Mech302-HEAT TRANSFER HOMEWORK-7 Solutions

1. (Problem 7.56 in the Book) Hot water at 50oC is routed from one building in which it
is generated to an adjoining building in which it is used for space heating. Transfer
between buildings occurs in a steel pipe (k=60 W/mK) of 100-mm outside diameter
and 8-mm wall thickness. During winter, representative environmental conditions
involve air at T∞ = −5oC and V = 3 m/s in cross flow over the pipe.
a. If the cost of producing the hot water is $0.1 per kWh, what is the representative daily
cost of heat loss from an uninsulated pipe to the air per meter of pipe length? The
convection resistance associated with water flow in the pipe may be neglected.
b. Determine the savings associated with application of a 10-mm-thick coating of
urethane insulation (k=0.026 W/mK) to the outer surface of the pipe.
Schematic

Assumptions
(1) Steady-state, (2) Negligible convection resistance for water flow, (3) Negligible contact
resistance between insulation and pipe, (4) Negligible radiation.
Properties
Table A-4, air (p = 1atm, Tf ≈ 300K): ka = 0.0263W/ m⋅K, ν = 15.89×10−6m2 / s, Pr = 0.707.
Analysis
(a) With ReD = VDo /ν= 3m/ s × 0.1m /15.89 × 10-6 m2 / s = 18,880, application of the
Churchill-Bernstein correlation yields

Without the insulation, the total thermal resistance and heat loss per length of pipe are then
Mech302-HEAT TRANSFER HOMEWORK-7 Solutions

The corresponding daily energy loss is

and the associated cost is

(b) The conduction resistance of the insulation is

and the total resistance is

The heat loss and cost are then

The daily savings is then

Comments
(1) The savings are significant, and the pipe should be insulated. (2) Assuming a negligible
temperature drop across the pipe wall, a pipe emissivity of εp = 0.6 and surroundings at Tsur =
268K, the radiation coefficient associated with the uninsulated pipe is hr = εσ (T + Tsur ) (T2 +
Tsur2 ) = 0.6 ×5.67 ×10-8 W/ m2 K4 (591K) (3232 + 2682 )K2 = 3.5W/ m2 ⋅K. Accordingly,
radiation increases the heat loss estimate of Part (a) by approximately 17%.
Mech302-HEAT TRANSFER HOMEWORK-7 Solutions

2. (Problem 7.69 in the book) A thermocouple is inserted into a hot air duct to measure
the air temperature. The thermocouple (T1) is soldered to the tip of a steel
thermocouple well of length L = 0.1 m and inner and outer diameters of Di = 5 mm
and Do = 8 mm. A second thermocouple (T2) is used to measure the duct well
temperature. Consider conditions for which the air velocity in the duct is V = 5 m/s
and the two thermocouples register temperatures of T1 = 450 K and T2 = 375 K.
Neglecting radiation, determine the air temperature T∞ . Assume that, for steel, k = 35
W/m.K, and for air, ρ = 0.774 kg/m3 , μ = 251×10−7N⋅s/m2 , k = 0.0373 W/mK.
Schematic

Assumptions
(1) Steady-state conditions, (2) Constant properties, (3) One-dimensional conduction along
well, (4) Uniform convection coefficient, (5) Negligible radiation.
Properties
Steel (given): k = 35 W/m⋅K; Air (given): ρ = 0.774 kg/m3, μ = 251×10-7 N⋅s/m2, k =
0.0373 W/m⋅K, Pr = 0.686.
Analysis
Applying Equation 3.75 at the well tip (x = L), where T = T1,
Mech302-HEAT TRANSFER HOMEWORK-7 Solutions

Comments
Heat conduction along the wall to the base at 375 K is balanced by convection from the air.
Mech302-HEAT TRANSFER HOMEWORK-7 Solutions

3. (Problem 7.77 in the book) A spherical, underwater instrument pod used to make
soundings and to measure conditions in the water has a diameter of 85 mm and
dissipates 300 W.
a. Estimate the surface temperature of the pod when suspended in a bay where the
current is 1 m/s and the water temperature is 15oC.
b. Inadvertently, the pod is hauled out of the water and suspended in ambient air without
deactivating the power. Estimate the surface temperature of the pod if the air
temperature is 15oC and the wind speed is 3 m/s.
Schematic

Assumptions
(1) Steady-state conditions, (2) Flow over a smooth sphere, (3) Uniform surface temperatures,
(4) Negligible radiation heat transfer for air (a) condition, and (5) Constant properties.
Properties
Table A-6, Water (T∞ = 15°C = 288 K): μ = 0.001053 N⋅s/m2, ν = 1.139 × 10-6 m2/s, k =
0.5948 W/m⋅K, Pr = 8.06; Table A-4, Air (T∞ = 288 K, 1 atm): μ = 1.788 × 10-5 N⋅s/m2, ν
= 1.482 × 10-5 m2/s, k = 0.02534 W/m⋅K, Pr = 0.710 ; Air (Ts = 945 K): μs = 4.099 × 10-5
N⋅s/m2.
Analysis
The energy balance for the submersed-in-water (w) and suspended-in-air (a) conditions are
represented in the schematics above and have the form
Mech302-HEAT TRANSFER HOMEWORK-7 Solutions

Comments
(1) While submerged and dissipating 300 W, the pod is safely operating at a temperature
slightly above that of the water. When hauled from the water and suspended in air, the pod
temperature increases to a destruction temperature (672oC). The pod gets smoked!
(2) The assumption that μ/μs ≈ 1 is appropriate for the water (w) condition. For the air (a)
condition, μ/μs = 0.436 and the final term of the correlation is significant. Recognize that
radiation exchange with the surroundings for the air condition should be considered for an
improved estimate.
(3) Why such a difference in Ts for the water (w) and air (a) conditions? From the results table
note that the ReD, NuD, and h D are, respectively, 4x, 7x and 170x times larger for water
compared to air. Water, because of its thermophysical properties which drive the magnitude
of h D , is a much better coolant than air for similar flow conditions.
Mech302-HEAT TRANSFER HOMEWORK-7 Solutions

4. (Problem 7.88 in the book) A silicon chip (k = 150 W/mK, ρ = 2300kg/m3 , cp = 700
J/kgK), 10 mm on a side and 1 mm thick, is connected to a substrate by solder balls (k
= 40 W/mK, ρ =10,000kg/m3 , cp=150 J/kgK) of 1-mm diameter, and during an
accelerated thermal stress test, the system is exposed to the flow of a dielectric liquid
(k = 0.064 W/mK, ν =10−6 m2 / s , Pr=25). As first approximation, treat the top and
bottom surfaces of the chip as flat plates in turbulent, parallel flow and assume the
substrate and lower chip surfaces to have a negligible effect on flow over the solder
balls. Also assume point contact between the chip and the solder, thereby neglecting
heat transfer by conduction between the components.
a. The stress test begins with the components at ambient temperature (Ti = 20oC) and
proceeds with heating by the fluid at T∞ = 80oC . If the fluid velocity is V = 0.2
m/s, estimate the ratio of the time constant of the chip to that of a solder ball.
Which component responds more rapidly to the heating process?
b. The thermal stress acting on the solder joint is proportional to the chip-to-solder
temperature difference. What is temperature difference 0.25 s after the start of
heating?
Schematic

Assumptions
(1) Solder balls and chips are spatially isothermal, (2) Negligible heat transfer from sides of
chip, (3) Top and bottom surfaces of chip act as flat plates in turbulent parallel flow, (4) Heat
transfer from solder balls may be approximated as that from an isolated sphere, (5) Constant
properties.
Properties
Given. Dielectric liquid: k = 0.064W/m⋅K,ν =10−6m2 / s, Pr = 25; Silicon chip: 3 ; k =
150W/m⋅K, ρ = 2300 kg /m3 , cp = 700 J / kg ⋅K Solder ball: k = 40W/ m⋅K, ρ =10,000 kg
/m3 , cp =150 J / kg ⋅K
Analysis
(a) From Eq. 5.7, the thermal time constant is τt = (ρVc / h As ). Hence,
Mech302-HEAT TRANSFER HOMEWORK-7 Solutions

Hence, the solder responds much more quickly to the convective heating.
(b) From Eq. 5.6, the chip-to-solder temperature difference may be expressed as

Comments
(1) The foregoing process is used to subject soldered chip connections (a major reliability
issue) to rapid and intense thermal stresses. (2) Some heat transfer by conduction will occur
between the chip and solder balls, thereby reducing the temperature difference and thermal
stress. (3) Constriction of flow between the chip and substrate will reduce h sld , as well as h ch
at the lower surface of the chip, relative to values predicted by the correlations. The
corresponding time constants would be increased accordingly. (4) With Bich = h ch (t / 2) /

kchip = 0.001 << 1 and Bisld = h sld (D / 6) / ksld = 0.008 << 1, the lumped capacitance analysis
is appropriate for both components.