SP Series

Any-mix manufacturing solution for evolving assembly needs

An exceptional platform for high-quality, consistently stable screen
printing with excellent aperture fill regardless of board complexity.
Ideal companions to our placement machines and available for both
single- and dual-lane production.
Design Concept
Over 50 years of exceeding customer needs
with proven industry excellence…
and over 100,000 solutions installed
The rapid growth of electronic devices is driving manufacturers to modify
assembly techniques by expanding and updating facilities or assets, cost-
engineering, implementing new processes, and reducing costs. The potential
to build scrap increases dramatically. A balance between costs and output
must be struck while maintaining quality. A trending option is low-cost
printing material; however, process stability is key.

With over 30 years in printing, Panasonic has cultivated leading expertise

by pioneering numerous process improvements to satisfy customer
requirements such as:

• Hybrid dual-blade squeegee for stable paste deposition at any speed

• Twice the accuracy of competitive offerings—
5 microns at 6σ (±3σ) ≥2.0 Cpk
• Robust to use low-cost materials and consumables
while delivering high yields

SPG
Panasonic’s SPG high-speed screen printing machine is the ultimate lean
SMT manufacturing solution. Equipped with multi-stage board handling,
1963 Panasonic Factory Solutions Founded PCB exchange time is reduced, making sure the printer does not become the
1968 1st Insertion Machine Developed bottleneck of the production line. Our hybrid printing method delivers the
right amount of solder with high-speed snap-off and reduced solder waste.
1973 1st Axial Machine Delivered The intuitive interface and changeover wizard helps the operator efficiently
1980 1st Surface Mount Machine Delivered navigate the NPI changeover process. Once established, the parameters are
1984 1st Solder Paste Screen Printer Delivered stored for fast retrieval. What’s more, Panasonic mounters use the same
program file, which further reduces setup time.
1988 10,000th Solution Installed
1988 PFSA Established for North American Market The Panasonic SPG’s printer feedback to the AOI/SPI and patented feed-
1992 Microelectronics Group Expands Offerings forward communication to the mounter helps further enhance overall
line productivity. Print capabilities reach beyond high speed and quick
1993 ISO Standard Certifications
changeover. The inherent SPG print capability supports 020125mm (008004”)
2000 30,000th Solution Installed components—roughly 75% lower volume than the 0402mm (01005”) chip.
2000 PanaCIM Enterprise Edition Released
Features & Benefits
2012 Total Solutions for “Any Mix, Any Volume”
• High-speed 15-second clean and print cycle time, every time
2014 100,000th Solution Installed • Eco-friendly solution for lean manufacturing
2015 NPM-W2 & D3 with Multi Recognition Camera • Compatible with industry-standard stencils
PRINTING INNOVATION >30 YEARS Scalable
• Match line capacity to production needs
Since 1984 Panasonic has been designing printer solutions. From • Integrate software modules when business dictates
this proven, innovative history working with both our customers • Single-line facilities to multi-nationals
and our own production requirements we acquired incredible
process expertise. Integrated
• For any machine platform or business system
• Communicates with numerous peripheral systems
Our expertise is further complemented by the leading-edge
• Multi-level traceability throughout the SMT process
material science program we developed with in-house production
of solder and resin pastes.
Efficient
For these reasons, the SP series of printer solutions are commonly • Asset utilization optimized by zero changeover
adopted at major OEM and EMS to build for automotive and high • Offline set-up, teach, and changeover tools
volume markets. • Highly-accurate inventory management

SPV SP-70
The revolutionary SPV transforms the traditional production model by The SP-70 screen printer is designed to address ultra-high accuracy printing
supporting a myriad of options to print multiple 350x300mm (M-size) boards for both high- and low-volume manufacturers with boards up to 510x510mm.
simultaneously. Complementing the versatility is a feature set rich with With a focus on advanced printing challenges, the SP-70 affords automatic
changeover options and an inherent print-clean cycle of 10 seconds. solder paste dispensing via sealed cartridges and syringe containers to
reduce replenishment frequency and increase capabilities for ultra fine-pitch
Features & Benefits bump printing.
• Lower WIP inventory and reduce changeover time by handling up to 4
unique products simultaneously Like other Panasonic printers, the SP-70 features advanced hybrid dual-blade
• Minimize capital expenditures by reducing printer investment by 50% squeegee for high quality, stable printing while reducing the amount of
• Maximize floor space utilization with new hybrid board handling concept wasted paste.

Achieve 10 second Average Printing Cycle Time Features & Benefits

• Newly developed automated cleaning unit • Excellent snap-off performance for advanced applications
• Multi-stage board handling conveyors • Hybrid squeegee head and selectable multi-level stencil release control
• Hybrid dual-blade squeegee provides stable print process and control
• Universal stencil holder for 21” to 29” frames without adapters along
2.5s 3.5s 2.0s 2.0s 2.5s
*10 second: Average Printing Time with automated stencil location and mask detection
+ transfer + cleaning.
Printing Transfer Position- Recogni- Printing
ing tion PCB dims: 250 x 165mm
Back-side Cleaning 7.0 seconds
Printing & cleaning conditions
10 second average are our recommended conditions
except the 2in1 printing.
Printing cycle time
STANDARD FEATURES
The SP Series of printers provides numerous standard features to ensure high quality printing process.
A few examples are highlighted below with numerous other options available.
Hybrid Squeegee Head Changeover Navi Multi-level Mask Release
• Dual-blade, motor- • Wizard guides • Control printing shape Screen Mask
controlled squeegee for operator through quality through speed
stable solder fill changeover process and stroke settings Solder
• Closed-loop print • One touch • Automated release PCB
pressure control with squeegee and program for ideal
warning alarm support pin release print conditions

CONFIGURATION OPTIONS
Like our award-winning NPM placement machines, the SP Series of printers provides numerous standard
features and optional entrancements to ensure high quality printing process. A few examples are
highlighted below with numerous other options available.

Auto-feed SPI Function Universal Mask Holder

• Novel, efficient • Identifies, bridging, • Expand beyond the 29”
dispensing stabilizes misalignment, blur, frame to multiple
solder volume and and oozing defects alternate frame sizes
reduces waste • User-defined • Combine with automatic
• Dual pot design ideal quality thresholds screen positioning for
for high volume and intervals simplified setup

Cartridge Head Mask Height Detection High Speed Mask Cleaning

• Enclosure prevents • Laser identifies and • Cleaning system
material from drying corrects mask and reduces paper con-
and improves control board clearance for sumption
of process stable printing • Parallel processing &
• Longer material life • Detects PCB thickness vacuum cleaning
and reduced waste data input errors increase performance

SPV BOARD HANDLING OPTIONS

Triple conveyor solution establishes a printing process according to your production.

SPV without PCB Discrimination Function SPV with Pre- & Post-Process PCB Discrimination Function
Single Spec 2 in 1 Spec
Select a spec Select a spec 1 to 2 Spec Dual Spec
SPV with Pre- & Post-Process PCB Discrimination Function

SPV with Post-Process PCB Discrimination Function SPV with Post-Process PCB Discrimination Function
ADVANCED PROCESS CONTROL
Incorrectly Certified Panasonic Placed Perfect
Printed PCB SPI Solution Mounter onto Paste Post Reflow

APC

Patented APC Feed Forward to Mounter

Numerous studies and documentation details how the solder reflow process Alternatively, APC-controlled placements will maximize the self-alignment
can help position surface mount components normally on the pads, even if principle. Using APC to mount microchips onto the solder instead of the pad
component placement is off pad. However, the trend to shrink components will increase yields and quality.
to 0.3mm pitch bumps or 0201mm microchips is opening doors to explore
how adaptable Advanced Process Controls (APC) can improve yields in high- In general, communication between a printer and mounter will improve
density placements. process repeatability by automatically adjusting component placement to
the solder deposition, rather than to the pad location. This advanced process
Advanced Process Control collects solder location data from a Solder Paste further improves microchip mounting reliability. When implementing APC
Inspection (SPI) system, and then sends the data downstream to pick and in production, manufacturers can realize dramatic process improvements
place mounters compared to a conventional placement approach lacking communication
between the printer and mounter.
The mounters use the received data to update the placement program;
thereby, ensuring the components are placed onto the solder deposits rather
than onto the substrate pads. This approach to placing components on the
Total Solutions for Any Mix Any Volume
printed solder uses the self-alignment principle to increase production yields Panasonic collaborates with the following leading AOI and SPI providers to
and reduce defects. provide you a turnkey, integrated solution with one single point of contact:

When solder is off pad and components are placed to the programmed CAD
Koh Young Mirtec Viscom TRI
location, self-alignment is not effective. During reflow, components will shift Parmi Cyber Optics Omron CKD Nagoya
off pad or bridge with other pads; thereby, causing rework or scrap.

LOW-COST PRINTING PAPER

The rapid growth of electronic devices is driving manufacturers to enhance In the end, both paths aim to maximize profitability. As such, understanding
high-volume PCBA techniques. As manufacturers strive to balance costs with how manufacturers can successfully integrate low-cost materials will help
production, they can expand facilities, update equipment, or implement novel ensure high-quality production, reduce costs, and maximize profitability.
processes. In any case, as manufacturers increase production volume, the
potential to scrap product or rework boards increases dramatically. Our expertise and testing
Manufacturers have two general paths to reduce the PCBA costs. The first provide a unique perspective
path is to reduce cost by focusing on high quality printing and mounting.
The other, increasingly popular option is to utilize low-cost materials.
on how low-cost materials
Regardless of the path, the baseline must provide a consistent high- affect print performance
speed solder paste printing method, which considers fill, snap-off,
and cleaning processes.
as well as help provide
a stable printing process
SOFTWARE AND PROGRAMMING
Data Generation System
DGS (Data Generation System) is our intuitive, PC-based programming
software. Taking line balance into consideration, it assigns parts from CAD Award Winner Award Winner
data, optimizes them, and then creates the placement program for the line. Circuits Assembly Global SMT & Pkg
NPI Award Technology Award
Multi-CAD Import Production Software Best Product Americas
• Retrieves data and allows properties
like polarity and position to be verified
on-screen

Component Library
• Registers and unifies component
mount data
• Large library of standard component
definitions available PanaCIM integrates cooperating software modules to solve key production
problems by addressing the top objectives for successful manufacturing.

Simulator Customizable
• Provides on-screen confirmation in The PanaCIM modules were developed based on user feedback to provide a
advance of production complete assembly software suite. Select the best modules for your current
situation and easily add others as needed.

Cloud-level Seamless integration of business systems

Virtual PCB Inspection
• Overlays program data on board image Enterprise-level Connect all departments to schedule and analyze
to validate or adjust component production and integrate with MRP/ERP systems
alignment and rotation
Facility-level Ensure visibility to track WIP, dispatch operators,
and take proactive measures
Changeover Mode
• Continuous production on one side of Line-level Manage OEE through traceability, WIP tracking,
the machine while changing over the and automated changeover
opposite side
Machine-level Machine-to-machine communication to assure yield,
materials, and quality

Complete MES software solutions Eliminate IT infrastructure costs with PanaCIM Express
for digital manufacturing… A self-contained, pre-configured
system especially for smaller
developed in the US, installations requiring digital
deployed globally data collection, yet do not
have dedicated IT staff.
Placement SOLUTIONS Providing
The rapid industry acceptance of the award-winning NPM platform is based on its inherent design
flexibility. Each NPM is a completely integrated, single-platform solution that can provide far-reaching world-class solutions
solutions to expand and evolve with your electronics assembly needs. In addition to its interchangeable, for industrial,
plug-and-play heads, the NPM can integrate solder paste inspection (SPI), automated optical component
inspection (AOI), and dispensing. communications,
automotive,
Yet, when requirements change, so can the NPM. Simply swap heads to add new machine functionality
and investment protection. As always, manufacturers can scale NPM lines to meet production needs and more…
while conserving investments until production or technology
requirements mandate. OEMs and EMS providers can
regardless
reconfigure both machine heads in approximately 15 of company size
minutes—maximizing flexibility and ROI, while protecting
assets. The NPM also incorporates existing feeders, carts,
and nozzles to minimize investment and inventory expenses.

TOTAL SOLUTIONS
Many suppliers claim to provide total solutions, but for Panasonic Factory Solutions Company of
America the notion of “Total Solutions” carries a very meaningful and powerful connotation. As a leading
electronics manufacturer with a deep and practical understanding of printed circuit board assembly, we
have the unique perspective to understand what is required to solve your production challenge.

What’s more, we have the distinctive ability to provide total solutions beyond the production line.
While we can provide best-in-class hardware and software tools from our own portfolio, we are part
of a supplier collective, which allows us to provide turn-key solutions for your unique application
and business model. Yet, the equipment sets are mere building blocks to solving your manufacturing
challenges, especially as our industry evolves with the Internet of Things.

FACTORY OF THE FUTURE

Across the globe, the “Smart Factory” has been highlighted in many national
initiatives. Regardless of the name, “Industry 4.0”, “Advanced Manufacturing”
or “Smart Factory”, all efforts focus on transforming the manufacturing
process from isolated silos to a “lean, agile, and integrated” ecosystem
underpinned by the Internet of Things.

Since our humble beginnings, Panasonic founder Konosuke Matsushita focused

on manufacturing innovation. In fact, we have been connecting “things”
throughout the course of our nearly 100 year history.

Beyond patents, PanaCIM MES software developments are already enabling the
connected factory and offering value beyond operational cost savings. It offers
compelling solutions to collect and analyze disparate data, in real-time and
across time, to transform the business. Furthermore, our software solutions
offer opportunities for sustained value creation—and even disruption for those
who can imagine the endless Factory of the Future possibilities.
SPECIFICATIONS
Model ID SPG SP-70 SPV
Model No. NM-EJP6A NM-EJP3A NM-EJP7A NM-EJP7A NM-EJP7A NM-EJP7A/8A
Images per Stencil One One One One One One
Input Board Handling Single Single Single Single Dual Single
Output Board Handling Single Single Single Dual Dual Dual
Board Shuttle Upline No No No No Yes No
Board Shuttle Downline No No No Yes Yes Yes
Min Board Size 50 x 50mm 50 x 50mm 50 x 50mm 50 x 50mm 50 x 50mm 50 x 50mm
Max Board Size 510 x 460mm 510 x 460mm 350 x 300mm 350 x 165mm 350 x 300mm 350 x 300mm
Optional Board Size 650 x 460mm 510 x 510mm ** ** ** **
Board Exchange Time 15 sec 13 sec 13 sec 10 sec 13 sec 13 sec
Repeatability +5μm @ 2.0 Cpk +5μm @ 2.0 Cpk +5μm @ 2.0 Cpk
Frame Size: 736 x 736mm X X X X X X
Frame Size: 650 x 650mm X X X X X X
Frame Size: 550 x 650mm X X X X X X
Frame Size: 750 x 750mm X X X X
Frame Size: 584 x 584mm X X X X
Cartridge Printer TBA X
Power (VAC) 200 - 240 200 200 - 240
Power (Phase) Single Triple Single
Power (Max KVA) 1.7 2.0 2.0 4.0
Air Supply (Mpa) 0.5 0.5 0.5
Footprint 1580 x 1800mm 1680 x 2070mm 1650 x 1517mm 1650 x 3044mm
Height (excluding Tower) 1500mm 1430mm 1500mm 1500mm
Mass 1500 kg 1730 kg 1550 kg 3000 kg

Panasonic Factory Solutions Company of America

Unit of Panasonic Corporation of North America
1701 Golf Road, Suite 3-1200, Rolling Meadows, IL 60008 USA
(847) 637-9600
PFSAmarketing@us.panasonic.com
panasonicfa.com

Europe Singapore
Panasonic Automotive & Industrial Systems Europe GmbH Panasonic Factory Solutions Asia Pacific
Winsbergring 15 22525, Hamburg, Germany 285 Jalan Ahmad Ibrahim, Singapore 639931
Kiyoharu.Ito@eu.panasonic.com fasales@sg.panasonic.com
+49 (0) 40-85386-222 +65 6860 5336

Brasil China
Panasonic do Brasil Limitada Panasonic Industrial Devices Sales (China) Co., Ltd.
Rodovia Presidente Dutra, KM 155 - São José dos Campos - SP - CEP:12230-971 Floor 6, China Insurance Building. 166 East Road LuJiaZui, PuDong New District, Shanghai, China 200120
fa@br.panasonic.com naito.hiroshi@jp.panasonic.com
+55-12-3935-9130 +86-(021)3855-2810

© Copyright 2016 Panasonic Corporation of North America. All rights reserved. Changes may be made without notice to specifications and appearance for product improvement. EAG029.01