Simulation Standard
Simulation Standard
Simulation Standard
1. Introduction
It is very important to understand the operation and underly- These motivate this article to study more details about
ing physics of InGaN/GaN materials based electronic device the basic forward characteristic of current injection and
in modern display industry such as flat-panel-display for various effects on the forward voltage shift.
back-light illumination and high efficiency light bulbs. For We will briefly explain the new capture-escape model
these reasons, the numerical device simulation is adapted to for an accurate description of carrier distribution in the
study the improvement of LED efficiency and to understand barrier, quantum well region and importance of polar-
the basic operation of multiple quantum well LEDs. ity in AlN/GaN/InN material growth, and finally how
But the main problem in device simulation is that there are so to simulate the forward characteristic of LED operation.
many unknown physical parameters which cannot be easily
measured and is also still in debate regarding the actual po- 2. Simulation Models
larization in the layer after screening by defects(dislocation
Practical approach to simulate LED device is to use clas-
or V-defect) and uncertain polarity which depends on sub-
sical drift-diffusion solver with the self-consistent the
strate condition and growth condition.
Schrodinger-Poisson solver for the quantum well bound
The basic simulation study for GaN LEDs utilizes the con- state energy and then use this result to calculate spon-
ventional InGaN/GaN MQW(multiple quantum well) LED taneous emission rate by developing effective mass ap-
structure and then extends the efficiency limit of this con- proximation from k.p theory. We need to know that this
ventional LED structure to further incorporate n+SPS(short- approach is only valid in parabolic band approximation.
period-superlattice) for pure ohmic contact and current With this assumption we simulated a conventional led
spreading layer for both n-side and p-side layers. Regarding with the following structure.
active emission regions, we may consider various techniques
to improve LED efficiency such as band-gap engineered cas- (1) Simulation LED Structure
cade quantum well design or tunneling junction which will 0.4um pGaN – acceptor: 12x1018 / cm3
dramatically improve carrier injection into the quantum well
0.045um thick EBL (AlxGaN(1-x) x=0.15) acceptor: 12x1018 / cm3
regions and to increase efficiency by over 100%.
0.015um thick GaN spacer
Despite the fact that all of these LED structures are basi-
cally based on the conventional LED structure, it is still not 8 pairs of InxGaN(1-x) /GaN well(x=0.17)
known about the correct simulation models and how to 3um nGaN donor-5x1018 / cm3
take into account experimental observation such as trap-
assisted tunneling through trap states in the quantum well * spacer and well/barrier have unintentionally doped
region, the amount of actual polarization, and polarity. donor level~2x1018 / cm3
Figure 1. Carrier density profile with different band-offset ratio(left: 70% band-offet, right:50% band-offet) red color is electron concentra-
tion and blue color is hole concentration.
(3) Limitation of Drift-diffusion Simulation For these reasons, we recently developed a new capture-
From previous simulation results, even though we ad- escape model which calculates the exact 2D bound carrier
justed the band-offset to a lower value to get high elec- density in the well regions with detailed carrier capture
tron concentration in the first few quantum well regions, from the bulk barrier and escape from the well into the
the hole and electron profile in barrier regions is very low barrier by adding probability of carrier capture-escape
and abrupt at the interface. This is related to lower carrier mechanism into carrier rate equation.
penetration to barrier from well regions. We will discuss The purpose of the article is to show the validation of
this more details in section 2-4. new capture-escape model through comparison with ex-
We studied in the forward current behavior depending perimental data and to give some guidelines for optimiz-
on the number of quantum well with drift-diffusion ing new models for real LED simulation.
without capture-escape model. It shows that the IV shifts General 3D carrier density rate equations are now modi-
to higher forward voltage when number of quantum well fied into following form.
increases at fixed positive the polarization and is related to
increased series resistance of quantum well/barrier regions n3D is the bulk carrier density and Cn3D->2D is capture-
caused by low carrier density in the barrier regions. Also escape rate from this bulk carrier to 2D carrier in the well.
when we increase the polarization charge from 0 to 50%
(1)
then it will also increase the forward voltage (Figure 2).
This is unrealistic behavior as we can see in a real LED
(2)
operation. So we can conclude that drift-diffusion solution
cannot alone explains current behavior very well. 2D carrier density rate equations in the well regions become
(8)
The carrier profile without capture-escape model shows polarization is downward and built-in electric field is
that electron concentration in the barrier region is far be- opposite direction. Figure 6. shows that polarity inver-
low 1x1010/cm3 in 1st barrier and hole concentration is sion significantly affects the forward voltage. The actual
decreased to below 1x10/cm^3 at the 3rd barrier region. amount of polarization by screening effect from various
But the carrier concentrations in the barrier by capture- defects(dislocation or V-defect) is very hard to estimate
escape model are smoothly decayed from quantum well and optimize to fit the experimental forward current.
region and have 1x1014/cm3 in the first two quantum Most simulation tasks so far normally use polarization
well/barrier pairs. We can conclude from this result that between 20% and 80% from the theoretical value but it is
capture-escape model accurately describes the exact the a very broad range to adjust to fit forward current.
carrier profile and so explains why drift-diffusion solu-
When we use polarization we should keep in mind that
tion always produces high forward voltage when the
the polarization is globally scaled from theoretical cal-
number of quantum well is increased.
culation which is not true in actual polarization of each
layer. To simulate more accurate polar-GaN LEDs it is
3. Material Growth and Trap-Assisted very important to understand the underlying polariza-
Tunneling (TAT) tion in each layer.
So far we have used the positive polarization scheme, in
Also, if non-negligible traps in the quantum well ex-
which polarization is directed toward to bottom interface
ist, there are some possibilities that electron can tunnel
as in Ga-face growth condition. But polarity is still un-
from n-side to p-side region via trap-assisted tunneling
certain because it is very dependent on which substrate
mechanisms.
buffer layer is used and also on growth condition.
For this purpose, we simulated trap-assisted tunneling
The default polarity in Atlas uses positive convention
to see the effect on forward tunneling current in a single
which is positive charge at the bottom interface and
quantum well case.
negative charge at the top interfac the. So direction of
(9)
Figure 7. forward current behavior by donor trap and trap-as- Figure 8. Ambient temperature effect on forward current(left:
sisted tunneling(red: without traps and TAT, blue: with trap only, negative polarity, right: positive polarity).
light blue: traps + TAT). Left plot is negative polarization case and
right plot is positive polarization case.
To fit the low and medium bias range SRH life time
is most dominant fitting parameters which are well
explained in ABC model and Auger coefficient is the
Figure 10. IL curve fitting result to experimental data. Figure 11. EQE plot(left is linear scale and right is log scale).
The internal quantum efficiency (IQE) is defined as Rrad Because trap-assisted tunneling is very important mech-
/( Rrad + Rnon_rad). anism in low and medium bias ranges, we fitted to the
experimental data[6] through Atlas trap-assisted tunnel-
The radiative rate (Rrad) is the total radiative rate which ing model with the capture-escape approach. For this
is mostly coming from quantum well regions and the purpose, we took into account of mid-gap traps states in
non-radiative rate (Rnon_rad) is the sum of each SRH quantum well region where is the most probable path for
and Auger recombination rate. tunneling via trap site. Because field enhancement term
As we can see from Figure 13, the carrier profile is very of TAT is strongly dependent on local field in SRH re-
different with drift-diffusion solution (Figure 1.) combination rate, the most important fitting parameter is
actual polarization charge which is also affected by well
The carrier concentration is much higher in barrier re- Indium composition, defects, and well thickness.
gions than the profile by the drift-diffusion solution.
We used tunneling effective mass to fit the experimental
Because the standard LED has AlGaN EBL layer to block data and Figure 14 shows reproducing the experimental
electron current from n-side, there is small leakage cur- forward current behavior except below 2.0V. Accord-
rent and most current flows into the quantum well and ing to the paper, difference below 2.0V could be due to
then recombines to give spontaneous or non-radiative heavy-hole tunneling. We need to study more about this
rate. Some references define the external quantum effi- in another trap-assisted tunneling mechanism.
ciency as the following equation.
(10)