System Engineering and Development and Test of The Adcs Breadboard For Swisscube

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Master Project 2007
Phase B
System
Engineering and
development and
test of the ADCS
breadboard for
SwissCube
Student:
Bastien Despont
Professor:
Borgeaud Maurice
Advisor:
Noca Muriel
y
EPFL
Lausane
Switzerland
y
2/24/2007
y
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RECORD OF REVISIONS
ISS/REV Date Modifications Created/modified by

1/0 8.01.2007 First release Bastien Despont
1/1 22.01.2007 Report structure Bastien Despont
st
1/2 15.02.2007 Corrections after 1 review Bastien Despont
1/3 18.02.2007 System engineering part Bastien Despont
1/4 21.02.2007 Abstract and work package Bastien Despont
Ref.: S3-B-ADCS-1-4-AHWreport.doc
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RECORD OF REVISIONS................................................................................................................................... 2
FOREWORD........................................................................................................................................................ 10
1 INTRODUCTION ...................................................................................................................................... 11
1.1 CUBESAT 11
1.2 SWISSCUBE 12
1.3 ADCS 13
2 DESIGN REQUIREMENTS AT LEVEL 4 ............................................................................................. 14
2.1 FUNCTIONAL REQUIREMENTS 14
2.2 MISSION & PERFORMANCE REQUIREMENTS 15
2.2.1 Subsystem modes 15
2.2.2 Subsystem states 15
2.2.3 Subsystem H/W performances 16
2.2.4 Subsystem S/W performances 17
2.2.5 Reliability and redundancy 17
2.3 DESIGN REQUIREMENTS 17
2.3.1 Constraints 17
2.3.2 Thermal 18
2.3.3 Maintainability 18
2.4 INTERFACE REQUIREMENTS 19
2.4.1 Structural Interfaces 19
2.4.2 Thermal Interfaces 19
2.4.3 Electrical Interfaces 19
2.4.4 Data Interfaces 20
2.4.5 Physical Interfaces 20
2.5 ENVIRONMENTAL REQUIREMENTS 20
2.5.1 Thermal 20
2.5.2 Static and dynamic loads 21
2.5.3 Vacuum 21
2.5.4 Radiation 21
2.6 OPERATIONAL REQUIREMENTS 21
2.6.1 Autonomy 21
2.6.2 Control 21
2.6.3 Failure management 22
3 DESIGN REQUIREMENTS AT LEVEL 5 ............................................................................................. 23
3.1 FUNCTIONAL REQUIREMENTS 23
3.2 MISSION & PERFORMANCE REQUIREMENTS 25
3.2.1 Subsystem modes 25
3.2.2 Subsystem states 25
3.2.3 Subsystem H/W performances 25
3.2.4 Subsystem S/W performances 28
3.2.5 Reliability and redundancy 28
3.3 DESIGN REQUIREMENTS 29
3.3.1 Constraints 29
3.3.2 Thermal 30
3.3.3 Maintainability 30
3.4 INTERFACE REQUIREMENTS 31
3.4.1 Structural Interfaces 31
3.4.2 Thermal Interfaces 31
3.4.3 Electrical Interfaces 32
3.4.4 Data Interfaces 33
3.4.5 Physical Interfaces 33
3.5 ENVIRONMENTAL REQUIREMENTS 34
3.5.1 Thermal 34
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3.5.2 Static and dynamic loads 35

3.5.3 Vacuum 35
3.5.4 Radiation 36
3.6 OPERATIONAL REQUIREMENTS 36
3.6.1 Autonomy 36
3.6.2 Control 37
3.6.3 Failure management 37
4 DESIGN ASSUMPTIONS AND APPROACH........................................................................................ 39
4.1 APPROACH 39
4.2 DISTURBANCES 39
4.3 ELECTRICAL AND DATA ASSUMPTIONS 40
4.4 HARDWARE 41
5 TECHNICAL DESCRIPTION ................................................................................................................. 42
5.1 SENSORS 42
5.1.1 Sun sensors 42
5.1.2 Magnetometers 44
5.1.3 Gyroscopes 45
5.1.4 The All-in-one sensor 46
5.1.5 Sensor summary 47
5.2 ACTUATORS 48
5.2.1 Magnetotorquers 48
5.2.2 IWA 52
5.3 MAIN PRINTED CIRCUIT BOARD 52
5.3.1 Magnetometer 53
5.3.2 Gyroscopes 54
5.3.3 Sun sensors electronic 55
5.3.4 Latch-up protection 56
5.3.5 Magnetotorquer driver stage 57
5.3.6 Microcontroller 58
5.3.7 Connector and reset button 59
5.3.8 Electrical and data Interfaces 61
5.4 FUNCTIONAL/FLOW DIAGRAMS AND SOFTWARE CONSIDERATIONS 62
5.4.1 Preliminary functional analysis 62
5.4.2 Flow analysis 62
5.4.3 Software functions 65
6 TESTS ......................................................................................................................................................... 66
6.1 MAIN BOARD 66
6.1.1 Test objectives 66
6.1.2 Identification and configuration of the test article 66
6.1.3 Test set-up identification 66
6.1.4 Test conditions 67
6.1.5 Step by step instruction for operation 67
6.1.6 Safety and security instructions 67
6.1.7 Personal required and responsibility 67
6.2 SUN SENSORS 67
6.2.2 Identification and configuration of sun sensor 67
6.3 GYROSCOPES 68
6.3.2 Identification and configuration of the gyroscope 68
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6.4 MAGNETOTORQUERS 69
6.4.2 Identification and configuration of the magnetotorquers 69
6.5 TESTS AFTER INTEGRATION 70
6.6 RESULTS 70
7 RECOMMENDATIONS ........................................................................................................................... 71
8 SYSTEM ENGINEERING........................................................................................................................ 72
8.1 MASS BUDGET 72
8.2 POWER BUDGET 73
8.2.1 Assumptions 73
8.2.2 Power production profile 74
8.2.3 Power modes 75
8.2.4 Consumption scenario 76
9 CONCLUSION ........................................................................................................................................... 77
10 REFERENCES ........................................................................................................................................... 78
11 ABBREVIATED TERMS.......................................................................................................................... 79
12 CONTACT LIST ........................................................................................................................................ 79
13 SIGNATURE .............................................................................................................................................. 79
APPENDIX A DISTURBANCES ............................................................................................................... 80
A.1 FORMULAS 80
A.1.1 Solar radiation 80
A.1.2 Gravity-gradient 80
A.1.3 Aerodynamic 81
A.1.4 Magnetic field 81
A.2 ASSUMPTIONS 82
A.2.1 Solar pressure 82
A.2.2 Gravity-gradient 82
A.2.3 Magnetic field 82
A.2.4 Aerodynamic 83
A.3 RESULTS 84
A.4 MATLAB SCRIPT : DISTURBANCES.M 85
APPENDIX B PCB LAYOUT AND ELECTRICAL SCHEMATIC...................................................... 88
B.1 SUN SENSORS 88
B.1.1 Electrical schematic 88
B.1.2 Component list 89
B.1.3 Sun sensor pcb layout 89
B.2 GYROSCOPES IN Z-AXIS (PCB REFERENCE FRAME) 90
B.2.1 Electrical schematic 90
B.2.2 Component list 90
B.2.3 Gyroscope 3rd axis pcb layout 90
B.3 MAGNETOTORQUERS 91
B.3.1 MatLab scripts for dimensioning 91
B.3.2 Drawings for magnetotorquers winding 96
B.3.3 Choice of the conducting wire 99
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B.4 MAIN BOARD 102

B.4.1 Board schematic 102
B.4.2 Components list 103
B.4.3 Main board pcb layout 104
B.4.4 Electrical data interfaces 105
B.4.5 Microcontroller current 106
APPENDIX C OTHER DOCUMENTATION ........................................................................................ 106
Space Center Abstract Master Project 23.02.2007
System Engineering and development and test of the ADCS breadboard for
SwissCube
Bastien Despont, Section Micro engineering
Assistant: Muriel Noca
Professor: Borgeaud Maurice
determination & control and a payload. The

The EPFL Space Center is currently system engineering team makes sure that all
developing the first entirely Swiss satellite, the subsystems are compatible and come to
called SwissCube. The satellite is designed a system.
following the CubeSat standards, cubic
external shape, one kilogram maximal mass ADCS
and one liter maximal volume. The
SwissCube scientific task is to take pictures The main part of the master project concerns
of the AirGlow, a light emitting the development of a breadboard for the
phenomenon occurring in the low Earth ADCS with the sensors and the actuators.
atmosphere. The satellite will be launched in The SwissCube shall be able to determine
2008 on a low Earth orbit between 400 and and control its attitude on the three axes to
1000 kilometers take the pictures. For the determination,
three types of sensors are used,
magnetometers, gyroscopes and sun sensors.
The determination algorithm will use the
sensor data to compute the state vector of
the satellite. For the control of the satellite
three perpendicular magnetic coils are used
as the main actuators. They interact with the
Earth magnetic field to generate torques.
The control algorithm will generate the
command values for the
actuators.
SwissCube
This master project focuses on two different

subjects, system engineering tasks and the
development of a breadboard for the
Attitude Determination and Control
Subsystem (ADCS) for the SwissCube.
System engineering
The satellite is composed of seven different

subsystems, power, thermal, structure &
ADCS development board
configuration, command & data
management, communication, attitude
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PROJECT: SwissCube Satellite PHASE: B WP REF: 1100
Master Project Title: System Engineering and development and test Sheet 1 of 2
of the ADCS breadboard for SwissCube
Issue Ref: 1
Responsible: EPFL-Space Center, Muriel Noca
Student: Bastien Despont Issue Date:
05-10-06
Start Date: 23-10-06

End Date: 28-02-07
Introduction and schedule
This Work Package summarizes the work expected from the Space Center student during
phase B (master’s project) of the SwissCube Project. The expected duration of the work is
4½ months. The student shall:
• Prepare a schedule for the planning of his work with milestones. Any deviation
from the plan shall be reported;
• Perform the technical work with supervision from Space Center, the HEVS
Laboratory from Prof. Moerschell and the Project Engineering Team;
• Attend appropriate engineering meetings and prepare for major reviews;
• Deliver an end-of-project report and support additional documentation when and
if necessary.
The project includes two main tasks. First the student shall continue partially his system
engineering duties during no more than 20% of the time. These duties will ensure consistency
of the satellite design at the system level. The second task consists of developing and testing
the hardware breadboard for the Attitude Determination and Control of the satellite. This
second task will be done under the supervision of Prof. Moerschell from the HEVS and is
expected to be done at least 80% of the time.
The system engineering task and the definition phase of the hardware task will be done
mainly at EPFL. Hardware implementation, integration and test will be done mainly at
HEVS.
Technical Work Description

System Engineering Task (20%)
This task includes the following subtasks:
- Continue system design iterations;
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- Continue book-keeping of the system budgets;

- Elaborate interface requirements (electrical, mechanical, data and thermal) in
cooperation with the rest of the System Engineering team;
- Complete functional analysis in cooperation with the flight SW.
ADCS Hardware (HW) Task (80%)
This task can be divided in three phases for clarity:
First phase:
- Gather information about sensors & actuators performances and manufacturers;
- Write hardware functionalities (what does the subsystem need to do?);
- Define the ADCS HW design (how it is going to perform the functionalities?) taking
into account electrical, mechanical, thermal and data interfaces, and environmental
constraints;
- Define required performances (how well does the subsystem need to do it?), taking
into account electrical, mechanical, thermal and data interfaces, and environmental
constraints. Compare with available hardware performances. Select hardware
components;
- Define operational requirements (how is the hardware going to be operated?).
Second phase:
- Purchase/procure HW;
- Model performances;
- Implement design on a breadboard respecting design rules used for the qualification
and flight models.
Third phase:
- Write breadboard functional test objectives and test procedure;
- Test breadboard for functionalities and performance characterization under electrical
and thermal environment.
Final phase
- Write test report and design report.
Deliverables:
- A report including all technical assessments;
- A breadboard for the ADCS HW subsystem;
- A presentation at the Preliminary Design Review that will conclude Phase B;
- A disk containing all analysis and documentation files for records.
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FOREWORD
This Master project consists of a written thesis reporting the background, design processes and
outcomes of a project conducted at the EPFL under the supervision of Mrs. Muriel Noca. It began
October 23 2006 and will finish March 5 2007 with the Phase B Review (Preliminary Design
Review).
The development of the ADCS hardware was divided in three different projects, the inertia wheel
and motor, the command electronic for the motor and the main part of the ADCS hardware. This
document summarizes the work done on the main part of the ADCS hardware during a Master
thesis at EPFL. The duration of this project was four month. This task was done 80% of the time in
parallel with other system engineering tasks (20%). This report summarizes mainly the work done on
the ADCS.
This report presents first the ADCS hardware specifications, then all the assumptions that were
made and the approach that was used to fulfill the objectives. The third part presents the actual
design of the ADCS hardware. In the forth part the test procedures, the test plan and some results
are presented. The last part summarizes recommendations for the future work. Some system
information is presented just before the conclusion.
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1 INTRODUCTION
The main purpose of this report is to present the development of the functional design for the
Attitude determination and control subsystem (ADCS) of the picosatellite SwissCube. The
SwissCube is the first entirely Swiss picosatellite program. The SwissCube project is based on the
CubeSat program started by Stanford University and California Polytechnic State University
(CalPoly).
1.1 CubeSat
The CubeSat project is a joint venture between California Polytechnic State University San Luis
Obispo and Stanford University’s Space Systems Development Laboratory. Started in 1999 the
purpose of the CubeSat project is to provide a conventional standard for the design and
development of picosatellites such that a common deployer can be used [R1]. The project attempts
to reduce the cost and development time generally associated with satellite design, consequently
increasing the accessibility to space for educational purposes. Currently there are more than 80
institutions around the world taking part or took part in the development of CubeSats.
The fundamental defining feature of the CubeSat standard is its dimensions. The standard specifies
that the satellite must have the geometry of 10cm3 cube with a mass of no more than 1kg and that
the center of gravity must be within 2cm of the geometrical center. The standard also specifies
several other important guidelines that must be followed, which will be dealt with as the design
progresses. The standards are outlined in the CubeSat Specification Document [R2]. It is the
purpose of the specification document to ensure that each satellite developed will integrate properly
with the deployer and will not interfere with other satellites, payloads or the launch vehicle. Figure 1
is an example of a CubeSat design. It has been included to give an understanding of the basic
external geometry of a typical CubeSat.
Figure 1: Example of a CubeSat (Aalborg University)
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1.2 SwissCube
SwissCube is the picosatellite being designed by students and staff at the Swiss Federal Institute of
Technology Lausanne (EPFL) to be developed and launched in line with the CubeSat specifications.
The primary objective of developing this satellite is to provide a dynamic and realistic learning
environment for undergraduates, graduates and staff in the development of small satellite
technology [R3]. As a secondary objective it is hoped that the picosatellite will be able to house a
science payload with the aim to take optical measurements and characterize the Nightglow
phenomena (see Figure 2) over all latitudes and longitudes for at least a period of 3 months, with
extended science mission duration up to 1 year [R4].
Figure 2: The Nightglow phenomena [R3].
In the design of the SwissCube, each of the subsystems like ADCS, EPS, etc., is being treated as an
individual component and managed by a specific group of the SwissCube Team. Although each
subsystem is being designed independently it is important to remember that each component is only
one part of the complete satellite. Therefore to maintain a high level of integration between the
various subsystems continuous communication and discussion is maintained between the designers
of the individual subsystems. This report focuses on the ADCS hardware of the picosatellite.
Introduction: [R12]
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1.3 ADCS
The ADCS hardware is the link between the physical state of the satellite and the algorithms that
permit to determine and control the attitude. The current baseline design for the determination part
of the ADCS subsystem includes magnetometers, gyroscopes and sun sensors. For the control the
current baseline assumes 3 magnetic torquers for nominal operations and an inertial wheel for
technology assessment.
The objectives of the ADCS Hardware project were divided into four phase. In the first phase the
goal was to gather information about the various foreseen sensors and actuators in the phase A, to
make a functional analysis and finally to write requirements and check the chosen hardware. The
hardware was purchased and procured during the second phase, and the design of the bread board
was implemented. In parallel, the ADCS functional analysis was refined and transformed in a flow
diagram for the future work on the software. The third phase focused on the tests. The test plan and
procedures were written and the tests were performed on the board.
Figure 3 shows the hardware block diagram of the ADCS board. The interfaces are thus data
transfer (black line) with the ADCS microprocessor, power from the EPS, represented as the blue
line on Figure 3 and connections with the actuators and the sun sensors that are placed behind the
side panels.
Figure 3: ADCS subsystem hardware block diagram.
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2 DESIGN REQUIREMENTS AT LEVEL 4
The level 4 requirements are requirements that are related to the whole subsystem. The definitions
and rules are defined in [R5].
2.1 Functional Requirements

4_ADCS_10_01: Interface
The ADCS shall provide an interface between sensors and CDMS as well as
between CDMS and actuators. This includes the following functions:
Receive cmd from and send TM to CDMS
Power and command acutators
Power, command and receive TM, store and format data from sensors
To fulfill mission objective 3
3_SSR_10_02
4_ADCS_10_02: Determination
The ADCS subsystem shall provide determination of the attitude of the
satellite.
To fulfill mission objective 3
3_SSR_24_02
4_ADCS_10_03: HK
The ADCS shall provide HK to determine its health.
To monitor health of the Space system
3_SSR_63_02
4_ADCS_10_04: Attitude control
The ADCS shall provide a control for the attitude of the satellite.
Pointing stability
3_SSR_24_04
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2.2 Mission & Performance Requirements

2.2.1 Subsystem modes
4_ADCS_21_01: Subsystem modes
The ADCS system shall have the following modes: “WHEEL”,
“NOMINAL”, “SENSOR”, “STAND-BY” and “OFF” modes.
To fulfill its function
4_ADCS_10_01
4_ADCS_21_02: “OFF” mode
In this mode the whole subsystem shall be turned off.
Off mode definition
4_ADCS_21_01
4_ADCS_21_03: “STAND-BY” mode
In this mode only the microcontroller shall be on and waiting for a command.
Stand-By mode definition
4_ADCS_21_01
4_ADCS_21_04: “SENSOR” mode
In this mode only the microcontroller and all the sensors shall be turned on.
Actuators shall be switched off.
Attitude determination
4_ADCS_10_02
4_ADCS_21_05: “NOMINAL” mode
In this mode the microcontroller, the sensors and the actuators shall be on.
The IWA shall be switched off.
Attitude determination and control
4_ADCS_10_04
4_ADCS_21_06: “WHEEL” mode
In this mode the microcontroller, the sensors and all the actuators shall be on.
Attitude determination and control
4_ADCS_10_04
2.2.2 Subsystem states
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2.2.3 Subsystem H/W performances

4_ADCS_23_01: Consumption in “OFF” mode
The ADCS shall not consume any power in “OFF” mode.
SSR power budget
4_ADCS_23_02: Consumption in “STAND-BY” mode
The ADCS shall consume less than [30] mW in “STAND-BY” mode.
SSR power budget
4_ADCS_23_03: Consumption in “SENSOR” mode
The ADCS shall consume less than [90] mW in “SENSOR” mode.
SSR power budget
4_ADCS_23_04: Consumption in “NOMINAL” mode
The ADCS shall consume less than [250] mW in “NOMINAL” mode.
SSR power budget
4_ADCS_23_05: Consumption in “WHEEL” mode
The ADCS shall consume less than [300] mW in “WHEEL” mode.
SSR power budget
4_ADCS_23_06: Attitude determination
The ADCS subsystem shall provide determination data of the attitude of the
satellite with an accuracy of [10] degrees on each axis.
MSR
3_SSR_24_02
4_ADCS_23_07: Attitude control
The ADCS subsystem shall provide a control for the attitude of the satellite
with a stability [3] deg/s.
MSR
3_SSR_24_04
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2.2.4 Subsystem S/W performances

4_ADCS_24_01: Command data
The ADCS shall accept the command signal for the actuators control
electronics at least once every [10] seconds.
Control algorithm
4_ADCS_24_02: Data transmission
The ADCS shall be able to send attitude and HK sensors data at specific
requests from the CDMS.
To fulfill its function
4_ADCS_10_01
2.2.5 Reliability and redundancy

4_ADCS_25_02: Latch up protection
The ADCS shall be designed with separate latch-up protection circuit.
To mitigate SEL
3_SSR_25_01
4_ADCS_25_03: SEU
ADCS H/W and S/W design for critical functions shall mitigated possible
SEUs.
Protection
3_SSR_25_01
4_ADCS_25_04: Tests
Reliability of the electrical systems shall be demonstrated by tests.
Tests requirements
3_SSR_25_02
2.3 Design Requirements

2.3.1 Constraints
4_ADCS_31_01: Outgassing
The ADCS materials shall have a Total Mass Loss (TML) ≤ 1 % and a
Collected Volatile Condensable Material (CVCM) ≤ 0.1 %.
Arianespace user’s manual.
3_SSR_31_15
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4_ADCS_31_02: Launch date

The ADCS shall be ready for integration in the Engineering Qualification
Model by December 2007.
Launch date deadline.
3_SSR_31_09
4_ADCS_31_03: Contamination
NASA approved materials shall be used whenever possible to prevent
contamination of other spacecraft during integration, testing and launch.
CalPoly spec.
3_SSR_31_13
2.3.2 Thermal
4_ADCS_32 _01: Temperature
The ADCS shall be capable of measuring its temperature.
Thermal analysis.
3_SSR_32_03
4_ADCS_32 _02: Temperature control
The ADCS shall have a passive temperature control.
Thermal analysis.
3_SSR_32_03
4_ADCS_32 _03: Thermal design
The thermal design of the board shall ensure that all components are
maintained within their qualification temperature range throughout the
lifetime of the subsystem.
Thermal analysis.
3_SSR_32_02
2.3.3 Maintainability
4_ADCS_33 _01: Electrostatic sensibility
The ADCS shall be handled with precaution against electrostatic discharges.
Manufacturer recommendation.
3_SSR_33_01
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4_ADCS_33 _02: Maintenance during storage and ground operation

The ADCS shall be designed to require no maintenance during storage and
ground life. If ground maintenance during storage or ground operation cannot
be avoided, the maintenance requirements shall be documented.
To survive storage and ground life
3_SSR_33_01
2.4 Interface Requirements

2.4.1 Structural Interfaces
4_ADCS_41_01: Attachment
The ADCS shall be attached on the frame.
S&C
4_SC_10_02
2.4.2 Thermal Interfaces

4_ADCS_42_01: Subsystem
Thermal interfaces optimized considering the whole satellite thermal design.
TH
3_SSR_32_02
2.4.3 Electrical Interfaces

4_ADCS_43_01: Supply voltage
The ADCS shall use 3.3V or 5V. Any deviations shall be discussed with the
EPS and System Engineering Team. (Requirement to be refined). 3.3 Volt
shall be preferred.
EPS.
4_ADCS_43_02: Current
The ADCS shall use less than [150] mA.
EPS.
4_ADCS_43_03: Connectors
The ADCS shall use connectors compatible with the main data bus and the
power bus.
SSR.
4_ADCS__10_01
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2.4.4 Data Interfaces

4_ADCS_44_01: Data bus compatibility
The ADCS shall be capable of communicating with the main data bus.
Same data bus for the whole satellite.
4_ADCS_10_01
4_ADCS_44_02: TM
The ADCS generate TM with all the sensors and the IWA data.
SSR
4_ADCS_10_01
2.4.5 Physical Interfaces

4_ADCS_45_01: Size
The ADCS size shall be adapted to the structure.
S&C, detail shall be discussed with mechanical engineer
4_SC_10_01
4_ADCS_45_02: Mass
The ADCS mass shall weight less than [120] grams.
Mass budget.
3_SSR_45_01
2.5 Environmental Requirements

4_ADCS_50_01: Environment
The ADCS operates under the environment constraints described in the
SwissCube Environment Requirements document [REF].
SSR.
3_SSR_50_01
2.5.1 Thermal
4_ADCS_51_01: Thermal
The ADCS subsystem shall operate at a temperature range between [-30 and
+80 TBR] degrees Celsius.
Thermal analysis
4_ADCS_50_01
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2.5.2 Static and dynamic loads

4_ADCS_52_01: Acceleration
The ADCS shall withstand a maximal acceleration of [10,4] g including
margins.
Launch environment constraints
3_SSR_52_02
2.5.3 Vacuum
4_ADCS_53_01: Vacuum
The ADCS subsystem shall operate under vacuum conditions.
PR
3_SSR_53_01
2.5.4 Radiation
4_ADCS_54_01: Total dose
The ADCS shall support a TID of maximum [37.4]kRad.
Analysis using ESA Spenvis Tool, This is the value for 1 year in orbit
3_SSR_54_02
2.6 Operational Requirements

2.6.1 Autonomy
4_ADCS_61_01: Life time
The ADCS shall have a life time of [4] months after commissioning phase.
The lifetime can be extended to [1] year.
SSR
3_SSR_61_01
2.6.2 Control
4_ADCS_62_01: Cmd reception
The ADCS shall be able to receive cmd from CDMS at all times when not in
the “OFF” mode. [TBC]
SSR
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2.6.3 Failure management

4_ADCS_63_01: Failure propagation
Failure of one part or element of the ADCS shall not result in consequential
damage to the equipment or other satellite components.
To minimize failure propagation
3_SSR_63_01
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3 DESIGN REQUIREMENTS AT LEVEL 5
3.1 Functional Requirements

5_ADCS/ACT_10_01: Actuators
The ADCS actuators shall provide torque to control the attitude of the
satellite.
Actuators include: Magnetotorquers, IWA
4_ADCS_10_04
5_ADCS/ACT_10_02: Magnetotorquer axis control
The magnetotorquers shall provide controllability on all three axes.
To provide attitude control
4_ADCS_10_04
5_ADCS/DTS_10_01: Determination sensors
The ADCS determination sensors shall provide data for determination of the
attitude of the satellite.
ADCS determination functions
Sensors include: magnetometers, gyroscopes, sun sensors
4_ADCS_10_02
5_ADCS/DTS_10_02: Sun sensors axis measurement
Sun sensors shall provide measurements on all 3 axis.
To determine the attitude
4_ADCS_10_02
5_ADCS/DTS_10_03: Gyroscopes axis measurement
Gyroscopes shall provide measurements on all3 axis.
4_ADCS_10_02
5_ADCS/DTS_10_04: Magnetometer axis measurement
The magnetic sensor shall measure the magnetic field strength along tree
axis.
4_ADCS_10_02
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5_ADCS/MCU_10_01: ADCS microcontroller function I

The ADCS MCU shall receive commands from CDMS.
Definition of ADCS function
4_ADCS_10_01
5_ADCS/MCU_10_02: ADCS microcontroller function II
The ADCS MCU shall turn on and off sensors.
ADCS determination function
4_ADCS_10_02
5_ADCS/MCU_10_03: ADCS microcontroller function III
The ADCS MCU shall collect sensor data.
Definition of ADCS function
4_ADCS_10_02
5_ADCS/MCU_10_04: ADCS microcontroller function IV
The ADCS MCU shall format the data from sensor.
ADCS function
4_ADCS_10_02
5_ADCS/MCU_10_05: ADCS microcontroller function V
The ADCS MCU shall send TM to CDMS.
ADCS function
4_ADCS_10_01
5_ADCS/MCU_10_06: ADCS microcontroller function VI
The ADCS MCU shall command the actuators.
ADCS attitude control function
4_ADCS_10_04
5_ADCS/PCB_10_01: PCB
The ADCS PCB shall provide a mechanical and electrical support for all the
electronic.
To perform ADCS function
4_ADCS_10_01
5_ADCS/HKS_10_01: HK sensors
The ADCS HK sensors shall provide data to determine the health of the
ADCS subsystem.
This includes: IWA state, Temperature sensors
4_ADCS_10_03
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3.2 Mission & Performance Requirements

3.2.1 Subsystem modes
3.2.2 Subsystem states
3.2.3 Subsystem H/W performances
5_ADCS/ACT_23_01: Magnetotorquers power consumption in “WHEEL” mode
The mean magnetotorquer power consumption in “WHEEL” mode shall be
less than [50] mW per magnetotorquer.
Power budget
4_ADCS_23_05
5_ADCS/ACT_23_02: Magnetotorquers power cons. in “NOMINAL” mode
The mean magnetotorquer power consumption in “NOMINAL” mode shall
be less than [50] mW per magnetotorquer
Power budget
4_ADCS_23_04
5_ADCS/ACT_23_03: Magnetotorquers power cons. in “SENSOR” mode
The magnetotorquers shall not consume any power in "SENSOR" mode.
Power budget
4_ADCS_23_03
5_ADCS/ACT_23_04: Magnetotorquers power cons. in “STAND-BY” mode
The magnetotorquers shall not consume any power in "STAND-BY" mode.
Power budget
4_ADCS_23_02
5_ADCS/ACT_23_05: Magnetotorquers power cons. in “OFF” mode
The magnetotorquers shall not consume any power in "OFF" mode.
Power budget
4_ADCS_23_01
5_ADCS/ACT_23_06: Magnetotorquers magnetic moment
The magnetotorquers shall generate a magnetic moment of at least [0.0285]
A2m.
AHW report phase B
To control perturbations torques
4_ADCS_10_04
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5_ADCS/DTS_23_01: Sensors power consumption in “WHEEL” mode

The mean sensors power consumption in “WHEEL” mode shall be less than
[60] mW.
Power budget
4_ADCS_23_05
5_ADCS/DTS_23_02: Sensors power consumption in “NOMINAL” mode
The mean sensors power consumption in “NOMINAL” mode shall be less
than [60] mW.
Power budget
4_ADCS_23_04
5_ADCS/DTS_23_03 Sensors power consumption in “SENSOR” mode
The mean sensors power consumption in “SENSOR” mode shall be less than
[60] mW.
Power budget
4_ADCS_23_03
5_ADCS/DTS_23_04 Sensors power consumption in “STAND-BY” mode
The determination sensors shall not consume any power in “STAND-BY”
mode.
Power budget
4_ADCS_23_02
5_ADCS/DTS_23_05 Sensors power consumption in “OFF” mode
The determination sensors shall not consume any power in “OFF” mode.
Power budget
4_ADCS_23_01
5_ADCS/DTS_23_06: Magnetometers measurement range
Magnetometers shall be capable of measuring magnetic fields in the range of
[0.3 10-4]T and [1.5 10-5] T with an accuracy of +/- [1]%. (maximal magnetic
field over the poles).
Sensor performances
4_ADCS_10_02
5_ADCS/DTS_23_07: Magnetometers measurement resolution
The magnetic sensor shall have a minimum resolution of [1.10-6]T.
Sensor performances.
4_ADCS_10_02
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5_ADCS/DTS_23_08: Sun sensors measurement range

Sun sensors shall be capable of measuring the direction of the sun in the
range of [0] deg and [60] deg with an accuracy of +/- [10]%.
4_ADCS_10_02
5_ADCS/DTS_23_09: Gyroscopes measurement range
Gyroscopes shall be capable of measuring angular rate in the range of [0.01]
deg/s and [180] deg/s with an accuracy of +/- [1]%.
4_ADCS_10_02
5_ADCS/MCU_23_01 MCU power consumption in “OFF” mode
The microcontroller shall not consume any power in “OFF” mode.
Power budget
4_ADCS_23_01
5_ADCS/MCU_23_02 MCU power consumption in “STAND-BY” mode
The microcontroller power consumption shall be less than [30] mW in
“STAND-BY” mode.
Power budget
4_ADCS_23_02
5_ADCS/MCU_23_03 Sensors power consumption in “SENSOR” mode
“SENSOR” mode.
Power budget
4_ADCS_23_03
5_ADCS/MCU_23_04: Sensors power consumption in “NOMINAL” mode
“NOMINAL” mode.
Power budget
4_ADCS_23_04
5_ADCS/MCU_23_05: Sensors power consumption in “WHEEL” mode
“WHEEL” mode.
Power budget
4_ADCS_23_05
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3.2.4 Subsystem S/W performances

5_ADCS/MCU_24_01: Command data
The microcontroller shall accept the command signal for the motor control
electronics and the magnetic torquers control electronics at least once every
[10] seconds.
4_ADCS_24_01.
5_ADCS/MCU_24_02: HK Data transmission
The microcontroller shall be able to send HK sensors data at specific requests
from the CDMS.
4_ADCS_24_02
5_ADCS/MCU_24_03: Data transmission
The microcontroller shall be able to send attitude data at specific requests
from the CDMS.
4_ADCS_24_02
5_ADCS/MCU_24_04: Determination sensors data storage
The microcontroller shall be able to store attitude sensor data for at least the
last [10] readings.
AHW report phase B
Requirement to be refined
5_ADCS/MCU_24_05: HK sensors data storage
The microcontroller shall be able to store HK sensor data for at least the last
[10] readings.
AHW report phase B
Requirement to be refined
3.2.5 Reliability and redundancy

5_ADCS/MCU_25_01: Actuators reliability and redundancy
The actuators shall comply to 4_ADCS_25_02, 03 and 04.
Level 4 ADCS requirements
4_ADCS_25_02
5_ADCS/MCU_25_02: Determination sensors reliability and redundancy
The determination sensors shall comply to 4_ADCS_25_02, 03 and 04.
4_ADCS_25_02
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5_ADCS/MCU_25_03: MCU reliability and redundancy

The MCU shall comply to 4_ADCS_25_02, 03 and 04.
4_ADCS_25_02
5_ADCS/MCU_25_03: PCB reliability and redundancy
The PCB shall comply to 4_ADCS_25_02, 03 and 04.
4_ADCS_25_02
3.3 Design Requirements

3.3.1 Constraints
5_ADCS/ACT_31_01: Magnetotorquers design constraints
The actuators shall comply with 4_ADCS_31_01, 4_ADCS_31_02 and
4_ADCS_31_03.
4_ADCS_31_01
5_ADCS/DTS _31_01: Determination sensors design constraints
4_ADCS_31_03.
4_ADCS_31_01
5_ADCS/DTS_31_02: Magnetometer
Magnetometer bias may be lessened by winding small coils near the
magnetometer in series with the larger control coils.
In order to avoid as well as it is possible disturbances.
5_ADCS/MCU_31_01: MCU design constraints
4_ADCS_31_03.
4_ADCS_31_01
5_ADCS/PCB_31_01: PCB design constraints
4_ADCS_31_03.
4_ADCS_31_01
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3.3.2 Thermal
5_ADCS/ACT_32_01: Actuators thermal design
4_ADCS_32_03.
4_ADCS_32_01
5_ADCS/DTS_32_01: Determination sensors thermal design
The determination sensors shall comply with 4_ADCS_32_01,
4_ADCS_32_02 and 4_ADCS_32_03.
4_ADCS_32_01
5_ADCS/MCU_32_01: MCU thermal design
The microcontroller shall comply with 4_ADCS_32_01, 4_ADCS_32_02
and 4_ADCS_32_03.
4_ADCS_32_01
5_ADCS/PCB_32_01: PCB thermal design
The PCB shall comply with 4_ADCS_32_01, 4_ADCS_32_02 and
4_ADCS_32_03.
4_ADCS_32_01
3.3.3 Maintainability
5_ADCS/ACT_33_01: Actuators maintainability
The actuators shall comply with 4_ADCS_33_01 and 4_ADCS_33_02.
4_ADCS_33_01
5_ADCS/DTS_33_01: Determination sensors maintainability
The determination sensors shall comply with 4_ADCS_33_01 and
4_ADCS_33_02.
4_ADCS_33_01
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5_ADCS/MCU_33_01: MCU thermal maintainability

The microcontroller shall comply with 4_ADCS_33_01 and
4_ADCS_33_02.
4_ADCS_33_01
5_ADCS/PCB_33_01: PCB maintainability
The PCB shall comply with 4_ADCS_33_01 and 4_ADCS_33_02.
4_ADCS_33_01
3.4 Interface Requirements

3.4.1 Structural Interfaces
5_ADCS/ACT_41_01: Magnetotorquers
Magnetotorquers shall be located in perpendicular planes.
Control on three axes.
5_ADCS/ACT_10_02
5_ADCS/DTS_41_01: Sun sensor location
Sun sensors shall be mounted on the 6 faces, 1 sensor per face.
Need 3 sensors to determine direction of the Sun at all times, need 6 sensor
heads to cover all possible directions.
5_ADCS/DTS_10_06
5_ADCS/DTS_41_02: Magnetometer location
The magnetometers shall be placed at a distance at least greater than [xx]mm
from the magnetotorquers plane.
In order to avoid as well as it is possible disturbances.
5_ADCS/PCB_41_01: PCB placement
The placement of the PCB shall be optimized to be as distant as possible
from the magnetotorquers and the IWA.
Magnetic perturbations on magnetometer.
3.4.2 Thermal Interfaces

5_ADCS/ACT_42_01: Magnetotorquers
Magnetotorquers shall be thermally connected to the frame.
TH
4_ADCS_32_02
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5_ADCS/PCB_42_01: PCB
The PCB shall be thermally connected to the frame.
TH
4_ADCS_32_02
3.4.3 Electrical Interfaces

5_ADCS/ACT_43_01: Magnetotorquers supply voltage
The magnetotorquers and their electronic shall use 3.3V.
ADCS supply
4_ADCS_43_01
5_ADCS/ACT_43_02: Magnetotorquers connection
The magnetotorquers shall be connected to ADCS board.
Decrease number of interfaces.
4_SC _10_01
5_ADCS/DTS_43_01: gyroscopes supply voltage
The gyroscopes and their electronic shall use 3.3V.
ADCS supply
4_ADCS_43_01
5_ADCS/DTS_43_02: magnetometers supply voltage
The magnetometers and their electronic shall use 3.3V.
ADCS supply
4_ADCS_43_01
5_ADCS/DTS_43_03: sun sensors supply voltage
The sun sensors and their electronic shall use 3.3V.
ADCS supply
4_ADCS_43_01
5_ADCS/DTS_43_07: sun sensors connection
The sun sensors shall be connected to ADCS board.
Decrease number of interfaces.
4_SC _10_01
5_ADCS/MCU_44_01: Microcontroller supply voltage
The microcontroller and its electronic shall use 3.3V.
ADCS supply
4_ADCS_43_01
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5_ADCS/PCB_44_01: Board supply

The main board shall be connected to the power bus and use use 3.3V.
ADCS supply
4_ADCS_43_01
3.4.4 Data Interfaces

5_ADCS/DTS_44_01: Magnetometer master clock frequency
The magnetometer shall use a master clock frequency of [8] or [10] MHz.
Magnetometer’s report.
5_ADCS/MCU_44_01: Microcontroller main bus interface
The microcontroller shall be capable of communicating with the main data
bus.
Same data bus for the whole satellite.
5_ADCS/MCU_44_02: Microcontroller sensor interface
The microcontroller shall be capable of communicating with each sensor.
Anolog signal reading, and serial data interface reading capability.
5_ADCS/MCU_10_02
5_ADCS/MCU_44_03: TM
The microcontroller shall generate TM with all the sensors and the IWA data.
[TBD]
4_ADCS_44_02
3.4.5 Physical Interfaces

5_ADCS/ACT_45_01: Magnetotorquer mass
Each coil shall weight less than [16] grams.
Mass budget.
4_ADCS_45_02
5_ADCS/ACT_45_02: Magnetotorquer size
Magnetotorquers external dimensions shall not exceed [82x90x4]mm on X
and Z axis, and [82x86.5x4]mm on Y axis in SRF
S&C.
4_ADCS_45_01
5_ADCS/DTS_45_01: Sun sensors dimensions
The external sun sensors PCB dimensions shall not exceed [20x16x3.5] mm.
S&C.
4_ADCS_45_01
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5_ADCS/PCB_45_01: Card dimensions

The external ADCS card dimensions shall not exceed [80x85x10] mm, and
the value of [10] shall not be reached on the entire surface.
S&C.
4_ADCS_45_01
5_ADCS/PCB_45_02: Card mass
The ADCS card (PCB and components) shall weight less than [34] grams.
Mass budget.
4_ADCS_45_02
3.5 Environmental Requirements

3.5.1 Thermal
5_ADCS/ACT_51_01: Thermal environment
The actuators shall comply with 4_ADCS_51_01 and 4_ADCS_51_02.
4_ADCS_51_01
5_ADCS/DTS_51_01: Thermal environment
The determination sensors shall comply with 4_ADCS_51_01 and
4_ADCS_51_02.
4_ADCS_51_01
5_ADCS/MCU_51_01: Thermal environment
The microcontroller shall comply with 4_ADCS_51_01 and
4_ADCS_51_02.
4_ADCS_51_01
5_ADCS/PCB_51_01: Thermal environment
The PCB shall comply with 4_ADCS_51_01 and 4_ADCS_51_02.
4_ADCS_51_01
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3.5.2 Static and dynamic loads

5_ADCS/ACT_52_01: Acceleration
The actuators shall comply with 4_ADCS_52_01.
4_ADCS_52_01
5_ADCS/DTS_52_01: Acceleration
The determination sensors shall comply with 4_ADCS_52_01.
4_ADCS_52_01
5_ADCS/MCU_52_01: Acceleration
The microcontroller shall comply with 4_ADCS_52_01.
4_ADCS_52_01
5_ADCS/PCB_52_01: Acceleration
The PCB shall comply with 4_ADCS_52_01.
4_ADCS_52_01
3.5.3 Vacuum
5_ADCS/ACT_53_01: Vacuum
The actuators shall be able to operate under vacuum conditions.
Space environment
4_ADCS_53_01
5_ADCS/DTS_53_01: Vacuum
The determination sensors shall be able to operate under vacuum conditions.
Space environment
4_ADCS_53_01
5_ADCS/MCU_53_01: Vacuum
The microcontroller shall be able to operate under vacuum conditions.
Space environment
4_ADCS_53_01
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5_ADCS/PCB_53_01: Vacuum
The PCB shall be able to operate under vacuum conditions.
Space environment
4_ADCS_53_01
3.5.4 Radiation
5_ADCS/ACT_54_01: Total dose
The actuators shall support a TID of maximum [37.4]kRad.
Analysis using ESA Spenvis Tool. This is the value for 1 year in orbit
4_ADCS_54_01
5_ADCS/DTS_54_01: Total dose
The determination sensors shall support a TID of maximum [37.4]kRad.
4_ADCS_54_01
5_ADCS/MCU_54_01: Total dose
The microcontroller shall support a TID of maximum [37.4]kRad.
4_ADCS_54_01
5_ADCS/PCB_54_01: Total dose
The PCB shall support a TID of maximum [37.4]kRad.
4_ADCS_54_01
3.6 Operational Requirements

3.6.1 Autonomy
5_ADCS/ACT_61_01: Life time
The actuators shall be designed to operate during [4] months including
commissioning and nominal activities. The lifetime can be extended to [1]
year.
SSR
4_ADCS_61_01
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5_ADCS/DTS_61_01: Life time

The determination sensors shall be designed to operate during [4] months
including commissioning and nominal activities. The lifetime can be
extended to [1] year.
SSR
4_ADCS_61_01
5_ADCS/MCU_61_01: Life time
The microcontroller shall be designed to operate during [4] months including
year.
SSR
4_ADCS_61_01
5_ADCS/PCB_61_01: Life time
The PCB shall be designed to operate during [4] months including
year.
SSR
4_ADCS_61_01
3.6.2 Control
5_ADCS/ACT_62_01: Magnetic incompatibility
The magnetotorquers shall be turned off during measurements with
magnetometers. [TBR]
5_ADCS/MCU_62_01: Microcontroller
The microcontroller must be able to receive a data request from CDMS at all
times when not in the “OFF” mode. [TBC]
[TBD]
4_ADCS_62_01
3.6.3 Failure management

5_ADCS/ACT_63_01: Failure propagation
Actuators failure shall not result in consequential damage to the equipment or
other satellite components.
3_SSR_63_01
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5_ADCS/DTS_63_01: Failure propagation

The determination sensors shall not result in consequential damage to the
equipment or other satellite components.
3_SSR_63_01
5_ADCS/MCU_63_01: Failure propagation
Microcontroller failure shall not result in consequential damage to the
equipment or other satellite components.
3_SSR_63_01
5_ADCS/PCB_63_01: Failure propagation
PCB failure shall not result in consequential damage to the equipment or
other satellite components.
3_SSR_63_01
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4 DESIGN ASSUMPTIONS AND APPROACH
In this section the various assumptions that were made are discussed. It summarizes the approach
for doing the work and some analysis. The assumptions are the points not described in the
requirements part of the report.
4.1 Approach
The first part of the project was to recalculate the disturbances in order to have reliable values for
the dimensioning of the actuators, wheel and magnetotorquers, and for the development of the
attitude controller. The second step was to do a functional analysis to know in detail which
functions the ADCS PCB shall fulfill. In parallel searches were made to find the different
components. They were compared, and one per category was chosen. Once the components were
chosen, the electronic circuit and the PCB layout were designed. During the PCB production time,
the magnetotorquers were redimensioned. A preliminary study was made during phase A, but it was
necessary to refine the design in accordance to the development done after the phase A review.
Once the hardware was ordered and produced, the next step was to define the software that will be
needed to test and run the system. The list of TC/TM was also defined.
It is important to mention that the hardware was not selected only on the performances, but on
availability, compatibility with the system and physical characteristics such as size and mass criterion.
4.2 Disturbances
In order to have precise dimensioning requirements, a disturbances analysis was made. The analysis
completes and refines the one done during Phase A.
The disturbances the satellite has to go through are mainly due to four sources of torques on low-
altitude Earth orbits. They are gravity-gradient effects, magnetic fields, disturbance by solar radiation
and aerodynamic torques. The torques are categorized as secular and cyclic. Cyclic torques vary in a
sinusoidal manner during an orbit and secular accumulate with time and don’t average out over an
orbit. For an Earth-oriented spacecraft, gravity-gradient and aerodynamic torques are secular and
solar radiation and magnetic field cyclic.
The disturbances torques were separately calculated in the very worst case for every altitude
between 400 kilometers and 1000 kilometers with a step of 100 kilometers. Very worst case means
that each parameter was taken at its maximal value. For this reason no margin was added at this
point. The major disturbance factor is aerodynamic up to 600km. The summarized results can be
seen in Figure 4 and Table 1.
For the dimensioning of the actuators, twice the worst case was taken. The worst case happens at
the altitude of 400 km. The torque that the actuators shall produce is 2x3.6e-7=7.2e-7 Nm. [R6].
For example, the torque used for the actuators dimensioning is twelve times greater than the
disturbance torque at the altitude of 700 km.
The detailed calculation and explanation are presented in Appendix A.
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Figure 4: Disturbances in function of altitude.
Altitude Solar pressure Gravity-gradient Magnetic field Aerodynamic Total torque

[km] [Nm] [Nm] [Nm] [Nm] [Nm]
400 3.6e-9 3.6e-10 5.1e-8 3.0e-7 3.6e-7
500 3.6e-9 3.4e-10 4.9e-8 9.7e-8 1.5e-7
600 3.6e-9 3.3e-10 4.7e-8 3.5e-8 8.6e-8
700 3.6e-9 3.2e-10 4.5e-8 1.3e-8 6.2e-8
800 3.6e-9 3.0e-10 4.3e-8 5.2e-9 5.2e-8
900 3.6e-9 2.9e-10 4.1e-8 2.2e-9 4.7e-8
1000 3.6e-9 2.8e-10 3.9e-8 8.9e-10 4.4e-8
Table 1: Analysis results for disturbances.
4.3 Electrical and data assumptions

According to the last developments before starting working on this subsystem in phase B, there is
only one data bus with all subsystems connected on it. The data bus is an I2C bus. The used
microcontroller shall be compatible with it.
The ADCS microcontroller will not support determination and control algorithm. It will be used to
collect the sensors values and to store them until the main controller on board (CDMS) will use
them. It will also be used control the actuators once the main computer has calculated the command
values.
In order to minimize power losses and simplify the design of the EPS, the choice of components
using a supply voltage of 3.3V was preferred.
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4.4 Hardware
At the end of phase A several assumptions were made on the hardware. The hardware elements
chosen for the development of the ADCS were kept for phase B. The sensors and actuators that will
be used are outlined in gray in Figure 5. The white boxes represent other possibilities for sensing
and actuating.
Figure 5 ADCS hardware trade-off.
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5 TECHNICAL DESCRIPTION
This section describes the chosen hardware, its implementation, the electronic layout and some of
the software aspects needed to fulfill the different functions of the ADCS board.
5.1 Sensors
The kind of sensors was made according to phase A specifications. For each category of sensor
several criteria were taken in account such as the weight, the size, the supply voltage, the power
consumption, the accuracy, the market availability, the price. The selection process for each sensor is
described below.
During daylight, the three kinds of sensors are used, gyroscopes, sun sensors and magnetometers.
According to preliminary calculations, the solar panels don’t offer enough accuracy to be used as
sensors. It was decide to check for more precise sun sensors. For the magnetometers a separate
semester project was done to choose the appropriate sensor.
During the eclipse, the sun sensors will become useless. The magnetometers and the gyroscopes will
still be used. Due to drift, the gyroscopes will probably need to be recalibrated. It will be done by
using the sun sensors during daylight.
The gyroscopes and magnetometers shall be able to measure on three axes. The sun sensors shall be
placed on the six faces even if one will never face the sun.
The planned sensor power consumption during phase A (30mW) was misestimated. The precise
consumption will be calculated during the test phase.
5.1.1 Sun sensors

This section describes the choice of the sun sensor, the chosen sensor and its implementation on a
PCB.
5.1.1.1 Choice of the sensor

In Table 2, all the sun sensors that were found during the search phase are listed. All criteria are
important for the final choice. One that is not represented is availability of the sensor. Due to
structural interfaces requirements, the size was critical. On this point the TNO and DTU sensors are
better choices. The necessary electronic is included in the size of the DTU sensor but not in the
TNO one. On the weight criteria, again the TNO and DTU are the lightest. In terms of power
consumption and power supply very few data were available, so could not be a selection criterion.
The highest accuracy and the biggest field of view are given by the TNO sensors.
According to all these criteria, the two best-fitting sensors are the one from DTU and TNO. The
final choice is the sensor of DTU, because of the unavailability of the TNO sensor.
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Power
Weight Size Power cons. Accuracy FoV
Model [g] [mm] supply [mW] [deg] [deg] prize
+/-5 to +/-
Optical Energy Technologies 1 40 40x10 15 50 +/- 0.5 100 16'000
Aero astro coarse sun sensor 2 20 23 x 9 NA NA +/- 5 120 NA
Aero astro medium sun sensor 3 36 35 x 10.5 NA NA +/- 1 134 NA
TNO without packaging 4 NA 10x10x2 NA NA 0.2 128 NA
TNO with packaging 5 50 30x30x14 NA NA 0.2 128 NA
DTU with PCB 6 1 20x16x1.5 3.3 V NA 1 120 Free
Power
Weight Size Power cons. Accuracy FoV
Model [g] [mm] supply [mW] [deg] [deg] prize
Optical Energy Technologies 1 -- -- - NA + - --
Aero astro coarse sun sensor 2 - - NA NA -- + NA
Aero astro medium sun sensor 3 -- -- NA NA - ++ NA
TNO without packaging 4 + ++ NA NA + ++ NA
TNO with packaging 5 -- -- NA NA + ++ NA
DTU with PCB 6 ++ + ++ NA - + ++
Table 2: List of possible sun sensors.

Since the DTU sun sensors have not been commercialized yet, no proper calibration was made. This
will be done during next semester. According to information by the supplier, the sensors should
have an accuracy of 1 degree within +-30 degrees FOV and 5 degrees within +-60 degrees FOV.
Figure 6: DTU Sun sensor chip.

The design of the sun sensors PCB was implemented according to [R7] for the amplification of the
signals. Each sun sensors has four outputs, one for each direction in the horizontal plane of the chip
and one reference for each direction. In Figure 7 the electronic for one direction of one sensor is
shown. The second direction needs exactly the same circuit. The sensing parts are represented with
diodes. Each direction has two sensing parts. The exact connexion and the list of the used
components are detailed in the appendix B.1.
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The sensors will give out analogic signals. The signals are amplified and redirected to the main
board. The conversion to a digital signal will be made by the microcontroller. The description of the
connexion between the sun sensor PCB and the microcontroller is documented in 5.3.
Figure 7: Electronic for one direction.
In order to minimize the size of the PCB and to make it possible to glue it on the side panels of the
satellite, the sun sensor itself is glued on the face of the PCB facing the outside of the satellite and
the electronic components on the other face. The electrical connection between the sensitive chip
and the PCB will be made by wire bonding. The values of the resistor and capacitors will be the
same as for DTU test in a first time. They will be changed if needed during the characterization
phase.
Figure 8: Left, sun sensor with PCB. Center, wire bond. Right with coating (courtesy of A. Baderstcher).
5.1.2 Magnetometers
The choice of the magnetometers was made in a separate project taking into account the constraints
of the ADCS board about the supply voltage, the power consumption, the number of axis
measured, the range and accuracy of measurement. The detailed analysis can be seen in
[R8][R8][R8].
The AKN sensors were chosen and integrated in the design of the ADCS Board. The electronic
implementation is documented in 5.3.
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5.1.3 Gyroscopes
The goal of the selection process was to find gyroscopes that minimize the complexity of the design
such as different supply voltage or the implementation of a dedicated small structure to ensure the
perpendicularity of the three axis. Ideally the final component should be able to measure all three-
axis with a single chip and with the same power supply as the other components on the board. The
three different gyroscopes that were selected can be seen in Table 3.
Power
Mass Size Power cons. Sensitivity Rate
Model [g] [mm] supply [V] [mW] [mV/°/s] [deg/s] prize
ADXRS150 1-Axis 1 < 0.5 7x7x4 4.75 to 5.25 30 (90) 12.5 +-150 30
TR0150S050 3-axial 2 <5 18x18x10 4.75 to 5.25 90 12.5 +-150 1300
Dual Axis Gyro - IDG300 3 < 0.5 6x6x1.5 3 to 3.3 30 2 +-500 50
Power Power
Mass Size supply cons. Sensitivity Rate
Model [g] [mm] [V] [mW] [mV/°/s] [deg/s] prize
ADXRS150 1-Axis 1 ++ + -- -- - - +
TR0150S050 3-axial 2 - - -- -- - - --
Dual Axis Gyro - IDG300 3 ++ ++ ++ + ++ ++ +
Table 3: List of possible gyroscopes.

Compared to the others, the IDG300 sensor has advantages in terms of mass, size, compatibility of
power supply, power consumption, sensitivity and rate. The only disadvantage is that it measures
only two axes, so it will need an additional PCB for the third axis and its peripheral electronic. A
small structure shall be designed to guarantee the perpendicularity with the other axes. In this
functional version of the board, the size of the third axis PCB has not been optimized yet. For the
choice of the different peripheral components (resistors and capacities), the manufacturer
recommendations were respected. According to the same recommendations a low-pass filter with a
cut-off frequency of 2 kHz was designed. The list of components for the third axis can be found in
B.2.2.
It is foreseen to convert the analog values with a 12-bits converter. It means that it is possible to
obtain a resolution of 1 mV and so an angular resolution of 0.5 degree per second.
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Figure 9: IDG300 gyroscope schematic.
5.1.4 The All-in-one sensor

During the selection process a sensor including a three-axes magnetometer, a three-axes gyroscope
and a three-axes accelerometer was found. It was not chosen because of its size, mass, supply
voltage and power consumption that were to important. The procurement of this component is also
not in the philosophy of a student project because of its very high prize (CHF 2000.-). The sensor
reference will be kept for future satellite.
Weight Size Power Power

Model [g] [mm] supply cons. Performances prize
MAG02-0150S050 <5 18x18x10 4.75 to 5.25 250 mW +-150 2000
± 1.9 Gauss
±2g
Table 4: All in one sensor characteristics.
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5.1.5 Sensor summary

The three tables below summarize the sensors characteristics and announced performances.
DTU sun sensor Mass (with PCB and 1

amplification) [g]
Size (with PCB) [mm] 20x16x1.5
Supply voltage [V] 3.3
Power [mW] NA
Accuracy [deg] 1
Field of view 1200
Prize [$] Free
Gyroscope Mass (with PCB and 0.5

IDG300 amplification) [g]
Size [mm] 6x6x1.5
Power [mW] 30
Sensitivity [mV/deg/s] 2
Rate [deg/s] +/- 500
Prize [$] 50
Magnetometer Mass [g] 0.4

AK8970N
Size [mm] 5x5x1
Power [mW] 24
Sensitivity [mV/mT] 8.33
Resolution [uV] 100
Prize [$] free
Table 5: Sensors summary.
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5.2 Actuators
Two different sorts of actuators are planned to be used. An inertial/momentum wheel has been
developed to be tested on the SwissCube. It was developed separately to the main board and shall be
integrated to it during next phase. The description of the IWA will be made in [R9].
The main actuators are three perpendicular coils, called magnetotorquers. Their size is maximized
according to the available space given by structural constraints.
All actuators were sized based on twice the maximum disturbance torque.
5.2.1 Magnetotorquers
The value that characterizes the magnetotorquers is their magnetic moment whose units is Am 2 and
is defined as:
G
M = NIAn Equation 1
I is the current in the coil, N the number of turns and A the area of the coil plane.
G
n
Figure 10: The magnetic torquer coil schematic.
The torque produced by the magnetic torquer is the cross product of the magnetic field strength in
Teslas, with the magnetic moment of the magnetic torquers.
TMag = M × B Equation 2
The minimal needed magnetic moment MN to counteract perturbations and to change the satellite
attitude is:
Tmax R 3
MN = Equation 3
Bo
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Where Tmax is the maximum perturbation torque for each altitude multiplied by 2, R is defined
R +h
as R = E with R E the radius of the earth and h the altitude taken from the ground. B0 is the
RE
magnetic field at the Equator at the surface, which is the weakest. Indeed, the weakest the field is,
the strongest the magnetic moment must be. In this case the magnetotorquers have to provide the
maximum magnetic moment. The development to obtain equation 3 starting from equation 2 is
presented in [R11].
Combining equation 1and equation 3 it is possible to calculate the needed number of turns NN,
where I = P/V with P the available power and V the bus voltage.
M N M N ⋅V
NN = = Equation 4
I⋅A P⋅ A
σ lw
According that the resistance of copper wire is R = , where Aw , lw and σ are the cross-sectional
Aw
V2
area, the length and σ is the resistivity of the wire material and also R = we can rewrite the
P
resistance equation as:
Pσ DN N
Aw =
V2 Equation 5
Where D is the length of one turn. The total mass of one torquer is:
mcu = ρ ⋅ .N N ⋅ D ⋅ Aw Equation 6
Combining the above equations, defining ρ as the density of the wire material and substituting the
term for resistivity with its expression with respect to temperature σ = σ o (1 + α T ) σ 0 is the
dσ
resistivity of the material, α is the temperature change coefficient, α = and T is the temperature
dT
in Kelvin, the mass can be calculated with the following equation:
2
Pσ 0 (1 + α T ) ρ D 2 ⎛ ⎡ M NV ⎤ ⎞
mCu = ⎜⎢ ⎥⎟ Equation 7
V2 ⎝⎢ P A ⎥⎠
In order to have the maximum magnetic moment created with a minimum mass and predefined
power and voltage, the enclosed area A shall be maximized and the number of turns minimized.
Due to geometrical constraints there is a maximal space where the magnetotorquers can be placed.
For two magnetotorquers the maximal available space is 82 mm by 90 mm and for the third one 82
mm by 86.5 mm. [R12]. The thickness of the coil is limited for the same reasons. It is limited to 4
mm.
Since the satellite total mass is very limited (1 kg) a short analysis was made to determine if it could
be advantageous to chosen an aluminum wire instead of a standard copper wire (appendix B.3.3).
The result is that the copper wire will be better and also easier to procure. Once the material of the
wire was chosen, the minimum required diameter needs to be calculated in function of the
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maximum current density and the maximum current. The maximum current is determined with the
available power and the supply voltage. The maximum current density was set to 2 Ampères/mm2,
even if it is possible to go up to 8. This is a security factor to avoid a wire burning due to the
absence of convection. The chosen wire is a CAB-200 and has diameter of 150 microns.
With outer dimension and the wire diameter it is possible to dimension the coils. Because the inner
surface is used to determine the magnetic moment and the fact that only the outer dimensions of
the coils are given, it is necessary to calculate iteratively the real number of turns. The process starts
by choosing approximately the inner surface so that the number of turns can be calculated. With the
number of turns and the external dimensions it is possible to determine completely the dimensions
of the coil and so the inner dimensions. These new values are needed to refine the calculation of the
number of turns. And so on. The MatLab code that was used is to be seen in B.3.1. Table 6 shows
the parameters and the results that used for the dimensioning of the three coils. Parameters that
depend on the altitude were taken at the worst case (400 km).
Maximal disturbance torque (design margin of 7.2e-7 Nm

2)
Magnetic field at surface level at equator (B0) 0.3e-4 T
Voltage 3.3 V
Power 50 mW
Maximum current density 2e6 A/m2
Copper resistivity 1.72e-8 Ohm m
Temperature change coefficient 3.9e-3 K-1
Current 15 mA
Magnetic moment 2.85e-2 Am2
Wire CAB-200
Wire diameter 150e-6 m
Table 6: Magnetotorquers parameter and general performance requirements.

Due to geometrical constraints and in order to maximize the coil surface, two different
magnetotorquer sizes were implemented. The two next tables summarize the dimensions of the
coils.
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Outer dimensions 82x90 mm

Inner dimensions 77.8x85.8 mm
Cross-section dimensions 2.1x4 mm
Number of turns 283
Coil resistance 45 Ohm
Coil inductance 168 mH
Time constant 3.7 ms
Table 7: Dimensions for the coils in X and Z (SRF).
Outer dimensions 82x86.5 mm

Inner dimensions 76.7x82.1 mm
Cross-section dimensions 2.2x4 mm
Number of turns 297
Coil resistance 45 Ohm
Coil inductance 176 mH
Time constant 3.8 ms
Table 8 Dimensions for the coil in Y (SRF).

To guarantee the dissipation of the power given to the torquers a resistor of R= U2/ P = 220 Ohm
is required. Since the coil has resistance of 45 Ohm an additional resistor if 180 Ohm is placed in
series.
Figure 11: Magnetotorquer
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5.2.2 IWA
The IWA was developed separately from the other ADCS components. The conclusions are to be
seen in [R9]. The control electronic will be integrated to the ADCS main board during the next
project phase.
5.3 Main printed circuit board

The PCB is the heart of ADCS in terms of hardware. The board includes a microcontroller, the
non-photosensitive sensors, the driver stage for the main actuators and all the electronics such as
latch-up protection, switches and filters.
The external dimensions of the PCB are limited by the available space in the structure. The PCB will
be directly attached to the frame. The outer dimensions are described in Figure 12.
In this section, each functional part of the card is presented separately. The whole board schematic
is shown in appendix B.4.1.
Figure 12: PCB dimensions.

The material used for this test board is FR-4 with a thickness of 0.8 mm and two layers. The bottom
plane is used as ground and the top plane contains the supply and the routing to connect the
components. A four layers PCB would be advantageous for thermal reasons. The PCB would have
one plane only for the supply voltage and one ground plane. These planes will make possible to
lessen thermal hot points. A four layers PCB offers also more available surface for the routing.
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Figure 13: Main Board.
5.3.1 Magnetometer
Due to magnetic perturbations induced either bay the magnetotorquers or the IWA, the
measurements with the magnetometer will be perturbed. In order to reduce the importance of those,
the sensor shall be placed in the middle of the ADCS PCB. For the same reasons, the PCB shall be
placed as far as possible from the actuators (magnetotorquers and IWA).
Figure 14 shows the electrical schematic of the magnetometer. The component on the right of the
figure is the sensor itself. It uses a serial data interface to communicate with the microcontroller.
The chip needs a clock signal to make possible the internal analog to digital conversion. The two
capacitors, C1 and Cmm in the figure, are decoupling capacitors used as a filter to lower the noise
coming from the power supply and the clock signal. The component welding was made carefully in
order to respect the chip alignment with the PCB axes. Both referential (sensor and satellite) will be
aligned, just the axis are not the same.
A switch was added to make possible the complete shut down of the sensor. It is commanded by
the microcontroller by a change of the logic level. Additionally, a jumper, Jmm, was implemented to
disconnect physically the sensor during the tests.
Vmm
Cmm
gnd 0.1 uF
MM
AKN9370
4
C1 Vdd
5 15 Vmm
100 pF +- 20% GND Vdd
MCLK 6 14 CS
MCLK CS
13 SK
SK
RSTN
Jmm
INT
SO
1 Vmo
SI
IN
2 Vmm
OUT
Y
7
10
11
12
SWI2
RSTN
Vss 1 5 Vss X
1 5
INT
SO
Vmo 2
SI
2
gnd 3 4 E2
3 4
Switch
Figure 14: Implemented circuitry for magnetometer.
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5.3.2 Gyroscopes
The problem with the chosen gyroscope chip is that it measures only on two axes. The chip for axis
X and Y, in the plane of the PCB, was aligned with its axes. For the third axis, the same chip is used.
A small PCB was developed. Once the component will be welded, it will be analyzed if an additional
small structure will be needed to guarantee the perpendicularity and if the connector is sufficient to
resist to the vibration test.
The implementation was made on the manufacturer recommendations. On the second chip (Z-axis)
one of the outputs was left unconnected. A low-pass filter is designed at every output to attenuate
the high frequency noise generated by the proof-masses of the sensors. The filter is dimensioned
with a cut-off frequency of 2 kHz (R= 750 Ohm, C=0.1 uF). A decoupling capacitor of 100 nF is
placed between the power supply and the ground of both chips. In Figure 15, the XAGC and
YAGC are compensation capacitors for the amplitude control loop. In the control loop, an
oscillation circuit controls the amplitude to maintain constant sensitivity over the temperature range.
The two output signals, ADCX and ADCY, are analogical signals. The conversion to digital will be
made by the ADCS microcontroller.
34 Vgyro
RLPX
40 gnd
39 gnd
38 gnd
ADCX XOUT
750
32
CLPX IDG1
0.1 uF Vdd
GND
GND
GND
0.1
Vref
gnd 2 29 Vgyro
GND Vdd
gnd
XOUT 3 28 YOUT
Xout Yout
Y
XAGC 25 gnd
GND
gnd XAGC
XAGC 8 23 YAGC
CPOUT
0.22 uF +-10% XAGC YAGC

22 gnd
GND
Vdd
0.22
CPOUT
CPOUT gnd IDG300
Vgyro 14
CPOUT17
0.1 uF / 25 V +- 20%
0.1
YAGC
YAGC gnd
CoGY
0.22 uF +-10% 1 ADCZ
0.22 signal
2 gnd
RLPY ADCY gnd
YOUT 3 Vgyro
Vcc
750 Gyro connector
CLPY Jgyro
0.1 uF 1 Vgo
0.1 IN
Vgyro 2 Vgyro
OUT
gnd
Cg1 SWI1
0.1 uF Vss 1 5 Vss
0.1 1 5
Vgo 2
2
gnd
gnd 3 4 E1
3 4
Switch
Figure 15: Electrical schematic for gyroscope.

At the bottom of Figure 15, three components can be seen. CoGY is the connector for the
gyroscope’s third axis, Jgyro is a jumper to disconnected totally the gyroscopes manually during
certain test phases and SWI1 is a switch that is commended by the microcontroller.
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5.3.3 Sun sensors electronic

Only a part of the sun sensors electronic is placed on the main board. The sensor output signal is
amplified as close as possible from the sensor. The amplification is placed on the back plane of the
small PCB. The amplified signal is transported to main board by electrical cables. Each sun sensors
generates 4 signals. Each signal is redirected to a multiplexer. This means that multiplexer 1 collects
the output 1 signal from each sensor. The second multiplexer collects all the reference 1 signals,
multiplexer 3 the second output and finally the fourth multiplexer the second reference signal. Four
control bits generated by the microcontroller allows to choose one of the six sun sensors on each
multiplexer. The four values are directed toward the analog to digital converter of the
microcontroller. The digital signal can be processed either on the ADCS microcontroller to give an
angle or on the CDMS. This choice remains to be made.
Jss SWI3
1 Vso Vss 1 5 Vss
IN 1 5
2 Vsun Vso 2
OUT 2
gnd 3 4 E3
3 4
Switch
CMu1 CMu2 CMu3 CMu4
Vsun gnd Vsun gnd Vsun gnd Vsun gnd
Mux10.1 uF Mux20.1 uF Mux30.1 uF Mux4 0.1 uF

A0 1 0.1 16 A1 A0 1 16 A1 A0 1 16 A1 A0 1 16 A1
A0 A1 A0 A1 A0 A1 A0 A1
EN 2 15 A2 EN 2 15 A2 EN 2 15 A2 EN 2 15 A2
EN A2 EN A2 EN A2 EN A2
gnd 3 14 gnd gnd 3 14 gnd gnd 3 14 gnd gnd 3 14 gnd
gnd gnd gnd gnd gnd gnd gnd gnd
s1o1 4 13 Vsun s1r1 4 13 Vsun s1o2 4 13 Vsun s1r2 4 13 Vsun
s1 Vdd s1 Vdd s1 Vdd s1 Vdd
s2o1 5 12 s5o1 s2r1 5 12 s5r1 s2o2 5 12 s5o2 s2r2 5 12 s5r2
S2 S5 S2 S5 S2 S5 S2 S5
s3o1 6 11 s6o1 s3r1 6 11 s6r1 s3o2 6 11 s6o2 s3r2 6 11 s6r2
S3 S6 S3 S6 S3 S6 S3 S6
s4o1 7 10 s4r1 7 10 s4o2 7 10 s4r2 7 10
S4 S7 S4 S7 S4 S7 S4 S7
OUT1 8 9 Ref1 8 9 OUT2 8 9 Ref2 8 9
D S8 D S8 D S8 D S8
ADG708 ADG708 ADG708 ADG708
CoSS1 CoSS2 CoSS3 CoSS4 CoSS5 CoSS6

1 s1o1 1 s2o1 1 s3o1 1 s4o1 1 s5o1 1 s6o1
Out1 Out1 Out1 Out1 Out1 Out1
2 s1r1 2 s2r1 2 s3r1 2 s4r1 2 s5r1 2 s6r1
Out1ref Out1ref Out1ref Out1ref Out1ref Out1ref
3 s1o2 3 s2o2 3 s3o2 3 s4o2 3 s5o2 3 s6o2
out2 out2 out2 out2 out2 out2
4 s1r2 4 s2r2 4 s3r2 4 s4r2 4 s5r2 4 s6r2
out2 ref out2 ref out2 ref out2 ref out2 ref out2 ref
5 gnd 5 gnd 5 gnd 5 gnd 5 gnd 5 gnd
gnd gnd gnd gnd gnd gnd
6 Vsun 6 Vsun 6 Vsun 6 Vsun 6 Vsun 6 Vsun
Vcc Vcc Vcc Vcc Vcc Vcc
connector sun sensor connector sun sensor connector sun sensor connector sun sensor connector sun sensor connector sun sensor
Figure 16 Sun sensors connection and electronic.

To avoid noise problems, each multiplexer and each sun sensors have decoupling capacitors. Again
for this part of the electronic circuit, a jumper and a switch were implemented.
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5.3.4 Latch-up protection

The latch-up protection was implemented as recommended in [R13]. Two protections were placed
in the circuit. The first one is used to protect the microcontroller and the second one to protect the
sensor part. The microcontroller protection was designed for a normal current of 10 mA. At this
stage, it is not possible to dimension it precisely for the sensors because the overall current is not
known yet. The protection was dimensioned fro an estimated current of 80 mA. This value will be
measured during the test phases. Table 9 summarizes the Latch-up peripheral components that were
implemented on the functional card.
Vcc RTH RTH MAX CAUX
Res1 RTH 1 AUXV
RTH
1K AUXV 2 15 gnd
AUXV INC 1 uF
Vcc 3
RSen IN
SENS 4 13 Vcc CTIM
Res1 SENS ON
Gate 5 CTIM
1K Gate
SENS Cext 6 11 CTIM
Cext CTIM ??
Vss 7 10 CSPD CSPD
LLMON CSPD
gnd 8 9 CTON CSPD
Q gnd CTON
Gate
NMOS-2 MAX4273 ??
CTON
CEXT CTON
Vss
Cext Gate
??
5 nF
gnd
Figure 17: Latch-up protection electrical schematic.
Components Microcontroller Sensors

Parameters
Islow 10 mA 80 mA
Rsense 4.7 Ω 1Ω
Rth None. Rth pin on chip None. Rth pin on chip
connected to gnd connected to gnd
Cauxvc 1 μF 1 μF
CTIM None, pin on chip left floating None, pin on chip left floating
CTON None, pin on chip left floating None, pin on chip left floating
CSPD None, pin on chip left floating None, pin on chip left floating
Cext 5 nF 5 nF
Table 9: Latch-up protection peripheral components.
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5.3.5 Magnetotorquer driver stage

The magnetotorquers are commanded with a PWM signal generated by the microcontroller on a
command of CDMS. By changing the duty cycle of the signal, the voltage level can vary between 0
and 3.3 V. A duty cycle of 100 % means that the output voltage of the driver stage is 3.3 V. Varying
this voltage, the current will also change proportionally. With the different current values it is
possible to vary the strength of the magnetotorquers effects. The dimension that varies is the
magnetic moment. The driver stage is composed of an H-bridge and a low pass filter. The H-bridge
is a four transistors bridge and allows changing the direction of the created magnetic moment.
In Figure 18, if T1 and T4 are switched on, the output A will be at a potential of Vdd and output B
will be at the potential of SB, in this case 0V. T2 and T4 are “open”. To have the other direction, T1
and T3 will be switched of and T2 and T4 switched on. The SA and SB pins were both connected to
the ground.
T1 T2
T3 T4
Figure 18: H-bridge schematic.

There are a couple of different integrated circuits that permit to do an H-bridge. For the SwissCube,
the component Si9987 form Vishay has been chosen. It offers the advantage that protection logic is
already integrated and that the user does not need to control the four transistors separately. Only an
input signal on the right pin is required to give out a signal in the chosen direction. The integrated
logic commutes the right transistors pair automatically. The IC follows the truth table presented in
Table 10. Since there are 3 coils and that they need to function in two directions, six signals are
necessary.
Table 10: H-bridge truth table.
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The electrical schematic is represented in Figure 19. The same design was implemented for the three
magnetotorquers. The circuit offers the possibility the switch on or off each coil. The command
signal on the three switches is generated by the microcontroller. Additionally, the power supply of
each coil can be manually cut. The jumpers will be removed once the design will be validated. At the
input of the H-bridge, decoupling capacitors were placed. A low-pass filter was added at their output
to obtain a constant voltage level.
CMT3
Vmt3 gnd
HB3 0.1 uF
gnd 1 0.1 8 RMT3 OPWM3+
GND OutA
gnd 2 7 PWM3+ 47
GND InA CMT6
SWI4 Vmt3 3 6 PWM3-
Vdd InB 0.1 uF
Vcc 1 5 Vcc Jmt1 gnd 4 5 OPWM3-
1 5 GND OutB
Vmto1 2 1 Vmto1
2 IN
gnd 3 4 E4 2 Vmt1 Si9987
3 4 OUT
Switch CMT2
Jmt2 Vmt2 gnd
1 Vmto2
IN
SWI5 2 Vmt2 HB2 0.1 uF
OUT 0.1 RMT2
Vcc 1 5 Vcc gnd 1 8 OPWM2+
1 5 GND OutA
Vmto2 2 gnd 2 7 PWM2+ 47
2 GND InA CMT5
gnd 3 4 E5 Jmt3 Vmt2 3 6 PWM2-
3 4 Vdd InB 0.1 uF
Switch 1 Vmto3 gnd 4 5 OPWM2-
IN GND OutB
2 Vmt3 CoMT
OUT
SWI6 Si9987 OPWM3+ 6
6
Vcc 1 5 Vcc OPWM3- 5
1 5 5
Vmto3 2 OPWM2+ 4
2 4
gnd 3 4 E6 CMT1 OPWM2- 3
3 4 3
Vmt1 gnd OPWM1+ 2
2
Switch OPWM1- 1
1
HB1 0.1 uF Magnetotorquers connector
gnd 1 0.1 8 RMT1 OPWM1+
GND OutA
gnd 2 7 PWM1+ 47
GND InA CMT4
Vmt1 3 6 PWM1-
Vdd InB 0.1 uF
gnd 4 5 OPWM1-
GND OutB
Si9987
Figure 19: Magnetotorquer electronic schematic.
5.3.6 Microcontroller
The microcontroller chosen just after phase A is a MSP430F169 from Texas Instrument. The
peripheral required electronic was implemented under the recommendations of the manufacturer
(for example decoupling capacitors). Seven of the ADC inputs are used, four for the sun sensors and
three for the gyroscopes. The serial data interface is used to read the magnetometer. This
microcontroller has also a I2C interface that can be connected to the main data bus. Several digital
ports are used as outputs to switch on or off the different sensors and actuators and to serve as
command signals for the multiplexers. Six outputs are used for PWM signal that commands the
magnetotorquers.
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!RSTNMI
ADCX
ADCY
ADCZ
AVdd
Dgnd
Agnd
Dgnd
TMS
TCK
TDO
TDI
64
63
62
61
60
59
58
57
56
55
54
53
52
MSP
MSP430F169
48 MCLK
MCLK
TDI/TCLK
XT2OUT
TCK
XT2IN
!RST/NMI
TMS
TDO/TDI
ADC
ADC
ADC
AVdd
Dgnd
Agnd
47 SK
SK clk out
46 SO
SO
Vmc DVdd DVdd 1 45 SI
DVdd SI
OUT1 2 44 CS
CMD2 CMD1 ADC STE-CS
Ref1 3 43 RSTN
10 uF 0.1 uF ADC Dout
OUT2 4 42 INT
10 0.1 ADC Din
gnd Dgnd Ref2 5 41 PWM3-
ADC TB5
DVdd 8 40 PWM3+
XIN TB4
Dgnd 10 39 PWM2-
VeREF+ TB3
Dgnd 11 38 PWM2+
VREF- TB2
DVdd AVdd EN 12 37 PWM1-
EN TB1
A0 13 36 PWM1+
I2C clock
CMA2 CMA1 A0 TB0
I2C data
A1 14
10 uF 0.1 uFAgnd A1
Dgnd A2 15
Rosc
10 0.1 A2
E1
E2
E3
E4
E5
E6
DVdd
17
18
19
20
21
22
25
29
I2c clk 31
Rosc
100 kOhm
I2C data
100K
DVdd
E1
E2
E3
E4
E5
E6
Figure 20: Microcontroller schematic.

An external resistor was added and connected to the pin 25 of the microcontroller. With this resistor
it is possible to push the frequency of the microcontroller up to 10 MHz instead of 8 MHz. Another
advantage of this design is that the frequency will be less temperature dependant.
Figure 21: Microcontroller internal clock frequency vs. temperature.
5.3.7 Connector and reset button

In order to load the software on the microcontroller and to debug it, a programming interface is
required. The MSP430 microcontroller offers the possibility to do it through a standard interface
called JTAG. A programmer is required to link the developed card to the computer. A 3 Volts
power supply is available directly from the computer. Since the card uses a 3.3V power supply, it is
necessary to provide an external supply. The JTAG has 5 digital data lines:
TDI, Test Data In
TDO, Test Data Out
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TCK, Test Clock

TMS, Test Mode Select
!RST/NMI, Reset
These lines do not need additional pull-up resistor, apart from the reset, and are directly connected
to microcontroller (JTAG port). A pull-up resistor limits the current that flows to microcontroller
and guarantee the logic level. The resistors are already implemented in the microcontroller. They are
required on the lines for the main data bus. A reset push button was implemented for the test phase.
It will be removed on the final version. Reset of the microcontroller can also be made externally
from the debug interface through a dedicated line.
CoMA
1 Vcc Cin
Vcc/Vdd 10 uF
2 gnd Vcc
gnd
3
3 Rpu1 Rpu2 Rpu3
4
4 47 kOhm 47k 47k
5
5 47 kOhm 47K 47K
6
6
RST 7 !RSTNMI
!RST/NMI
1 !RSTNMI 8 TCK
IN TCK
2 gnd 9 TMS
OUT TMS
rst 10 TDI
TDI/TCLK
Ctest 11 TDO
TDO/TDI
!RSTNMI gnd 12 gnd
gnd
13 I2C data
10 nF I2C data
14 I2c clk
I2C clock
main connector
Figure 22: Card main connector and reset button schematic.

An adapter was developed to interface the computer JTAG programmer and the card JTAG
because the pin layout was not implemented with the same configuration. This will be corrected for
the next version of the card. Figure 23: JTAG adapter. Figure 23 shows the electrical routing
between the board and computer connectors.
External supply
1
Vcc
2
JTAG gnd
1 1
TDO Vcc/Vdd
2 2
Internal Vcc gnd
3 3
TDI 3
4 4
External Vcc 4
5 5
TMS 5
6 6
NC 6
7 7
TCK !RST/NMI
8 8
Test/Vpp TCK
9 9
gnd TMS
10 10
NC TDI/TCLK
11 11
!RST/NMI TDO/TDI
12 12
NC gnd
13 13
NC I2C data
14 14
NC I2C clock
external main connector
Figure 23: JTAG adapter.
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5.3.8 Electrical and data Interfaces

The ADCS card has not only interfaces with other subsystem for the power or data transfer but also
with its own components that are not placed on the PCB. The power interface requires two lines,
positive power supply (Vcc) and ground , the data interface also two connection, one for the clock
signal and the other for the data. Each magnetotorquer requires two electrical connections, six in all.
The sun sensors need 6 connections. Two are for the power supply and four for the analog signals.
Without the IWA, the ADCS has 46 electrical interfaces. The complete list with the name of the
connectors and pins is presented in the appendix B.4.4.
2 2
Latch up Latch up Latch up

protection protection protection
ACDS micro IWA

controller microcontroller
A
Switch Enable
Motor driver B ?
C
Switch
3.3V
SPI
Logic (?)
Driver
Gyros Gyros
Switch 3.3 Magnetometer
Switch
Analog
MUX
(4x)
Figure 24: ADCS main board schematic with interfaces (R. Krpoun).
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5.4 Functional/flow diagrams and software considerations

5.4.1 Preliminary functional analysis
The functional analysis presented in Figure 25 is a high level analysis. It lists the main functions that
the ADCS shall fulfill apart from the algorithms for the determination and control. The list is non-
exhaustive.
Figure 25 ADCS H/W functions
5.4.2 Flow analysis

This section describes the preliminary analysis that was made for the operations of the ADCS. It
does not include the determination and control calculation. The objective is to present the possible
operation modes and a possible way to organize the ADCS software. The booting sequence is
shown in Figure 26. Each rectangle box represents a process. The orange boxes are for CDMS
actions, the greens are for EPS actions and the grays for the ADCS’s. The ADCS will only starts
when the CDMS will give a command to the EPS to switch on the subsystem. The EPS will just
supply the whole card. If there is not enough available energy to start the board, the EPS will send
back an acknowledgement that it was not able to switch the subsystem on. Once the ADCS will be
supplied, only the microcontroller should start. It will go through its own boot sequence, initialize
the sensors with pre-stored values and perform some functional test on them. It should send an
acknowledgement or test report to the CDMS and enter in a STAND-BY mode. The STAND-BY
mode will be a waiting mode in which only the microcontroller will be in function. The
microcontroller will be ready to receive TC’s from the CDMS and change the operational mode.
A possible mode is the OFF mode. It is planned that in this mode the microcontroller will
deactivated sensors and actuators and save some critical values before sending a reply to CDMS, so
that the CDMS can give a command to the EPS to switch off the subsystem.
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The third foreseen mode, the SENSOR mode, only the sensors and the microcontroller will be in
functions.
The NOMINAL mode is almost the same as the SENSOR mode, the difference is just that the
magnetotorquers will be in action.
And finally the WHEEL mode is the NOMINAL mode plus the fact that IWA will be in action.
The change from one mode to another shall only be commanded by the CDMS.
The implementation of these modes can be made in, at least, two different ways. The first possibility
is to stay in infinite loop for each mode until an interruption is generated by the CDMS and the
mode change. It may need a lot of resources and increase the complexity of the code. A more
elegant solution will be to use the microcontroller timer to generate interruption automatically at
certain time to launch small functions, such as sensors reading, magnetotorquers switch. Between
the interruptions the program will stay in a main loop ready for the next interruption or TC from the
CDMS.
The detail of each phase can be found in Appendix C.
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Figure 26: Flow diagram.
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5.4.3 Software functions

In order to test the different functional part of the development board, software codes need to be
implemented on the microcontroller. The software will be developed under the code composer v2.0
emulator. Following functions are required:
First of all the program shall initialize the clock system. The internal digital clock system is the bas
signal that will be used for the other clock signals and all the time dependant operations.
Apart form the special pins of the microcontroller like power supply or ground, the other pins can
be configured in at least two states, the general purpose input/output (GPIO) or specific functions.
Specific functions can be ADC inputs, PWM outputs, clock signal output, SPI, I2C, etc. For more
details refer to [R14].
The microcontroller shall communicate with the CDMS through the main bus, actually an I2C bus.
The configuration to communicate with the appropriate pins of the microcontroller shall be
implemented. Each command received from the CDMS should generate a interruption, resulting in
action such as sending TM/HK, changing parameters.
To collect the sensor data two kinds of function are required. For the magnetometer a SPI interface
is required. The microcontroller will be the master. The gyroscopes and the sun sensors generate
analog signals. These signals will be converted to digital signal by the microcontroller. A timer allows
to set the sampling time of the conversions. An interrupt is set every second for example. The
conversion starts at the interruption. No CPU operation are needed except for the transfer of the
data from the buffer in storing registers.
The command signals for the driver stage of the actuators are PWM. They will be generated by the
timer B of the MSP430. Six outputs are necessary with the actual setup. The timer control registers
can be configured with a lot of option. The programming of the microcontroller was started at the
end of the project for this part.
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6 TESTS
The test procedures presented in this section describe the functional testing. Before making thermal,
vacuum, vibration, supply voltage variation tests, the design shall be validate in laboratory
conditions. Some of the components can be tested separately from the main board with
independent set-ups. It is foreseen to test first the actual version of the card in parallel to the sensors
to prove the functionality of each functional part separately. Once it is done, a card close to the
flight model shall be developed and test in mission like conditions.
This section presents a preliminary view of the tests that shall be made. Unfortunately the actual
results are very limited.
6.1 Main board

The main board is the heart of the ADCS hardware. All functionalities except the sun sensors, their
amplification electronic and the coils can be tested on it.
6.1.1 Test objectives

The objective is to prove that the design fulfill the functional analysis and the requirements. It
means that the programmability of the microcontroller, the generation of the actuation signals, the
reading of sensors and the communication capability with the main bus will be proven. These points
include the functional test of all the components necessary to achieve the functionalities. In a second
phase the board shall be tested in mission like conditions and the frequency dependency to supply
voltage variations shall be characterized.
6.1.2 Identification and configuration of the test article

A full mounted version of the development board is required to test all the capabilities. It is possible
to start the test with a minimal configuration of the board. The minimal configuration is the PCB
with the microcontroller and its peripheral components such as the main connector, resistors and
capacitors. For more detail, refer to the electrical schematic. The other components can be added
during the test process. If the board is entirely mounted, the jumpers that were included in the
design allow disconnecting completely each part of the system that is not necessary for the tests.
The documentation required for the test is the datasheets for the corresponding components.
Reference based sensors and actuators will be tested on separate test benches. A particular reference
frame is not required at this stage.
6.1.3 Test set-up identification

For testing the functionality and electrical parameters, a programming and debugging interface, a
multi channel oscilloscope, a voltage stabilized source are required. The interface between the card
and the main board shall be ensured with the available development tools, parallel to JTAG interface
or USB to JTAG interface.
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6.1.4 Test conditions

Functional test can be made in laboratory conditions at beginning. The card will be tested in mission
conditions after the functionality of all parts is proven.
6.1.5 Step by step instruction for operation

Start emulator
Connect devices
Program functions
Measure parameters (clock, current, voltage, temperature)
Document
The exact procedure will be defined during the next semester.
6.1.6 Safety and security instructions

6.1.7 Personal required and responsibility
1 person is required at least. Since several cards were developed, it is possible to test in parallel.
The ADCS system engineer will be responsible.
6.2 Sun sensors

The sun sensors will be tested separately from the main board in a first phase. Once they will be
properly characterized, the sensors will be added to the ADCS and the reading will be tested.
The solar cells require similar test. They were tested in the industry. The tester shall ask the person
responsible for the solar cells to see if it is possible to use the existing set-up.

The main objective is to test the accuracy that can be measured in function of the angle of incidence
of sun rays and temperature. Another objective is to measure the power consumption refine the
power budget. The sensor should also be tested under vibration conditions to test the wire bonding
and the gluing.
6.2.2 Identification and configuration of sun sensor

The PCB developed during phase B will be used. The sensor shall be placed on a horizontal plane
looking upward. The planarity shall be verified between the sensitive head and the table. The
sensitive head is the reference for the angular dependency.

The test set-up shall capable to rotate the sensor along two directions, pitch and roll, for the
incidence angle characterization. The set-up shall be able to convert the sensor signals from analog
to digital signals. A special light shall offer the same spectral range as the sun and parallel rays for
valuable data. The set-up shall measure electrical characteristics.
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Several tests in the same conditions should be performed to check the repeatability of the angle
dependency.

Fix sun sensor on table.
Start measurement set-up.
Ensure electrical connections.
Start illumination.
Vary incidence angle.
Measure signals and currents.
Store data.
Model performances.
Document

1 person is required
6.3 Gyroscopes
For the gyroscopes, small test PCB was developed so that the first test can be conducted only on it.
In a second phase, the development board shall be used to test the three axes performances

The objectives are verify the performances given by the data sheet and characterize the drift during
eclipse and accuracy. The linearity of measurement shall be characterized in function of the
temperature.
6.3.2 Identification and configuration of the gyroscope

The PCB developed for the third axis should be used for the first tests. Then the gyroscopes of the
main board should be tested

The sensor shall be placed on a rotary table. The angular speed shall be adjustable -1 rad/sec and 1
rad/sec. The set-up shall be able to convert the sensor signals from analog to digital signals. Or the
ADCS main board shall be used for the conversion. The set-up shall measure electrical
characteristics.
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Tests should be longer as eclipse duration, since the gyroscopes can only be recalibrated during
daylight.

Fix gyroscope on table.
Start measurement set-up.
Ensure electrical connections.
Start rotation.
Vary rotation.
Measure signals and currents.
Store data.
Model performances

1 person is required
6.4 Magnetotorquers
For the magnetotorquers testing it is necessary to test the main board before. Once the PWM
generation with the microcontroller is validated, they can be tested.

The objectives of the test are to characterize the electrical parameters of each coil and the magnetic
field generated. In second phase it is to characterize the interaction of the three coils. Another
objective is to check to disturbances induces in the other signal lines on the PCB, in order to refine
the design to avoid those. The magnetotorquers shall be tested with different PWM rates. The
change of electrical parameters of the coils shall be characterized under vacuum conditions when
there is no convection. Supply voltage variation shall also be tested.
6.4.2 Identification and configuration of the magnetotorquers

For the testing of the electrical characteristics, the test can be made on only one coil. No specific
configuration is required. For the test with the three coils, they shall be attached on a test frame in a
way that the perpendicularity is guaranteed.
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The test set-up will be composed of the main board with its programming interface, a multi channel
oscilloscope a stabilized voltage source. The three coil test requires the same set-up plus a structure
to maintain the three magnetotorquers perpendicular to each other.

In a first phase the coils shall be tested in laboratory conditions. Test s in a vacuum chamber are
necessary in second phase.

Connect elements
Start software, PWM sequence with different rates
Measure current, voltage, temperature
Document

1 person is required.
6.5 Tests after integration

As said before, once the component will all be tested separately, the ADCS shall be put together and
test under mission-like conditions (temperature, vacuum, voltage variation, main bus data interface).
A magnetometer measurement test shall be done, once the system is integrated. The aim is to
characterize the measurement with the magnetotorquers and the wheel functioning in a Helmholz
coil to determine the disturbances induce by the actuators.
6.6 Results
The program is under development. The first result is that the main card is programmable, that the
master clock works, the magnetotorquers switch can be configured. PWM can be generated.
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7 RECOMMENDATIONS
The actual board is a functional card. The placement of the components was not optimized. The
power supply and main data bus connectors shall be placed to be compatible with the mother board.
The sun sensors and magnetotorquers connectors shall be placed on the side of the card in order to
simplify and shorten the cabling. The size of PCB for the gyroscope third axis shall be first reduced
to the minimum. A mechanical structure shall be designed to fix the PCB mechanically and to
guarantee the perpendicularity of the sensor. The placement of the gyroscope module shall be
checked to make sure that the card can be inserted in the structure. The card shall placed as close as
possible to middle of the satellite and the components facing the center, where is space available.
The sun sensors shall be cabled before gluing on the carbon panels, if not, the glue goes in the
connection holes. According to last minute information of the structure and configuration
subsystem, their size can be increased of 3 mm in the length. The surface available for the gluing will
be larger. This will improve the quality of the mechanical interface.
The sun sensors give out two pairs of signals. An angle is calculated with each. pair. When possible
the angle should be calculated directly in the ADCS microcontroller, so the CDMS do not need to
allow calculating power to this task. This will be evaluated during the next semester.
The magnetometer requires a clock signal for its internal ADC. Actually the magnetometer uses the
master clock signal MCLK of the microcontroller. MCLK is also the CPU clock signal. It is
advantageous to use sub main clock signal if the clock frequency of the magnetometer should be
adjusted without changing the CPU clock
The connection of the PWM outputs contains a mistake. The first output was used as standard
PWM output, but its compare threshold is used on the six other PWM to determine the upper limit
of the counter. The six other compare threshold can be set independently to fix the duty cycle. For
the detailed information about the microcontroller timer and PWM outputs, refer to [R14].
Magnetotorquers were built during the project for the test phase. Due to structural interface
modifications they are not at the right size anymore. They shall be resized in accordance to the
structural constraints. After the first tries to make magnetometers, it was observed that it will not be
possible to obtain precise outer dimension. In order to solve this problem, it is recommended to
undersize the coil of a tenth of millimeters, to put the coil in a mould and to cast epoxy over it.
Once the design is validated the design of the IWA shall be integrated to the rest of the ADCS
board. When possible both should use the same microcontroller.
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8 SYSTEM ENGINEERING
This section summarizes the mass and power budgets at system level. The other system engineering
tasks described in the work package were overtaken by other students at the end of the semester and
presented in the other System engineering reports.
For information about the subsystems, refer to the specific report or to [R17].
8.1 Mass budget

The mass budget is based on the work done during Phase A. It was updated during the whole Phase
B. Just as a reminder a CubeSat shall weight less than 1 kilogram. After Phase A, the overall mass of
the SwissCube was 913 grams. It means a margin of about 10%. During Phase B it was possible to
refine the estimation made before, because most of the hardware was available. Table 11 presents
the mass allocation of each subsystem. Actually the satellite weights 709 grams, so a margin of about
30%.
Subsystem Mass [g]

Structure & Configuration 273
EPS 188
ADCS 114
CDMS 33
Payload 47
COM 30
Mechanism & antenna 20
Thermal 4
Total 709
Table 11: Subsystems mass budget.

Table 12 gives another representation of the mass allocation. The mass is distributed over the
different boards and faces. By face it is meant the sun sensor, the magnetotorquer if placed behind it
the composite panel and in one case the antennas.
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Boards / Faces Mass [g]

EPS board 162
ADCS board 28
CDMS board 33
Payload module 48
COM board 30
General structure 214
face +x 20
face -x 36
face +y 49
face -y 35
face +z 36
face -z 20
Total 709
Table 12: Board and faces mass budget.
8.2 Power budget

The actual power budget is based on the work done during phase A and B. The establishment of the
power budget is done with many assumptions. The worst case in term of orbit duration is
considered and an 30 % margin is book kept.
8.2.1 Assumptions
To calculate the total amount of energy (mWh) needed for one orbit around the Earth, assumptions
were made. Some of them come from the projects requirements and others will define new system
requirements. These assumptions are listed below.
- One orbit is 92.6 minutes long, 36 minutes in eclipse and 56.6 minutes in daylight. This is
the worst case because this is the longest eclipse duration and it corresponds to an altitude of
400 km.
- Science takes pictures during the eclipse and when possible also during day time
- RF reception is always on
- The beacon sends a 15 seconds long message every 30 seconds
- ADCS Magnetotorquers are always in use and need 50 mW each on average
- ADCS controller and sensors are always on
- EPS is on all the time (eclipse and daylight)
- RF Data transmission sends 7.5 minutes long data message
- Payload picture capture is 10 seconds long
- The energy taken from the battery generate 10% losses
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The power, in watts, needed by each subsystem is presented in Table 13.
mW
EPS 30
Payload 450
CDMS 150
Beacon 150
ADCS control 30
ADCS sensor 60
ADCS Magnetotorquers 150
ADCS wheel 85
Main RF control & receiver 90
Main RF transmitter 2000
Eclipse duration 0.6 400km

Daylight duration 0.94
Produced power (mean) 1744
Transmission duration 0.13 h
Margin 30%
20%
Battery discharging losses 10%

Battery charging losses 10%
Table 13: Power required per subsystem.
8.2.2 Power production profile

The mean power production over the worst case orbit (400 km) was calculated using the STK
simulator and Simulink. The incidence angle on each face is calculated with Simulink/MatLab taking
different vector from STK. With a basic model of the SwissCube, the incidence angle of the solar
rays on each satellite face can be computed. The results of each face are summed the power
production profile over the orbit can be determined. The average over the orbit is taken and so the
power production. Figure 27 shows the power production in function of time.
The solar cells of the model have a limit angle of 20 degrees. It means that if the solar ray it the side
panel with an angle below 20 degrees, no power will be produced.
The produced power is constant on one face, +y or –y depending of the kind of orbit. The peaks
correspond to the illumination of the four other faces.
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Figure 27: Power production in function of time with mean value.
8.2.3 Power modes

Once the satellite is in function which is corresponding to the nominal mode of the operational
modes, there are 8 different possible power consumption states, 4 during daylight and 4 during the
eclipse. In each part of the orbit the satellite can be transmitting or not and taking pictures or not.
The different states are listed in Table 14, with their corresponding energy consumption.
DTS Daylight WITH transmission and WITH science 1090 mWh

DTnS Daylight WITH transmission but WITHOUT science 1088 mWh
DnTS Daylight WITHOUT transmission but WITH science 789 mWh
DnTnS Daylight WITHOUT transmission and WITHOUT science 787 mWh
ETS Eclipse WITH transmission and WITH science 1021 mWh
ETnS Eclipse WITH transmission but WITHOUT science 1020 mWh
EnTS Eclipse WITHOUT transmission but WITH science 559 mWh
EnTnS Eclipse WITHOUT transmission and WITHOUT science 558 mWh
Table 14: Power modes.
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In order to have to have power modes for complete orbits, the different cases above have to be
combined. The combination gives 16 (4x4) different power states. Table 15 shows the sum of the
divers states (unit mWh).
ETS ETnS EnTS EnTnS

DTS 2'266 2'265 1'884 1'883
DTnS 2'265 2'264 1'883 1'882
DnTS 1'923 1'921 1'541 1'539
DnTnS 1'921 1'920 1'539 1'538
Table 15: Power consumption combinations.
8.2.4 Consumption scenario

The 16 different combinations are list in Table 16. Once the satellite is in nominal mode of
operation, it will be in one of these power consumption combinations. At an altitude of 400
kilometers, the satellite will orbit about 15 times around the Earth. It will have three opportunities to
communicate with the ground segment (assumption that only one ground station is used for
communication). The imagined scenario is that the satellite will take pictures once a day, that the
communication will be established three times a day and that during the remaining eleven orbits, no
science and no transmission will occur. The energy consumed for each orbit is summed, so the total
consumption per day is known. As it is to be seen in Table 16 the total power consumed power in
one day is less than the total amount of produced energy during the fifteen orbits.
Number of
Phase orbits Energy/phase Energy
DTS ETS 2'266 0
DTS ETnS 2'265 0
DTS EnTS 1'923 0
DTS EnTnS 1'921 0
DTnS ETS 2'265 0
DTnS ETnS 2'264 0
DTnS EnTS 1'921 0
DTnS EnTnS 3 1'920 5'759
DnTS ETS 1'884 0
DnTS ETnS 1'883 0
DnTS EnTS 1'541 0
DnTS EnTnS 1'539 0
DnTnS ETS 1'883 0
DnTnS ETnS 1'882 0
DnTnS EnTS 1 1'539 1'539
DnTnS EnTnS 11 1'538 16'916
Total 24'215
Power production 15 1'639 24'590
Table 16: Scenario.
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9 CONCLUSION
Most of the objectives of the ADCS part of the project were fulfilled. The ADCS breadboard was
developed and 3 boards are now available for the software programming and the tests.
Unfortunately it was not possible to finish the test and to make the characterization of the
gyroscopes, sun sensors and magnetotorquers. The choice of the components and the development
took more time than expected. The tests on the main board have been started. Its programmability
was tested proven. At this stage it was noticed that certain point of the actual design shall be
improved in the next version of the card. They are listed in the recommendation chapter, 7.
At system level, the design iterations were continued and the different budgets book kept. Despite
the fact that a lot of hardware has been developed, it remains some points that are not totally
defined and so the budgets and diagrams need to be refined. For example a detailed mission
planning will be necessary to make a precise power budget. Actually only the mean consumption
was taken in account and not the peaks. The system functional analysis was continued and is now
refined functional within the frame work of another master thesis. The reflections about the
interfaces definition were taken into account for the block diagrams updates, but they need to be
refined.
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10 REFERENCES
[R1] Armen Toorian, CubeSat as responsive Satellites, California Polytechnic State University, 3rd
Responsive Space Conference, 2005.
[R2] CubeSat Design Specification, Revision 9, CalPoly, May 2005.
[R3] R. Krpoun, CubeSat Project – Mission Description Document, EPFL, May 2005.
[R4] M. Noca, SwissCube Project Specifications, EPFL, January 2006.
[R5] Dumont Marie, S3_B_SE_1_1_specrules, February 2007
[R6] ECSS-E-30-3A, September 2006, Mechanical
[R7] M. Pedersen and J.H. Hales, Linear Two-axis MOEMS sun sensor, Technical university of
Danemark (DTU), 2006.
[R8] Vasko Vitanov, S3 Phase B report magnetic sensor, EPFL, February 2007.
[R9] Omar Scaglione, IWA electronics report, EPFL, February 2007.
Gavrilo Bozovic, IWA electronics report, EPFL, February 2007.
[R10] ECSS-E-60A, September 2006, SE control systems
[R11] Alvaro Foletti, Piyawat Kaewkerd, ADCS_Swisscube_V3_1, EPFL, October 2006.
[R12] Guillaume Roethlisberger, S3-B-STRU-1-0-Structure&Configuration, February 2007.
[R13] Jean Gubelmann, S3_B_EPS_1_0_RBF_LUP_FMS_HBG_final_report, EPFL, February
2007.
[R14] Texas Instruments, MSP430 family user’s guide slau049f, EPFL, 2006
[R15] Texas Instrument, Mixed Signal Microcontroller slas368e, August 2006.
[R16] ECSS-E-10-04a Space Environement, last revision
[R17] Noca, Scheidegger, Krpoun, S3-A-SET-1-0-systemdescription, June 2006
Issue : 1 Rev : 0
Date : 2/24/2007
Page : 79 of 106
11 ABBREVIATED TERMS
ADCS Attitude Determination and Control System

ADC Analog to digital converter
DTU Dansk Technical University
EPS Electrical Power System
JTAG Joint Test Action Group
NA Not available
PWM Pulse Width Modulation
SRF Satellite Reference Frame
TNO Name of Dutch technology research institute
USB Universal Serial Bus
12 CONTACT LIST
Bruelmeier Peter peter.bruehlmeier@epfl.ch PCB layout

Badertscher André andre.badertscher@epfl.ch Component welding
Meinen Cédric cedric.meinen@epfl.ch Electronic
Dupuis Roland roland.dupuis@epfl.ch Electromechanical workshop
Brugger Jean-Paul jean-paul.brugger@epfl.ch Electromechanical workshop
Rachidi Farhad farhad.rachidi@epfl.ch High frequency electromagnetic disturbances
Hales Jan jhh@mic.dtu.dk Sun sensors
Serge Costaldi 024 55 76 316 HEIGVD assistant, MSP430
Pierre Zweiacker pierre.zweiacker@epfl.ch, Magnetism
13 SIGNATURE
Lausanne, le 23.02.2007 Signature:

Bastien Despont

System Engineering and Development and Test of The Adcs Breadboard For Swisscube

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Issue : 1 Rev : 0

Master Project 2007

ISS/REV Date Modifications Created/modified by

3.5.2 Static and dynamic loads 35

6.3.4 Test conditions 69

B.4 MAIN BOARD 102

determination & control and a payload. The

This master project focuses on two different

The satellite is composed of seven different

PROJECT: SwissCube Satellite PHASE: B WP REF: 1100

Start Date: 23-10-06

Technical Work Description

- Continue book-keeping of the system budgets;

Figure 1: Example of a CubeSat (Aalborg University)

Figure 2: The Nightglow phenomena [R3].

Figure 3: ADCS subsystem hardware block diagram.

2 DESIGN REQUIREMENTS AT LEVEL 4

2.1 Functional Requirements

2.2 Mission & Performance Requirements

2.2.2 Subsystem states

2.2.3 Subsystem H/W performances

2.2.4 Subsystem S/W performances

2.2.5 Reliability and redundancy

2.3 Design Requirements

4_ADCS_31_02: Launch date

4_ADCS_33 _02: Maintenance during storage and ground operation

2.4 Interface Requirements

2.4.2 Thermal Interfaces

2.4.3 Electrical Interfaces

2.4.4 Data Interfaces

2.4.5 Physical Interfaces

2.5 Environmental Requirements

2.5.2 Static and dynamic loads

2.6 Operational Requirements

2.6.3 Failure management

3 DESIGN REQUIREMENTS AT LEVEL 5

3.1 Functional Requirements

5_ADCS/MCU_10_01: ADCS microcontroller function I

3.2 Mission & Performance Requirements

5_ADCS/DTS_23_01: Sensors power consumption in “WHEEL” mode

5_ADCS/DTS_23_08: Sun sensors measurement range

3.2.4 Subsystem S/W performances

3.2.5 Reliability and redundancy

5_ADCS/MCU_25_03: MCU reliability and redundancy

3.3 Design Requirements

5_ADCS/MCU_33_01: MCU thermal maintainability

3.4 Interface Requirements

3.4.2 Thermal Interfaces

3.4.3 Electrical Interfaces

5_ADCS/PCB_44_01: Board supply

3.4.4 Data Interfaces

3.4.5 Physical Interfaces

5_ADCS/PCB_45_01: Card dimensions

3.5 Environmental Requirements

3.5.2 Static and dynamic loads

3.6 Operational Requirements

5_ADCS/DTS_61_01: Life time

3.6.3 Failure management

5_ADCS/DTS_63_01: Failure propagation