustrate the
correct LCN node address. If the status of the indicators is incorrect, go to
Table 5.3.

5.3.2 Sequential Troubleshooting
Overview Use the troubleshooting procedure in Figure 5.1 to help isolate a failure.
This flowchart assumes the History Module was in an operational state
before the error in the flowchart occurred. Attempting an autoboot or
loading the node will destroy some status information. The flowchart then
refers you to troubleshooting tables and other subsections in this section of
the manual.
Figure 5.1 History Module Troubleshooting Flowchart
Select SYSTEM Is the HM

STATUS. Check Y
Start SYSTEM End
the HISTORY STATUS
MODULE status. OK?
N
If an autoboot was started, it
may take up to 15 minutes to
complete. Otherwise, the (Once for each HM)
program has "hung." Check
the Alphanumeric Display at N Y
the front of the K2LCN/K4LCN
board. Go to Table 4-4 if it
doesn't indicate the proper Has Is
Y Check the status
LCN node number. If it does, NODE STATUS NODE STATUS
of each HM node.
reload the HM personality and changed? OK?
continue.
N
HM software is performing an
Is
interim operation. Wait 1 Is
Y NODE STATUS N
minute or less and look for a NODE STATUS
LOAD, TEST, or
state change. OFF?
READY?
Power is off or this
Make sure printer is on. N node is not connected Y
Print out any error message to the LCN. Correct
found that follows. the problem.
Is Is
NODE STATUS N NODE STATUS N NODE STATUS
FAIL OR SEVERE OR is PWR_ON or
ISOLATED? WARNING? QUALIF?
Y Y
The node has failed The History Module

An abnormal or critical
or become isolated software personality
condition exists.
on the LCN. is suspect.
Go to Table 4-5.
Go to Table 4-3. Go to Table 4-5.
16761

5.3.2 Sequential Troubleshooting, Continued
Use the printer Enable the printer and record status and error messages as you are
investigating a problem. If the failure cannot be corrected by performing
these procedures, you will need these messages when you contact the
Honeywell Technical Assistance Center (TAC).
The History Module If the History Module will not boot, or the History Module’s Node Status
will not boot is FAIL or ISOLATED, use Table 5.3.
Table 5.3 Troubleshooting Procedure – History Module Will Not Boot or Node Status is
FAIL or ISOLATED
The Alphanumeric display Software problem or a Go to Table 5.4 for further troubleshooting
on the failure in some of the information.
EMPU/HMPU/HPK2/ circuit board self-tests.
K2LCN/K4LCN board is
not displaying the correct
LCN node number.
The red indicator on the Circuit board failure. Replace the circuit board with a known good
EMPU/HMPU/HPK2/ one. If the problem is not corrected, return the
K2LCN/K4LCN or SPC original circuit board to the slot.
circuit board is illuminated.
The associated I/O circuit Install the I/O circuit board in the correct slot.
board is not in the slot
directly behind the circuit
board.
The green indicator on the Power supply failure. Reset the circuit breaker by cycling the power
power supply is supply switch off, then on.
extinguished.
Replace the power supply.
All the above indicators System failure. Check the RTJ for any reference to a History
are properly illuminated. Module failure. In most cases, the RTJ will show
the task that failed and some additional
information. Select SMCC from a Universal
Station with an Engineering personality. Printout
the Active Maintenance Journal and the Detailed
Module Errors that can be recorded for the
History Module. Go to subsection 5.3.3.
If you have no RTJ or SMCC error data, call TAC

and discuss the error. You may receive a
request to connect a modem so that TAC
personnel can monitor as the History Module is
booted.

Alphanumeric display If the Alphanumeric display on the EMPU/HMPU/HPK2/K2LCN/K4LCN

is -1xx circuit board shows -1xx, use Table 5.4 to identify the problem.
Table 5.4 Troubleshooting Procedure – Kernel Circuit Board Alphanumeric Display is -1xx
-190 Power to a Winchester Be sure all the cables are firmly in place and
Drive Tray is removed or power is applied to the Winchester Drive Tray(s).
the power cable to a drive Check the SMCC and RTJ journals.
is disconnected.
The volume configuration Be sure to initialize the History Module after the
on the system NCF has volume configuration on the system NCF is
been altered without the altered. This is an error in procedure. It is not
user also initializing the an equipment failure.
History Module.
-176 &HMO may not have been Review Task 16 in the System Startup Guide.
copied to the local volume This is an error in procedure. It is not an
(!9NP). equipment failure.
A drive is suspect. Call TAC and discuss the problem.
-177 -183 -193 The History Module Autoboot the History Module.
-178 -184 -194 personality software is
corrupted.
-179 -185 -195 Go to Table 5.3 if the autoboot is not successful.
-189 Call TAC if error -189 is repeated.

-188 ($BOOT.MS) The file is missing, cannot Check the contents of the History Module local
-18A (a QLT file) be read, or the copy on volume. If the file is missing, damaged, or
-18C (a personality file) the drive is damaged. cannot be read, review Task 16 in System
-18E (an OFT file) Startup Guide. This is an error in procedure. It
is not an equipment failure.
-18F (bad checksum in Autoboot the History Module. Go to Table 5.3 if

any file) not successful. Call TAC if error -18F is
repeated.
-1XX (any other number) Circuit board failure. Refer to the Five/Ten-Slot Module Service
manual, Appendix A for assistance. Follow the
suggestions.

History Module Node If the History Module Node Status has an error displayed, use Table 5.5.
Status error
Table 5.5 Troubleshooting Procedure – History Module Node Status Errors

FAIL or ISOLATED Go to Table 5.3.
WARNING An abnormal condition Select the HM STATUS DETAIL target to obtain

exists. additional information.
SEVERE A critical abnormal Select the HM STATUS DETAIL target to obtain
condition exists. additional information.
PWR_ON or QUALIF Software corruption. Autoboot the History Module with the History
Module Initialization personality. If the problem is
Note: Each of these states not corrected, transfer a fresh copy of the &HMO
should always be and &LDR volumes from removable media to the
temporary. Do this task History Module:
only if the state is
permanent. CP $Fn>&HMO>*.* PN:nn>!9np>= -D
CP $Fn>&LDR>*.*.PN:nn>!9np>= -D
then autoboot again.
If the above procedure is not successful, go to

Table 5.3. Call TAC if the same error is
displayed.

5.3.3 Maintenance Recommendations
Overview Maintenance recommendation messages can be found in either the Real

Time Journal (RTJ) or the Active Maintenance Journal. To read the
Active Maintenance Journal, select the SMCC/MAINTENANCE target from
the Engineering Main Menu. Then select the ACTIVE MAINT JOURNAL
target.
Detailed Error Module Some errors will also cause a Detailed Error Module message (also under
messages SMCC) to be generated. Detailed Error Module messages for Winchester
disk drives are explained in subsection 5.3.4. If available, use the Detailed
Error Module message to confirm other error reports.
Status and Object Check the node's Status Detail display and the Object Detail (Volume
Detail displays Status) displays for error messages and additional status information.
Refer to subsections 5.3.11 and 5.3.12. These two types of displays can
provide the best detailed information available to assist in an accurate
diagnosis.
Check the If you still have not found your error, compare the RTJ message with the
maintenance samples in subsection 5.3.5. Also, if you have not already done so, use the
messages
printer to make copies of all maintenance messages and System Status
Error messages. Then compare them with the types of messages shown in
subsections 5.3.3 through 5.3.4, and 5.3.11.
Maintenance message Abbreviations used in these maintenance recommendation messages are:

abbreviations
• np = Node pair
• n = Disk drive device number
• xxxx = Sector number
• mmmm = Volume name

5.3.3 Maintenance Recommendations, Continued
Maintenance Some examples of maintenance recommendation messages can be found

recommendation in Table 5.6.
message examples
Table 5.6 Maintenance Recommendation Messages
Interpretation Action
Message: RUN HVTS FAILED SPC CTLR HM NON RECOV CTLR ERROR
There has been a failure in the SPC controller. See Table 5.2.
The object state is set to FAIL (History Module
Node Status).
Message: INVESTIGATE DEGRADED WINCH DISC DRIVE n HM DISK ERROR SECTOR xxxx
There has been a data error either reading or Check for a Detailed Module Error message. See
writing drive n. You have lost some of your subsection 5.3.4. Check the Node Status and Status
data. Detail. See subsection 5.3.11. You may be able to
reassign the bad sector. Replace the drive if time is
valuable and you have a spare. Then plan to reformat
this drive and use it for a spare. Go to subsection 5.3.6
and use the information you have learned here.
Note: If you have redundant drives, this report is also

generated when an error occurs in the synchronization.
On-line data is being copied to the off-line drive. DRIVE
n in the message signifies which of the redundant drives
is faulty. See the special disassembly/assembly
procedures for redundant drives. Also, a Status Detail
message will be generated giving the volume name, file
name, sector address, and error type.
Message: HM np WENT OFLN; NO FUNCTIONS LOST; LOST 1 CTL TRACK
Note: The above message is a system status change event, not a maintenance recommendation, as
were all the others. At the same time, the following message appears as a maintenance
recommendation:
RUN HVTS BAD SECTOR WINCH DISC DRIVE n HM DISK ERROR SECTOR xxxx or HM DISK SET
OFF LINE (if both control tracks lost)
There has been a Control Track error. Since This is a serious error, but you are probably still
each drive has two Control Tracks for operational unless both control tracks were lost. Plan to
redundancy, the second Control Track should replace or reformat the disk as soon as your
have kept your data intact and you should still maintenance schedule allows. Check for a Detailed
be operational on the second track. You Module Error message in subsection 5.3.4. Check the
should be able to go back on-line. If both Node Status and Status Detail in subsection 5.3.11. Go
Control Tracks are lost, the drive will be placed to subsection 5.2.6 and use the information gained here
off-line and must be replaced. You cannot go and from the available status indicators.
back on-line. Neither track has a fixed location
on the disk and can possibly be repaired by
reassignment or initialization. Use the
recovery procedure in either subsection 5.3.8
or 5.3.9.

5.3.4 SMCC/Detailed Module Error Messages
Detailed Module Use the following procedure in Table 5.7 to display error messages.
Errors display
Table 5.7 WREN III, 210/445/875 MB, and 1.8 GB Drive
Error Messages Display Procedure
Step Action
1 Select the SMCC/MAINTENANCE target on the Engineering Main
Menu display.
2 Select the MODULE ERROR target.
3 Select the DETAILED MODULE ERRORS target.
4 Enter the node number of the suspect History Module.
If there has been a drive error, the display will be shown (and printed) in a
format similar to the example in Figure 5.2. The example lists “SPC
Error” enclosed in a box. The boxes are not actually printed. They are for
illustration only. This is an error detected by the software in its exchange
with the SPC circuit board, its I/O, the SCSI bus interface, or the drive(s).
Figure 5.2 WREN III, 210/445/875 MB, and 1.8 GB Drive
Detailed Module Errors Display
MODULE NUMBER 43
Node Type History Module

Node State Running
Error Entity Type : Unit Error

Unit Name : WR04
Error Descriptor Size : 20
Error Descriptor Type : SPC Error SCSI Interface Error
Error Occurrence Time: 01 Feb 90 02:03:10:0335
Error Descriptor Info: Drive Address
Error Severity: 1
Error Breakdown: 0
Primary Code: -5 Primary Code
Secondary Code: 11 Secondary Code
Board Slot Number: 5
Device_Number: 5 Sense Key
OP Status: 8400
Sense Code
Command Register: 0280
Config Status: 0706
HW Status: 42C9
Paged Status Wd: 2/X/Y : 0000 3F3F 0101
Current IOCB Addr: 00097ADA
Current IOCB: 8002 0AF0 03 10 0002 25D0 0601 0000 0000
11744

5.3.4 SMCC/Detailed Module Error Messages, Continued
Identifying the failed The address of the device (drive) is listed in the example Figure 5.2 as
drive “Device_Number 5” or SCSI bus address 5. If there is more than one drive
in your system, this is where you can identify the physical drive in which
the error occurred.
Determining the cause To determine the cause of the error, locate the remaining four numbers
of the drive failure enclosed in boxes in Figure 5.2. They are labeled Primary Code, Secondary
Code, Sense Key, and Sense Code.

Primary and Use the Primary and Secondary Error Codes listed in Table 5.8 to find the
Secondary Error source of the reported error within the History Module. Note that there are
Codes
very few errors which can be attributed to the drive itself. If a “software
error” or “controller error” is indicated, look for corrupted software or a
failed SPC or SPC I/O circuit board.
Table 5.8 Drive Primary and Secondary Error Codes
Primary Code Secondary Code Error Source
0 n/a Software error
-1 n/a Software error
-4 n/a Controller error
-5 0 Controller error
-5 5 Software error
-5 6 Software error
-5 7 Software error
-5 11 Disk drive error with status
-5 12 Disk drive/interface error
-6 n/a Not used
-7 n/a Disk drive failure/removal

Primary and
Secondary Error
Codes, continued
Table 5.8 Drive Primary and Secondary Error Codes, Continued
Primary Code Secondary Code Error Source
-8 n/a Not used
-9 n/a Not used
-10 n/a Not used
-11 n/a Not used
Sense Key and Sense

Code
Use the drive Sense Key/Sense Codes listed in Table 5.9 to find the cause
of the problem.
Table 5.9 Drive Sense Keys/Sense Codes
Step Action Result
00 No Error 00 No sense data
01 Recovered 17 Recovered read data error
Error
01 Recovered 18 Recovered read data error
Error
02 Not Ready 04 Drive not ready
03 Media Error 10 Data CRC or ECC error
03 Media Error 11 Unrecovered read error
03 Media Error 12 No address mark in ID
03 Media Error 14 No record found
03 Media Error 15 Seek positioning error
03 Media Error 19 Defect List error
03 Media Error 1C Primary Defect List not found
03 Media Error 31 Medium format corrupted
03 Media Error 32 No defect spare available
04 Hardware Error 01 No index signal
04 Hardware Error 02 No seek complete

Sense Key and Sense

Codes, continued
Table 5.9 Drive Sense Keys/Sense Codes, Continued
Step Action Result
04 Hardware Error 03 Write failure
04 Hardware Error 08 Logical unit failure
04 Hardware Error 09 Track following error
04 Hardware Error 40 RAM failure
04 Hardware Error 41 Data path failure
04 Hardware Error 42 Diagnostic failure
04 Hardware Error 44 Internal controller error
04 Hardware Error 47 SCSI bus interface parity error
05 Illegal Request 20 Invalid command
05 Illegal Request 21 Illegal logical block address
05 Illegal Request 22 Illegal function for device
05 Illegal Request 24 Illegal field in CDB
05 Illegal Request 25 Invalid logical unit number
05 Illegal Request 26 Invalid field in parameter List
06 Unit Attention 29 Power/bus device reset
06 Unit Attention 2A Mode select parameter change
0B Aborted 43 Message reject error
Command
0B Aborted 45 Select/reselect failed
Command
0B Aborted 48 Initiator detected error
Command
0B Aborted 49 Inappropriate/illegal message
Command

Recommended After determining the error source using Table 5.9, use Table 5.10 for the
corrective action recommended corrective action based on the Sense Key Code. Then go to
subsection 5.3.6 to determine what to do next.
Table 5.10 WREN III, 210/445/875 MB, and 1.8 GB Drive
Recommended Corrective Action
Sense Key Recommended Corrective Action
00 No Error No action – Information only
01 Recovered No action – Recovered from error

Error
02 Not Ready Test and/or replace the drive.
03 Media Error Test the drive and reassign the failed media sectors.
04 Hardware Error Replace the drive.
05 Illegal Request No action – Software error
06 Unit Attention Replace the drive. Test the History Module.
0B Aborted No action—Software error

Command
Analyzing the failure Analyzing Figure 5.2, drive 5 has failed with a Primary Code of -5 and a
in Figure 5.2 Secondary Code of 11. Table 5.8 indicates a “Disk drive error with
status” failure. Furthermore, you find the Sense Key is 03 and the Sense
Code is 10. Table 5.9 identifies the failure as a “Data CRC or ECC error.”
Sense Key 03 in Table 5.10 recommends that you “Test the drive and
reassign the failed media sectors.”
If you proceed to subsection 5.3.6, you are directed to run a test that
identifies bad sectors and reassigns them to the Bad Sector List as it
reformats the drive. The details of the test are given in subsection 9.5.1.

5.3.5 Real Time Journal (RTJ) Messages
RTJ messages Table 5.11 is a list of some Real Time Journal (RTJ) messages from the
History Module that do not necessarily indicate a failed drive. The
interpretation of each message and possible error symptoms are listed in
the table. Troubleshooting responses are suggested.
Table 5.11 Real Time Journal (RTJ) Messages
Interpretation Symptom Action
Message: HM11 T$BG_EXEC 000B305C 000EF3E4 000EF59A 502 46 0 0
The 502 46 message None Check for a defective K2LCN or K4LCN
indicates a double bit error in circuit board.
memory during a scrub
routine.
Message: K$MMIK_CP, E$L_EVNT_MGT exception type 03,06 Driver Name WDS CMDREG
PRIM 5
The system detected a The History Module can crash Replace the SPC circuit board.
physical error in the data or some nodes can lockup on
transferred from/to the SPC data access from the History
circuit board or the drive. Module.
Message: $$FM_NET_TSK exception type 03,06 Detector Code = 57 or 70
The drive is unreadable. The The History Module crashed Check for power to the drives. Replace
drive’s present Paged Status on the load of INIT. The SPC the SPC circuit board. Go to subsection
Word is bad. Self-Test indicator is 5.3.7 and run SCMD under HVTS for
illuminated. each drive.
Message: J$INPR Int1 = 3090, Int2 = YY
An inconsistent message None None
header received from Node YY
(Int2).

5.3.6 Repair Strategy
CAUTION CAUTION—When reformatting an 875 megabyte drive (51196680-200)

or 1.8 gigabyte drive (51196895-100), you must use a 11.5 or later release
of HVTS.
Help from TAC If you have reached this point without finding an Alphanumeric display or
a maintenance recommendation that will help you, call TAC for
assistance. Not only can TAC engineers help isolate hardware failures,
they can often determine if a procedural error has been committed. In
addition, they have ready access to Shipping Alerts, Product Release
Notices, and problem histories that can help identify the source of a
problem.
After determining the Now that you feel you have identified the area in the History Module that
problem has failed, decide from the information in this subsection and the
appropriate area in subsection 5.3.7 what your repair/replace strategy will
be. Consider the following:
• If necessary, use Section 5 or 6 to disassemble the History Module. Be
sure you pay special attention to some of the shut-down and power-off
sequences required for the equipment.
• If necessary, use Section 7 or 8 to reassemble the components of the
History Module. Pay particular attention to proper jumper block
pinning and termination of the drive, and the connection of any cables
you may have removed.
• Section 9 contains formatting details for the Winchester disk drive.
• After a drive has been formatted, it is electrically operational.
However, it must still be initialized and the files that were previously
on the drive must be restored before it can be placed in service.
• Use Section 10 to determine the replacement parts you need, if any.
Repair or replace? The best maintenance strategy will depend on the nature of the failure, the
drive(s) in use, and the criticality of the lost functionality. If the drive has
a redundant partner, operation can continue with the backup drive and the
faulty drive can be replaced or repaired without disrupting the process or
losing any data. If the drive does not have a redundant partner and the
error is confined to a single file or volume that is noncritical to the
process, it may be possible to continue operation without the lost function
and perform the maintenance at a more convenient time. A
nonrecoverable data error does not necessarily require placing the drive
off-line if redundant; or the entire History Module off-line if
nonredundant.

5.3.6 Repair Strategy, Continued
Nonredundant drive If the drive is nonredundant and the lost functionality is critical to the
failure process, the best solution may be to replace the drive and attempt to repair
the failed unit at a more favorable time. If replacement is necessary and
you have a spare drive from the factory for replacement, it will already be
formatted. However, you must initialize it and reload it from backup
media.
Sector initialization or If you know the volume/file name and bad sector number, you can use the
reassignment sector initialization/reassignment feature under the System Maintenance
procedure
Control Center (SMCC) function. See subsection 5.3.7. This feature
allows you to “repair” the drive without a lengthy HVTS procedure. In
addition, the faulty drive can be repaired while the History Module
remains on-line. This is not available with Type II Drives.
No information from a For a nonredundant drive, try an autoboot. If you are not successful, load
bad sector or a faulty the History Module Initialization (HMI) personality and save as much data
nonredundant drive
as possible. Then, try running HVTS. If you cannot run HVTS, the drive
is probably beyond repair and must be replaced. If you can load and run
HVTS, you may be able to repair media defects on the disk by detecting
bad sectors and adding them to the Bad Sector List. If recovery time is
critical, you can simply replace the drive, then initialize and reload the
History Module.
No information from a For redundant drives, the normal procedure is to replace the defective
bad sector or a faulty drive while leaving the History Module on-line, running with the
redundant drive
redundant drive. If it is presently possible to place the History Module
off-line, you can attempt to repair the defective drive using HVTS.
Bad sector For a nonredundant drive, the faulty sector can be initialized or reassigned
information reported using the SMCC function under the HMI personality. See subsection
on a nonredundant
drive
5.3.8. Then, the bad file is reloaded if required. However, in certain
situations the entire disk will require initialization and reloading. If this is
anticipated, save as much data as possible prior to attempting the disk
repair. This is not available with Type II Drives.
Bad sector For a redundant drive, the faulty sector can be initialized or reassigned
information reported using the SMCC function without placing the History Module off-line.
on a redundant drive
The drive is placed off-line for repair through the SMCC function and
then brought back on-line using the SYNCH command. See subsection
5.3.9. After the repair, use the SYNCH utility to data synchronize the
drive. This is not available with Type II Drives.

5.3.7 Data Error Recovery Technics and Documentation
Overview The two subsections that follow provide recommended procedures for
handling unrecoverable data errors on drives. The term “unrecoverable
data error” means that the History Module disk handler software has
encountered an error while attempting to read a sector, has retried reading
the sector several times without success, and has displayed an error
message while modifying the status of the History Module, drive, or
volume, as appropriate.
These errors can be caused by media defects or by electrical transients.

Errors caused by transients can sometimes be corrected by rewriting the
sector. Errors due to media defects require that the sector or sectors that
are affected must no longer be used by the software.
Error handling The History Module error handling technics available are as follows:
technics
• An unreadable data sector on a nonredundant drive may not necessarily
cause the failure of the entire History Module, providing the History
Module with a level of fault tolerance. If an unrecoverable data error is
encountered in a specific file, the volume containing the file has its
status set to DEGRADED. See subsection 5.3.8. If the error affects the
whole volume, for example, a directory error, the volume has its status
set to CORRUPTED. If the volume with the error is critical, the function
associated with that volume is stopped, but operation of other functions
can continue.
• On-line sector initialization/reassignment is available for redundant
drives through an SMCC function. This permits the repair of a drive
with media defects without physically disconnecting the drive or
running HVTS. The sector initialization/reassignment function is
covered in subsection 5.3.9.
• In situations where a nonrecoverable data error occurs and the History
Module software can identify the bad sector number, the software
generates a journal message and a Status Detail display message
containing this information. This information is required in the SMCC
sector initialization/reassignment function.
• It is possible to boot load from the redundant drive when an error is
encountered on the initial disk accessed.
• The Status Detail and Object Detail displays provide status information
on drives, History Module functions, and drive volumes as an important
aid to troubleshooting drive problems. These displays are discussed in
subsections 5.3.11 and 5.3.12, respectively.

5.3.7 Data Error Recovery Technics and Documentation,
Continued
Other manuals that In using the recovery methods that follow in subsections 5.3.8 and 5.3.9,
aid with recovery information in other manuals can be very helpful. Table 5.12 lists the
scenarios
manuals of interest and the information provided by the manual. The
binders in which the manuals are found are referenced at the beginning of
this publication.
Table 5.12 History Module Error Recovery Reference Manuals
Manual Information
Engineer’s Reference Contains information on saving and
restoring Continuous History, and
general information on synchronizing
redundant drives and placing the drives
on-line or off-line.
Command Processor Operation Covers utilities to copy files and
volumes, synchronize redundant drives,
and set drives on-line and off-line.
Test System Executive Contains HVTS information.
Hardware Verification Test System Contains HVTS information.
HVTS information Section 9 in this manual contains information on running individual

HVTS tests.
5.3.8 Nonredundant Drive Data Error Recovery
Drive data error when First attempt an autoboot in case the error was caused by an electronic
the sector is not transient. If the failure reoccurs in the same way, you will need to do the
known
detailed procedure. This involves scanning the drive for bad sectors,
adding the bad sectors to the Bad Sector List in the drive, initializing the
drive, and reloading all volumes.
All data will be lost All data will be lost during the initialization process. Therefore, in the
during initialization procedure you will be directed to save as much data as possible. In some
cases, much can be saved. In other cases, very little or nothing can be
accessed. It depends on the specific failure and where it is located.
Careful observation of the displays is required to obtain a list of good and
unrecovered volumes/files. Use the printer output if available.

5.3.8 Nonredundant Drive Data Error Recovery, Continued
Loading the Use the procedure in Table 5.13 to load the personality. If the HMI
personality software personality software is available on the History Module, you can do a
personality change directly, by selecting the LOAD/DUMP target on the
History Module Status display. If this is the case, skip Step 1
(it is not necessary to shut down the node to do a personality change).
Table 5.13 History Module Personality Loading Procedure
Step Action
1 Perform a node shutdown of the History Module. See the text above.
2 Load the HMI personality into the History Module.
3 Attempt to save as much data as possible using the BACKUP

function. Keep detailed records of which volumes/files were
recovered and which must be reloaded from an alternate known good
source.
4 Attempt to save Continuous History files. Keep detailed records of
which volumes/files were recovered and which were lost.
5 Load HVTS and run the SCMD test using Subtest 19. This test can
be configured to do a complete surface “Read Check” and
automatically add any bad sectors it encounters to the existing defect
list (Bad Sector List). A short period (approximately 10 minutes) of
running Subtest 14 will certify the read/write capability of the drive.
Additional tests should be run if there is any doubt concerning the
drive’s functionality.
An alternate method of drive recovery would be to completely
reformat the drive using Subtest 21 of the SCMD test under HVTS.
This test must be configured to add bad sectors (HVTS refers to
these as defective blocks) to the existing defect list (Bad Sector List).
Never run this test configured to clear the Bad Sector List.
This HVTS testing could reveal that the drive is defective and must
be replaced.
6 Load the HMI personality and perform a drive initialization.
7 Restore to the History Module, the data saved in Steps 3 and 4.
8 Load additional volumes/files from alternate sources noted in Step 3.

History data that could not be saved as noted in Step 4 remains lost.
9 Load the HMO personality by performing a History Module autoboot.
10 Enable the saving of Continuous History data and any other normal
functions required to restore complete system operation.

ATTENTION ATTENTION—In some cases, it may be desirable to quickly replace the

drive to save the time needed for the HVTS tests. HVTS testing will take
approximately 1 hour if no additional problems are discovered.
Replacement drives come preformatted and require only a History Module
initialization and data restore operation.
The removed drive can be tested/reclaimed using HVTS at a more

convenient time, or on alternate equipment.
Drive data error when The circumstances will dictate the urgency in restoring the complete
the sector is known functionality of the History Module. The best maintenance strategy to use
will depend on the nature of the failure and the criticality of the lost
functionality. The alternatives that are available, listed in probable order
of increasing time to perform, are as follows:
1. Continue running with reduced functionality and repair the drive when
more convenient. This may not be practical if the functionality that
was lost due to the error is critical to the process.
2. Attempt a quick fix by using the SMCC Sector
Initialization/Reassignment function. Refer to subsection 5.3.13. There
are two variations that can occur.
The nature of the error is such that initialization and total reload of the
drive is not required. After using the SMCC Sector
Initialization/Reassignment function, reload the bad file from backup and
resume operation.
The nature of the error is such that the drive must be initialized and
reloaded. Save as much data as possible, use the SMCC
Initialize/Reassign Sector function, initialize the drive, reload the entire
drive, and resume operation.
3. Remove and replace the drive, initialize the new drive, and restore all
data.
4. Use HVTS off-line and attempt to recover the drive.
5. If a quick fix procedure is to be used, you must determine whether or
not drive initialization and full reload will be required. The drive must
be initialized and fully reloaded if one of the following situations is
true.
The status of the affected volume is CORRUPTED on the Volume Status
display. Refer to subsection 5.3.12.
The bad file is in one of the following volumes:
Maintenance System software
Journals
Continuous History data (except CM files, assuming backup copy)
Checkpoint files

Two quick fix Two quick fix procedures are available. They are described below. If one
procedures of the above situations is true, you must use the procedure that
incorporates initialization and reload of the disk.
If the status of the affected volume is DEGRADED on the Volume Status

display and the file is not in one of the volumes indicated above, you can
use the procedure that does not incorporate initialization and reloading the
drive.

Quick fix procedure When drive initialization and reloading are not required, use the procedure in
when drive Table 5.14. If the HMI personality software is available in the History
initialization and
reload are not
Module, you can do a personality change directly using the LOAD/DUMP
required target on the History Module Status display. If this is the case, skip Step 1.
It is not necessary to shut down the node to do a personality change.
Table 5.14 Data Error Recovery Procedure – Init/Reload Not Required
Step Action
1 Perform a node shutdown of the History Module. See above text.
2 Load the History Module Initialization (HMI) personality software.
3 Initialize the bad sector using the SMCC function. This writes zeros
into the bad sector.
4 Using utility commands, reload the known bad file from a known good
source. This could be from a previously saved copy or some original
source of the file. If the file in error was a checkpoint file, a complete
set of files from a previous “good” checkpoint must be reloaded.
Checkpoint files must be in synchronization with each other.
5 Using utility commands, verify that the file in question can be read
successfully by copying it from the HM to some scratch media. If this
is successful, the quick repair is complete. Continue with Step 9.
6 If steps 4-5 were not successful, a bad spot exists on the drive
media. Use the SMCC feature to reassign the known bad sector to
the Bad Sector List. Each drive has many spare sectors.
Reassigning a bad sector to the Bad Sector List uses one of the
available spare sectors. The sectors added to the Bad Sector List will
be lost forever.
7 Using utility commands, reload the known bad file from a known good
source again. This should repair the degraded file.
8 Using utility commands, verify that the file in question can now be
read successfully.
9 Load the History Module Operating (HMO) personality software by
performing a History Module autoboot.
10 Initiate the collection of history data, if needed.
11 Restart the function that was aborted when the History Module failure
was detected.
ATTENTION ATTENTION—If you use the Sector Reassignment function, be aware that it
does have one undesirable feature. Some of the sectors that contain the
original file will be lost from the Sector Allocation tables. These lost sectors
cannot be reclaimed until an initialization of the complete drive is
accomplished. This will necessitate a complete save, initialization, and
reload operation. Fortunately, it can be scheduled as a planned activity.

Quick fix procedure Use the procedure in Table 5.15 when drive initialization and reload are
when drive required. If the HMI personality software is available in the History
initialization and
reload are required
Module, you can do a personality change directly using the LOAD/DUMP
target on the History Module Status display. If this is the case, skip Step
1. It is not necessary to shut down the node to do a personality change.
Table 5.15 Data Error Recovery Procedure – Init/Reload Required
Step Action
1 Perform a node shutdown of the History Module. See the above text.
2 Load the History Module Initialization (HMI) personality software.
3 Attempt to save as much History Module data as possible using the

BACKUP function. Keep detailed records of which volumes/files
were recovered and which must be reloaded from an alternate known
good source.
4 Attempt to save Continuous History files. Keep detailed records of
which volumes/files were recovered and which were lost.
5 Reassign the bad sector using the SMCC function.
Initialization of the sector can be attempted in place of reassignment
of the sector. However, a marginal sector can initialize properly and
then become as a problem later. The recovery process for active file
problems requires too much time to implement at this point.
6 Initialize the drive.
7 Restore the data saved in Steps 3 and 4 to the History Module.

Procedures for restoring Continuous History data are provided in the
Customer Release Guide.
8 Load additional volumes/files from alternate sources, noted in Step 3.
History Module data that was not saved, noted in Step 4, remains
lost.
9 Load the HMO personality by performing a History Module autoboot.
10 Enable the saving of Continuous History Data and any other normal
functions required to restore complete system operation.
ATTENTION ATTENTION—If you use the Sector Reassignment function, be aware

that it does have one undesirable feature. Some of the sectors that stored
the original file will be lost from the Sector Allocation tables. These lost
sectors cannot be reclaimed until an initialization of the complete drive is
accomplished. This will necessitate a complete save, initialization, and
reload operation. Fortunately, it can be scheduled as a planned activity.

5.3.9 Redundant Drive Data Error Recovery
Redundant drive data This failure could be a drive’s electronic failure or it could be a sector-
error recovery when related problem where the software is unable to identify the sector address.
the sector is not
known
In either case, an exact diagnosis is not possible without shutting down the
History Module and running the HVTS off-line tests. One attempt to
“synch” the drive should be made in case the error was transient in nature.
If this is successful, the problem is resolved. If not, HVTS is required or
the drive must be replaced. The drive can be replaced while the History
Module continues full operation using the redundant (backup) drive.
Replacing the defective drive while its redundant partner is in full

operation is accomplished using the procedure in Table 5.16. Use extreme
care to prevent the accidental shutdown of the working drive(s).
Table 5.16 Redundant Drive Data Error Recovery Procedure –
Sector Not Known
Step Action
1 Use utility command OFF to set the suspected drive off-line.
2 If the History Module has redundant dual drives (4 drives), use the
utility command OFF to set all volumes on both Disk drives in the
same Winchester Drive Tray off-line.
3 Remove power from the tray that contains the defective drive.
4 Replace the defective drive using the procedures provided in this

manual, Sections 4 and 5. Pay particular attention to the drive’s
jumper block selections and whether termination modules should be
installed (front drive only).
5 Reapply power to the tray containing the replaced drive.
6 Use the utility command SYNCH to data synchronize the drive(s) that
is presently in the off-line state. One SYNCH command will data
synchronize both redundant drives, if present.

5.3.9 Redundant Drive Data Error Recovery, Continued
Reclaiming a It is possible that a defective redundant drive containing a media defect

defective redundant can be reclaimed by running the off-line HVTS using Subtest 19 in the
drive with off-line
HVTS
SCMD test. This test can be configured to do a complete surface “READ
CHECK” and automatically add any bad sectors (called “defective blocks”
by HVTS) that the test encounters to the existing Bad Sector List (called
“Defect Data List” by HVTS).
A short period of running Subtest 14 will certify the read/write capability

of the drive.
A “sync” operation is required to place the drive on-line once the node
autoboots with the History Module Operating (HMO) personality
software.
The History Module must be taken off-line to run the HVTS procedure.
This can be done at a convenient time, or the drive can be removed and
placed in a less critical History Module to perform the HVTS recovery
attempt.
Alternate method of During the following procedure, the History Module remains fully
drive recovery operational, running with the redundant (backup) drive.
An alternate method
of drive recovery
would be to Data errors are most frequently caused by a defective spot on the drive
completely reformat media. However, an electrical transient can give the very same symptom.
the drive using This procedure recommends first attempting an initialization of the
Subtest 21 of the suspect sector (writing zeros) and reloading the affected data through a
SCMD test under
“SYNCH” operation. If this does not correct the problem, perform the
HVTS. This test must
be configured to add Sector Reassignment function using the procedure in Table 5.17.
bad sectors to the
existing Bad Sector
List. drive data error
recovery when the
sector is known
Table 5.17 Redundant Drive Data Error Recovery Procedure –
Sector Known
Step Action
1 Initialize the bad sector (write zeros) using the SMCC Sector
Initialization/Reassignment function covered in subsection 5.3.13. If
an error occurs, use the Sector Reassignment option of the SMCC
Sector Initialization/Reassignment function.
2 Use the utility command SYNCH to synchronize the data on the
problem drive with the working redundant partner.

5.3.9 Redundant Drive Data Error Recovery, Continued
Synchronization A “SYNCH” operation copies the data resident on the working (primary)
operation drive to the drive that is being synchronized. Only the necessary volumes
and files are copied. The final result provides a functional on-line
redundant drive with identical data as the primary drive.
System demands on the History Module will affect the total time for
synchronization. The “SYNCH” operation can take up to 45 minutes. Any
system activity which alters the contents of the working drive during the
“SYNCH” operation will also be passed on to the drive being synchronized.
The successful conclusion of the synchronization operation places the
synchronized drive on-line with its working redundant partner.
If the sector problem If the problem with the sector in question returns, it must be assumed that
returns there is a bad spot on the disk surface which must be avoided. Repeat the
procedure described, but instead of initializing the sector in Step 1,
reassign the sector to the Bad Sector List using the SMCC Sector
Initialization/Reassignment function. With the Type II drives the sectors
are re-assigned automatically.

5.3.10 Control Track Error Recovery for Sectors 1-31
Overview The following procedures address Control Track recovery for sectors
1 through 31 on the History Module. Both redundant and nonredundant
drives are covered in the procedures.
Redundant drive 5 or Use the recovery procedure in Table 5.18 for an error condition in sectors
3 has a Control Track 1 through 31 of the Control Track on drive 5 or 3.
error
Table 5.18 Drive 5 or 3 Control Track Error Recovery Procedure –
Redundant Drives
Step Action
1 For a Control Track error on drive 5 or 3, place its redundant partner,
drive 4 or 2, respectively, OFFLINE by using the appropriate
Universal Station display.
2 Initialize or reassign the sector containing the error.
3 If sectors 1 through 7 on the drive have been initialized or reassigned,

rewrite the Boot record on the drive.
4 Autoboot the History Module twice by cycling power to the History
Module. Wait for an OK status between the first and second
autoboot.
5 Synchronize drive 4 or 2 with drive 5 or 3, respectively.
Redundant drive 4 or Use the recovery procedure in Table 5.19 for an error condition in sectors
2 has a Control Track 1 through 31 of the Control Track on drive 4 or 2.
error
Redundant Drives
Step Action
1 For a Control Track error on drive 4 or 2, place the drive OFFLINE by
using the appropriate Universal Station display.
3 Synchronize drive 4 or 2 with drive 5 or 3, respectively.

5.3.10 Control Track Error Recovery for Sectors 1-31, Continued
Nonredundant drive 5 Use the recovery procedure in Table 5.20 for an error condition in sectors
or 3 has a Control 1 through 31 of the Control Track on drive 5 or 3.
Track error
Nonredundant Drives
Step Action
1 Load the HMI personality into the History Module.
3 If sectors 1 through 7 of drive 5 have been initialized or reassigned,

rewrite the Boot record on the drive.
4 Autoboot the History Module twice by cycling power to the History
Module. Wait for an OK status between the first and second
autoboot.

5.3.11 Status Detail Display
Accessing the Status The Status Detail display for a History Module shows the status for each
Detail display drive and each function, such as Continuous History, History Journals, and
other displays. It also contains a target that provides access to the drive’s
Volume Status display (Object Detail display). See Figure 5.3.
Figure 5.3 Status Detail Display
7877
Status Detail display Use the procedure in Table 5.21 to access the Status Detail Display.
access procedure
Table 5.21 Accessing the Status Detail Display Procedure
Step Action
1 Choose the System Status display on the console with the SYSTEM
STATUS key.
2 Select the HISTORY MODULES target on the System Status display.
This produces the History Modules display.
3 Select the desired History Module on the History Modules display.
4 Select the STATUS DETAIL target. This provides the Status Detail
display for the selected History Module as shown in Figure 5.3.

5.3.11 Status Detail Display, Continued
Status Detail display For any status indication other than “OK,” one of the following error
status messages will be displayed.
SYNCHRONIZE SOURCE ERROR - SECTOR xxxxxxx

SYNCHRONIZE DESTIN ERR. - SECTOR xxxxxxx
NON RECOV ERR, 1 CTL TRK - SECTOR xxxxxxx
NON RECOV VVID ERROR - SECTOR xxxxxxx - volm>filename.ex
NON RECOV VVAT ERROR - SECTOR xxxxxxx - volm>filename.ex
NON RECOV FAB ERROR - SECTOR xxxxxxx - volm>filename.ex
NON RECOV SAT ERROR - SECTOR xxxxxxx - volm>filename.ex
NON RECOV PDB ERROR - SECTOR xxxxxxx - volm>filename.ex
RECOV DISK DATA ERROR - SECTOR xxxxxxx - volm>filename.ex
NON RECOV DATA ERROR - SECTOR xxxxxxx - volm>filename.ex
ERROR WITH BOTH CTL TRKS - SECTOR xxxxxxx
NON RECOV DEVICE ERROR - SECTOR xxxxxxx - volm>filename.ex
DISK CONTROLLER ERROR
Refer to the Messages Directory manual for assistance in interpreting the

message.

5.3.12 Volume Status Display
Volume Status display The Volume Status display is a two-page Object Detail display that shows
the status of all the volumes of each drive in the History Module. This
information is important when troubleshooting and repairing drive
problems.
Volume Status display Use the procedure in Table 5.22 to access the Volume Status displays.
access procedure
Table 5.22 Volume Status Display Access Procedure
Step Action
1 Choose any NOTIFICATION line on the Status Detail display, as
illustrated in Figure 5.4, and the VIEW OBJECT DETAIL target will
appear at the bottom of the screen.
2 Select the VIEW OBJECT DETAIL target. The Volume Status
display will appear as shown in Figures 5.5 and 5.6. This is a two-
page display that presents the status of each of the four possible
drives and the status of the volumes stored on each drive.
Figure 5.4 Status Detail Display (Drive Selected)
7878

5.3.12 Volume Status Display, Continued
Volume Status display The Volume Status displays are illustrated in Figures 5.5 and 5.6.
illustrations
Figure 5.5 Volume Status Display (Page 1)
7879
Figure 5.6 Volume Status Display (Page 2)
7880

5.3.12 Volume Status Display, Continued
Volume Status display The status on the Volume Status display that is of interest to the
status troubleshooting process are listed in Table 5.23.
Table 5.23 Volume Status Display Status
Status Explanation
OK The normal error free status.
DEGRADED An error in a file, but other files in the

volume are accessible.
CORRUPTED The entire volume is inaccessible.
Possibly an error in the directory.
SYN_IP Synchronization is in process,
synchronizing a drive with its
redundant partner so that both have
identical data.
NOT INITIALIZED The volume has been created but has
not been synchronized. It has been
placed off-line. Performing a
synchronization will place the volume
on-line. This state will be seen on
drives 04 and 03 after the HMI
personality has been run.

5.3.13 Sector Initialization/Reassignment Procedure for Type
I Drives
Overview The Sector Initialization/Reassignment procedure is useful when a

nonrecoverable data error has occurred and the sector number has been
reported. The sector number can be obtained from the Real Time Journal
(RTJ), a System Status Journal error message, or from a Status Detail
message as detailed in subsection 5.3.11.
RTJ nonrecoverable An example of a nonrecoverable error message in the RTJ is shown

error message below:
13:40:36 NODE 11 INFORM DISK_DRIVE 5

(OK --> WARNING) :NON RECOV DATA ERROR
-SECTOR 00049408 -!201>BB000000.CM
The error message provides information that can be helpful in

troubleshooting. Interpreting the message provides the following
information:
• The drive number5

• The bad sector number 00049408
• The volume name !201
• The file name BB000000.CM
The drive number and the bad sector number are required in the Sector
Initialization/Reassignment procedure that follows.
Initialize/reassign Use the procedure in Table 5.24 to perform the sector initialization or
sector procedure reassignment function. Refer also to Figures 5.7 through 5.10.
DEGRADED or The History Module status must be DEGRADED or CORRUPTED to perform an

CORRUPTED status on-line Sector Initialization/Reassignment procedure. A WARNING status is
not acceptable because it may be the result of a data error while trying to
read a bad sector.
Off-line procedure If the Initialization/Reassignment procedure is not successful on-line, try

loading the History Module with the off-line Initialization personality
(HMI) and performing the Initialization/Reassignment procedure.
Autoboot the History Module and do a SYNCH operation.

5.3.13 Sector Initialization/Reassignment Procedure, Continued
Procedure
Table 5.24 Initialize/Reassign Sector Procedure
Step Action
1 Choose the Engineering Personality Main Menu. See Figure 5.7.
2 Select the SMCC/MAINTENANCE target. This produces the SMCC

Main Menu as illustrated in Figure 5.8.
3 On the SMCC Main Menu display, as illustrated in Figure 5.8, select
the SECTOR INIT/REASSIGN target. This will cause the Sector
Initialization/Reassignment display to appear. See Figure 5.9.
4 Enter the information requested.
Module Number This is the node number of the History Module with
the defective drive.
Drive Number From the RTJ, System Status Journal, or Status
Detail display.
Sector Number From the RTJ, or System Status Journal, or Status
Detail display.
I or R Enter I to initialize, or R to reassign the sector.
5 After you have entered the information, press the ENTER key. This
produces the verification screen shown in Figure 5.10. It is the same
as the previous screen except that it asks you to verify that the data
entered is correct and provides two additional targets, YES and NO.
6 After you have verified that the data is correct, select the YES target.
Output status The system will output one of the following three status messages on the
messages Status Detail display.
• DISK yy SECTOR zzzzzz HAS BEEN INITIALIZED
• DISK yy SECTOR zzzzzz HAS BEEN REASSIGNED, DATA RECOVERED
• DISK yy SECTOR zzzzzz HAS BEEN REASSIGNED, DATA NOT
RECOVERED
If the message indicates that the data was recovered, you do not have to
reload the file that contained the error.
If the error “DEVICE IN USE – ACCESS DENIED (14)” occurs, do the
following.
1. Set the suspect drive OFFLINE and if dual drives exist on the same
drive tray, set the other drive OFFLINE also.
2. Cycle the power to the drive tray.
3. Repeat Steps 1 through 6 in Table 5.24.
4. Perform a SYNCH command to restore all drives to service.

Engineering The Engineering Personality Main Menu display is illustrated in Figure

Personality Main 5.7.
Menu display
Figure 5.7 Engineering Personality Main Menu Display
27 Jul 91 06:28:06 2
ENGINEERING PERSONALITY MAIN MENU

UNIT NAMES HIWAY GATEWAY PICTURE EDITOR
AREA NAMES LOGIC BLOCKS FREE FORMAT LOGS
CONSOLE NAMES APPLICATION MODULE BUTTON CONFIGURATION
LCN NODES COMPUTING MODULE HM HISTORY GROUPS
SYSTEM WIDE VALUES NETWORK INTERFACE
MODULE
VOLUME CONFIGURATION
DOCUMENTATION TOOL
BUILDER COMMANDS AREA DATA BASE
Support Functions and Utility Functions
COMMAND
SYSTEM MENU SYSTEM STATUS CONSOLE STATUS
PROCESSOR
SUPPORT SMCC/
UTILITIES MAINTENANCE R400 (C) Honeywell Inc., 1984
6134
SMCC Main Menu The SMCC Main Menu display is illustrated in Figure 5.8.
display
Figure 5.8 SMCC Main Menu Display
14 Jul 91 12:55:29
SMCC MAIN MENU
MODULE MEMORY HIWAY BOX MEMORY PROBE FAILED MODULE
SYSTEM MAINT JOURNAL ACTIVE MAINT JOURNAL MODULE ERROR
REV/CONFIG STATUS SECTOR INIT./REASSIGN MAIN MENU
For Information On Funtions And Options Displayed On this Menu,

Position The Cursor On the Desired Target And Press HELP.
6135

Sector Initialization/ The Sector Initialization/Reassignment Menu display is illustrated in

Reassignment Menu Figure 5.9.
display
Figure 5.9 Sector Initialization/Reassignment Menu Display
23 Jul 91 21:15:47 1
SECTOR INITIALIZATION/REASSIGNMENT
Enter PARAMETERS -
ENTER Module Number : (1 To 96)

ENTER Drive Number : (0 To 7)
ENTER Sector Number : (1 To 99999999)
ENTER Sector Initialize/Sector Reassign : (I or R)
WARNING - Use of Function Will Permanently Reassign Sector on the Requested HM.
This Should Only Be Used After receipt of a System Message Requesting
Action Be Taken Against a Specific HM Drive.
For Information On Functions And Options Displayed On This Menu,

Position The Cursor On The Desired Target And Press HELP.
6138
Sector Initialization/ The Sector Initialization/Reassignment Menu (Verification) display is

Reassignment Menu illustrated in Figure 5.10.
(Verification)
Figure 5.10 Sector Initialization/Reassignment Menu (Verification)
Display
23 Jul 91 21:15:47 1
SECTOR INITIALIZATION/REASSIGNMENT
Enter PARAMETERS -
ENTER Module Number : 43 (1 To 96)
ENTER Drive Number : 5 (0 To 7)

ENTER Sector Number : 99999999 (1 To 99999999)
ENTER Sector Initialize/Sector Reassign : I (I or R)
VERIFY THAT THE DATA ENTERED IS CORRECT? YES NO
WARNING - Use of Function Will Permanently Reassign Sector on the Requested HM.
This Should Only Be Used After receipt of a System Message Requesting
Action Be Taken Against a Specific HM Drive.
For Information On Functions And Options Displayed On This Menu,

Position The Cursor On The Desired Target And Press HELP.
6139

Section 6 – WREN Type History Module Disassembly
6.1 Overview

Topic See Page
6.1 Overview 119

6.2 Electronics Module Disassembly 120
6.3 Nonredundant Winchester Drive Module Disassembly 121
6.3.1 Fan Assembly Removal 122
6.3.2 Slide Tray Assembly Removal 122
6.3.3 Power Supply/Disk Drive Removal 123
6.4 Redundant Winchester Drive Module Disassembly 124
6.4.2 Slide Tray Assembly Removal 125
6.4.3 Power Supply/Disk Drive Removal 126
CAUTION CAUTION—Risk of electric shock
Purpose This section describes disassembly of the major components of the History
Module, including removal of the electronics boards, Winchester disk
drive(s), power supply, fan assembly, and disconnection of the module
cabling.
WARNING WARNING—Do not attempt any disassembly or repair the History

Module without first conducting orderly testing and troubleshooting
procedures. Return to Section 4 if you do not have a clear understanding
of which part in the History Module has failed.
YOU MUST OBTAIN OPERATOR PERMISSION BEFORE

PLACING THE HISTORY MODULE OFF-LINE FOR TESTING.
Before disassembly Disassemble the major components of the History Module only to the
extent necessary to repair or replace a defective part.
For a nonredundant drive system, always use the Universal Station to

select the failed node from the History Module Status display and perform
a SHUTDOWN command.
For a redundant drive system, place the drive(s) off-line in the Winchester
Drive Module to be repaired.
Allow at least a 30-second drive spin-down time before attempting to

remove a Winchester Drive tray. If a drive is jarred while its disks are
spinning, there is “head crash” potential.

Before proceeding Before proceeding:

IF the failure is in… SHUT DOWN, then go to
…
The electronics module with a failure of the fan Subsection 6.2
assembly, the power supply, or on a circuit
board.
A Winchester Drive Module with a failure of the Subsection 6.3
fan assembly, the power supply, or in one of the
drives (WREN III, 210 MB, 445 MB, 875 MB, or
1.8 GB). The drive is not configured as a
redundant disk drive.
IF the failure is in… DO NOT SHUT DOWN,

but go to …
A Winchester Drive Module that is part of a Subsection 6.4
redundant drive History Module. The failure is in
the fan assembly, the power supply, or a disk
drive in one of the modules.
Now go to the appropriate subsection for disassembly instructions.
6.2 Electronics Module Disassembly
Overview Refer to the Five/Ten-Slot Module Service or Dual Node Service manual
for the applicable disassembly procedure. To protect equipment from
voltage transients and ensure reliable operation, always remove power
from the History Module before removing or replacing circuit boards, or
any other component in the electronics module.
CAUTION CAUTION—Many of the assemblies used in this module are likely to

contain electrostatically sensitive devices. Use a personnel grounding strap
and grounded work surfaces/equipment. Store and transport parts only on
electrostatically safe containers.

6.3 Nonredundant Winchester Drive Module Disassembly
Overview Use these instructions in this subsection to remove the fan assembly and
the slide tray assembly in the Winchester Drive Module(s) that is a
component of a nonredundant drive History Module. The slide tray
assembly contains a drive power supply assembly and disk drive(s), and
can be disassembled. Go to the specific instructions in subsection 6.4 if
you are disassembling a Winchester Drive Module for a redundant drive
History Module.
Component Disassemble the module only to the extent necessary to repair or replace a
references defective part. The item numbers referenced in this section are keyed to
ballooned numbers in Figure 6-1. The item numbers are also referenced in
Section 7, WREN Type History Module Assembly, and Section 10, Spare
Parts.
Figure 6-1 Winchester Drive Module Exploded View
7
3
1
5
4
6347
Preliminary Remove the front cover by turning the two quarter-turn fasteners and
disassembly freeing the cover tabs from the chassis slots. Place the power switch on
the power supply (4) in the OFF position and note that the indicator on the
power supply extinguishes.

6.3.1 Fan Assembly Removal
Procedure Remove the fan assembly (3) by turning the two fasteners and sliding the
assembly out of the chassis.
The individual fans are not a replaceable item, so the complete assembly
must be replaced at the Optimum Replaceable Unit (ORU) level.
6.3.2 Slide Tray Assembly Removal
No shipping locks The WREN III, 210 MB, 445 MB, 875 MB, and 1.8 GB drives have no
shipping locks. They automatically lock when power is removed and
unlock when power is applied to the drive.
Disassembly Referencing Figure 6-1, use the following procedure to disassemble the
procedure slide tray assembly.
1. Release the cable clamp(s) that holds the SCSI bus ribbon cable to the
inside surface of the module chassis or the tray assembly.
2. Disconnect the AC power cord (2) from the power supply and the fan
assembly cable (3) from its mating connector in front of the power
supply on the slide tray assembly. Loosen the bale-headed fasteners
on the tray assembly and pull the tray assembly out of the module
chassis about 7.5 centimeters (3 inches). Use extreme care not to
damage ribbon cables on a sharp edge of the tray assembly or the
module chassis.
Remove the connectors from the disk drive (5) on the tray assembly.
Note the dress of the ribbon cable(s) and the position of the ribbon
cable connectors where they enter the drive. In particular, note the
orientation of the stripe on the ribbon cable(s).
The single SCSI bus ribbon cable for the WREN III, 210 MB,
445 MB, 875 MB, or 1.8 GB drive routes over the tray assembly
between the drive and the fan assembly. The cable for WREN III
drives is slipped under the edge of the drive(s), or clamped to the tray
assembly for 210 MB, 445 MB, 875 MB, or 1.8 GB drive to prevent it
from interfering with the rotating fan blades.
3. Once all the ribbon cables have been disconnected, you can fully
remove the tray assembly from the module chassis and place it on a
work surface for further disassembly.

6.3.3 Power Supply/Disk Drive Removal
Disassembly Referencing Figure 6-1, use the following procedures to disassemble the
procedure power supply and/or disk drives.
1. If replacing the power supply assembly (4), tag and remove the wires
connected to the power supply’s terminal board (6). Detach the power
supply from the tray assembly by removing four screws, lock washers,
and flat washers from beneath the tray assembly.
2. If replacing a disk drive (5), pay particular attention to the position of
the jumpers and the presence or absence of a bus terminator module
(WREN III) or bus termination resistor modules (210 MB or 445 MB)
on the drive. These subjects are covered in detail in Section 7.
3. Disconnect the drive’s power cable. Detach the drive by removing
four screws, lock washers, and flat washers from beneath the tray
assembly.

6.4 Redundant Winchester Drive Module Disassembly
Overview If you are considering disassembling a Winchester Drive Module

containing redundant drives, you probably were informed by a History
Module Status display that a DISKPROB exists because of either a power
supply failure or a disk drive failure.
Fan failure If the fan assembly has failed, the red Fan Alarm LED is illuminated.
Check drive status Be sure you request status through the Command Processor to verify the
address of the disk that is OFFLINE, and that its redundant partner is still
OK.
General Refer to Figure 6-2 to find the physical location of the OFFLINE drive, then
disassemble that Winchester Drive Module and remove its slide tray
assembly using the procedures that follow. The item numbers referred to
in this section are keyed to ballooned numbers in Figure 6-1. The item
numbers are also used in Section 9, WREN Type History Module
Assembly, and Section 12, Spare Parts.
Figure 6-2 Redundant Drive Positioning and Address Assignments

Drive 2
Drive 4 Address = 2
Drive 4
Preliminary Remove the front cover by turning the two quarter-turn fasteners and
disassembly freeing the cover tabs from the chassis slots.
CAUTION CAUTION—DO NOT REMOVE POWER UNTIL INSTRUCTED IN THE STEPS

THAT FOLLOW.

Procedure Remove the fan assembly (1) by turning the two bale-headed fasteners and
sliding the assembly out of the module chassis.
6.4.2 Slide Tray Assembly Removal
ATTENTION ATTENTION—If power to a drive is switched-off unexpectedly, the

software will time-out and continue.
CAUTION CAUTION—Allow at least a 30-second drive spin-down time before

attempting to remove a Winchester Drive tray. If a drive is jarred while its
disks are spinning, there is “head crash” potential.
Disassembly Referencing Figure 6-1, use the following procedure to remove the
procedure slide-out tray assembly from the Winchester Drive Module.
1. Place the Drive Power Supply switch in the 0 (OFF) position. Note
that the indicator on the drive power supply extinguishes.
2. Release the cable clamp(s) that hold the SCSI bus ribbon cable in
place inside the module chassis. Go to the back of the History Module
and release any other appropriate SCSI bus cable clamps.
3. Disconnect the SCSI bus cable connector from the failed disk drive (5)
on the tray assembly. Note the dress of the ribbon cable and the
orientation of the ribbon cable connector as it connects to the drive. In
particular, note the orientation of the red stripe on the ribbon cable. It
is to the right when facing the drive’s connector side. If there is a
second drive on the same tray assembly, disconnect its ribbon cable
also. Do not remove the SCSI bus ribbon cable connector from the
bus terminator card (8), the SPC I/O circuit board in the electronics
module, or the drive(s) in the other Winchester Drive Module, because
the redundant drive(s) is still operational.
4. Disconnect the AC power cord (2) from the power supply assembly
and the fan assembly power cable (3) from its mating connector that is
located at the front of the drive power supply on the tray assembly.
Loosen the bale-fasteners on the tray, pull it out of the module chassis,
and place it on a antistatic work surface for further disassembly.

6.4.3 Power Supply/Disk Drive Removal
Removal procedure Referencing Figure 6-1, use the following procedure to disassemble the
power supply and/or disk drive(s).
1. If replacing the power supply assembly (4), tag and remove the wires
connected to the power supply’s terminal board (6). Detach the power
supply from the tray assembly by removing four screws, lock washers,
and flat washers from beneath the tray assembly.
2. If replacing a disk drive (5), pay particular attention to the position of
the jumpers and the presence or absence of a bus terminator module
(WREN III) or termination resistor modules (210 MB or 455 MB) on
the drive. These subjects are fully covered in Section 7.
3. Disconnect the drive’s power cable. Detach the drive by removing
four screws, lock washers, and flat washers from beneath the tray
assembly.

Section 7 – WDA Type I History Module Disassembly
7.1 Overview

Topic See Page
7.1 Overview 127

7.2 History Module Disassembly 128
7.2.1 General Disassembly 129
7.2.3 Power Supply Removal 130
7.2.4 Circuit Board Removal 131
7.2.5 Winchester Disk Assembly Removal 132
7.3 Winchester Drive Tray Disassembly 133
7.3.1 Winchester Disk Drive Removal 136
Module, including removal of the electronics boards, Winchester Disk
Assembly, Winchester disk drive(s), power supply, fan assembly, and
disconnection of the module cabling.
CAUTION CAUTION—Do not attempt any disassembly or repair the History



a SHUTDOWN command.
For a redundant drive system, place the drive(s) off-line on the Winchester
Drive Tray to be removed.


…
The electronics and auxiliary components with a Subsection 7.2
failure in the fan assembly, the power supply, or
in a circuit board.
The Winchester Disk Assembly with a failure of a Subsection 7.3
drive, and the History Module is not configured
for redundancy because only the right-hand
Winchester Drive Tray exists.

but go to …
drive, and the History Module is configured for
redundancy because both Winchester Drive
Trays have one or two drives.
7.2 History Module Disassembly
Overview Refer to the Five/Ten-Slot Module Service manual for any additional
disassembly procedure assistance. To protect the equipment from voltage
transients and ensure reliable operation, always place the power supply
ON/OFF switch in the OFF position before removing or replacing the
circuit boards, power supply, fan assembly, cables, or the Winchester Disk
Assembly. One or both Winchester Drive Trays can be removed while
power is applied to the History Module because each has a power ON/OFF
switch.
Always follow proper ESD (Electrostatic Discharge) procedures when

handling circuit boards or other electronic components.

7.2.1 General Disassembly

Preliminary Disassemble the module only to the extent necessary to repair or replace a
defective assembly or part. The item numbers referenced in this section
are keyed to ballooned numbers in Figure 7-1. These item numbers are
also used in Section 8, WDA Type History Module Assembly and Section
10, Spare Parts. Figure 3-1 is another view of the History Module
assembly.
Remove the front panel (1) by turning the two quarter-turn fasteners at the
right side of the panel and swinging the panel outward until free from the
chassis slots. Place the power switch on the power supply (2) in the OFF
position and verify that all indicators on the power supply are
extinguished.
Figure 7-1 WDA History Module Exploded View
12 10
4
9
6 8
11
2
3
6761

contain electrostatically sensitive devices. Use a personnel grounding
strap and grounded work surfaces/equipment. Store and transport parts
only on electrostatically safe containers.

Removal procedure Remove the fan assembly (3) by turning the two fasteners and sliding the
7.2.3 Power Supply Removal
Removal procedure Release the power supply (2) by simultaneously pulling outward on the
extractor levers located on each side of the assembly. Slide the power
supply out of the History Module chassis after it has been released from its
backpanel connectors.
The circuit board in the power supply is not a replaceable item, so the
complete assembly must be replaced if the board has failed.

7.2.4 Circuit Board Removal
Cable removal Disconnect those cables necessary for the removal of the associated circuit
board assembly. Three I/O circuit board assemblies have cables connected
to them, the SPCII I/O (SPC2), WDI I/O (WDI), and LCN I/O
(CLCN A/B).
SCSI bus ribbon The SPCII I/O (SPC2) circuit board (8) and the WDI I/O (WDI) circuit
cables board (9), located in slots 2 and 5, respectively, at the rear of the History
Module chassis, are interconnected by two SCSI bus ribbon cables (10).
The friction-fit connections are released by pulling outward on the
individual connectors. Do not pull on the ribbon cable itself.
LCN coax cables The Local Control Network (LCN) trunk cables, A and B, connect to the
LCN I/O (CLCN A/B) circuit board (7) in slot 1 at the rear of the History
Module chassis by coaxial T-connectors. Do not disconnect the cables
from the T-connectors. Disconnect only the T-connectors from the board
connectors. Removal of an LCN trunk cable connector from its T-
connector interrupts the continuity of the network. Note where cables A
and B connect. They are color-coded yellow (A) and green (B). Do not
cross the cable connections.
K2LCN or K4LCN and The K2LCN (11) or K4LCN (11) and SPC (12) circuit boards are removed
SPC circuit boards by simultaneously pulling outward on the board extractors located on each
side of the board and sliding the board out of the History Module chassis.
I/O circuit boards The I/O circuit boards, LCN I/O [CLCN A/B] (7) and SPCII I/O [SPC2]
(8), and the WDI I/O [WDI] (9), are located at the rear of the History
Module chassis in the module’s I/O card cage. They are assigned to slots
1, 2, and 5, respectively. The circuit boards are removed by
simultaneously pulling outward on the board extractors located on each
side of the board and sliding the board out of the I/O card cage.

7.2.5 Winchester Disk Assembly Removal
Description The Winchester Disk Assembly (4) is composed of a chassis and two
Winchester Drive Trays, right-hand and optional left-hand, that reside in
the chassis. The trays are interchangeable assemblies, but must be
properly configured for their application in the History Module. Each tray
is held in place by an extractor lever and by the friction of the tray’s
mating connectors. The trays are removed from the assembly by pulling
outward on their extractor lever and sliding the tray out of the chassis.
WDA removal The Winchester Disk Assembly is removed from the History Module
chassis by first removing two fasteners that are located towards the front
of each side of the chassis. The Winchester Disk Assembly connectors
mate with backpanel connectors in the slot 5 position, but are guided into
position by the guide rails normally used for a circuit board in the slot 4
position. The friction of the backpanel connectors tends to hold the
assembly in place.
Assembly removal is initiated by first removing the fan assembly to gain

access to the right side fastener. Both assembly fasteners are then
removed, and the assembly is then pulled forward by grasping the metal
partition dividing the tray compartments and sliding the assembly out of
the History Module chassis along slot 4’s guide rails.
WDI circuit board Besides the Winchester Drive Trays, the Winchester Disk Assembly also
replacement contains the Winchester Drive Interface (WDI ) circuit board which is held
in place by five Phillips-head screws, located at the corners and the
forward center of the board, and available through access holes at the top
of the assembly chassis.
There is a spacer used with each fastener. The spacers are very important
when mounting the circuit board, because without the spacers the circuit
board will not mate properly with its backpanel connectors. Since it is
very difficult to install the WDI circuit board using spacers, it is
recommended that the circuit board not be replaced in the field. Instead,
the Winchester Disk Assembly should be replaced if it is suspected that
the circuit board has failed. The WDI circuit board cannot be ordered as a
spare part.

7.3 Winchester Drive Tray Disassembly
Overview These instructions cover the disassembly of the right-hand or left-hand

Winchester Drive Tray and the removal of the Winchester disk drive(s)
mounted on the tray. In a nonredundant History Module configuration, the
left-hand Winchester Drive Tray will not be present. A Winchester Drive
Tray can contain one (single drive) or two (dual) drives.
General You are probably removing a Winchester Drive Tray and replacing a drive
because you were informed by the History Module Status display that a
DISKPROB exists. If you have redundant drives, be sure you request status
from the Command Processor to verify the address of the failed drive,
which is OFFLINE, and that its redundant partner is operational. Be sure
both drives of a dual redundant configuration are OFFLINE.

7.3 Winchester Drive Tray Disassembly, Continued
Before beginning Before beginning disassembly, consider whether or not the History
disassembly Module has redundant drives. If the module does not contain redundant
drives, power can be removed from the drive(s) mounted on the right-hand
Winchester Drive Tray, at the power supply or the tray by placing their
respective power ON/OFF switch in the OFF position. Should the History
Module contain redundant drives, then remove power only at the
Winchester Drive Tray that contains the defective drive.
Disassemble the Winchester Drive Tray only to the extent necessary to

replace a defective part. The item numbers used in this subsection are
keyed to ballooned numbers in Figures 7-2 and 7-3.
Figure 7-2 Single-Drive Winchester Drive Tray Exploded View
7
4
1 3
8
6 6769
Figure 7-3 Dual-Drive Winchester Drive Tray Exploded View

7
2 4
1 3
8 6
6768

CAUTION CAUTION—The drive(s) mounted on the tray is an electrostatically sensitive

device. Use a grounding strap and grounded work surfaces/equipment. Store
and transport parts only in electrostatically safe containers.
Winchester Drive Tray The Winchester Drive Tray contains the following components:
description
• One or two Winchester disk drives (1 and 2). A single-drive tray
contains one drive, and a dual-drive tray contains two drives.
• A printed flex-circuit (3) that interconnects the drive(s) with the tray
connector (4) that interfaces to the WDI circuit board in the
Winchester Disk Assembly. The printed flex-circuit provides the
SCSI bus interface to the drive(s).
• A connector hold-back bracket (5) prevents damage to the printed flex-

circuit when only the front drive is mounted on the tray. The bracket
is installed to rigidly hold the unused connector in place. It is held in
place by two phillips-head screws using holes intended for mounting
the rear drive. The connector attaches to the bracket with two screws.
• A power ON/OFF switch (6) to control power from the power supply to
the drive(s) and SCSI bus terminators on the WDI circuit board in the
Winchester Disk Assembly. When power is removed from the tray,
SCSI bus terminators are activated on the WDI circuit board in
anticipation of the loss of the bus terminators installed on a
Winchester disk drive on the tray that is about to be removed. The
terminators are installed on the drive that is mounted at the front of the
tray.
• A tray power connector (7) that interfaces to the WDI circuit board in
the Winchester Disk Assembly and provides +5 Vdc, +12 Vdc, and
ground return to the drive(s) from the power supply.
• An extractor lever (8) used to lock the tray in place in the Winchester
Disk Assembly and assist in extracting the tray when it is in place.
A single-drive configuration has a single drive (1) mounted at the front of

the tray, while the dual-drive configuration has drives mounted at both the
front and the rear of the tray.
CAUTION CAUTION—When power is removed from a Winchester Drive Tray, the

tray must be removed from the Winchester Disk Assembly as soon as
possible because the SCSI bus terminators on the WDI circuit board in the
Winchester Disk Assembly are electronically activated, which places them
in parallel with the bus terminators installed on the drive. Intermittent
errors could occur.

7.3.1 Winchester Disk Drive Removal
General When replacing a Winchester disk drive, it is important that you duplicate
all jumper block pinning on the drive. Of particular interest is the SCSI
bus address (device) and terminator pinning. The replacement drive must
be pinned identically.
If a 210 MB or 445 MB drive is being replaced, notice whether or not

SCSI bus termination modules are installed on the bottom of the drive. A
210 MB or 445 MB drive mounted at the front of the tray must have three
bus termination modules installed. A 210 MB or 445 MB drive mounted
at the rear of the tray must not have termination modules installed.
The drive has a self-locking protective mechanism that is activated when

power is removed from the drive. However, the drive must be handled
with great care.
CAUTION CAUTION—Do not attempt to remove a drive’s mating connectors until

the screws attaching the drive to the Winchester Drive Tray have been
removed.
To avoid excessive stress and possible damage to the SCSI printed

flex-circuit, keep the tray and the drive together as an assembly until the
drive’s mating connectors are removed.
Drive removal Gently place the tray in an inverted position prior to removal of the drive.
Loosen and remove the three Phillips-head screws on the bottom portion
of the tray that attach the drive to the tray. Holding the drive in place on
the tray, place the tray in an upright position.
The power and SCSI printed flex-circuit connectors are friction-mated

with their respective connectors on the drive.
Separate the drive’s SCSI connector from its mating printed flex-circuit
SCSI connector by gently prying them apart using a small screwdriver or
similar tool. The drive must be moved away from the printed flex-circuit
SCSI connector to prevent damage to the printed flex-circuit. Do not
attempt to move the printed flex-circuit SCSI connector away from the
drive’s connector.
Separate the power connector from its mating drive power connector. Do
not pull on the power cable itself, but on the connector only. You can now
remove the drive from the tray.
If two drives are being replaced, follow the same procedure for removal of
the second drive.

7.3.1 Winchester Disk Drive Removal, Continued
210 megabyte drive Figure 7-4 is an illustration of the 210 megabyte Winchester hard-disk
jumper blocks drive, showing the locations of the various jumper blocks. All of the
jumper blocks should be checked for proper positioning of the jumpers,
based upon the drive’s mounting location on a tray.
The Options and Parity/Remote Start jumper blocks have fixed jumper
positions for all drive mounting positions. Three of the jumper blocks
must be altered, if necessary, to accommodate the mounting location of
the drive on either a right-hand or left-hand tray, front or rear position.
These are the Active/Passive Termination, Terminator Power, and SCSI
Drive Address jumper blocks.
Table 7-1 and Figure 7-4 illustrate the proper positioning of the jumpers
on each jumper block for the drive’s mounting position.
Table 7-1 210 Megabyte Drive SCSI Device Address Selection
Device Tray SCSI Device Address Jumper Position
Location
Left-Hand Rear 2 3 to 4
Right-Hand Rear 3 3 to 4, and 5 to 6
Left-Hand Front 4 1 to 2
Right-Hand Front 5* 1 to 2 and 5 to 6
* Replacement drives are shipped from the factory pinned for a SCSI device address of 5.

210 megabyte drive The locations of the jumper blocks on the drive are illustrated in Figure 7-
jumper block 4. Only the Active/Passive Termination, Terminator Power, and SCSI
locations
Drive Address jumper blocks should be altered. SCSI drive addresses of
2, 3, 4, and 5 are the only valid addresses.
Figure 7-4 210 Megabyte Drive Jumper Block Selections (Bottom View)
Options Jumper Block
(None Selected for Drives 2-5)
13 11 9 7 5 3 1
PWB
Parity/Remote Start PWB 14 12 10 8 6 4 2 SCSI Drive Address

Jumper Block Jumper Block PWB
3 1 2 4 6
Ground
Ground See
Drives
Table
2-5 1 3 5 Signal
4 2
Signal
Pin 1
Terminating
Resistor Modules
(Pin 1)
Active/Passive
I/O Connector
Termination Jumper Block
5 3 1 PWB
Drives
4 and 5
6 4 2
DC Power Connector
5 3 1 Terminator Power (Drives 2-5)
Drives Jumper Block
2 and 3 1 2 3 4 PWB
3 1 PWB
6 4 2
Drives
(No Jumpers) 4 and 5 + 5 Vdc
4 2 + 5 Volts Return
+ 12 Volts Return
3 1
+ 12 Vdc
Drives
2 and 3
4 2 6763

210 megabyte drive Three SCSI bus termination modules must be installed at the bottom of
SCSI bus termination any Winchester disk drive that is mounted at the front position of the
resistor modules
Winchester Drive Tray. A drive mounted at the rear position on a tray
never has termination resistor modules installed. The location and
orientation of the modules is illustrated in Figure 7-5. Be sure that the
module orientation is correct. The dot on the module that identifies pin 1
and/or the part number must be visible. A square pad on the drive’s
printed circuit board locates pin 1. It is possible to reverse the orientation
of the modules.
The modules provide end termination for the SCSI bus when the
Winchester Drive Tray is present. With the tray removed, resistor
terminators on the Winchester Drive Interface (WDI) circuit board in the
Winchester Dive Assembly provide the bus termination.
Figure 7-5 Bottom View of 210 MB Drive with SCSI Bus Terminators
Pin 1 Dot or
Part Number
on Top Side
Square Pad on PWB

Indicates Pin 1
6762

The Options jumper block is not used for all drive mounting positions.
There should be no jumpers installed on the jumper block. Two jumper
blocks must be altered, if necessary, to accommodate the mounting
location of the drive on either a right-hand or left-hand tray, front or rear
position. These are the Active/Passive Termination and SCSI Drive
Address jumper blocks.
Location
Left-Hand Rear 2 2
Right-Hand Rear 3 1 and 2
Left-Hand Front 4 3
Right-Hand Front 5* 1 and 3

jumper block 6. Only the Active/Passive Termination and SCSI Drive Address jumper
locations
blocks should be altered. SCSI drive addresses of 2, 3, 4, and 5 are the
only valid addresses.

(Not Used – No Jumpers)
PWB
Drive
Bottom
1 2 3 4 5 6
SCSI Drive Address
Jumper Block
J1 (See Table)
Drive
Bottom
PWB 3 2 1
SCSI BusTermination
Resistor Modules
(Pin 1)
J1
Active/Passive
PWB (Drives 4 and 5)
DC Power Connector I/O Connector (J1)

PWB
1 2 3 4 5 6 7 8 1 2 3 4
Active/Passive + 5 Vdc
Termination Jumper Block + 5 Volts Return
PWB (Drives 2 and 3) + 12 Volts Return
+ 12 Vdc
1 2 3 4 5 6 7 8
12824

resistor modules
orientation of the modules is shown in Figure 7-7. Be sure that the
and/or the part number must be visible. It is possible to reverse the
orientation of the modules.
Pin 1 Dot or
Part Number on
Top
12492

ATTENTION ATTENTION—Your History Module will contain one of two types of

875 megabyte drives. They are easily identified by their appearance and
the Honeywell part number (51196680-100 or 51196680-200) on the
drive. Be sure that you use the pinning procedure that matches the drive.
875 MB drive jumper Figure 7-8 is an illustration of the 875 megabyte Winchester drive,
blocks (51196680-100) 51196680-100, showing the locations of the three jumper blocks. The
The SCSI Address/Remote (J6) jumper block is not used in any drive
mounting positions. There should be no jumpers installed on the jumper
block. Two jumper blocks must be altered, if necessary, to accommodate
the mounting location of the drive on either a right-hand or left-hand tray,
front or rear position. These are the Option Select (J2) and SCSI Address
(J5) jumper blocks.
Table 7-3 875 MB Drive (51196680-100) SCSI Bus Address Selection
Location
Left-Hand Rear 2 2
Left-Hand Front 4 3

875 megabyte drive The locations of the jumper blocks on the 875 megabyte drive
jumper block (51196680-100) are illustrated in Figure 7-8. Only the Options Select (J2)
locations
(51196680-100)
and SCSI Address (J5) jumper blocks should be altered. SCSI drive
addresses of 2, 3, 4, and 5 are the only valid addresses.
Figure 7-8 875 Megabyte Drive (51196680-100) Jumper Block Selections (Bottom View)
SCSI Address/Remote Jumper Block

J6
PWB
SCSI Drive Address
Jumper Block
Drive (See Address Selection Table)
Bottom 1 2 3 4 5 6
J1 J5
Drive
PWB 3 2 1 Bottom
J1
Option Select Jumper Block

(Drives 4 and 5)
PWB
J2
PWB
1 2 3 4 5 6 7 8 1 2 3 4
Option Select Jumper Block + 5 Vdc

(Drives 2 and 3) + 5 Volts Return
PWB +12 Volts Return
J2
+12 Vdc
1 2 3 4 5 6 7 8 16762

875 megabyte drive Unlike the 210 and 445 megabyte drives, the 875 megabyte drive,
(51196680-100) 51196680-100, does not accommodate external SCSI bus termination
SCSI bus termination
modules on the bottom of the drive. Bus terminators are permanently
located on the drive’s PWB and activated by jumpers on the Option Select
(J2) jumper block as illustrated in Figure 7-8.
The SCSI bus terminators must be enabled on any drive that is mounted in
the front position of the Winchester Drive Tray. A drive mounted in the
rear position on a tray must never have its bus terminators enabled.

875 MB drive Figure 7-9 is an illustration of the 875 megabyte Winchester drive,
(51196680-200) jumper 51196680-200, showing the locations of the two jumper blocks. The
blocks
The two jumper blocks must be altered, if necessary, to accommodate the

mounting location of the drive on either a right-hand or left-hand tray,
front or rear position. These are the Option (J2) and SCSI Bus Address
(J6) jumper blocks.
Drive Tray Location SCSI Bus Address Jumper Position
Left-Hand Rear 2 A1
Right-Hand Rear 3 A0 and A1
Left-Hand Front 4 A2
Right-Hand Front 5* A0 and A2

(51196680-200) jumper 9. The Options (J2) and SCSI Address (J5) jumper blocks should be
block locations
altered if necessary. SCSI drive addresses of 2, 3, 4, and 5 are the only
valid addresses.
SCSI Bus Address Jumper Block Option Jumper Block

(See Address Selection Table) (Drives 4 and 5) PWB
TE DS ME WP PD SS TP TP
A0 A1 A2
J6 J2
Drive
Bottom PWB Option Jumper Block
(Drives 2 and 3) PWB
J2
SCSI BusTermination
Resistor Modules
(Pin 1)
Address Selection Table

DC Power I/O Connector
Drive A2 A1 A0 Connector (J1)
PWB
2
1 2 3 4
3
+ 5 Vdc
4 + 5 Volts Return
+12 Volts Return
5 +12 Vdc
16725-B

located on the drive’s PWB and activated by jumpers on the Option (J2)
jumper block as illustrated in Figure 7-9.

1.8 gigabyte drive Figure 7-10 is an illustration of the 1.8 gigabyte Winchester hard-disk
(J5) jumper blocks.
Table 7-5 1.8 Gigabyte Drive SCSI Device Address Selection
Location
Left-Hand Rear 2 2
Left-Hand Front 4 3

1.8 gigabyte drive The locations of the jumper blocks on the drive are illustrated in
jumper block Figure 7-10. Only the Options Select (J2) and SCSI Address (J6) jumper
locations
Figure 7-10 1.8 Gigabyte Drive Jumper Block Selections (Bottom View)

A2 A1 A0
J6 J2
Drive
J2
SCSI BusTermination
Resistor Modules
(Pin 1)

Drive A2 A1 A0
Connector (J1)
PWB
2
1 2 3 4
3
+ 5 Vdc
4 + 5 Volts Return
+12 Volts Return
5 +12 Vdc
16725-A

1.8 gigabyte drive Unlike the 210 megabyte and 445 megabyte drives, the 1.8 gigabyte drive
SCSI bus termination does not accommodate external SCSI bus termination modules on the
bottom of the drive. Bus terminators are permanently located on the
drive’s PWB and activated by jumpers on the Option Select (J2) jumper
block as illustrated in Figure 7-10.

Section 8 – WDA History Module with Dual Logical Drive Tray
Disassembly
8.1 Overview

Topic See Page
8.1 Overview 153

8.2 History Module Disassembly 154
8.2.1 General Disassembly 155
8.2.3 Power Supply Removal 156
8.2.4 Circuit Board Removal 157
8.2.5 Winchester Disk Assembly Removal 158
8.3 Winchester Drive Tray Disassembly 159
8.3.1 Winchester Disk Drive Removal 162
Module, including removal of the electronics boards, Winchester Disk
Assembly, Winchester disk drive(s), power supply, fan assembly, and
disconnection of the module cabling.
CAUTION CAUTION—Do not attempt any disassembly or repair the History



a SHUTDOWN command.
For a redundant drive system, place the drive(s) off-line on the Winchester
Drive Tray to be removed.


…
The electronics and auxiliary components with a Subsection 8.2
failure in the fan assembly, the power supply, or
in a circuit board.
drive, and the History Module is not configured
for redundancy because only the right-hand
Winchester Drive Tray exists.

but go to …
drive, and the History Module is configured for
redundancy because both Winchester Drive
Trays have one or two drives.
8.2 History Module Disassembly
Overview Refer to the Five/Ten-Slot Module Service manual for any additional
disassembly procedure assistance. To protect the equipment from voltage
transients and ensure reliable operation, always place the power supply
ON/OFF switch in the OFF position before removing or replacing the
circuit boards, power supply, fan assembly, cables, or the Winchester Disk
Assembly. One or both Winchester Drive Trays can be removed while
power is applied to the History Module because each has a power ON/OFF
switch.
Always follow proper ESD (Electrostatic Discharge) procedures when

handling circuit boards or other electronic components.

8.2.1 General Disassembly

Preliminary Disassemble the module only to the extent necessary to repair or replace a
defective assembly or part. The item numbers referenced in this section
are keyed to ballooned numbers in Figure 8-1. These item numbers are
also used in Section 10, WDA Type History Module Assembly and Section
12, Spare Parts. Figure 3-1 is another view of the History Module
assembly.
Remove the front panel (1) by turning the two quarter-turn fasteners at the
right side of the panel and swinging the panel outward until free from the
chassis slots. Place the power switch on the power supply (2) in the OFF
position and verify that all indicators on the power supply are
extinguished.
12 10
4
9
6 8
11
2
3
6761

contain electrostatically sensitive devices. Use a personnel grounding
strap and grounded work surfaces/equipment. Store and transport parts
only on electrostatically safe containers.

Removal procedure Remove the fan assembly (3) by turning the two fasteners and sliding the
8.2.3 Power Supply Removal
Removal procedure Release the power supply (2) by simultaneously pulling outward on the
extractor levers located on each side of the assembly. Slide the power
supply out of the History Module chassis after it has been released from its
The circuit board in the power supply is not a replaceable item, so the
complete assembly must be replaced if the board has failed.

8.2.4 Circuit Board Removal
Cable removal Disconnect those cables necessary for the removal of the associated circuit
board assembly. Three I/O circuit board assemblies have cables connected
to them, the SPCII I/O (SPC2), WDI I/O (WDI), and LCN I/O
(CLCN A/B).
SCSI bus ribbon The SPCII I/O (SPC2) circuit board (8) and the WDI I/O (WDI) circuit
cables board (9), located in slots 2 and 5, respectively, at the rear of the History
Module chassis, are interconnected by two SCSI bus ribbon cables (10).
The friction-fit connections are released by pulling outward on the
individual connectors. Do not pull on the ribbon cable itself.
LCN coax cables The Local Control Network (LCN) trunk cables, A and B, connect to the
LCN I/O (CLCN A/B) circuit board (7) in slot 1 at the rear of the History
Module chassis by coaxial T-connectors. Do not disconnect the cables
from the T-connectors. Disconnect only the T-connectors from the board
connectors. Removal of an LCN trunk cable connector from its T-
connector interrupts the continuity of the network. Note where cables A
and B connect. They are color-coded yellow (A) and green (B). Do not
cross the cable connections.
K2LCN or K4LCN and The K2LCN (11) or K4LCN (11) and SPC (12) circuit boards are removed
SPC circuit boards by simultaneously pulling outward on the board extractors located on each
side of the board and sliding the board out of the History Module chassis.
I/O circuit boards The I/O circuit boards, LCN I/O [CLCN A/B] (7) and SPCII I/O [SPC2]
(8), and the WDI I/O [WDI] (9), are located at the rear of the History
Module chassis in the module’s I/O card cage. They are assigned to slots
1, 2, and 5, respectively. The circuit boards are removed by
simultaneously pulling outward on the board extractors located on each
side of the board and sliding the board out of the I/O card cage.

8.2.5 Winchester Disk Assembly Removal
Description The Winchester Disk Assembly (4) is composed of a chassis and two
Winchester Drive Trays, right-hand and optional left-hand, that reside in
the chassis. The trays are interchangeable assemblies, but must be
properly configured for their application in the History Module. Each tray
is held in place by an extractor lever and by the friction of the tray’s
mating connectors. The trays are removed from the assembly by pulling
outward on their extractor lever and sliding the tray out of the chassis.
WDA removal The Winchester Disk Assembly is removed from the History Module
chassis by first removing two fasteners that are located towards the front
of each side of the chassis. The Winchester Disk Assembly connectors
mate with backpanel connectors in the slot 5 position, but are guided into
position by the guide rails normally used for a circuit board in the slot 4
position. The friction of the backpanel connectors tends to hold the
assembly in place.
Assembly removal is initiated by first removing the fan assembly to gain

access to the right side fastener. Both assembly fasteners are then
removed, and the assembly is then pulled forward by grasping the metal
partition dividing the tray compartments and sliding the assembly out of
the History Module chassis along slot 4’s guide rails.
WDI circuit board Besides the Winchester Drive Trays, the Winchester Disk Assembly also
replacement contains the Winchester Drive Interface (WDI ) circuit board which is held
in place by five Phillips-head screws, located at the corners and the
forward center of the board, and available through access holes at the top
of the assembly chassis.
There is a spacer used with each fastener. The spacers are very important
when mounting the circuit board, because without the spacers the circuit
board will not mate properly with its backpanel connectors. Since it is
very difficult to install the WDI circuit board using spacers, it is
the circuit board has failed. The WDI circuit board cannot be ordered as a
spare part.

8.3 Winchester Drive Tray Disassembly
Overview These instructions cover the disassembly of the right-hand or left-hand

Winchester Drive Tray and the removal of the Winchester disk drive(s)
mounted on the tray. In a nonredundant History Module configuration, the
left-hand Winchester Drive Tray will not be present. A Winchester Drive
Tray can contain one (single drive) or two (dual) drives.
General You are probably removing a Winchester Drive Tray and replacing a drive
because you were informed by the History Module Status display that a
DISKPROB exists. If you have redundant drives, be sure you request status
from the Command Processor to verify the address of the failed drive,
which is OFFLINE, and that its redundant partner is operational. Be sure
both drives of a dual redundant configuration are OFFLINE.

Before beginning Before beginning disassembly, consider whether or not the History
disassembly Module has redundant drives. If the module does not contain redundant
drives, power can be removed from the drive(s) mounted on the right-hand
Winchester Drive Tray, at the power supply or the tray by placing their
respective power ON/OFF switch in the OFF position. Should the History
Module contain redundant drives, then remove power only at the
Winchester Drive Tray that contains the defective drive.
Disassemble the Winchester Drive Tray only to the extent necessary to

replace a defective part. The item numbers used in this subsection are
keyed to ballooned numbers in Figures 8-2 and 8-3.

CAUTION CAUTION—The drive(s) mounted on the tray is an electrostatically sensitive

device. Use a grounding strap and grounded work surfaces/equipment. Store
and transport parts only in electrostatically safe containers.
Winchester Drive Tray The Winchester Drive Tray contains the following components:
description
• One Winchester ST39175LW disk drive.
• A ribbon cab le (3) that interconnects the drive(1) with the tray
connector (4) that interfaces to the WDI circuit board in the
Winchester Disk Assembly. The ribbon cable provides the SCSI bus
interface to the drive(s).
Winchester disk drive on the tray that is about to be removed. The
terminators are installed on the drive that is mounted at the front of the
tray.
• An extractor lever (8) used to lock the tray in place in the Winchester
Disk Assembly and assist in extracting the tray when it is in place.
Termination The SCSI cable is terminated by a termination model attached to the drive
end of the SCSI interface cable.
CAUTION CAUTION—When power is removed from a Winchester Drive Tray, the

tray must be removed from the Winchester Disk Assembly as soon as
possible because the SCSI bus terminators on the WDI circuit board in the
Winchester Disk Assembly are electronically activated, which places them
in parallel with the bus terminators installed on the drive. Intermittent
errors could occur.

8.3.1 Winchester Disk Drive Removal
General When replacing a Winchester disk drive, it is important that you duplicate
bus address (device) and terminator pinning. The replacement drive must
be pinned identically.

with great care.
Drive removal Gently place the tray in an inverted position prior to removal of the drive.
Loosen and remove the three Phillips-head screws on the bottom portion
of the tray that attach the drive to the tray. Holding the drive in place on
the tray, place the tray in an upright position.
The power and SCSI printed flex-circuit connectors are friction-mated

with their respective connectors on the drive.
Separate the drive’s SCSI connector from ribbon cable SCSI connector by
gently prying them apart using a small screwdriver or similar tool. The
drive must be moved away from the printed flex-circuit SCSI connector to
prevent damage to the printed flex-circuit. Do not attempt to move the
printed flex-circuit SCSI connector away from the drive’s connector.
Separate the power connector from its mating drive power connector. Do
not pull on the power cable itself, but on the connector only. You can now
remove the drive from the tray.

Section 9 – WREN Type History Module Assembly
9.1 Overview

Topic See Page
9.1 Overview 163

9.2 Electronics Module Assembly 164
9.3 Winchester Drive Module Assembly 165
9.3.1 Fan Replacement 166
9.3.2 Power Supply Replacement 166
9.3.3 Disk Drive Replacement 166
9.3.4 Slide Tray Assembly 170
9.4 Nonredundant WREN III Drive Installation 171
9.4.1 Smart Peripheral Controller (SPC) and SPC I/O Boards 171
9.4.2 Single/Dual WREN III Drive Pinning 172
9.4.3 Single/Dual WREN III Drive Cabling 174
9.5 Nonredundant 210/445/875 MB and 1.8 GB Drive Installation 177
9.5.1 Smart Peripheral Controller (SPC) and SPC I/O Boards 178
9.5.2 Single/Dual 210 MB Drive Pinning 179
9.5.5 Single/Dual 1.8 GB Drive Pinning 195
9.5.6 Single/Dual 210/445/875 MB or 1.8 GB Drive Cabling 199
9.6 Redundant WREN III Drive Installation 204
9.6.1 Single Drive Installation 205
9.6.1.1 Single WREN III Drive Pinning 205
9.6.1.2 Single WREN III Drive Cabling 207
9.6.2 Dual Drive Installation 211
9.6.2.1 Dual WREN III Drive Pinning 211
9.6.2.2 Dual WREN III Drive Cabling 213
9.7 Redundant 210/445/875 MB or 1.8 GB Drive Installation 215
9.7.1 Redundant Single Drive Installation 215
9.7.1.1 Single 210 MB Drive Pinning 215
9.7.1.4 Single 1.8 GB Drive Pinning 228
9.7.1.5 Single 210/445/875 MB or 1.8 GB Drive Cabling 231
9.7.2 Redundant Dual Drive Installation 234
9.7.2.1 Dual 210 MB Drive Pinning 234
9.7.2.4 Dual 1.8 GB Drive Pinning 249
9.7.2.5 Dual 210/445/875 MB or 1.8 GB Drive Cabling 253
Purpose This section describes the assembly of the History Module with major
components that includes the circuit boards, Winchester disk drive(s),
power supply, fan assembly, and the module cabling.

9.2 Electronics Module Assembly
Reference Assembly of the electronics module is described in the Five/Ten-Slot

Module Service or the Dual Node Service manual.
CAUTION CAUTION—Always follow proper ESD (Electrostatic Discharge)

procedures when handling circuit boards and other electronic components.

9.3 Winchester Drive Module Assembly
Overview The following subsections provide step-by-step instructions for the

mechanical assembly of a Winchester Drive Module containing WREN
III, 210 MB, 445 MB, 875 MB, or 1.8 GB disk drives. Choose those
instructions necessary to reassemble the parts you have disassembled in
Section 5. When specific pinning or cabling instructions for a particular
type of disk drive are required, the text will direct you to the subsection
where the specific instructions can be found.
Reference The item numbers referenced in this subsection are keyed to ballooned
numbers shown in Figure 9-1.
Figure 9-1 Winchester Drive Module Exploded View
7
3
1
5
4
6347

9.3.1 Fan Replacement
Procedure Slide the fan assembly (1) into the chassis, being careful that the connector
at the rear of the unit mates correctly, and secure the assembly with the
two bale-headed fasteners.
9.3.2 Power Supply Replacement
Procedure Use the following procedure to install the drive power supply on the tray
assembly.
1. Attach the power supply (4) to the tray assembly with four M4 x 12
mm screws, four M4 lock washers, and four M4 wide washers as
shown in the inset illustration in Figure 9-1.
2. Install the wires previously removed from the power supply’s terminal
block (6) in subsection 5.3. Reconnect the AC power cord (2).
9.3.3 Disk Drive Replacement
Drive pinning and bus Prepare the disk drive for installation by pinning, and if necessary,
termination installing a data bus terminator resistor module (WREN III drive) or
termination resistor modules (210 MB or 445 MB drives) on the
replacement drive as required. For assistance, refer to the subsection that
has installation instructions for the particular type of drive.
• See subsection 9.3 for nonredundant WREN III drive information

(pinning information is in subsection 9.3.2).
• See subsection 9.4 for nonredundant 210 MB, 445 MB, 875 MB, or 1.8
GB drive information (pinning information is in subsection 9.4.2 or
9.4.3).
• See subsection 9.5 for redundant WREN III drive information

(redundant single drive pinning information is in subsection 9.5.1,
redundant dual drive pinning information is in subsection 9.5.2).
• See subsection 9.6 for redundant 210 MB, 445 MB, 875 MB, or 1.8 GB
disk drive information (redundant single drive information is in
subsection 9.6.1, redundant dual drive information is in subsection
9.6.2).

9.3.3 Disk Drive Replacement, Continued
WREN III drive The WREN III drive requires rubber shock-mounts. If they appear
mounting nonresilient or cracked, replacement shock-mounts (Honeywell part
number 51108679-100) are recommended. Use either new mounts or
salvage the mounts from the failed drive. Attach them to the slide-out tray
assembly as illustrated in Figure 9-2.
Orient the drive as illustrated in Figure 9-1 and secure it with four #6-32 x
1 1/4 inch panhead screws, four #6 split lock washers, and four M3.5 wide
washers as illustrated in Figure 9-2. Connect the dc power cable to the
disk drive.
Figure 9-2 Assembly of Drive Shock Mount Hardware
51108679-300 51108679-200
Snub Collar Snub Washer
3.5 x 10 (2)
51108679-100
Shock Mount
51108679-200
3.5 w/Flat 3.5 w/Flat

3.5 Hex (2)
#6 Split Lock
6-32 x 1.25
2090

210/445/875 MB and The 210 MB, 445 MB, 875 MB, and 1.8 GB drive requires an adapter
1.8 GB Drive plate to mount the drive on the tray assembly. The drive is orientated with
mounting
its connectors to the right side of the tray assembly. No shock-mounts are
required.
Figure 9-3 illustrates the attachment of the adapter plate to the drive.
Three
6 - 32 1/4-inch screws are used to attach the plate.
Figure 9-4 illustrates the mounting of the drive adapter plate on the tray
assembly. Four M3.5 x 10 mm screws and four flat washers are used in
the process.
Figure 9-3 Assembly of Adapter Plate to Drive
Rear Side of Drive
(Connector Side)
Adapter Plate
11838
6 - 32 1/4 Inch Screws

Drive mounting
Figure 9-4 Mounting the 210/445/875 MB or 1.8 GB Drive
on the Tray Assembly
Self-Locking PEM Nut on Plate
Drive Adapter Plate

(51196226-100)
Original Shock Mount Hole

in Assembly
Tray Assembly
3.5 mm Flat Washer

(51108390-004)
3.5 x 10 mm Machine Screw

(51108385-410)
Notes:
1. Set the tray assembly on its side with the drive power supply at the bottom.
2. Mount the drive adapter plate using the screws and washers provided.
Ensure that no washers fall into the power supply by covering it with
a protective material. 11839

9.3.4 Slide Tray Assembly
Procedure Use the following procedure to reassemble the slide-out tray assembly.
1. Insert the slide tray assembly into the chassis until about 15
centimeters (6 inches) of the tray assembly protruding. Reconnect and
dress the ribbon cable(s) as they were originally installed and secure
them in place with the cable clamp(s) on the slide tray assembly and/or
the inside surface of the module chassis. Be sure the ribbon cable is
secured properly and will not interfere with the fan assembly’s
operation. Section 7 details the proper cable dress for the appropriate
drive configuration.
2. Carefully slide the tray assembly into the module, using special care
not to pinch the ribbon cable(s) or bind a ribbon cable between the
slide tray assembly and the back surface of the module. Secure the
tray assembly in position by locking the two quarter-turn fasteners at
the front of the tray assembly.
Secure the ribbon cable with the cable clamp(s) exterior to the module
chassis. If you have released the ribbon cable from the clamp at the
top of the I/O card cage, dress the cable and secure it with the cable
clamp(s).
3. Reconnect the power supply’s ac power cord (2) to the power supply
assembly. Connect the fan assembly’s power cable to its mating
connector that is located on the tray assembly at the front of the power
supply.
4. Insert the front cover’s tabs into the slots in the chassis and secure the
front cover with the two quarter-turn fasteners.
You can now refer to the History Module startup instructions in Section 9.
If you have replaced a redundant drive, be sure to synchronize the drives
as instructed in subsection 9.4.

9.4 Nonredundant WREN III Drive Installation
Overview Use the supplementary information provided in this subsection when

installing a nonredundant WREN III drive and associated components.
9.4.1 Smart Peripheral Controller (SPC) and SPC I/O Boards
SPC Pinning Check the pinning jumpers in location TS1 on the Smart Peripheral
Controller circuit board (51401052-100) and verify they are positioned as
illustrated in Figure 9-5. The revision pinning in TS2 is factory set and
must not be altered in the field.
Figure 9-5 SPC Board Address Pinning for SCSI Bus Address
Board Revision Socket

DO NOT CHANGE
ADDR REV
TS1 TS2
9 8
10 7
11 6
12 5 Program TS1 as follows:
13 4
14 3 PINS DESCRIPTION
15 2
16 1 9-8 Always Shorted
10-7 Always Shorted
11-6 Always Shorted
12-5 Always Shorted
13-4 Short = WREN III (History Module)*
14-3 Open**
15-2 Open**
16-1 Open**
* = Setting for this application

** = SCSI Address 7 for this application
51401052-100
SPC
3814
No SPC I/O pinning The SPC Input/Output (SPC I/O) circuit board (51304156-100) that
required interfaces WREN III drives has no pinning requirements.

9.4.2 Single/Dual WREN III Drive Pinning
Overview Refer to Figures 9-6 and 9-7 to determine pinning for the nonredundant
WREN III drive(s).
Single drive pinning In a nonredundant single drive configuration, a single WREN III drive is
mounted in one Winchester Drive Module. As illustrated in Figure 9-6,
the single drive is designated “Drive 5” and has a SCSI bus address of 5.
Address 5 is selected on the drive by placing Drive Select Plugs in the “2”
and “0” positions. In binary arithmetic, 22 + 20 = 4 + 1 = 5 decimal. Be
sure that a terminator resistor module is installed on the drive. Jumpers
must also be installed in the locations marked P (Parity Checking) and TP
(Termination Power).
Figure 9-6 Single WREN III Drive Configuration and Termination (Nonredundant)
Set Jumpers as
Shown for Correct
System Address Drive 5 Rear View
Single Drive
(Nonredundant)
Drive Select
Jumpers
Terminator
2,1,0 = Octal address on SCSI Bus

P = Parity Checking
TP = Termination Power
2 1 0 P TP 16763
Address 5

9.4.2 Single/Dual WREN III Drive Pinning, Continued
Dual WREN III drive In a nonredundant dual drive configuration, the two WREN III drives are
pinning housed in separate Winchester Drive Modules.
As illustrated in Figure 9-7, Drive 5 is mounted in the upper module

(module #2) and has a SCSI bus address of 5. Address 5 is selected by
placing Drive Select Plugs in the “2” and “0” positions. In binary
arithmetic, 22 + 20 = 4 + 1 = 5 decimal. Be sure that a terminator resistor
module is installed on the drive.
The second drive, Drive 3, is mounted in the lower module (module #1)
and has a SCSI bus address of 3. Address 3 is selected by placing Drive
Select Plugs in the “1” and “0” positions. In binary arithmetic,
21 + 20 = 2 + 1 = 3 decimal. Be sure that the terminator resistor module is
removed from the drive.
In the dual drive configuration, the SCSI bus cable from the SPC I/O card
connects first to Drive 3 and then to Drive 5. For this reason, no
terminator resistor module should be installed on Drive 3. The
termination must be located at the end of the SCSI bus cable on Drive 5.
Each drive must also have a jumper in the locations marked P (Parity
Checking) and TP (Termination Power).
Figure 9-7 Dual WREN III Drive Configuration and Termination (Nonredundant)
Rear View
Dual Drive 5
Drive
Drive5A (Nonredundant)
Set Jumpers as
Shown for Correct
System Address Keep Terminator
in Drive 5
Rear View
Dual Drive 3
(Nonredundant)
Drive3 A
Drive
Remove
Terminator
2 1 0 P TP from Drive 3
Address 5
Drive Select
Jumpers
2,1,0 = Octal Address on SCSI Bus

P = Parity Checking
TP = Termination Power
2 1 0 P TP 16764
Address 3

9.4.3 Single/Dual WREN III Drive Cabling
Overview The single SCSI bus ribbon cable from the SPC I/O circuit board in the
I/O card cage on the electronics module passes through a slotted hole in
the back of the Winchester Drive Module above the electronics module
and routes over the slide tray assembly to the drive. If it is a single drive
History Module, the cable ends at the drive. If it is a dual drive History
Module, the cable exits the lower Winchester Drive Module (module #1)
and then enters the upper Winchester Drive Module (module #2) where it
connects to the drive in the module.
The SCSI bus cable always connects to a WREN III drive with the red
stripe at the right side of the drive as you face the connectors on the drive.
Avoid the fan blades Use special care to prevent the ribbon cables from interfering with the
rotating fan blades in the fan assembly. The cable can be placed under the
WREN III drive to avoid the fan blades. Note that the cable is folded
under the drive so it can make a 90° turn up to the drive connector.
Single drive cabling Figures 9-8 (side view) and 9-9 (top and front view) show the cable
routing for a single WREN III drive.
The drive must have a terminator resistor module installed on it to

terminate the end of the SCSI bus cable.
Figure 9-8 SCSI Cable Routing for Single WREN III Drive
Winchester Drive Module
WREN III
SCSI Bus
Drive 5
Terminator Ribbon Cable
Resistor Module
Slide Tray Assembly
Electronics Module
SPC I/O
Connector
16765
SIDE VIEW

9.4.3 Single/Dual WREN III Drive Cabling, Continued
Single WREN III drive

SCSI cable
installation
Figure 9-9 Single WREN III Drive SCSI Cable Installation
I/O Card Cage
Red
Line
Winchester Drive 5
Top View of Chassis
Locate
Approximately
as Shown
Red
Line
Electronics Module
(Shown for Reference)

9.4.3 Single/Dual WREN III Drive Cabling, Continued
Dual drive cabling Figure 9-10 illustrates a side view of the cable routing for dual WREN III
drives. Note the cabling is similar to single drive cabling, but the cable
continues on to the upper Winchester Drive Module (module #2) that
contains the second WREN III drive. The cable is folded and routed under
the drives in the same manner that is illustrated in Figure 9-9.
Note the upper module contains Drive 5, while the lower module contains
Drive 3. The drive in the upper module must have a terminator resistor
module installed on it to terminate one end of the SCSI bus cable.
Figure 9-10 SCSI Cable Routing for Dual WREN III Drives
WREN III
Drive 5
Terminator
Resistor Module
Slide Tray Assembly
WREN III SCSI Bus Ribbon

Drive 5 Cable
Slide Tray Assembly
Electronics Module
SPC I/O
Connector
SIDE VIEW
16767

9.5 Nonredundant 210/445/875 MB and 1.8 GB Drive
Installation
Overview Use the supplementary information in this section when installing either
the 210 megabyte, 445 megabyte, 875 megabyte, or 1.8 gigabyte drive and
associated components. With the exception of drive pinning instructions,
the installation of either type of drive is identical.

9.5.1 Smart Peripheral Controller (SPC) and SPC I/O Boards
SPC pinning Check the pinning jumpers at location TS1 on the Smart Peripheral
Controller circuit board (51401052-100) and verify they are positioned as
illustrated in Figure 9-11. The revision pinning at TS2 is factory set and
must not be altered in the field.
SPC firmware revision Inspect the Smart Peripheral Controller circuit board and verify that it has
the proper firmware revision. It must be revision “G,” or a later revision.
The two firmware EPROMs are located approximately at coordinates 18F
and 18G as illustrated in Figure 9-11.
If replacement of the firmware is required, note the orientation and

location of the EPROMs 0928-101 and 0928-102 before removal. Be sure
to wear an ESD wriststrap that is properly grounded. Remove the
EPROMs and replace them with the proper revision. Change the firmware
revision at the front of the circuit board.
No SPC I/O pinning The SPC Input/Output (SPC I/O) circuit board (51304156-100) that
required interfaces the 210 MB, 445 MB, 875 MB, or 1.8 GB drive has no pinning
requirements.
Figure 9-11 SPC Board Address Pinning for SCSI Bus Address

DO NOT CHANGE
ADDR REV
TS1 TS2
9 8
10 7
11 6
12 5 Program TS1 as follows:
13 4
14 3 PINS DESCRIPTION
15 2
16 1 9-8 Always Shorted
10-7 Always Shorted
11-6 Always Shorted
12-5 Always Shorted
13-4 Short = WREN III (History Module)*
14-3 Open**
15-2 Open**
16-1 Open**

51401052-100
SPC
12544

9.5.2 Single/Dual 210 MB Drive Pinning
Overview Use Figures 9-12 and 9-14 to determine the pinning for the nonredundant
210 MB drive(s).
Single drive pinning In a nonredundant single drive configuration, a single 210 MB drive is
mounted in the front position on the tray assembly in one Winchester
Drive Module. Figure 9-12 illustrates the location and configuration of
the jumper blocks on the 210 MB drive. The drive must be configured for
a SCSI bus address of 5. Also, note the location of the jumpers on the
Active/Passive Termination, Terminator Power, and Parity/Remote Start
jumper blocks.
The SCSI Drive Address jumper block must have jumpers between pins 1
and 2, and pins 5 and 6 for correct addressing.
The Active/Passive Termination jumper block must have jumpers between

pins 2 and 4, and pins 5 and 6 because SCSI bus termination resistor
modules must be installed on the Winchester disk drive.
The Terminator Power jumper block must have jumper between pins 1
and 2 because SCSI bus termination resistor modules must be installed on
the Winchester disk drive.
The Parity/Remote Start jumper block must have a jumper between pins 1
and 2 to enable data parity checking.
Terminator resistor modules must be installed on the drive as illustrated in

Figure 9-13.

9.5.2 Single/Dual 210 MB Drive Pinning, Continued
Terminated 210 MB
Drive 5 jumper block
selections
Figure 9-12 Terminated 210 MB Drive 5 Jumper Block Selections
(Bottom View)
13 11 9 7 5 3 1
PWB
14 12 10 8 6 4 2 SCSI Drive Address

Parity/Remote Start PWB
Jumper Block PWB
Jumper Block
3 1 2 4 6
Ground Ground
Drive
Drive
5
5 1 3 5 Signal
Signal 51196220-100
4 2
Pin 1
Termination
Resistor Modules
(Pin 1)
Active/Passive
I/O Connector
5 3 1 PWB
Drive
5
6 4 2
DC Power Connector
Terminator Power
Jumper Block 1 2 3 4 PWB
3 1 PWB
Drive + 5 Vdc
5 + 5 Volts Return
+ 12 Vdc
11837

210 MB drive
terminator modules
Figure 9-13 Bottom View of 210 MB Drive with SCSI Bus Terminator
Modules Installed
Pin 1 Dot or
Part Number
on Top Side
Square Pad on PWB

Indicates Pin 1
6762

Dual drive pinning In a dual drive configuration, two 210 MB drives can be housed in
separate Winchester Drive Modules or the same module.
Drive 5 is mounted in the front position on the tray assembly in the upper
module (module #2), or the only module, and has a SCSI bus address of 5.
Figure 9-12 illustrates the location and configuration of the jumper blocks
on Drive 5. Use the single drive pinning instructions to properly configure
the drive.
Termination resistor modules must be installed on Drive 5 as illustrated in

Figure 9-13.
The second drive, Drive 3, is mounted in the front position on the tray
assembly in the lower module (module #1), if there are two modules, or
the rear position, if there is a single module, and has a SCSI bus address of
3. Also, note the location of the jumpers on the Active/Passive
Termination jumper block. Figure 9-14 illustrates the location and
configuration of the jumper blocks on Drive 3.
The SCSI Drive Address jumper block must have jumpers between pins 3
and 4, and pins 5 and 6 for correct addressing.
The Active/Passive Termination jumper block must have no jumpers

because no SCSI bus termination resistor modules should be installed on
the drive.
The Terminator Power jumper block must have a jumper between pins 2
and 4 because no SCSI bus termination resistor modules should be
installed on the Winchester disk drive.
The Parity/Remote Start jumper block must have a jumper between pins 1
and 2 to enable data parity checking.
Be sure that the terminator resistor modules are removed from Drive 3.
In the nonredundant dual drive configuration, the SCSI bus cable from the
SPC I/O circuit board connects first to Drive 3 and then to Drive 5. For
this reason, no termination resistor modules should be installed on Drive
3. They must be at the end of the SCSI bus cable on Drive 5.

Nonterminated 210
MB Drive 3 jumper
block selections
Figure 9-14 Nonterminated 210 MB Drive 3 Jumper Block Selections
(Bottom View)
13 11 9 7 5 3 1
PWB

3 1 2 4 6
Ground
Ground Drive
Drive
3
3 Signal 1 3 5 Signal
4 2 51196220-100
Pin 1
No Termination
Resistor Modules
Active/Passive
I/O Connector
5 3 1 PWB
Drive
3
6 4 2
(No Jumpers) DC Power Connector
Terminator Power
3 1 PWB
Drive + 5 Vdc
3 + 5 Volts Return
+ 12 Vdc
11843

445 MB drive(s).
Single drive pinning In a nonredundant single drive configuration, a single 445 MB drive is
the jumper blocks on the 445 MB drive. The drive must be configured for
a SCSI bus address of 5. Also, note the location of the jumpers on the
Active/Passive Termination jumper block.
The SCSI Drive Address jumper block must have jumpers in positions 1
and 3 for correct addressing.
The Active/Passive Termination jumper block must have a jumper in

position 5 to enable data parity checking, and a jumper between positions
7 and 8 because SCSI bus termination resistor modules must be installed
on the drive.
The Options jumper block should have no jumpers installed on it.
Terminator resistor modules must be installed on the drive as illustrated in

Figure 9-16.

Terminated 445 MB
selections
Figure 9-15 Terminated 445 MB Drive 5 Jumper Block Selections
(Bottom View)

PWB
Drive
Bottom
1 2 3 4 5 6
SCSI Drive Address
Jumper Block
Drive
Bottom
PWB 3 2 1
SCSI BusTermination
Resistor Modules
(Pin 1)
Active/Passive
PWB
DC Power Connector
PWB
1 2 3 4 5 6 7 8 1 2 3 4
+ 5 Vdc
+ 5 Volts Return
+12 Volts Return
+12 Vdc
12507-A

445 MB drive with

terminator modules
Figure 9-16 Bottom View of 445 MB Drive with SCSI Bus Terminator
Modules Installed
Pin 1 Dot or
Part Number on
Top
12492

Dual drive pinning In a dual drive configuration, two 445 MB drives can be housed in
the drive.
Termination resistor modules must be installed on Drive 5 as illustrated in

Figure 9-16.
3. Also, note the location of the jumpers on the Active/Passive
Termination jumper block. Figure 9-17 illustrates the location and
configuration of the jumper blocks on Drive 3.
The SCSI Drive Address jumper block must have jumpers installed in
positions 1 and 2 for correct addressing.
The Active/Passive Termination jumper block must have a jumper

installed in position 5 to enable data parity checking. No SCSI bus
termination resistor modules should be installed on the drive.
The Options jumper block should have no jumpers installed on it.
Be sure that the terminator resistor modules are removed from Drive 3.
this reason, no termination resistor modules should be installed on Drive
3. They must be at the end of the SCSI bus cable on Drive 5.

Nonterminated 445
MB Drive 3 jumper
block selections
Figure 9-17 Nonterminated 445 MB Drive 3 Jumper Block Selections
(Bottom View)

PWB
Drive
Bottom
1 2 3 4 5 6
SCSI Drive Address
Jumper Block
Drive
Bottom
PWB 3 2 1
No SCSI BusTermination
Resistor Modules
Active/Passive
PWB
DC Power Connector
PWB
1 2 3 4 5 6 7 8 1 2 3 4
+ 5 Vdc
+ 5 Volts Return
+12 Volts Return
+12 Vdc
12503-A

Overview Use Figures 9-18 through 9-21 to determine the pinning for the
nonredundant 875 MB drive(s).

Single drive In a nonredundant single drive configuration, a single 875 MB drive is

Drive Module.
875 MB Drive 5 Figure 9-18 illustrates the location and configuration of the jumper blocks
(51196680-100) on the 875 MB drive, 51196680-100. The drive must be configured for a
SCSI bus address of 5 on the SCSI Address (J5) jumper block. Also, note
the location of the jumper(s) on the Option Select (J2) jumper block.
The SCSI Address (J5) jumper block must have jumpers in positions 1 and
3 for correct addressing.
The Option Select (J2) jumper block must have a jumper in position 5 to
enable data parity checking, a jumper in position 1 to enable the SCSI bus
terminators on the drive, and a jumper between positions 7 and 8 to enable
power from the SCSI bus for the bus terminators.
The SCSI Address/Remote (J6) jumper block must have no jumpers

installed on it.

Terminated 875 MB
selections
(51196680-100)
Figure 9-18 Terminated 875 MB Drive 5 (51196680-100) Jumper Block Selections

(Bottom View)
SCSI Address/Remote Jumper Block SCSI Drive Address

(Not Used – No Jumpers) Jumper Block
J6 PWB J1 J5
Drive
3 21 Bottom
Drive PWB
Bottom 1 2 3 4 5 6
J1
DC Power Connector
PWB
J2 1 2 3 4
PWB + 5 Vdc
+ 5 Volts Return
+12 Volts Return
1 2 3 4 5 6 7 8 +12 Vdc 54020

(51196680-200) on the 875 MB drive, 51196680-200. The drive must be configured for a
SCSI bus address of 5 on the SCSI Bus Address (J6) jumper block. Also,
note the location of the jumper(s) on the Option (J2) jumper block.
The SCSI Address (J5) jumper block must have jumpers in positions A0
and A2 for correct addressing.
The Option (J2) jumper block must have a jumper in position TE to enable
the SCSI bus terminators on the drive, and a jumper between the two TP
positions to enable power from the SCSI bus for the bus terminators.
Terminated 875 MB
selections
(51196680-200)
Figure 9-19 Terminated 875 MB Drive 5 (51196680-200) Jumper Block Selections
(Bottom View)
SCSI Bus Address Jumper Block

(Drive 5)
A0 A1 A2
Option Jumper Block

J6 (Drive 5 Terminated)
PWB
Drive
Bottom PWB
J2
SCSI BusTermination
Resistor Modules
(Pin 1)
16726-B

Dual drives In a dual drive configuration, two 875 MB drives can be housed in
The first drive, Drive 5 is mounted in the front position on the tray
assembly in the upper module (module #2), or the only module, and has a
SCSI bus address of 5. Figure 9-18 or 9-19 illustrates the location and
configuration of the jumper blocks on Drive 5. Use the single drive
pinning instructions to properly configure the drive.
3.
(51196680-100) on Drive 3, 51196680-100. The drive must be configured for a SCSI bus
address of 3 on the SCSI Address (J5) jumper block. Also, note the
location of the jumper(s) on the Option Select (J2) jumper block.
The SCSI Address (J5) jumper block must have jumpers installed in
The Option Select (J2) jumper block must have a jumper installed in
position 5 to enable data parity checking.
The SCSI Address/Remote (J6) jumper block must have no jumpers

installed on it.
this reason, the SCSI bus terminators on Drive 3 must not be enabled.
Only the SCSI bus terminators on Drive 5 must be enabled.

Nonterminated 875
MB Drive 3 jumper
block selections
(51196680-100)
Figure 9-20 Nonterminated 875 MB Drive 3 (51196680-100) Jumper Block Selections
(Bottom View)

J6 PWB J1 J5
Drive
321 Bottom
Drive PWB
Bottom 1 2 3 4 5 6
J1
DC Power Connector
PWB
J2 1 2 3 4
PWB + 5 Vdc
+ 5 Volts Return
+12 Volts Return
1 2 3 4 5 6 7 8 +12 Vdc 54027
(51196680-200) on Drive 3, 51196680-200. The drive must be configured for a SCSI bus
address of 3 on the SCSI Bus Address (J6) jumper block. Also, note the
absence of the jumpers on the Option (J2) jumper block.
positions A0 and A1 for correct addressing.
The Option Select (J2) jumper block must have no jumpers installed on it.

Nonterminated 875
MB Drive 3 jumper
block selections
(51196680-200)
(Bottom View)

(Drive 3)
A0 A1 A2
Option Jumper Block

J6 (Drive 3 Nonterminated)
PWB
Drive
Bottom PWB TE DS ME WP PD SS TP TP
J2
SCSI BusTermination
Resistor Modules
(Pin 1)
16730-B

9.5.5 Single/Dual 1.8 GB Drive Pinning
1.8 GB drive(s).
Single drive pinning In a nonredundant single drive configuration, a single 1.8 GB drive is
the jumper blocks on the 1.8 GB drive. The drive must be configured for
a SCSI bus address of 5 on the SCSI Bus Address (J6) jumper block.
Also, note the location of the jumpers on the Option (J2) jumper block.
The SCSI Address (J6) jumper block must have jumpers in positions A0
and A2 for correct addressing.
The Option Select (J2) jumper block must have a jumper in position TE to
enable the SCSI bus terminators on the drive, and a jumper between the
two TP positions to enable power from the SCSI bus for the bus
terminators.

9.5.5 Single/Dual 1.8 GB Drive Pinning, Continued
Terminated 1.8 GB
selections
Figure 9-22 Terminated 1.8 GB Drive 5 Jumper Block Selections (Bottom View)

(Drive 5)
A0 A1 A2
Option Jumper Block

J6 (Drive 5 Terminated)
PWB
Drive
Bottom PWB
J2
SCSI BusTermination
Resistor Modules
(Pin 1)
16726-B

Dual drive pinning In a dual drive configuration, two 1.8 GB drives can be housed in separate
Winchester Drive Modules or the same module.
the drive.
3. Also, note the location of the jumpers on the Option Select (J2) jumper
block. Figure 9-23 illustrates the location and configuration of the jumper
blocks on Drive 3.
The Option Select (J2) jumper block must have no jumpers installed on it.

Nonterminated 1.8 GB
selections
Figure 9-23 Nonterminated 1.8 GB Drive 3 Jumper Block Selections (Bottom View)

(Drive 3)
A0 A1 A2
Option Jumper Block

PWB
Drive
J2
SCSI BusTermination
Resistor Modules
(Pin 1)
16730-B

9.5.6 Single/Dual 210/445/875 MB or 1.8 GB Drive Cabling
Overview The single SCSI bus ribbon cable from the SPC I/O circuit board in the
card cage at the rear of the electronics module, passes through a slotted
hole in the back of the Winchester Drive Module, above the electronics
module and routes over the slide tray assembly to the drive. If it is a
single drive History Module, the cable ends at the drive. If it is a dual
drive History Module, the cable exits the lower Winchester Drive Module
(module #1), then enters the upper Winchester Drive Module (module #2)
and connects to the drive in the upper module.
Ribbon cable red The SCSI bus ribbon cable must always connect to a 210 MB, 445 MB,
stripe positioning 875 MB, or 1.8 GB drive with the red stripe at the right side of the drive as
you face the connectors on the drive.
rotating fan blades in the fan assembly. The cable must be held in place
by cable clamps on the tray assembly to avoid the fan blades. Note that
the cable is folded so it can make a 90° turn up to the drive connector.
Single drive cabling Refer to Figures 9-24 (top view) and 9-25 (side view), which illustrate the
cable routing for a single drive configuration.
A 210 MB or 445 MB drive must have terminator resistor modules

installed on it to terminate the end of the SCSI bus cable. An 875 MB or
1.8 GB drive must have its internal SCSI bus terminators enabled.

9.5.6 Single/Dual 210/445/875 MB or 1.8 GB Drive Cabling,
Continued
Single drive SCSI

cable routing (top
view)
Figure 9-24 Single 210/445/875 MB or 1.8 GB Drive SCSI Cable
Routing (Top View)
Cable Clamp
Red Line
I/O Card Cage
(Electronics Chassis)
Cable Clamp
Red Line
Winchester Disk
Drive 5
Top View of History Module Drive Chassis

11841

Continued
Single drive cable

routing (side view)
Figure 9-25 Single 210/445/875 MB or 1.8 GB Drive SCSI Bus Cable Routing (Side View)
SCSI Bus
Drive 5 Ribbon Cable
Slide Tray Assembly
Electronics Module
SPC I/O
Connector
SIDE VIEW 16768

Continued
Dual drive cabling Figure 9-26 illustrates a side view of the SCSI bus cable routing for a
nonredundant dual drive configuration. Note the cabling is similar to
single drive cabling, but the cable continues on to the upper Winchester
Drive Module (module #2) that contains the second drive. The cable is
folded and clamped beside the drives on the tray assemblies in the same
manner as illustrated in Figure 9-24.
The upper Winchester Drive Module contains Drive 5, while the lower
Winchester Drive Module contains Drive 3. The drive in the upper
module has termination resistor modules installed on it to terminate the
drive end of the SCSI bus cable.
Dual Winchester Drive

Modules
Figure 9-26 Dual 210/445/875 MB or 1.8 GB Drive SCSI Cable Routing (Side View) –
Dual Modules
Drive 5
Slide Tray Assembly
SCSI Bus
Slide Tray Assembly
Electronics Module
SPC I/O
Connector
16769
SIDE VIEW

Continued
Single Winchester Figure 9-27 is an illustration of a nonredundant dual drive configuration

Drive Module when both drives are mounted in a single Winchester Drive Module.
Figure 9-27 Dual 210/445/875 MB or 1.8 GB Drive SCSI Cable Routing (Side View) –
Single Module
SCSI Bus
Drive 5 Drive 3 Ribbon Cable
Slide Tray Assembly
Electronics Module
SPC I/O
Connector
SIDE VIEW 16770

9.6 Redundant WREN III Drive Installation
Overview Use the supplemental information in this subsection when installing

WREN III drives and associated components in History Modules
configured for redundant drives. The History Module contains redundant
single or dual pairs of WREN III drives. The drives and associated
components are configured by software to accept identical write data. If
one of the drives fails, its unimpaired partner can assume operational
responsibility until the failed drive can be repaired or replaced.
Drive configurations The redundant drive configurations that are illustrated in Figure 9-28 have
a few physical characteristics that are different from the “conventional”
nonredundant configurations. The differences are presented in the
following subsections.
Figure 9-28 Redundant Drive Positioning and Address Assignments

Drive 2
Drive 4 Drive 4 Address = 2

9.6.1 Single Drive Installation
Overview The redundant single drive configuration is very similar to the dual drive
configuration. The differences are in address pinning, SCSI bus
termination, and cabling.
9.6.1.1 Single WREN III Drive Pinning
Single drive pinning In the redundant single drive configuration, each drive is housed in a
separate Winchester Drive Module.
The terminator resistor module must be removed from both drives.
As illustrated in Figures 9-29 and 9-30, Drive 5 is mounted in the front

position on the tray assembly in the upper module (module #2) and has a
SCSI bus address of 5. Address 5 is selected by placing Drive Select
Plugs in the “2” and “0” positions. In binary arithmetic, 22 + 20 = 4 + 1 =
5 decimal.
Drive 4 is mounted in the front position on the tray assembly in the lower
module (module #1) and has a SCSI bus address of 4. Address 4 is
selected by placing a Drive Select Plug in the “2” position. In binary
arithmetic, 22 = 4 decimal.
Be sure that the terminator resistor module is removed from both drives.
Bus termination is provided at the end of the SCSI bus cable by a bus
terminator card for redundant single drives.

9.6.1.1 Single WREN III Drive Pinning, Continued
Redundant single
WREN III drive
configuration
Figure 9-29 Redundant Single WREN III Drive Configuration
Set Jumpers as Shown

for Correct System
Address
2 1 0 P TP
Address 5
Drive5A
Drive
Remove Terminators
from both Drives
Rear View Single Drive

(Redundant Configuration
Is Two Physical Drives)
2 1 0 P TP
Address 4
Drive A
4
16771

9.6.1.2 Single WREN III Drive Cabling
Redundant single Figure 9-30 illustrates a side view of the cable routing for a redundant
drive SCSI bus cable single WREN III drive configuration. The single SCSI bus ribbon cable
routing
from the SPC I/O circuit board in the I/O cage in the rear of the electronics
module passes through a slotted hole in the back of the lower Winchester
Drive Module and routes over the slide tray assembly to Drive 4. The
cable then exits the lower Winchester Drive Module and enters the upper
module where it connects to Drive 5. It then connects to a bus terminator
card mounted at the top of the upper Winchester Drive Module chassis.
Figure 9-30 Redundant Single WREN III Drive SCSI Bus Cable Routing (Side View)
Bus Terminator Winchester

Assembly Drive Module #2
WREN III
Drive 5
Slide Tray Assembly
Winchester
Drive Module #1
WREN III SCSI Bus

Slide Tray Assembly
Electronics Module
SPC I/O
Connector
SIDE VIEW 16772

9.6.1.2 Single WREN III Drive Cabling, Continued
Terminator/Card The bus terminator card is illustrated in Figure 9-31.

Guide assembly
Figure 9-31 Terminator/Card Guide Assembly
51195180
Card Guide
ASSY NO. 51195178 - 100 REV A

!
C1
+ C2
RN3 1 RN2 1 RN1 1
J1
49 1
50 2
! !
Chassis
SCSI Terminator Board
Card Guides
2103
Ribbon cable red Front and top views of the modules are illustrated in Figures 9-32 and 9-
stripe positioning 33, respectively. The SCSI bus cable always connects to a WREN III
drive with the red stripe on the right side of the drive as you face the
connectors on the drive.
rotating fan blades in the fan assembly. The cables can be dressed under
the WREN III drives to avoid the fan blades. Note that the cable is folded
under the drive so it can make a 90° turn up to the drive connector as

Redundant WREN III

drive cable
installation (front
view)
Figure 9-32 Redundant Single WREN III Drive SCSI Bus Cable Installation (Front View)
51195180
Card Guide
51195178
Bus Terminator
Red
Stripe
Locate
Approximately
as Shown
Red
Line
Electronics Module
(Shown for Reference)
Front View
(Front Cover and Slide Assembly Omitted for Clarity)
2101

Redundant WREN III

drive cable
installation (top view)
Figure 9-33 Redundant Single WREN III Drive SCSI Bus Cable Installation (Top View)
Locate
Approximately
as Shown
Red
Stripe
I/O Card Cage
Red
Stripe
Winchester
Drive 5
Top View 51195180

Card Guide
51195178
Bus Terminator 16773

9.6.2 Dual Drive Installation
Overview The redundant dual drive configuration consists of pairs of WREN III
drives mounted on separate slide-out tray assemblies in separate
Winchester Drive Modules. They are configured so that one tray
assembly, which might contain a failed drive, can be removed while the
system continues to function with the redundant pair of drives on the other
tray assembly.
9.6.2.1 Dual WREN III Drive Pinning
Dual drive pinning Be sure that the terminator resistor module is removed from all drives.
As illustrated in Figures 9-34 and 9-35, Drive 5 is mounted at the front

position in the upper module (module #2) and has a SCSI bus address of
5. Address 5 is selected by placing Drive Select Plugs in the “2” and “0”
positions. In binary arithmetic, 22 + 20 = 4 + 1 = 5 decimal.
Drive 5’s redundant partner, Drive 4, is mounted at the front position in

the lower module (module #1) and has a SCSI bus address of 4. Address
4 is selected by placing a Drive Select Plug in the “2” position. In binary
arithmetic, 22 = 4 decimal.
In a similar manner, Drive 3 is mounted at the rear position in the upper

module and has a SCSI bus address of 3. Address 3 is selected by placing
Drive Select Plugs in the “1” and “0” positions. In binary arithmetic,
21 + 20 = 2 + 1 = 3 decimal.
Drive 3’s redundant partner, Drive 2, is mounted at the rear position in the
lower module and has a SCSI address of 2. Address 2 is selected by
placing a Drive Select Plug in the “1” position. In binary arithmetic,
21 = 2 decimal.
SCSI bus termination is provided at the drive end of the cable by a bus
terminator card for the redundant dual WREN III drives.

9.6.2.1 Dual WREN III Drive Pinning, Continued
Redundant dual
WREN III drive
configuration
Figure 9-34 Redundant Dual WREN III Drive Configuration
Rear View Dual Drives

Set Jumpers as
(Redundant Configuration Shown for Correct
Is Four Physical Drives)
2 1 0 P TP 2 1 0 P TP System Addresses
Address 5 Address 3
Drive
Drive 5 A Drive 3 A
Drive
Remove Terminators
from All 4 Drives
2 1 0 P TP 2 1 0 P TP
Address 4 Address 2
Drive
Drive
4 A Drive
Drive 2 A
16774

9.6.2.2 Dual WREN III Drive Cabling
Dual drive cabling Figure 9-35 illustrates a side view of the cable routing for redundant dual
WREN III drives. The single SCSI bus ribbon cable from the SPC I/O
circuit card in the I/O card cage at the rear of the electronics module
passes through a slotted hole in the back of the lower Winchester Drive
Module and routes over the slide-out tray assembly to Drive 4, then back
to Drive 2. The cable exits the lower Winchester Drive Module and enters
the upper Winchester Drive Module where it connects to Drive 5, then to
Drive 3. Finally, it connects to a bus terminator card that is mounted at
the top of the upper Winchester Drive Module chassis. The bus
terminator card is illustrated in Figure 9-31.
Ribbon cable red A top view of the Winchester Drive Modules is illustrated in Figure 9-36.
stripe positioning The SCSI bus ribbon cable always connects to a WREN III drive with the
red stripe on the right side of the drive as you face the connectors on the
drive.
Avoid the fan blades Use special care to prevent the ribbon cable from interfering with the
rotating fan blades in the fan assembly. The cable can be dressed under
the WREN III drives to avoid the fan blades. As illustrated in Figure 9-36,
the cable is also folded under the drive so it can make a 90° turn up to the
drive connector.

9.6.2.2 Dual WREN III Drive Cabling, Continued
Redundant dual
WREN III drive SCSI
bus cable routing
Figure 9-35 Redundant Dual WREN III Drive SCSI Bus Cable Routing (Side View)
Bus Terminator Assembly Winchester

Drive Module #2
WREN III WREN III

Drive 5 Drive 3
Slide Tray Assembly
Winchester
Drive Module #1
WREN III WREN III

Drive 4 Drive 2
SCSI Bus
Ribbon Cable
Slide Tray Assembly
Electronics Module
SPC I/O
Connector
16775
SIDE VIEW

9.6.2.2 Dual WREN III Drive Cabling, Continued
Redundant dual
WREN III drive SCSI
bus cable installation
Figure 9-36 Redundant Dual WREN III Drive SCSI Cable Installation (Top View)
Locate
Approximately
as Shown
Red
I/O Card
Stripe
Cage
Red Winchester
Stripe Drive 3 or 2
Winchester
Drive 5 or 4
Top View 51195180

Card Guide
51195178
Bus Terminator 16759

9.7 Redundant 210/445/875 MB or 1.8 GB Drive Installation
Overview Information in this section can be used as an aid when installing the
210 MB, 445 MB, 875 MB, or 1.8 GB drive and associated components in
History Modules configured for redundant drives. The History Module
contains redundant single or dual pairs of drives. The drives and
associated components are configured by software to accept identical write
data. If one of the drives fails, its unimpaired partner can assume
operational responsibility until the failed drive can be repaired or replaced.
The redundant drive configurations that are illustrated in Figure 9-37 have
a few physical characteristics that are different from the “conventional”
nonredundant configurations. The differences are presented in the
following subsections.
Figure 9-37 Redundant 210/445/875 or 1.8 GB Drive Positioning
and Address Assignments

Drive 2
Drive 4 Address = 2
Drive 4
9.7.1 Redundant Single Drive Installation
9.7.1.1 Single 210 MB Drive Pinning
Overview Redundant single drive configuration is similar in appearance to the

nonredundant dual drive configuration. The differences are in address
pinning, SCSI bus termination, and cabling.

9.7.1.1 Single 210 MB Drive Pinning, Continued
Single 210 MB drive Each drive is housed in a separate Winchester Drive Module. The
pinning configuration of a History Module with redundant single 210 megabyte
drives is illustrated in Figure 9-37. The drives are located in the front
positions on the tray assembly in both drive chassis and must be pinned as
drive 5 (upper drive chassis) and drive 4 (lower drive chassis) as
illustrated in Figures 9-38 and Figure 9-39, respectively. Note the
positions of the configuration jumpers on the drives. If necessary,
reposition the pinning.
Drive 5
• The SCSI Drive Address jumper block must have jumpers between
pins 1 and 2, and pins 5 and 6 for correct addressing.
• The Active/Passive Termination jumper block must have no jumpers
installed because no SCSI bus termination resistor modules should be
installed on the drive.
• The Terminator Power jumper block must have a jumper installed
between pins 2 and 4 because the SCSI bus termination modules
should not be installed.
• The Parity/Remote Start jumper block must have a jumper between
pins 1 and 2 to enable data parity checking.
• The Options jumper block should have no jumpers installed.
Drive 4
• The SCSI Drive Address jumper block must have a jumper installed
between pins 1 and 2 for correct addressing.
• The Active/Passive Termination jumper block must have no jumpers
installed because the SCSI bus termination resistor modules should be
installed on the drive.
• The Terminator Power jumper block must have a jumper installed
between pins 2 and 4 because no SCSI bus termination resistor modules
should be installed.
• The Parity/Remote Start jumper block must have a jumper installed
between pins 1 and 2 to enable data parity checking.
• The Options jumper block should have no jumpers installed.
SCSI bus termination No SCSI bus termination resistor modules should be installed on either
resistor modules drive. Bus termination is provided at the drive end of the SCSI bus cable
by a bus terminator card.

Nonterminated 210
MB Drive 5 jumper
block selections
Figure 9-38 Nonterminated 210 MB Drive 5 Jumper Block Selections (Bottom View)
13 11 9 7 5 3 1
PWB

3 1 2 4 6
Ground
Ground Drive
Drive
5
5 1 3 5 Signal
4 2
Signal 51196220-100
Pin 1
No Termination
Resistor Modules
Active/Passive
I/O Connector
5 3 1 PWB
Drive
5
6 4 2
(No jumpers) DC Power Connector
Terminator Power
3 1 PWB
Drive + 5 Vdc
5 + 5 Volts Return
+ 12 Vdc
11848

Nonterminated 210
MB Drive 4 jumper
block selections
13 11 9 7 5 3 1
PWB

3 1 2 4 6
Ground
Ground Drive
Drive
4
4 1 3 5 Signal
4 2
Signal 51196220-100
Pin 1
No Termination
Resistor Modules
Active/Passive
I/O Connector
5 3 1 PWB
Drive
4
6 4 2
(No jumpers) DC Power Connector
Terminator Power
3 1 PWB
Drive + 5 Vdc
4 + 5 Volts Return
+ 12 Vdc
11849


pinning configuration of a History Module with redundant single 445 megabyte
reposition the pinning.
Drive 5
• The SCSI Drive Address jumper block must have jumpers installed in
• The Active/Passive Termination jumper block must have a jumper
• The Options jumper block should have no jumpers installed on it.
Drive 4
• The SCSI Drive Address jumper block must have a jumper installed in
position 3 for correct addressing.
• The Active/Passive Termination jumper block must have a jumper
• The Options jumper block should have no jumpers installed on it.
SCSI bus termination No SCSI bus termination resistor modules should be installed on either
resistor modules drive. Bus termination is provided at the drive end of the SCSI bus cable
by a bus terminator card.

Nonterminated 445
MB Drive 5 jumper
block selections

PWB
Drive
Bottom
1 2 3 4 5 6
SCSI Drive Address

Jumper Block
Drive
Bottom
PWB 3 2 1
Resistor Modules
Active/Passive
PWB
DC Power Connector
PWB
1 2 3 4 5 6 7 8 1 2 3 4
+ 5 Vdc
+ 5 Volts Return
+12 Volts Return
+12 Vdc
12506-A

Nonterminated 445
MB Drive 4 jumper
block selections

PWB
Drive
Bottom
1 2 3 4 5 6
SCSI Drive Address
Jumper Block
Drive
Bottom
PWB 3 2 1
Resistor Modules
Active/Passive
PWB
DC Power Connector
PWB
1 2 3 4 5 6 7 8 1 2 3 4
+ 5 Vdc
+ 5 Volts Return
+12 Volts Return
+12 Vdc
12504



configuration jumpers configuration of a History Module with redundant single 875 megabyte
illustrated in Figures 9-42 through 9-45, respectively. Note the positions
of the configuration jumpers on the drives. If necessary, reposition the
jumpers.
875 MB Drive 5
(51196680-100)
• The SCSI Address (J5) jumper block must have jumpers installed in
• The Option Select (J2) jumper block must have a jumper installed in
position 5 to enable data parity checking. The internal SCSI bus
terminators on the drive must not be enabled.
• The SCSI Address/Remote (J6) jumper block must not have any
jumpers installed on it.
875 MB Drive 4
(51196680-100)
• The SCSI Address (J5) jumper block must have a jumper installed in
position 3 for correct addressing.
• The Option Select (J2) jumper block must have a jumper installed in
position 5 to enable data parity checking. The internal SCSI bus
terminators on the drive must not be enabled.
• The SCSI Address/Remote (J6) jumper block must not have any
jumpers installed on it.
SCSI bus termination The internal SCSI bus terminators on either drive must not be enabled.
Bus termination is provided at the drive end of the SCSI bus cable by a
bus terminator card.

Nonterminated 875 Figure 9-42 illustrates the jumper selections for the 875 MB drive,
MB Drive 5 jumper 51196680-100, when configured as a nonterminated Drive 5.
block selections
(51196680-100)

(Bottom View)

J6 PWB J1 J5
Drive
3 21 Bottom
Drive PWB
Bottom 1 2 3 4 5 6
J1
DC Power Connector
PWB
J2 1 2 3 4
+ 5 Vdc
PWB
+ 5 Volts Return
+12 Volts Return
1 2 3 4 56 7 8 +12 Vdc 54025

9.7.1.3 Single 875 MB Drive Installation, Continued
block selections
(51196680-100)

(Bottom View)

J6 PWB J1 J5
Drive
3 21 Bottom
Drive PWB
Bottom 1 2 3 4 5 6
J1
DC Power Connector
PWB
J2 1 2 3 4
+ 5 Vdc
PWB
+ 5 Volts Return
+12 Volts Return
1 2 3 45 6 7 8 +12 Vdc 54026

875 MB Drive 5
(51196680-200)
• The SCSI Bus Address (J6) jumper block must have jumpers installed
in positions A0 and A2 for correct addressing.
• The Option (J2) jumper block must have no jumpers installed on it.
The internal SCSI bus terminators on the drive must not be enabled.
875 MB Drive 4
(51196680-200)
position A2 for correct addressing.
• The Option (J2) jumper block must have no jumpers installed on it.
The internal SCSI bus terminators on the drive must not be enabled.

block selections
(51196680-200)

(Bottom View)

(Drive 5)
A0 A1 A2
Option Jumper Block

Drive PWB
J2
SCSI BusTermination
Resistor Modules
(Pin 1)
16727-B

block selections
(51196680-200)

(Bottom View)

(Drive 4)
A0 A1 A2
Option Jumper Block

PWB
Drive
J2
SCSI BusTermination
Resistor Modules
(Pin 1)
16729-B

9.7.1.4 Single 1.8 GB Drive Pinning

Single 1.8 GB drive Each drive is housed in a separate Winchester Drive Module. The
pinning configuration of a History Module with redundant single 1.8 gigabyte
reposition the jumpers.
Drive 5
• The SCSI Address (J6) jumper block must have jumpers installed in
positions A0 and A2 for correct addressing.
• The Option Select (J2) jumper block must not have any jumpers
installed on it.
Drive 4
position A2 for correct addressing.
• The Option Select (J2) jumper block must not have any jumpers
installed on it.

9.7.1.4 Single 1.8 GB Drive Pinning, Continued
selections

(Drive 5)
A0 A1 A2
Option Jumper Block

Drive PWB
J2
SCSI BusTermination
Resistor Modules
(Pin 1)
16727-B

9.7.1.4 Single 1.8 GB Drive Pinning, Continued
selections

(Drive 4)
A0 A1 A2
Option Jumper Block

PWB
Drive
J2
SCSI BusTermination
Resistor Modules
(Pin 1)
16729-B

9.7.1.5 Single 210/445/875 MB or 1.8 GB Drive Cabling
Single drive cabling Figure 9-48 illustrates a side view of the cable routing for a redundant
single 210 MB, 445 MB, 875 MB, or 1.8 GB drive configuration. The
single SCSI bus ribbon cable from the SPC I/O circuit board, that is
located in the card cage at the rear of the electronics module, passes
through a slotted hole in the back of the lower Winchester Drive Module
and routes over the slide-out tray assembly to Drive 4. The cable then
exits the lower Winchester Drive Module and enters the upper Winchester
Drive Module where it connects to Drive 5. It then connects to a bus
terminator resistor card mounted at the top of the upper Winchester Drive
Module chassis. The bus terminator resistor card is illustrated in Figure 9-
31.
Ribbon cable red A top view of the modules is illustrated in Figure 9-49. The SCSI bus
stripe positioning ribbon cable always connects to a drive with the red stripe on the right side
of the drive as you face the connectors on the drive.
rotating fan blades in the fan assembly. The cables must be held in place
on the tray assemblies by cable clamps to avoid the fan blades. The cable
is folded so it can make a 90° turn up to the drive connector as illustrated
in Figure 9-49.

9.7.1.5 Single 210/445/875 MB or 1.8 GB Drive Cabling, Continued
Redundant single
drive SCSI bus cable
routing
Figure 9-48 Redundant Single 210/445/875 MB or 1.8 GB Drive SCSI Bus Cable Routing
(Side View)
Drive 5
Slide Tray Assembly
SCSI Bus
Slide Tray Assembly
Electronics Module
SPC I/O
Connector
16777
SIDE VIEW

9.7.1.4 Single 210/445/875 MB or 1.8 GB Drive Cabling, Continued
Redundant single
drive SCSI bus cable
installation
Figure 9-49 Redundant Single 210/445/875 MB or 1.8 GB Drive SCSI
Bus Cable Installation (Top View)
Cable Clamps
Red Line
Winchester Disk
Drive 5
Bus Terminator
Top View of Upper Drive Chassis
Cable Clamp
Red Line
I/O Card Cage
(Electronic Chassis)
Cable Clamps
Red Line
Winchester Disk
Drive 4
Top View of Lower Drive Chassis

11851

Section 10 – WDA Type History Module Assembly
10.1 Overview

Topic See Page
10.1 Overview 257

10.2 History Module Assembly 259
10.2.1 General Assembly 259
10.2.2 Fan Assembly Replacement 260
10.2.4 Circuit Board Replacement 261
10.2.5 Cabling Replacement 270
10.2.6 Winchester Disk Assembly Replacement 271
10.3 Winchester Disk Assembly Reassembly 272
10.4 Winchester Drive Tray Assembly 273
10.4.1 General Information 273
10.4.2 Winchester Disk Drive Replacement 275
Purpose This section describes the assembly of the WDA History Module with
major components that includes the circuit boards, Winchester Disk
Assembly, Winchester disk drive(s), power supply, fan assembly, and the
module cabling.
Reference Refer to the Five/Ten-Slot Module Service manual for assembly

procedures where applicable. In particular, the installation of the K2LCN
or K4LCN circuit board and its associated I/O circuit board, the LCN I/O
(CLCN A/B), is detailed in the Five/Ten-Slot Module Service manual. All
the other circuit boards used in the WDA History Module, other than the
Smart Peripheral Controller (SPC) circuit board, are unique to the WDA
History Module.

History Module The Winchester Disk Assembly that occupies the upper two card slot
description locations in the module chassis can contain two Winchester Drive Trays.
The trays are physically and electrically identical except for the number of
drives the tray contains. Depending on the History Module configuration,
one or two Winchester disk drives are mounted on the tray. See Section 2
for a description of the allowable drive configurations.
A nonredundant History Module will have single or dual drives mounted

on the right-hand tray. The left-hand tray will be absent.
A redundant History Module will have single or dual drives mounted on

both the right-hand and left-hand trays. The number of drives and their
orientation must be the same on each tray. A tray can be installed in the
Winchester Disk Assembly while power is applied to the History Module
(the power supply’s ON/OFF switch is in the ON position). However, the
tray’s ON/OFF switch must be in the OFF position when installing the tray.


10.2 History Module Assembly
10.2.1 General Assembly
Purpose This subsection contains instructions for the assembly of the WDA
History Module. Use those subsections necessary to reassemble the
module with parts you removed by following instructions in Section 4.
When specific configuration or cabling instructions for a given part or
assembly are required, notes or special instructions in the text will assist
you, or reference you, to the subsection where those instructions can be
found.
The item numbers used in this section are keyed to ballooned numbers in
Figure 10-1. These item numbers are also used in Section 6, WDA Type
History Module Disassembly. Figures 3-1 and 3-2 is other views of a
typical History Module assembly. The CE Compliant version is slightly
different in appearance.
12 10
4
9
6 8
11
2
3
6761
CAUTION CAUTION—When assembling the History Module, power must be

removed from the module, either by disconnecting the module’s power
cord or by placing the power supply’s ON/OFF switch in the OFF position,
whichever is applicable.
The exception is the installation of a Winchester Drive Tray. The tray can
be installed while power is applied to the module, but the tray’s ON/OFF
switch must be in the OFF position when installing the tray. However, the
tray’s ON/OFF switch must be placed in the ON position immediately after
installing the tray.

10.2.2 Fan Assembly Replacement
Assembly procedure Slide the fan assembly (3) into the chassis, being careful that the connector
at the rear of the assembly mates properly. Secure the fan assembly with
the two fasteners.
Assembly procedure Be sure the power supply’s ON/OFF switch is in the OFF position. Slide
the power supply (2) into the module until it begins to mate with its
backpanel connectors. Then press on the extractor levers located on each
side of the assembly until the power supply is fully mated with the

10.2.4 Circuit Board Replacement
CAUTION CAUTION—All circuit boards used in the History Module contain

electrostatically sensitive devices. Use a personnel grounding strap and
grounded work surfaces/equipment. Store and transport the parts only in
Correct circuit board When replacing an SPC circuit board that was removed from the History
pinning Module, be sure the address pinning (TS1) on the replacement board
matches the removed board. Do not attempt to duplicate the revision
pinning (TS2).
Smart Peripheral Verify the selection of the pinning jumpers on the TS1 module on the
Controller (SPC) Smart Peripheral Controller (SPC) circuit board (13) as illustrated in
circuit board
Figure 10-2. The revision pinning on the TS2 module has been
determined in the factory and must not be changed in the field.
Inspect the Smart Peripheral Controller circuit board for the proper
firmware revision. It must be revision “G,” or a later revision. The two
firmware EPROMs are located approximately at coordinates 18F and 18G
as illustrated in Figure 10-2.
If replacement is required, note the orientation and location of the

EPROMs
0928-101 and 0928-102 before removal. Be sure to wear an ESD
wriststrap that is properly grounded. Remove the EPROMs and replace
them. Change the firmware revision on the circuit board.
Slide the SPC circuit board (13), as illustrated in Figure 10-1, into slot 3 of
the module chassis until it is fully mated with the backpanel connectors.

10.2.4 Circuit Board Replacement, Continued
SPC circuit board

SCSI bus address
pinning
Figure 10-2 SCSI Bus Address Pinning on SPC Circuit Board

DO NOT CHANGE
9 8
10 7
11 6
12 5
13 4
14 3 ADDR REV
15 2
TS2
TS1
16 1
Configure TS1 as follows:
PINS DESCRIPTION
9-8 Always Shorted
0928-101
0928-101
10-7 Always Shorted

REV. G
11-6 Always Shorted

12-5 Always Shorted
13-4 Short = WREN III or WDA History Module *
14-3 Open **
15-2 Open **
0928-102
0928-102
REV. G
16-1 Open **

ASSY No.51401052-100
SPC
12554
SPC II (SPC2) I/O The SPC II (SPC2) I/O circuit board (8) is associated with the SPC circuit
circuit board board and is installed in slot 2 of the rear card cage as illustrated in
Figure 10-1. Slide the SPCII I/O circuit board into the slot until fully
mated with the backpanel connectors.
There are no pinning requirements on the board.

LCN address The LCN node address can be selected on either the K2LCN (K4LCN)
configuration circuit board or the LCN I/O (CLCN A/B) board. Configuring the LCN
node address on the K2LCN (K4LCN) circuit board is preferred for
consistency, but selecting the address on either circuit board is acceptable.
However, all the jumpers on the circuit board that is not being used for
address selection must be removed, or if the board uses configuration
switches as a substitute for the jumpers, the switches must be placed in
their zero (0) position.
K2LCN circuit board The early production and current production K2LCN circuit boards (11),
LCN node address as illustrated in Figures 10-3 and 10-4, have an LCN node address pinning
selection
module at coordinate 9C and 7A, respectively. Pin the K2LCN board for
the appropriate LCN node address. All jumpers on the LCN I/O circuit
board must be removed if the LCN address is selected on the K2LCN
circuit board. If a CLCN A/B is present, its configuration switches must
be in their zero (0) position.
The early production and current production K4LCN circuit boards (11),
as illustrated in Figures 10-5 and 10-6, have an LCN node address pinning
module, TS2, at locations 21E and 7A, respectively. Pin the K4LCN
board for the appropriate LCN node address. All jumpers on the LCN I/O
circuit board must be removed if the LCN address is selected on the
K4LCN circuit board. If a CLCN A/B board is present, its configuration
switches must be in their zero (0) position.
As illustrated in Figure 10-1, slide the K2LCN or K4LCN circuit board

(11) into slot 1 until it is fully mated with the backpanel connectors after
selecting the appropriate LCN node address.

K2LCN Figure 10-3 illustrates LCN node address selection on the K2LCN board,
(51401551-x00) LCN assembly 51401551-x00. The pinning block, TS2, is located at coordinate
address selection
9C on the board. The absence of a jumper is a binary “1.” Parity must be
an odd number.
Figure 10-3 K2LCN Board (51401551-x00) LCN Node Address Selection
NOTE: This text is not on the board.
Binary
Weight
P
Parity
TS2
6
64
9C
5
32
4
16
3
8
2
4
1
2
9D
0
Jumper Removed = "1"
9F
9H
K2LCN
9467

(51402615-x00) LCN assembly 51402615-x00. The pinning block, TS1, is located at
address selection
coordinate 7A on the board. The absence of a jumper is a binary “1.”
Parity must be an odd number.

TS1
Binary
Weight
7A
P
Parity
6
64
5
32
4
16 4C
3
8
2
4
1
2
0
The overall number of jumpers

removed, including the parity 8H
jumper, must be an odd number. 3H
This example indicates node
address 03.
K2LCN
7739

(51401946-100) LCN assembly 51401946-100. The pinning block, TS2, is located at coordinate
address selection
21E on the board. The absence of a jumper is a binary “1.” Parity must be
an odd number.
Figure 10-5 K4LCN Board (51401946-100) LCN Node Address Selection
LCN Address Jumper Out = 1

NOT ON BOARD This Sample is 43:
Pinning Jumper In = 0
PARITY
P
The overall number of
64 jumpers out, including the
1 2 3 4 5 6
parity jumper, must be an
LCN ADDRESS
32
odd number.
16 Note that addresses 0-127
BINARY 8 could be set, but software
WEIGHT will allow only node
4
addresses 1-64.
2
The 1 and 0 refer to DIP
0
1 switch positions when a
1 0 switch assembly is installed
in place of the jumper block.
51081

(51402755-100) LCN assembly 51402755-100. The pinning block, TS1, is located at
address selection

TS1
Binary
Weight
7A
P
Parity
6
64
5
32
4
16 4C
3
8
2
4
1
2
0

address 03.
K2LCN
773

LCN I/O board LCN The LCN I/O and CLCN A/B circuit boards (7) are associated with the
node address K2LCN and K4LCN circuit boards and are installed in slot 1 of the rear
selection
card cage as illustrated in Figure 10-1. The LCN I/O circuit board must be
revision T or higher and must be configured for the appropriate LCN node
address as illustrated in Figure 8-7. All jumpers on the K2LCN or
K4LCN circuit board must be removed if the LCN address is selected on
the LCN I/O circuit board.
Slide the board into the slot until it is fully mated with the backpanel
connectors after configuring the board for the appropriate LCN node
address.
Figure 10-7 LCN I/O Board LCN Node Address Selection
LCN ADDRESS
LCN I/O BOARD
FROM REAR SLOT 2
51107403-100
Binary
Weight Jumper Removed = "1"
P Parity
Overall number of jumpers
6 64 omitted, including the
5 32
odd number. This example
4 16 indicates node address
03.
3 8
2 4
1 2
0 1
NOTE: The software will allow only node addresses 1-64 at this time.
2923

CLCN A/B board LCN The CLCN A/B board is the CE Compliant version of the LCN I/O board.
node address
selection
Figure 10-8 illustrates LCN node address selection on the CLCN A/B
board. The figure illustrates an LCN node address of seven (7). Placing a
switch in the zero (0) position is a binary “1.” Parity must be an odd
number.
address.
Figure 10-8 CLCN A/B Board LCN Node Address Selection
8
P
ASSY NO. 51305072-100
7
REV A 6
BAR CODE
6
5
5
4
4
3
3
2
2
1
ON
1
0
J1 J2 1 0 LCN
LCN A LCN B Address
16749

WDI I/O circuit board The WDI I/O circuit board (9) is associated with the Winchester Drive
Interface (WDI) circuit board located in the Winchester Disk Assembly (4)
and is installed in slot 5 of the rear card cage as illustrated in Figure 10-1.
There are no pinning requirements on the circuit board.
connectors.
10.2.5 Cabling Replacement
Overview The History Module requires the connection of two external cable sets to
service its two interfaces. The interfaces are described below.
Winchester drive An interface between the SPCII (SPC2) I/O circuit board (8), located in
interface slot 2 of the History Module’s rear card cage, and the WDI I/O circuit
board (9), located in slot 5 of the rear card cage, is provided by two 50-pin
ribbon cables (10). The interface is the SCSI bus interface between the
SPC circuit board (12) and any Winchester disk drives mounted on the
Winchester Drive Trays (5 and 6) in the Winchester Disk Assembly.
The sets of ribbon cable connectors are keyed and friction-mate with
connectors on the SPCII (SPC2) I/O and WDI I/O circuit boards as
illustrated in Figure 10-1. Do not grasp the ribbon cable when making the
connection. Grasp only the ribbon cable connectors.
Local Control Network Two coaxial trunk cables, A and B, provide the interface to the Local
interface Control Network (LCN). The trunk cables are color coded, with cable A
coded yellow, and cable B coded green. The connections to the LCN
(CLCN A/B) I/O circuit board (7), located in slot 1 of the module’s rear
card cage, are made with tee connectors.
Connect the LCN trunk cables, noting the identification labels and color
codes on the cables. Match the cables to the proper connector on the LCN
I/O circuit board. Do not cross-connect the cable connections.

10.2.6 Winchester Disk Assembly Replacement
WDA replacement As illustrated in Figure 10-1, the Winchester Disk Assembly (4) occupies
slots 4 and 5 in the History Module chassis. Figure 10-9 is an illustration
of the assembly. The Winchester Disk Assembly connectors mate with
the backpanel connectors in the slot 5 position, but is guided into position
by the circuit board guide rails for the slot 4 position. Grasping the metal
partition dividing the tray compartments, with the tray(s) disengaged or
removed, is a convenient way of inserting the assembly into its backpanel
connectors.
The friction of the backpanel connectors tends to hold the assembly in

place. However, two fasteners, located toward the front of each side of the
assembly, secure it in place. The fan assembly must be removed to have
access for the right-hand side fastener.
Figure 10-9 Winchester Disk Assembly
6770

10.3 Winchester Disk Assembly Reassembly
Description As illustrated in the exploded view of the Winchester Disk Assembly,

Figure 10-10, the assembly is composed of a chassis (1), a Winchester
Drive Interface (WDI) circuit board (2), and one or two Winchester Drive
Trays, right-hand (3) and left-hand (4), that reside in the chassis. The trays
are physically interchangeable assemblies, but must be properly configured
for their application in the History Module. Refer to subsection 10.4.
Figure 10-10 Winchester Disk Assembly Exploded View
2
1
WDI C
ircuit B
oard
3 6771
Tray removal and Each tray (3 or 4) is held in place by an extractor lever and by the friction
replacement of the tray’s mating connectors. The tray is removed from the assembly
by pulling outward on the tray’s extractor lever and sliding the tray out of
the chassis.
WDI circuit board The Winchester Drive Interface (WDI ) circuit board (2) is installed with
five phillips-head screws at the corners and forward center of the board
that are accessible through holes at the top of the assembly chassis. A
1.27-mm (.050-inch) spacer (washer) must be used between the circuit
board and the metal chassis at each screw location. It is very important
that the spacers are used in mounting the board, because without the
spacers the board will not properly mate with the backpanel connectors.
Since it is very difficult to install the WDI circuit board using spacers, it is
the circuit board has failed.
Tray installation A Winchester Drive Tray (3 or 4) is installed in the assembly by gently

sliding it into its compartment until it begins to mate with the WDI board.
Then firmly apply pressure to the front of the tray until the extractor lever
assumes a relaxed position that is parallel to the tray’s front panel.

10.4 Winchester Drive Tray Assembly
10.4.1 General Information
Introduction The item numbers identified in parentheses ( ) in this subsection are

represented by the ballooned numbers in Figures 10-11 and 10-12, which
are exploded views of the Winchester Drive Tray.
7
4
1 3
8
6 6769
Figure 10-12 Dual-Drive Winchester Drive Tray Exploded View
7
2 4
1 3
8 6
6768

10.4.1 General Information, Continued
Description A Winchester Drive Tray consists of the following components:

• One or two Winchester disk drives (1 or 2). A single-drive tray
contains one drive and a dual-drive tray contains two drives.
• A printed flex-circuit (3) interconnects the drive(s) with the tray
connector (4) that interfaces to the WDI circuit board in the Winchester
Disk Assembly. The printed flex-circuit provides the SCSI bus
interface to the drive(s).
• A connector hold-back bracket (5) that prevents damage to the printed
flex-circuit when only the front drive is mounted on the tray. The
connector hold-back bracket is installed to rigidly hold the unused
connector in place. It is held in place by two Phillips-head screws
using holes intended for mounting the rear drive. The connector
attaches to the bracket with two screws.
Winchester disk drive in the tray that is about to be removed.
Terminators are installed on the drive that is mounted at the front of
tray.
• An extractor lever (8) used to both lock the tray in place in the
Winchester Disk Assembly and assist in extracting the tray when it is in
place.
Disk drive SCSI bus When a Winchester Drive Tray has a single drive, the drive is mounted at
termination the front of the tray. If the drive is a 210 megabyte or 445 megabyte drive,
three SCSI bus termination modules must be installed on the drive. If the
drive is a 875 megabyte or 1.8 gigabyte drive, the internal SCSI bus
terminators on the drive must be enabled by jumper block pinning. A tray
containing dual drives has drives mounted at both the front and rear of the
tray. Only the front drive must terminate the SCSI bus. Refer to
subsection 10.4.2 for the pinning and termination information for an
individual drive.

10.4.2 Winchester Disk Drive Replacement
Introduction When replacing a Winchester disk drive, it is important that you duplicate
bus address (device) and SCSI bus terminator pinning. The replacement
drive must be pinned identically.
If the drive is a 210 megabyte or 445 megabyte drive, notice also whether
or not SCSI bus termination modules are installed at the bottom of the
drive. A 210 MB or 445 MB drive mounted at the front of the tray must
have three bus termination modules installed. A drive mounted at the rear
of the tray must not have termination modules installed.

with care.
The Options and Parity/Remote Start jumper blocks have fixed jumper
positions for all drive mounting positions. Three of the jumper blocks
must be altered, if necessary, to accommodate the mounting location of
the drive on either a right-hand or left-hand tray, front or rear position.
These are the Active/Passive Termination, Terminator Power, and SCSI
Drive Address jumper blocks.
Table 10-1 and Figure 10-13 illustrate the proper positioning of the
jumpers on each jumper block for the drive’s mounting position.
Location
Left-Hand Rear 2 3 to 4
Right-Hand Rear 3 3 to 4, and 5 to 6
Left-Hand Front 4 1 to 2
Right-Hand Front 5* 1 to 2 and 5 to 6
* Replacement drives are shipped from the factory pinned for a SCSI device address of
5.

10.4.2 Winchester Disk Drive Replacement, Continued
210 megabyte drive The locations of the jumper blocks on the drive are illustrated in
jumper block Figure 10-13. Only the Active/Passive Termination, Terminator Power,
locations
and SCSI Drive Address jumper blocks should be altered. SCSI drive
addresses of 2, 3, 4, and 5 are the only valid addresses.
13 11 9 7 5 3 1
PWB

3 1 2 4 6
Ground
Ground See
Drives
Table
2-5 1 3 5 Signal
4 2
Signal
Pin 1
Terminating
Resistor Modules
(Pin 1)
Active/Passive
I/O Connector
5 3 1 PWB
Drives
4 and 5
6 4 2
DC Power Connector
5 3 1 Terminator Power (Drives 2-5)
Drives Jumper Block
2 and 3 1 2 3 4 PWB
3 1 PWB
6 4 2
Drives
(No Jumpers) 4 and 5 + 5 Vdc
+ 12 Volts Return
3 1
+ 12 Vdc
Drives
2 and 3
4 2 6763

210 megabyte drive Three resistor SCSI bus termination modules must be installed at the
SCSI bus termination bottom of any Winchester disk drive that is mounted at the front position
resistor modules
of the Winchester Drive Tray. A drive mounted at the rear position on a
tray never has termination modules installed. The location and orientation
of the termination modules is illustrated in Figure 10-14. Be sure that the
Winchester Drive Assembly provide the bus termination.
Pin 1 Dot
Square Pad on PWB

Indicates Pin 1
6762

The Options jumper block is not used for all drive mounting positions.
There should be no jumpers installed on the jumper block. Two jumper
blocks must be altered, if necessary, to accommodate the mounting
location of the drive on either a right-hand or left-hand tray, front or rear
position. These are the Active/Passive Termination and SCSI Drive
Address jumper blocks.
Location
Left-Hand Rear 2 2
Left-Hand Front 4 3
5.

jumper block Figure 8-15. Only the Active/Passive Termination and SCSI Drive
locations
Address jumper blocks should be altered. SCSI drive addresses of 2, 3, 4,
and 5 are the only valid addresses.

PWB
Drive
Bottom
1 2 3 4 5 6
SCSI Drive Address
Jumper Block
J1 (See Table)
Drive
Bottom
PWB 3 2 1
SCSI BusTermination
Resistor Modules
(Pin 1)
J1
Active/Passive
PWB (Drives 4 and 5)

PWB
1 2 3 4 5 6 7 8 1 2 3 4
Active/Passive + 5 Vdc
Termination Jumper Block + 5 Volts Return
PWB (Drives 2 and 3) + 12 Volts Return
+ 12 Vdc
1 2 3 4 5 6 7 8
12824

resistor modules
orientation of the modules is illustrated in Figure 10-16. Be sure that the
Pin 1 Dot or
Part Number on
Top
12492


875 MB drive jumper Figure 10-17 is an illustration of the 875 megabyte Winchester drive,
blocks (51196680-100) 51196680-100, showing the locations of the three jumper blocks. The
(J5) jumper blocks.
Location
Left-Hand Rear 2 2
Left-Hand Front 4 3
5.

jumper block Figure 8-17. Only the Options Select (J2) and SCSI Address (J5) jumper
locations
(51196680-100)
SCSI Address/Remote Jumper Block

J6
PWB
SCSI Drive Address
Jumper Block
Drive (See Address Selection Table)
Bottom 1 2 3 4 5 6
J1 J5
Drive
PWB 3 2 1 Bottom
J1

(Drives 4 and 5)
PWB
J2
PWB
1 2 3 4 5 6 7 8 1 2 3 4
Option Select Jumper Block + 5 Vdc
(Drives 2 and 3) + 5 Volts Return
PWB +12 Volts Return
J2
+12 Vdc
1 2 3 4 5 6 7 8 16762

located on the drive’s PWB and activated by jumpers on the Option Select
(J2) jumper block as illustrated in Figure 10-17.

875 MB drive Figure 10-18 is an illustration of the 875 megabyte Winchester drive,
(51196680-200) jumper 51196680-200, showing the locations of the two jumper blocks. The
blocks
The two jumper blocks must be altered, if necessary, to accommodate the

front or rear position. These are the Option (J2) and SCSI Bus Address
(J6) jumper blocks.
Table 10-4 and Figure 10-18 and illustrate the proper positioning of the
Drive Tray Location SCSI Bus Address Jumper Position
Left-Hand Rear 2 A1
Right-Hand Rear 3 A0 and A1
Left-Hand Front 4 A2
Right-Hand Front 5* A0 and A2
5.

(51196680-200) jumper
Figure 8-18. The Options (J2) and SCSI Address (J5) jumper blocks
block locations
should be altered if necessary. SCSI drive addresses of 2, 3, 4, and 5 are
the only valid addresses.

A0 A1 A2
J6 J2
Drive
J2
SCSI BusTermination
Resistor Modules
(Pin 1)
Drive A2 A1 A0 DC Power I/O Connector

Connector (J1)
PWB
2
1 2 3 4
3
+ 5 Vdc
4 + 5 Volts Return
+12 Volts Return
5 +12 Vdc
16725-B

located on the drive’s PWB and activated by jumpers on the Option (J2)
jumper block as illustrated in Figure 10-18.
1.8 gigabyte drive Figure 10-19 is an illustration of the 1.8 gigabyte Winchester hard-disk
Two jumper blocks must be altered, if necessary, to accommodate the

(J6) jumper blocks.
jumpers on both jumper blocks (J2 and J6) for the drive’s mounting
position.
Table 10-5 1.8 Gigabyte Drive SCSI Device Address Selection
Location
Left-Hand Rear 2 2
Left-Hand Front 4 3
5.

1.8 gigabyte drive The locations of the jumper blocks on the drive are illustrated in
jumper block Figure 10-19. The Options Select (J2) and SCSI Address (J6) jumper
locations
blocks should be altered as appropriate. SCSI drive addresses of 2, 3, 4,
and 5 are the only valid addresses.
Figure 10-19 1.8 Gigabyte Drive Jumper Block Selections (Bottom View)

A0 A1 A2
J6 J2
Drive
J2
SCSI BusTermination
Resistor Modules
(Pin 1)

Drive A2 A1 A0 Connector (J1)
PWB
2
1 2 3 4
3
+ 5 Vdc
4 + 5 Volts Return
+12 Volts Return
5 +12 Vdc
16725-B

1.8 gigabyte drive Unlike the 210 MB and 445 megabyte drives, the 1.8 gigabyte drive does
SCSI bus termination not accommodate external SCSI bus termination modules on the bottom of
the drive. Bus terminators are permanently located on the drive’s PWB
and activated by jumpers on the Option Select (J2) jumper block as
Winchester disk drive Before mounting the drive, be sure that it is pinned correctly and has bus
installation termination modules installed if the drive will be mounted at the front
position on the tray. The SCSI bus address and SCSI bus termination
module information was discussed previously in this subsection.
Place the tray in an upright position. Grasp the printed flex-circuit

connector and move the drive to the connector. Do not grasp the printed
flex-circuit itself. Connect the power cable connector to its mating
connector on the drive. Both connectors are held in place by the mated
connection friction. There are no connector retainers.
Hold the drive you are installing in place with your hand and invert the
tray, so that the tray is resting on the drive. Reposition the tray carefully,
so that the desired set of drive mounting holes (front or rear) align with the
four tapped holes at the bottom of the drive as illustrated in Figure 10-20
for the 210 megabyte drive. Figure 10-21 illustrates the 445 MB, 875 MB,
and
1.8 GB drives. They are similar in appearance. If the tray does not have
another drive already mounted on it, you will have to support one end of
the tray while you tighten the screws. Install only the three Phillips-head
screws as illustrated in Figure 10-19 or 10-20. Only three screws are used
to accommodate any warpage in the tray’s construction affecting the drive.

210 MB drive
mounting
Figure 10-20 210 Megabyte Drive Mounting
6760
445/875 MB and
1.8 GB drive
mounting
Figure 10-21 445/875 Megabyte and 1.8 Gigabyte Drive Mounting
Rear Side of Drive
(Connector Side)
6 - 32 1/4 Inch Screws

12491

Section 11 – Dual Logical WDA History Module Assembly
11.1 Overview

Topic See Page
11.1 Overview 291

11.2 History Module Assembly 293
11.2.1 General Assembly 293
11.2.2 Fan Assembly Replacement 294
11.2.4 Circuit Board Replacement 295
11.2.5 Cabling Replacement 304
11.2.6 Winchester Disk Assembly Replacement 305
11.3 Winchester Disk Assembly Reassembly 306
11.4 Winchester Drive Tray Assembly 307
11.4.1 General Information 307
11.4.2 Winchester Disk Drive Replacement 309
Purpose This section describes the assembly of the WDA History Module with
major components that includes the circuit boards, Winchester Disk
Assembly, Winchester disk drive(s), power supply, fan assembly, and the
module cabling.
Reference Refer to the Five/Ten-Slot Module Service manual for assembly

procedures where applicable. In particular, the installation of the K2LCN
or K4LCN circuit board and its associated I/O circuit board, the LCN I/O
(CLCN A/B), is detailed in the Five/Ten-Slot Module Service manual. All
the other circuit boards used in the WDA History Module, other than the
Smart Peripheral Controller (SPC) circuit board, are unique to the WDA
History Module.

History Module The Winchester Disk Assembly that occupies the upper two card slot
description locations in the module chassis can contain two Winchester Drive Trays.
The trays are physically and electrically identical except for the number of
drives the tray contains. Depending on the History Module configuration,
one or two Winchester disk drives are mounted on the tray. See Section 2
for a description of the allowable drive configurations.
A nonredundant History Module will have a single drive mounted on the

right-hand tray. The left-hand tray will be absent.
A redundant History Module will have a single drive mounted on both the
right-hand and left-hand trays. The number of drives and their orientation
must be the same on each tray. A tray can be installed in the Winchester
Disk Assembly while power is applied to the History Module (the power
supply’s ON/OFF switch is in the ON position). However, the tray’s
ON/OFF switch must be in the OFF position when installing the tray.


11.2 History Module Assembly
11.2.1 General Assembly
Purpose This subsection contains instructions for the assembly of the WDA
History Module. Use those subsections necessary to reassemble the
module with parts you removed by following instructions in Section 4.
When specific configuration or cabling instructions for a given part or
assembly are required, notes or special instructions in the text will assist
you, or reference you, to the subsection where those instructions can be
found.
The item numbers used in this section are keyed to ballooned numbers in
Figure 11-1. These item numbers are also used in Section 6, WDA Type
History Module Disassembly. Figures 3-1 and 3-2 are other views of
typical History Module assemblies. The CE Compliant version is slightly
different in appearance.
12 10
4
9
6 8
11
2
3
6761
CAUTION CAUTION—When assembling the History Module, power must be

removed from the module, either by disconnecting the module’s power
cord or by placing the power supply’s ON/OFF switch in the OFF position,
whichever is applicable.
The exception is the installation of a Winchester Drive Tray. The tray can
be installed while power is applied to the module, but the tray’s ON/OFF
switch must be in the OFF position when installing the tray. However, the
tray’s ON/OFF switch must be placed in the ON position immediately after
installing the tray.

11.2.2 Fan Assembly Replacement
Assembly procedure Slide the fan assembly (3) into the chassis, being careful that the connector
at the rear of the assembly mates properly. Secure the fan assembly with
the two fasteners.
Assembly procedure Be sure the power supply’s ON/OFF switch is in the OFF position. Slide
the power supply (2) into the module until it begins to mate with its
backpanel connectors. Then press on the extractor levers located on each
side of the assembly until the power supply is fully mated with the

11.2.4 Circuit Board Replacement
CAUTION CAUTION—All circuit boards used in the History Module contain

electrostatically sensitive devices. Use a personnel grounding strap and
grounded work surfaces/equipment. Store and transport the parts only in
Correct circuit board When replacing an SPC circuit board that was removed from the History
pinning Module, be sure the address pinning (TS1) on the replacement board
matches the removed board. Do not attempt to duplicate the revision
pinning (TS2).
Smart Peripheral Verify the selection of the pinning jumpers on the TS1 module on the
Controller (SPC) Smart Peripheral Controller (SPC) circuit board (12) as illustrated in
circuit board
Figure 11-2. The revision pinning on the TS2 module has been
determined in the factory and must not be changed in the field.
Inspect the Smart Peripheral Controller circuit board for the proper
firmware revision. It must be revision “G,” or a later revision. The two
firmware EPROMs are located approximately at coordinates 18F and 18G
as illustrated in Figure 11-2.
If replacement is required, note the orientation and location of the

EPROMs
0928-101 and 0928-102 before removal. Be sure to wear an ESD
wriststrap that is properly grounded. Remove the EPROMs and replace
them. Change the firmware revision on the circuit board.
Slide the SPC circuit board (12), as illustrated in Figure 11-1, into slot 3 of
the module chassis until it is fully mated with the backpanel connectors.

SPC circuit board

SCSI bus address
pinning
Figure 11-2 SCSI Bus Address Pinning on SPC Circuit Board

DO NOT CHANGE
9 8
10 7
11 6
12 5
13 4
14 3 ADDR REV
15 2
TS2
TS1
16 1
Configure TS1 as follows:
PINS DESCRIPTION
9-8 Always Shorted
0928-101
0928-101
10-7 Always Shorted

REV. G
11-6 Always Shorted

12-5 Always Shorted
13-4 Short = WREN III or WDA History Module *
14-3 Open **
15-2 Open **
0928-102
0928-102
REV. G
16-1 Open **

ASSY No.51401052-100
SPC
12554
SPC II (SPC2) I/O The SPC II (SPC2) I/O circuit board (8) is associated with the SPC circuit
circuit board board and is installed in slot 2 of the rear card cage as illustrated in
Figure 11-1. Slide the SPCII I/O circuit board into the slot until fully
mated with the backpanel connectors.
There are no pinning requirements on the board.

LCN address The LCN node address can be selected on either the K2LCN (K4LCN)
configuration circuit board or the LCN I/O (CLCN A/B) board. Configuring the LCN
node address on the K2LCN (K4LCN) circuit board is preferred for
consistency, but selecting the address on either circuit board is acceptable.
However, all the jumpers on the circuit board that is not being used for
address selection must be removed, or if the board uses configuration
switches as a substitute for the jumpers, the switches must be placed in
their zero (0) position.
K2LCN circuit board The early production and current production K2LCN circuit boards (11),
LCN node address as illustrated in Figures 11-3 and 11-4, have an LCN node address pinning
selection
module at coordinate 9C and 7A, respectively. Pin the K2LCN board for
the appropriate LCN node address. All jumpers on the LCN I/O circuit
board must be removed if the LCN address is selected on the K2LCN
circuit board. If a CLCN A/B is present, its configuration switches must
be in their zero (0) position.
The early production and current production K4LCN circuit boards (11),
as illustrated in Figures 11-5 and 11-6, have an LCN node address pinning
module, TS2, at locations 21E and 7A, respectively. Pin the K4LCN
board for the appropriate LCN node address. All jumpers on the LCN I/O
circuit board must be removed if the LCN address is selected on the
K4LCN circuit board. If a CLCN A/B board is present, its configuration
switches must be in their zero (0) position.
As illustrated in Figure 11-1, slide the K2LCN or K4LCN circuit board

(11) into slot 1 until it is fully mated with the backpanel connectors after
selecting the appropriate LCN node address.

(51401551-x00) LCN assembly 51401551-x00. The pinning block, TS2, is located at coordinate
address selection
9C on the board. The absence of a jumper is a binary “1.” Parity must be
an odd number.
Binary
Weight
P
Parity
TS2
6
64
9C
5
32
4
16
3
8
2
4
1
2
9D
0
9F
9H
K2LCN
9467

(51402615-x00) LCN assembly 51402615-x00. The pinning block, TS1, is located at
address selection

TS1
Binary
Weight
7A
P
Parity
6
64
5
32
4
16 4C
3
8
2
4
1
2
0

address 03.
K2LCN
7739

(51401946-100) LCN assembly 51401946-100. The pinning block, TS2, is located at coordinate
address selection
21E on the board. The absence of a jumper is a binary “1.” Parity must be
an odd number.
LCN Address Jumper Out = 1

NOT ON BOARD This Sample is 43:
Pinning Jumper In = 0
PARITY
P
The overall number of
64 jumpers out, including the
1 2 3 4 5 6
LCN ADDRESS
32
odd number.
16 Note that addresses 0-127
BINARY 8 could be set, but software
WEIGHT will allow only node
4
addresses 1-64.
2
The 1 and 0 refer to DIP
0
1 switch positions when a
1 0 switch assembly is installed
in place of the jumper block.
51081

(51402755-100) LCN assembly 51402755-100. The pinning block, TS1, is located at
address selection

TS1
Binary
Weight
7A
P
Parity
6
64
5
32
4
16 4C
3
8
2
4
1
2
0

address 03.
K2LCN
773

LCN I/O board LCN The LCN I/O and CLCN A/B circuit boards (7) are associated with the
node address K2LCN and K4LCN circuit boards and are installed in slot 1 of the rear
selection
card cage as illustrated in Figure 11-1. The LCN I/O circuit board must be
revision T or higher and must be configured for the appropriate LCN node
address as illustrated in Figure 10-7. All jumpers on the K2LCN or
K4LCN circuit board must be removed if the LCN address is selected on
the LCN I/O circuit board.
address.
Figure 11-7 LCN I/O Board LCN Node Address Selection
LCN ADDRESS
LCN I/O BOARD
FROM REAR SLOT 2
51107403-100
Binary
Weight Jumper Removed = "1"
P Parity
Overall number of jumpers
6 64 omitted, including the
5 32
odd number. This example
4 16 indicates node address
03.
3 8
2 4
1 2
0 1
NOTE: The software will allow only node addresses 1-64 at this time.
2923

CLCN A/B board LCN The CLCN A/B board is the CE Compliant version of the LCN I/O board.
node address
selection
Figure 11-8 illustrates LCN node address selection on the CLCN A/B
board. The figure illustrates an LCN node address of seven (7). Placing a
switch in the zero (0) position is a binary “1.” Parity must be an odd
number.
address.
Figure 11-8 CLCN A/B Board LCN Node Address Selection
8
P
ASSY NO. 51305072-100
7
REV A 6
BAR CODE
6
5
5
4
4
3
3
2
2
1
ON
1
0
J1 J2 1 0 LCN
LCN A LCN B Address
16749

WDI I/O circuit board The WDI I/O circuit board (9) is associated with the Winchester Drive
Interface (WDI) circuit board located in the Winchester Disk Assembly (4)
and is installed in slot 5 of the rear card cage as illustrated in Figure 11-1.
There are no pinning requirements on the circuit board.
connectors.
11.2.5 Cabling Replacement
Overview The History Module requires the connection of two external cable sets to
service its two interfaces. The interfaces are described below.
Winchester drive An interface between the SPCII (SPC2) I/O circuit board (8), located in
interface slot 2 of the History Module’s rear card cage, and the WDI I/O circuit
board (9), located in slot 5 of the rear card cage, is provided by two 50-pin
ribbon cables (10). The interface is the SCSI bus interface between the
SPC circuit board (12) and any Winchester disk drives mounted on the
Winchester Drive Trays (5 and 6) in the Winchester Disk Assembly.
The sets of ribbon cable connectors are keyed and friction-mate with
connectors on the SPCII (SPC2) I/O and WDI I/O circuit boards as
illustrated in Figure 11-1. Do not grasp the ribbon cable when making the
connection. Grasp only the ribbon cable connectors.
Local Control Network Two coaxial trunk cables, A and B, provide the interface to the Local
interface Control Network (LCN). The trunk cables are color coded, with cable A
coded yellow, and cable B coded green. The connections to the LCN
(CLCN A/B) I/O circuit board (7), located in slot 1 of the module’s rear
card cage, are made with tee connectors.
Connect the LCN trunk cables, noting the identification labels and color
codes on the cables. Match the cables to the proper connector on the LCN
I/O circuit board. Do not cross-connect the cable connections.

11.2.6 Winchester Disk Assembly Replacement
WDA replacement As illustrated in Figure 11-1, the Winchester Disk Assembly (4) occupies
slots 4 and 5 in the History Module chassis. Figure 11-9 is an illustration
of the assembly. The Winchester Disk Assembly connectors mate with
the backpanel connectors in the slot 5 position, but is guided into position
by the circuit board guide rails for the slot 4 position. Grasping the metal
partition dividing the tray compartments, with the tray(s) disengaged or
removed, is a convenient way of inserting the assembly into its backpanel
connectors.
The friction of the backpanel connectors tends to hold the assembly in

place. However, two fasteners, located toward the front of each side of the
assembly, secure it in place. The fan assembly must be removed to have
access for the right-hand side fastener.
Figure 11-9 Winchester Disk Assembly
6770

11.3 Winchester Disk Assembly Reassembly
Description As illustrated in the exploded view of the Winchester Disk Assembly,

Figure 11-10, the assembly is composed of a chassis (1), a Winchester
Drive Interface (WDI) circuit board (2), and one or two Winchester Drive
Trays, right-hand (3) and left-hand (4), that reside in the chassis. The trays
are physically interchangeable assemblies, but must be properly configured
for their application in the History Module. Refer to subsection 11.4.
Figure 11-10 Winchester Disk Assembly Exploded View
2
1
WDI C
ircuit B
oard
3 6771
Tray removal and Each tray (3 or 4) is held in place by an extractor lever and by the friction
replacement of the tray’s mating connectors. The tray is removed from the assembly
by pulling outward on the tray’s extractor lever and sliding the tray out of
the chassis.
WDI circuit board The Winchester Drive Interface (WDI ) circuit board (2) is installed with
five phillips-head screws at the corners and forward center of the board
that are accessible through holes at the top of the assembly chassis. A
1.27-mm (.050-inch) spacer (washer) must be used between the circuit
board and the metal chassis at each screw location. It is very important
that the spacers are used in mounting the board, because without the
spacers the board will not properly mate with the backpanel connectors.
Since it is very difficult to install the WDI circuit board using spacers, it is
the circuit board has failed.
Tray installation A Winchester Drive Tray (3 or 4) is installed in the assembly by gently

sliding it into its compartment until it begins to mate with the WDI board.
Then firmly apply pressure to the front of the tray until the extractor lever
assumes a relaxed position that is parallel to the tray’s front panel.

11.4 Winchester Drive Tray Assembly
11.4.1 General Information
Introduction The item numbers identified in parentheses ( ) in this subsection are

represented by the ballooned numbers in Figures 11-11 and 11-12, which
are exploded views of the Winchester Drive Tray.

11.4.1 General Information, Continued
Description A Winchester Drive Tray consists of the following components:

• One Winchester ST39175LW disk drive.
• A ribbon cable (3) interconnects the drive(s) with the tray connector (4)
that interfaces to the WDI circuit board in the Winchester Disk
Assembly. The ribbon cable provides the SCSI bus interface to the
drive.
Winchester disk drive in the tray that is about to be removed.
Terminators are installed on the drive that is mounted at the front of
tray.
• An extractor lever (8) used to both lock the tray in place in the
Winchester Disk Assembly and assist in extracting the tray when it is in
place.
Disk drive SCSI bus The SCSI cable is terminated by a termination modle attached to the drive
termination end of the SCSI interface cable.

11.4.2 Winchester Disk Drive Replacement
Introduction A Dual Logical WDA hard drive tray can be used to replace the older
WDA drive tray that has 8.75 MB or 1.8 GB drives. Because it is always
a single drive tray that is partitioned into dual drives, it is a direct
replacement for single and dual drive redundant and non-redundant drive
trays.
When replacing a Seagate ST39175LWDrive with a new one, it must be

pinned exactly like the old one.
The SCSI cable is terminated by a termination module attached to the

drive end of the SCSI interface cable.

with care.
Disk drive SCSI bus The SCSI cable is terminated by a termination module attached to the
termination drive end of the SCSI interface cable.
ST39175LW hard-disk Figure 4-4 is an illustration of the partitioned Winchester ST39175LW

drive pinning hard-disk drive. The SCSI address pinning is 5 (for the primary drive tray)
or 4 (for the redundant Drive tray).

Winchester The locations of the jumper blocks on the drive are illustrated in Figure
ST39175LW drive 11-12. Only the J2 and J5 should have pinning, remove any pinning from
jumper block
locations
J6. SCSI drive addresses of 4 and 5 are valid addresses. Address 5 is the
address for the primary drive and 4 is the address for the redundant drive.
Figure 11-12 Winchester ST39175LW Drive Pinning

Section 12 – Startup
12.1 Overview

Topic See Page
12.1 Overview 311

12.2 Visual Checks 311
12.2.1 WREN Type History Module 311
12.2.2 WDA Type History Module 312
12.3 Power-on Procedure 313
12.3.1 Component Replacement Startup 314
12.3.2 Nonredundant Drive Replacement Startup 316
12.3.3 Redundant Drive Replacement Startup 318
12.4 Redundant Disk Drive Data Synchronization 318
12.5 Winchester Disk Drive Formatting 320
12.5.1 Drive Formatting Procedure 321
Purpose This section provides an orderly startup procedure to use after installation
or repair of the History Module. It begins with a visual checkout and
concludes with the results of applying power to the History Module.
12.2 Visual Checks

12.2.1 WREN Type History Module
Remove the front Remove the front cover of the Winchester module and check to ensure
panel that it is free of foreign matter and dirt accumulation. Be sure that all
connections are proper and tight.
Check the circuit Check that all circuit boards are installed in their assigned module slots
boards and properly seated. Refer to the Five/Ten-Slot Module Service or Dual
Node Module Service manuals for the circuit board assignments.
Check the LCN coax Check to be sure that the Local Control Network (LCN) trunk cables are
cables properly connected to the LCN I/O (CLCN A/B) circuit board and not
cross-connected. Cable A (yellow) must be connected to the A connector,
and cable B (green) must be connected to the B connector.
Check the LCN node Check that the address jumpers on the LCN I/O board or switches on the
address jumpers CLCN A/B board are correct for the LCN node selection.

12.2.2 WDA Type History Module
Remove the front Remove the front panel of the WDA History Module so that you have
panel access to the Winchester Drive Tray power ON/OFF switch(es).
Check the trays If a Winchester Drive Tray was removed to replace a defective drive, be
sure the drive is properly pinned for the drive’s location on the tray
(right-hand or left-hand tray). If you are not sure that the front drive on a
tray has three SCSI bus termination modules installed on the bottom of the
drive, you will have to remove the drive to verify their presence.
Ensure that the trays are locked in position. The tray’s extractor lever
should be in its relaxed position, which is parallel to the front of the tray.
Place each tray’s power ON/OFF switch in the ON position.
Check the circuit Check that all circuit boards are installed in their assigned module slots
boards and properly seated. Figure 3-1, 3-2, 6-1, and 11-1 illustrate the circuit
board assignments.
Check the SCSI bus Check that the two ribbon cables between the SPCII I/O and WDI I/O
ribbon cables circuit boards are in place and secure.
Check the LCN coax Check to be sure that the Local Control Network (LCN) trunk cables are
cables properly connected to the LCN I/O (CLCN A/B) circuit board and not
cross-connected. Cable A (yellow) must be connected to the A connector,
and cable B (green) must be connected to the B connector.
Check the LCN Check that the address jumpers (switches) on the K2LCN (K4LCN) or
address jumpers LCN I/O (CLCN A/B) circuit board are correct for the LCN node
selection. Only one of the two circuit boards must be pinned. Be sure the
other circuit board has no address jumpers.

12.3 Power-on Procedure
Overview There is a choice of three power-on procedures found in the next three
subsections. The procedure you choose depends upon your situation.
Power was removed If power was removed from the History Module to replace a defective
from the History circuit board, power supply, fan assembly, or a component that required
Module
the removal of power from the History Module, use the procedure in
subsection 12.3.1.
A nonredundant drive If you are replacing a defective drive in the History Module without a
was replaced redundant drive, follow the procedure in subsection 12.3.2.
A redundant drive was If you are replacing a defective drive in the History Module with a
replaced redundant drive, follow the procedure in subsection 12.3.3.

12.3.1 Component Replacement Startup
WREN type HM Use the procedure in Table 12-1 to restart a WREN type History Module
startup procedure after replacing a defective component, other than a drive. Power was
removed from the History Module.
Table 12-1 Restarting a WREN Type History Module Procedure –
Component Replacement
Step Action
1 In the Winchester Drive Module(s), place the drive power supply’s AC
POWER switch in the 1 (ON) position. The green LED on the power
supply should be lit. Check that the red LED on the fan assembly is
not lit. Secure the cover(s) to the module(s).
2 Place the POWER switch on the electronics module in the ON (1)
position. Check that all red LEDs extinguish and all green LEDs
illuminate within 1.5 minutes. Also, note the alphanumeric display
and ensure that it displays the proper LCN node address for the
History Module.
3 Verify that the History Module has autobooted properly and that its
data is valid. Examine the status of the History Module at the
Universal Station and test for History Module related activities. If the
data is not valid, continue with this procedure.
4 You must now initialize the History Module using the original NCF.
See the Network Data Entry manual for details.
5 Restore the local volume and system software files.
6 Restore the Continuous History data. See subsection 7.7 in the

Engineer’s Reference Manual.
7 Restore all other files. Refer to the Command Processor Operation
manual.
8 After all of your files have been restored, autoboot the History Module
by either doing a double-shutdown from the Universal Station, or by
placing the electronics module’s power supply switch in the OFF (0)
position for approximately 30 seconds, then back to the ON (1)
position. If the autoboot is unsuccessful, go to the troubleshooting
techniques in Section 5 or call TAC for assistance.

12.3.1 Component Replacement Startup, Continued
WDA type HM startup Use the procedure in Table 12-2 to restart a WDA type History Module
procedure after replacing a defective component, other than a drive. Power was
removed from the History Module.
Table 12-2 Restarting a WDA Type History Module Procedure –
Component Replacement
Step Action
1 Place the Winchester Drive Tray power switch(es) in the ON position.
Place the power supply power ON/OFF switch in the ON position.
Check that all red LEDs extinguish and that all green LEDs illuminate
within approximately 1.5 minutes. Check that the alphanumeric
display on the K2LCN/K4LCN circuit board shows the correct LCN
node address for the History Module.
2 Verify that the History Module has autobooted properly and that its
data is valid. Examine the status of the History Module at the
Universal Station and test for History Module related activities. If the
data is not valid, continue with this procedure.
3 You must now initialize the History Module using the original NCF.
See the Network Data Entry manual for details.
5 Restore the Continuous History data. See subsection 7.7 in the

manual.
placing the power supply’s ON/OFF switch in the OFF position for
approximately 30 seconds, then back to the ON position. If the
autoboot is unsuccessful, go to the troubleshooting techniques in
Section 5 or call TAC for assistance.

12.3.2 Nonredundant Drive Replacement Startup
WREN type HM Use the procedure in Table 12-3, when replacing a nonredundant drive in
startup procedure a WREN type History Module.
Nonredundant Drive Replacement
Step Action
1 In the Winchester Drive Module, place the drive power supply’s AC
POWER switch in the 1 (ON) position. The green LED on the power
supply should be lit. Check that the red LED on the fan assembly is
not lit. Secure the cover(s) to the module(s).
2 Place the POWER switch on the electronics module in the ON (1)
position. Check that all red LEDs extinguish and all green LEDs
illuminate within 1.5 minutes. Also, note the alphanumeric display
and ensure that it displays the proper LCN node address for the
History Module.
3 If you replaced a defective drive with a factory replacement, the drive
has been formatted at the factory. If you replaced a defective drive
with a drive previously used in another History Module, the drive must
be reformatted. Reformat the drive using the procedure in subsection
12.5 before continuing.
4 You must now initialize the History Module using the original NCF you
saved before the drive failed. See the Network Data Entry manual for
the procedure.
6 Restore the Continuous History Data. See subsection 7.7 in the

manual.
placing the electronics module’s power supply switch in the OFF (0)
position for approximately 30 seconds, then back to the ON (1)
position. If the autoboot is unsuccessful, go to the troubleshooting
techniques in Section 5 or call TAC for assistance.

12.3.2 Nonredundant Drive Replacement Startup, Continued
WDA type HM startup When replacing a nonredundant drive in a WDA type History Module, you
procedure had the option of removing power from the entire WDA History Module
using the ON/OFF switch on the power supply, or remove power from the
right-hand tray, using its power ON/OFF switch. Either method is
acceptable. If you used the latter method, start at Step 2 in the procedure
in Table 12-4.
Nonredundant Drive Replacement
Step Action
1 Set the Winchester Drive Tray power switch(es) in the ON position.
Place the power supply ON/OFF switch in the ON position. Check
that all red LEDs extinguish and that all green LEDs illuminate within
approximately 1.5 minutes. Check that the alphanumeric display on
the K2LCN circuit board shows the correct LCN node address for the
History Module.
2 If you replaced a defective drive with a factory replacement, the drive
has been formatted at the factory. If you replaced a defective drive
with a drive previously used in another History Module, the drive must
be reformatted. Reformat the drive using the procedure in subsection
12.5 before continuing.
3 You must now initialize the History Module using the original NCF you
saved before the drive failed. See the Network Data Entry manual for
the procedure.
5 Restore the Continuous History Data. See subsection 7.7 in the

manual.
placing the power supply’s ON/OFF switch in the OFF position for
approximately 30 seconds, then back to the ON position. If the
autoboot is unsuccessful, go to the troubleshooting techniques in
Section 5 or call TAC for assistance.

12.3.3 Redundant Drive Replacement Startup
WREN type HM Use the procedure in Table 12-5 when replacing a drive in a WREN type
startup procedure History Module that has a redundant partner.
Redundant Drive Replacement
Step Action
1 Power was removed from the Winchester Drive Module that housed
the defective drive. Place the drive power supply’s AC POWER
switch in the 1 (ON) position. The green LED on the power supply
should be lit. Check that the red LED on the fan assembly is not lit.
Secure the cover(s) to the module(s).
2 Perform the “data synchronization” procedure detailed in subsection
12.4. After the synchronization has been successfully completed, you
will be on-line and in an operating state.
WDA type HM startup Use the procedure in Table 12-6 when replacing a drive in a WDA type
procedure History Module that has a redundant partner.
Redundant Drive Replacement
Step Action
1 Power was not removed from the History Module power supply.
Instead, power was removed from the Winchester Drive Tray on
which you replaced a drive. Place the tray’s power switch in the ON
position after it is reinstalled.
2 Perform the “data synchronization” procedure detailed in subsection
12.4. After the synchronization has been successfully completed, you
will be on-line and in an operating state.
12.4 Redundant Disk Drive Data Synchronization
Overview After a redundant drive has been replaced, the data on the disk must be
restored with data from its redundant partner by a synchronization process.
That is, the drive must be structured by software to contain exactly the
same data as its redundant partner, which has remained functional while
the drive was being replaced.

12.4 Redundant Disk Drive Data Synchronization, Continued
Data synchronization To synchronize the drives, perform the following steps in Table 12-7.
Table 12-7 Redundant Drives Data Synchronization Procedure
Step Action
1 At a US, use the Engineering Personality Main Menu display to select
the SYSTEM STATUS target and examine the status of the HM you
have serviced. The status should be SEVERE. This is a system
indication that data synchronization has not been performed.
2 Select the Command Processor and issue a status request for the
physical drive that you have replaced as follows:
STA PN:XX (XX is the physical node number of the target HM)
Examples of a printout for physical node 43 are as follows:
Device Redundant
Node Peripheral Address Device Status System Name
---- ---------- --------- --------- -------- -----------
43 FIXED DISK 5 4 OFFLINE NONE
43 FIXED DISK 4 5 OK NONE
The first display example of the status shows drive 5 as OFFLINE.
Drive 4 is OK, it is operational. More than one drive can be
OFFLINE.
Device Redundant
Node Peripheral Address Device Status System Name
---- ---------- --------- --------- -------- -----------
43 FIXED DISK 5 4 UNINITD NONE
43 FIXED DISK 4 5 OK NONE
The second display example of the status shows drive 5 as
UNINITD, meaning not initialized.
Both drive status require that you execute the synchronization
command.
3 Execute a data synchronization request for the OFFLINE or UNINITD
drive(s):
SYNCH PN:XX (XX is the physical node)
The response “Synchronization was Initiated” should then
be displayed. Synchronization takes at least 10 minutes. If another
drive is also OFFLINE or in the UNINITD state, you can immediately
issue the SYNCH request again for the other drive. If you do another
status request (Step 2), you will receive a printout similar to the
example for physical LCN node 43 as shown in Step 2.
SYN_IP shows that synchronization is in progress. The printout is
not periodically updated and must be displayed to check the progress
of the synchronization. However, the History Module status on the
System Status display is updated and changes from DISKPROB to
OK when the synchronization has been successfully completed.
Other status codes that you may see are:
INITIALIZED – The device has been initialized
NOT CREATED – The drive has not been formatted
CORRUPTED – Formatting was unsuccessful

12.5 Winchester Disk Drive Formatting
Overview All Winchester disk drives (WREN III, 210 MB, 445 MB, 875 MB, and
1.8 GB) in the History Module are formatted at the factory. However, you
may be required to reformat a disk drive if it develops additional bad
sectors.
Bad sector detection The History Module is designed to detect bad sectors on its drive(s). You
must manually allocate them to the Bad Sector Table so that they cannot
be used. When bad sector allocation is required, use the procedure in
subsections 12.5.1 or 12.5.2.
WARNING WARNING—ALL DATA ON THE DISK(S) WILL BE

DESTROYED.

12.5.1 Drive Formatting Procedure
CAUTION CAUTION—When reformatting an 875 megabyte drive (51196680-200)

or 1.8 gigabyte drive (51196895-100), you must use a 10.8 or later release
of HVTS.
Smart Controller To reformat a drive, use the off-line Smart Controller Magnetic Disk
Magnetic Disk tests (SCMD) tests described in the Hardware Verification Test System manual
and referenced in the following discussion. Consult the reference for the
detailed instructions required to run the test.
SCMD Test 21 When properly configured, HVTS SCMD Test 21 will test the drive and
overview print a list of defective Logical Block addresses before and after the test
runs. If additional bad sectors are found, they will be identified and the
blocks associated with them will be automatically reassigned.
SCMD Test 21 Use the procedure in Table 12-8 to run HVTS SCMD Test 21.
procedure
Table 12-8 HVTS SCMD Test 21 Procedure
Step Action
1 To load the disk-formatting software to the History Module, first load a
Universal Station with HVTS. Then download HVTS to the History
Module.
2 After loading HVTS to the selected History Module, press SELECT .
Answer the prompt that ends with ALL? with NOD XX ENTER
where XX is the node number of the History Module. Now, press
SELECT and answer the prompt with SET SCMD ENTER . The
program displays several functions that should have the parameters
shown in Table 12-6. If they are correct, simply press ENTER . If
they must be changed, type in the change, then press ENTER .
3 After the last entry, press SELECT , then type MOD S and press
ENTER . Again, press SELECT , then type RUN and press
ENTER .
SCMD Test 21 will run, printing a list of defective Logical Block

addresses before and after the test runs, and then the bad sectors will be
reassigned. The Defect Data List display is in raw hex format because
form and content of defective data varies depending on the drive vendor.
Since detection and reassignment of bad sectors is automatic, the actual
defective data printed is only of a casual concern to the user.

12.5.1 Drive Formatting Procedure, Continued
SCMD Test 21
parameters
Table 12-9 SCMD Test 21 Parameters
Function/Parameter Comment
DEVICE_0=NOT_IN_USE A nonredundant single drive is DEVICE_5
DEVICE_1=NOT_IN_USE (SCSI address 5).
DEVICE_2= Nonredundant dual drives are devices 5 and 3.
DEVICE_3= Redundant single drives are devices 5 and 4.
DEVICE_4= Redundant dual drives are devices 5, 4, 3, and 2.
DEVICE_5= Identify the device(s) you want to format (you can
DEVICE_6=NOT_IN_USE enter more than one) by entering the parameter
DEVICE_7=NOT_IN_USE =W (abbreviation for WREN3_FMD) or =FMD (for
210/445/875 MB and 1.8 GB drives). List all other
devices as =NOT_IN_USE if the drive address
is not used or you do not want to access it.
ENTRY= Not applicable—press ENTER
TESTS=21 Test 21 only
ERROR_LIMIT=5 Report after the fifth error
PASS_LIMIT=1 One pass through the test
INHIBIT= Not applicable—press ENTER
MINUTES_LIMIT=- Unlimited test time
ABBREVIATION=4 Provide test help information
Function Parameters
LIMIT_TESTING_TO_READ_ONLY= NO
AVOID_WRITING_TO_RESERVED_DISK NO
AREA=
CLEAR_DEFECT_LIST= NO
DISPLAY_DEFECT_LIST= BOTH
MASTER_CONTROLLER_NODE_NUMBER= 0
ENABLE= FORMAT,
REASSIGN_DEFECTIVE_BLOCKS
DISABLE= MANUAL_INTERVENTION_TESTS,
RESET_SCSI_BUS,
CONTROLLERTOCONTROLLER_
TESTING, UTILITY_HELP

12.5.1 Drive Formatting Procedure, Continued
SCMD Test 21
parameters, continued
Table 12-9 SCMD Test 21 Parameters, Continued
Function/Parameter Comment
UDO= COMPARE_DATA, ERR_DISPLAY
UDONT= STATUS_DISPLAY
BLOCK_SIZE_IN_BYTES= 256
REPORT= TESTNUMBER, PASSNUMBER, LOG
SCALE= 100

Section 13 – Spare Parts
13.1 Overview

Topic See Page
113.1 Overview 325

13.2 Replaceable Parts Lists 325
Optimum Replaceable In the parts list, Optimum Replaceable Unit (ORU) items are shown with
Unit (ORU) an asterisk (*) beside the part.
13.2 Replaceable Parts Lists
Overview Refer to the Five/Ten-Slot Module Service or Dual Node Module Service
manual for ORU part numbers in the electronics module portion of the
HM.
In the parts lists, the Optimum Replaceable Unit (ORU) items are shown
by an asterisk (*) beside the listing. Where appropriate, the item numbers
in each parts list correspond to reference numbers in Figure 6-1 or 9-1 for
a WREN type History Module and Figure 7-1 for a Type I WDA type
History Module or 11-1 for a Type II WDA type History Module.
Spare parts are listed by the original type of History Module that uses
them (WREN or WDA). Go to the appropriate subsection listing the type
of equipment that requires a replaceable part.
The 210 megabyte, 445 megabyte, 875 megabyte, and 1.8 gigabyte
Winchester disk drives are included in both the WREN and the
210/445/875 megabyte and 1.8 gigabyte parts list, because the WREN type
of History Module can be upgraded to accommodate the 210 megabyte,
445 megabyte,
875 megabyte, or 1.8 gigabyte drive.

13.2 Replaceable Parts Lists, Continued
WREN type History Table 13-1 lists part numbers for the WREN Winchester Drive Modules at
Module parts list the service-part level.
Table 13-1 WREN Type Drive History Module Parts List
Item Description Part Number
*1 Fan Assembly (includes fans) 51400646-100
2 Winchester Drive Module Power Cord, 120 Vac 51303421-092
2 Winchester Drive Module Power Cord, 240 Vac 51303629-092
3 Cable from Slide Tray Assembly Connector to Fan Assembly 51303549-100
*4 Winchester Drive Module Power Supply 51107595-100
*5 WREN III Hard Disk Drive 51195155-100
*5 210 Megabyte Hard Disk Drive (includes installation instructions) 51196269-100
*5 1.8 Gigabyte Hard Disk Drive (includes installation instructions) 51196897-100
6 Power Cable from Drive Power Supply to Disk Drives 51303536-061
Power Cable from Drive Power Supply to Fan Cable 51303625-019
7 SCSI Bus Ribbon Cable for single WREN III, 210/445/875 MB, 51304191-100
or 1.8 GB Drive
7 SCSI Bus Ribbon Cable for dual WREN III, 210/445/875 MB, 51304192-100
or 1.8 GB Drives
7 SCSI Bus Ribbon Cable for redundant single WREN III, 210/445/875 MB, 51304193-100
or 1.8 GB Drives
7 SCSI Bus Ribbon Cable for redundant dual WREN III, 210/445/875 MB, 51304194-100
or 1.8 GB Drives
* ORU level replacement item

WDA type History Table 13-2 lists part numbers for the Winchester Disk Assembly type
Module parts list History Module at the service part level.
Table 13-2 WDA Type Drive History Module Parts List
Five-Slot Module Assembly (w/o circuit boards, power supply, fan assy) * 51195499-100
*3 Fan Assembly with fans for Five-Slot Module 51400646-100
*2 Enhanced Power Supply for Five-Slot Module 51195066-100
Power Cord, 125 Vac, for Five-Slot Module 51303508-100
Power Cord, 250 Vac, for Five-Slot Module 51303508-200
1 Five-Slot Module Cover Assembly 51400918-100
*4 WDA Chassis with Winchester Drive Interface (WDI) circuit board 51401930-100
5/6 Winchester Drive Tray (power cable, power switch, and printed flex-circuit) 51401929-300
* 210 Megabyte Disk Drive kit (includes installation instructions) 51196269-100
* 1.8 Gigabyte Disk Drive kit (includes installation instructions) 51196897-100
* Partioned WDA Winchbester Drive Tray 51403366-100
* Dual Logical Drive replacement for 1.8 GB disk drive 51191579-100
* Dual Logical Drive replacement for 875 MB disk drive 51191579-200
* 11 K2LCN-2 Circuit Board (with 2 megawords of memory) 51402615-200
* 11 K2LCN-4 Circuit Board (with 4 megawords of memory) 51402615-400
* 11 K4LCN Circuit Board 51401946-100
* 11 4-Megaword Memory Board for K4LCN Board (51401946-100) 51201645-400
* 11 K4LCN Circuit Board 51402755-100
* 11 4-Megaword Memory Board for K4LCN Board (51402755-100) 51201795-400
*7 LCN I/O Circuit Board 51107403-100
*7 CLCN A/B Circuit Board – CE Compliant 51305072-100
* 12 Smart Peripheral Controller (SPC) Circuit Board 51401052-100
* ORU Level Replacement Item

WDA type History Table 13-2 lists part numbers for the Winchester Disk Assembly type
Module parts list, History Module at the service part level.
continued
Table 13-2 WDA Type Drive History Module Parts List, Continued
*8 Smart Peripheral Controller II (SPCII) I/O Circuit Board 51304907-100
*8 Smart Peripheral Controller II (SPC2) I/O Circuit Board – CE Compliant 51304907-200
*9 Winchester Drive Interface (WDI) I/O Circuit Board 51304903-100
*9 Winchester Drive Interface (WDI) I/O Circuit Board – CE Compliant 51304903-200
* 10 WDA SCSI Bus Interface Ribbon Cable 51304808-100
BNC T-Connector 51190728-105
* ORU Level Replacement Item

Index
+
+12 Vdc, 141, 169, 254, 288
+5 Vdc, 141, 169, 254, 288
5
50-pin ribbon cables, 250, 284
A
Active Maintenance Journal, 91
Alphanumeric display, 85, 89
Alphanumeric display, 100
autoboot, 84, 101
autoboot, 87, 103
B
backup copies of the data, 84
Bad Sector List, 98, 101, 110
Bad Sector List, 58, 103
Bad Sector Table, 300
bad sectors, 101, 103
block diagram, 48, 70
C
cable removal, 127, 137, 165
cabling, 163, 237, 271
card cage, 250, 284
circuit board: configuration information, 52, 73
circuit board: pinning, 241, 275
circuit board indicators, 85
circuit boards, 163, 237, 271
coaxial T-connectors, 137, 165
connector hold-back bracket, 141
Continued on next page, 74
Continuous History data, 84
Control Track error, 112
CORRUPTED, 102, 105
D
data synchronization, 58, 77
Defect Data List, 35
Defect Data List display, 301
defective blocks, 110
DEGRADED, 102, 106
Detailed Error Module message, 91

Index
disassembly, 123, 133, 140, 161, 168

DISKPROB, 139, 167
drive: maintenance, 35, 58, 77; pinning, 37, 59
drive: mounting, 144, 147, 150, 157, 255, 258, 261
Drive 2, 61, 78
Drive 3, 56
Drive 4, 59
Drive 5, 56, 74
drive tray interconnections, 55, 57, 60, 62, 76, 79
Dual drive configuration, 33
dual-drive tray, 141, 254
E
electrical transients, 102
Electronics module configuration, 31
Electrostatic Discharge, 164, 238, 272
ELECTROSTATIC DISCHARGE (ESD), 82
EMPU/HMPU/HPK2/K2LCN/K4LCN, 85
Engineering Main Menu, 91
Engineering Personality Main Menu display, 121
ESD, 164, 238, 272
external cable, 250, 284
extractor lever, 141, 169
F
failure indicators, 81
fan assembly, 45, 67, 85, 126, 136, 164, 163, 237, 271
fan assembly, 240, 274
Fan failure, 128
fast-load cartridges, 84
field adjustments, 20, 44, 63, 66, 80
flowchart, 87
front panel, 135, 163
G
grounding strap, 141, 169
H
Hardware Verification Test System, 81
History Module description, 238, 272
History Module Status display, 104, 108
HMI personality, 101, 107, 108
HMI personality, 104
HVTS, 105, 110
HVTS, 101
HVTS SCMD Test 21, 301

Index
I
I/O card cage, 137, 165
initialization, 103
intermittent problem, 84
J
jumper: block pinning, 142, 170
jumper: block pinning, 255; blocks, 144, 147, 150, 154, 157, 255, 258, 261, 264, 266
jumper blocks, 144, 147, 150, 154, 157, 255, 258, 261, 264, 266
jumpers, 144, 147, 150, 154, 157, 255, 258, 261, 264, 266
K
K2LCN, 45, 67, 137, 165
K2LCN or K4LCN, 52, 73
L
LCN, 137, 165, 250, 284
LCN: coax cables, 137, 165; node address, 85
LCN I/O, 137, 165
LOAD/DUMP, 104, 107, 108
Logical Block addresses, 301
M
maintenance message abbreviations, 91
media defects, 102
modules, 146, 149, 153, 156, 159, 260, 263, 266, 268
N
nonredundant drive failure, 101
O
Object Detail (Volume Status) displays, 91
Object Detail display, 114
OFFLINE, 139, 167
Optimum Replaceable Unit, 305
ORU, 305
Overview, 21
P
personnel grounding strap, 82, 135, 163
pinning, 142, 170, 255
pinning, 241, 275
power supply, 45, 67, 85, 135, 163, 237, 240, 271, 274

Index
power supply, 136, 164; indicators, 85

power switch, 135, 163
power-on procedures, 293
Primary Code, 98
printed flex-circuit, 141, 254
Product Release Notices, 17
R
Real Time Journal (RTJ), 91; messages, 99
redundancy, 35, 58, 77; drive synchronization, 35, 58, 77
redundant drive: configuration, 20, 44, 66
ribbon cab le, 169
ribbon cable, 49, 71, 250, 284
ribbon cable, 288
S
SCMD Test 21, 301
SCSI bus, 49, 50, 71, 72, 257
SCSI bus: interface, 141, 169; ribbon cables, 137, 165; termination, 49, 71; termination modules, 53, 56, 59, 61, 78, 146, 149, 153,
156, 159, 255, 260, 263, 266, 268; termination modules, 142, 257; termination modules must be, 254; terminators, 141, 153,
156, 159, 169, 263, 266, 268
Seagate ST39175LWDrive with a new one, it must be piined exactly like the old one., 289
Secondary Code, 98
sector, 102
sector: initialization/reassignment, 101
Sector Allocation tables, 107, 108
Sector Initialization/Reassignment Menu display, 122
Sense Key Code, 98
Shipping Alerts, 17
SHUTDOWN, 123, 133, 161
single-drive tray, 141
single-drive tray, 254
SMCC Initialize/Reassign Sector, 105
SMCC Main Menu display, 121
SMCC Maintenance Recommendation messages, 84
software: status displays, 81
SPC, 49, 71
SPC, 52, 73, 137, 165, 241, 275
SPCII I/O, 242, 276
SPCII I/O (SPC2), 137, 165
Status Detail display, 91, 114
Status Detail display, 102
Subtest 14, 110
Subtest 19, 110
Subtest 21, 110
support: documents, 17; services, 17
SYNCH, 110, 111

Index
SYNCH, 101
synchronization, 111
synchronization, 298
System Maintenance Control Center (SMCC), 101
System Real Time Journal, 58, 77
System Status Error messages, 91
T
TAC, 85
TAC, 100
T-connectors, 137, 165
Technical Assistance Center, 85
termination: modules, 49; resistor modules, 146, 149, 260
test run, 84
transient problem, 84
trunk cables, 137, 165, 250, 284
U
unrecoverable data error, 102
V
visual checkout, 291
Volume Status display, 105
Volume Status display, 114
W
WDA Drive Tray, 16
WDA removal, 138, 166
WDI, 250, 252, 284, 286
WDI, 49, 71, 138, 141, 166, 169; replacement, 128, 138, 166
WDI I/O, 49, 137, 165, 250, 284
WDI I/O, 52, 73
Winchester Disk Assembly, 237, 252, 271, 286
Winchester Disk Assembly, 49, 71, 251, 285
Winchester disk drive, 163, 237, 255, 271
Winchester disk drive, 268
Winchester Drive Tray, 128, 138, 139, 166, 167, 254, 288
Winchester Drive Tray: description, 141, 169

Index

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History Module

© Copyright 1995 - 2002 by Honeywell

While this information is presented in good faith and believed to be accurate,

12/02 History Module Service ii

This publication supports CE Compliant equipment. Any equipment designated as “CE

12/02 History Module Service iii

Ground connection to building safety ground.

Ground stake for building safety ground.

Electrical Shock Hazard—can be lethal.

Electrical Shock Hazard—can be lethal.

Rotating Fan—can cause personal injury.

Caution—refer to the appropriate installation document.

SECTION 2 – WREN TYPE HISTORY MODULE DESCRIPTION .................................. 19

SECTION 3 – WDA TYPE HISTORY MODULE WITH TYPE I DRIVE............................ 41

SECTION 4 – WDA HISTORY MODULE WITH TYPE II DRIVE TRAY........................... 61

SECTION 5 – TEST/TROUBLESHOOTING .................................................................... 77

SECTION 6 – WREN TYPE HISTORY MODULE DISASSEMBLY ............................... 117

12/02 History Module Service v

SECTION 7 – WDA TYPE I HISTORY MODULE DISASSEMBLY ............................... 125

SECTION 8 – WDA HISTORY MODULE WITH DUAL LOGICAL DRIVE TRAY

SECTION 9 – WREN TYPE HISTORY MODULE ASSEMBLY..................................... 161

12/02 History Module Service vi

SECTION 10 – WDA TYPE HISTORY MODULE ASSEMBLY...................................... 233

SECTION 11 – DUAL LOGICAL WDA HISTORY MODULE ASSEMBLY .................... 267

SECTION 12 – STARTUP .............................................................................................. 287

SECTION 13 – SPARE PARTS ...................................................................................... 301

12/02 History Module Service vii

12/02 History Module Service viii

12/02 History Module Service ix

12/02 History Module Service x

Table 1-1 Winchester Disk Drive Capacities .............................................................. 16

12/02 History Module Service xi

12/02 History Module Service xii

Publication Publication Binder Binder

History Module Specification and HM03-500 System Summary - 2 3010-2

LCN System Installation SW20-500 LCN Installation 3025

LCN System Checkout SW20-510 LCN Installation 3025

Engineer’s Reference Manual SW09-505 Implementation/Startup & 3030-2

Command Processor Operation SW11-507 Implementation/Startup & 3030-1

Five/Ten-Slot Module Service LC13-500 LCN Service - 2 3060-2

System Maintenance Guide SW13-500 LCN Service - 1 3060-1

Maintenance Test Operations SW11-502 LCN Service - 1 3060-1

Universal Station Service US13-500 LCN Service - 1 3060-1

Test System Executive SW13-510 LCN Service - 3 3060-3

Hardware Verification Test System SW13-511 LCN Service - 3 3060-3

12/02 History Module Service xiii

Section contents The topics covered in this section are:

The electronics module consists of a Five-Slot Module or one Local

The Winchester Drive Module contains one or two Winchester Disk

Continued on next page

12/02 History Module Service 15

WDA History Module The WDA History Module consists of:

Continued on next page

12/02 History Module Service 16

Troubleshooting, The troubleshooting, disassembly, and assembly procedures presented are

1.2 Support Services and Documents

12/02 History Module Service 17

Section contents The topics covered in this section are:

Continued on next page