Phison Electronics Corporation

PS3111-S11 2.5’’ SATA SSD

(SB260-Small) Specification

Version 1.4

Phison Electronics Corporation

No.1, Qun-Yi Road, Jhunan, Miaoli County, Taiwan 350, R.O.C.
Tel: +886-37-586-896 Fax: +886-37-587-868
E-mail: sales@phison.com / suppport@phison.com
Document Number: S-16234
ALL RIGHTS ARE STRICTLY RESERVED. ANY PORTION OF THIS PAPER SHALL NOT BE REPRODUCED, COPIED,
OR TRANSLATED TO ANY OTHER FORMS WITHOUT PERMISSION FROM PHISON ELECTRONICS
CORPORATION.

Phison may make changes to specifications and product description at any time without notice. PHISON and
the Phison logo are trademarks of Phison Electronics Corporation, registered in the United States and other
countries. Products and specifications discussed herein are for reference purposes only. Copies of
documents which include information of part number or ordering number, or other materials may be
obtained by emailing us at sales@phison.com or support@phison.com.

© 2016 Phison Electronics Corp. All Rights Reserved.

 Revision History
Revision Draft Date History Author

1.0 2016/01/08 First release Elsa Chen

1.1 2016/02/22 Update performance, TBW and power consumption. Elsa Chen

Update 64GB/512GB performance

1.2 2016/04/27 Elsa Chen
Update chapter 6 supported command

Update 64GB/512GB power consumption

1.3 2016/06/03 Elsa Chen
Update chapter 6 supported command.

Update ATTO performance

1.4 2016/08/17 Ichen Yang
Update product warranty policy.
 Product Overview

 Capacity  MTBF
Note3
￭ 64 GB up to 512GB ￭ More than 2,000,000 hours
 SATA Interface  Advanced Flash Management
￭ SATA Revision 3.2 ￭ Static and Dynamic Wear Leveling
￭ SATA 1.5Gbps, 3Gbps, and 6Gbps ￭ Bad Block Management
interface ￭ TRIM
 Flash Interface ￭ SMART
￭ Flash type: MLC ￭ Over-Provision
￭ 1pcs to 4pcs of TSOP/BGA flash ￭ Firmware Update
 Performance ￭ SmartZIPTM
￭ Read: up to 560 MB/s  Low Power Management
￭ Write: up to 465 MB/s ￭ DEVSLP Mode (Optional)
 Power ConsumptionNote1 ￭ DIPM/HIPM Mode
￭ Active mode: < 1,910 mW  Temperature Range
￭ Idle mode: < 295 mW ￭ Operation: 0°C ~ 70°C
￭ DEVSLP mode: < 5 mW ￭ Storage: -40°C ~ 85°C
 TBW (Terabytes Written) Note2  RoHS compliant
￭ 544 TBW for 512GB

 Minimum Average Program/Erase Cycles

￭ MLC : 3,000 cycles

Notes:
1. Please see “4.2 Power Consumption” for details.
2. Please see “TBW (Terabytes Written)” in Chapter 2 for details.
3. Other capacities can be supported in the future.
 Performance and Power Consumption
Performance Power Consumption
CrystalDiskMark ATTO
Capacity Flash Structure Read Write DEVSLP
Read Write Read Write
(mW) (mW) (mW)
(MB/s) (MB/s) (MB/s) (MB/s)
60/64GB 16GBx4, TSOP, TSB 15nm 560 335 550 540 1,095 1,360 4.9
120/128GB 32GBx4, TSOP, TSB 15nm 560 465 550 540 1,000 1,600 4.9
240/256GB 64GBx4, TSOP, TSB 15nm 560 465 550 540 1,015 1,605 4.9
480/512GB 128GBx4, TSOP, TSB 15nm 560 465 550 540 1,565 1,910 4.9
NOTE:
For more details on Power Consumption, please refer to Chapter 4.2.
 TABLE OF CONTENTS
1. Introduction ........................................................................................................................ 1
1.1. General Description ........................................................................................................... 1
1.2. Controller Block Diagram ................................................................................................... 1
1.3. Product Block Diagram....................................................................................................... 2
1.4. Flash Management............................................................................................................. 2
1.4.1. Error Correction Code (ECC) ..................................................................................... 2
1.4.2. Wear Leveling .......................................................................................................... 2
1.4.3. Bad Block Management .......................................................................................... 3
1.4.4. TRIM ........................................................................................................................ 3
1.4.5. SMART ..................................................................................................................... 3
1.4.6. Over-Provision ......................................................................................................... 3
1.4.7. Firmware Upgrade .................................................................................................. 3
1.5. Low Power Management ................................................................................................... 4
1.5.1. DEVSLP Mode (Optional) ......................................................................................... 4
1.5.2. DIPM/HIPM Mode ................................................................................................... 4
1.6. Power Loss Protection: Flushing Mechanism (Optional) ................................................... 4
1.7. Advanced Device Security Features ................................................................................... 5
1.7.1. Secure Erase ............................................................................................................ 5
1.7.2. Write Protect ........................................................................................................... 5
1.8. SSD Lifetime Management ................................................................................................. 5
1.8.1. Terabytes Written (TBW) ......................................................................................... 5
1.8.2. Thermal Monitor (Optional) .................................................................................... 6
1.9. An Adaptive Approach to Performance Tuning ................................................................. 6
1.9.1. Throughput .............................................................................................................. 6
1.9.2. Predict & Fetch ........................................................................................................ 6
1.9.3. SmartZIPTM............................................................................................................... 6
2. Product Specifications ......................................................................................................... 8
3. Environmental Specifications ............................................................................................. 10
3.1. Environmental Conditions ............................................................................................... 10
3.1.1. Temperature and Humidity ................................................................................... 10
3.1.2. Shock...................................................................................................................... 11
3.1.3. Vibration ................................................................................................................ 11
3.1.4. Drop ....................................................................................................................... 11
 3.1.5. Bending .................................................................................................................. 11
3.1.6. Torque .................................................................................................................... 11
3.1.7. Electrostatic Discharge (ESD) ................................................................................ 12
3.1.8. EMI Compliance ..................................................................................................... 12
3.2. MTBF ................................................................................................................................ 12
3.3. Certification & Compliance .............................................................................................. 12
4. Electrical Specifications ..................................................................................................... 13
4.1. Supply Voltage ................................................................................................................. 13
4.2. Power Consumption ........................................................................................................ 13
5. Interface ........................................................................................................................... 14
5.1. Pin Assignment and Descriptions..................................................................................... 14
6. Supported Commands ....................................................................................................... 15
6.1. ATA Command List ........................................................................................................... 15
6.2. Identify Device Data ......................................................................................................... 17
7. Physical Dimension............................................................................................................ 22
8. Product Warranty Policy .................................................................................................... 23
9. Reference .......................................................................................................................... 24
10. Terminology .................................................................................................................... 25
 LIST OF FIGURES
Figure 1-1 PS3111 2.5’’ SATA SSD Controller Block Diagram ............................................................... 1
Figure 1-2 PS3111 2.5’’ SATA SSD Product Block Diagram ................................................................... 2
Figure 5-1 PS3111 2.5’’ SATA SSD Pin Assignment ............................................................................. 14

LIST OF TABLES
Table 3-1 High Temperature Test Condition ....................................................................................... 10
Table 3-2 Low Temperature Test Condition........................................................................................ 10
Table 3-3 High Humidity Test Condition ............................................................................................. 10
Table 3-4 Temperature Cycle Test ...................................................................................................... 10
Table 3-5 PS3111 2.5’’ SATA SSD Shock Specification ........................................................................ 11
Table 3-6 PS3111 2.5’’ SATA SSD Vibration Specification ................................................................... 11
Table 3-7 PS3111 2.5’’ SATA SSD Drop Specification .......................................................................... 11
Table 3-8 PS3111 2.5’’ SATA SSD Bending Specification..................................................................... 11
Table 3-9 PS3111 2.5’’ SATA SSD Torque Specification....................................................................... 11
Table 3-10 PS3111 2.5’’ SATA SSD Contact ESD Specification ............................................................ 12
Table 4-1 Supply Voltage of PS3111 2.5’’ SATA SSD ........................................................................... 13
Table 4-2 Power Consumption of PS3111 2.5’’ SATA SSD .................................................................. 13
Table 5-1 Signal Segment Pin Assignment and Descriptions ............................................................. 14
Table 5-2 Power Segment Pin Assignment and Descriptions............................................................. 14
Table 6-1 ATA Command List .............................................................................................................. 15
Table 6-2 List of Device Identification ................................................................................................ 17
Table 6-3 List of Device Identification for Each Capacity ................................................................... 20
Table 9-1 List of References................................................................................................................ 24
Table 10-1 List of Terminology ........................................................................................................... 25
1. INTRODUCTION

1.1. General Description

Phison’s PS3111 2.5” SATA Solid State Disk (SSD) delivers all the advantages of flash disk technology with

Serial ATA I/II/III interface, including being fully compliant with standard 2.5-inch form factor, providing low
power consumption compared to traditional hard drive and hot-swapping when
removing/replacing/upgrading flash disks. The device is designed based on the standard 7-pin interface for

data segment and 15-pin for power segment, as well as operating at a maximum operating frequency of
200MHz with 30MHz external crystal. Its capacity could provide a wide range up to 512GB. Moreover, it can
reach up to 550MB/s read as well as 500MB/s write high performance based on 16CE and Toggle 2.0 MLC
flash (with 32MB SDR enabled and measured by CrystalDiskMark v5.0).

1.2. Controller Block Diagram

Figure 1-1 PS3111 2.5’’ SATA SSD Controller Block Diagram

1
1.3. Product Block Diagram

Figure 1-2 PS3111 2.5’’ SATA SSD Product Block Diagram

1.4. Flash Management

1.4.1. Error Correction Code (ECC)

Flash memory cells will deteriorate with use, which might generate random bit errors in the stored data.
Thus, PS3111 2.5’’ SATA SSD applies the LDPC (Low Density Parity Check) of ECC algorithm, which can
detect and correct errors occur during read process, ensure data been read correctly, as well as protect
data from corruption.

1.4.2. Wear Leveling

NAND flash devices can only undergo a limited number of program/erase cycles, and in most cases, the
flash media are not used evenly. If some areas get updated more frequently than others, the lifetime of the

device would be reduced significantly. Thus, Wear Leveling is applied to extend the lifespan of NAND flash
by evenly distributing write and erase cycles across the media.
Phison provides advanced Wear Leveling algorithm, which can efficiently spread out the flash usage
through the whole flash media area. Moreover, by implementing both dynamic and static Wear Leveling
algorithms, the life expectancy of the NAND flash is greatly improved.

2
1.4.3. Bad Block Management
Bad blocks are blocks that include one or more invalid bits, and their reliability is not guaranteed. Blocks

that are identified and marked as bad by the manufacturer are referred to as “Initial Bad Blocks”. Bad blocks
that are developed during the lifespan of the flash are named “Later Bad Blocks”. Phison implements an
efficient bad block management algorithm to detect the factory-produced bad blocks and manages any bad

blocks that appear with use. This practice further prevents data being stored into bad blocks and improves
the data reliability.

1.4.4. TRIM
TRIM is a feature which helps improve the read/write performance and speed of solid-state drives (SSD).

Unlike hard disk drives (HDD), SSDs are not able to overwrite existing data, so the available space gradually
becomes smaller with each use. With the TRIM command, the operating system can inform the SSD which
blocks of data are no longer in use and can be removed permanently. Thus, the SSD will perform the erase
action, which prevents unused data from occupying blocks all the time.

1.4.5. SMART
SMART, an acronym for Self-Monitoring, Analysis and Reporting Technology, is an open standard that allows
a hard disk drive to automatically detect its health and report potential failures. When a failure is recorded

by SMART, users can choose to replace the drive to prevent unexpected outage or data loss. Moreover,
SMART can inform users of impending failures while there is still time to perform proactive actions, such as
copy data to another device.

1.4.6. Over-Provision
Over Provisioning refers to the inclusion of extra NAND capacity in a SSD, which is not visible and cannot be
used by users. With Over Provisioning, the performance and IOPS (Input/Output Operations per Second)
are improved by providing the controller additional space to manage P/E cycles, which enhances the

reliability and endurance as well. Moreover, the write amplification of the SSD becomes lower when the
controller writes data to the flash.

1.4.7. Firmware Upgrade

Firmware can be considered as a set of instructions on how the device communicates with the host.

3
Firmware will be upgraded when new features are added, compatibility issues are fixed, or read/write

performance gets improved.

1.5. Low Power Management

1.5.1. DEVSLP Mode (Optional)

With the increasing need of aggressive power/battery life, SATA interfaces include a new feature, Device
Sleep (DEVSLP) mode, which helps further reduce the power consumption of the device. DEVSLP enables

the device to completely power down the device PHY and other sub-systems, making the device reach a
new level of lower power operation. The DEVSLP does not specify the exact power level a device can
achieve in the DEVSLP mode, but the power usage can be dropped down to 5mW or less.

1.5.2. DIPM/HIPM Mode

SATA interfaces contain two low power management states for power saving: Partial and Slumber modes.
For Partial mode, the device has to resume to full operation within 10 microseconds, whereas the device
will spend 10 milliseconds to become fully operational in the Slumber mode. SATA interfaces allow low
power modes to be initiated by Host (HIPM, Host Initiated Power Management) or Device (DIPM, Device
Initiated Power Management). As for HIPM, Partial or Slumber mode can be invoked directly by the
software. For DIPM, the device will send requests to enter Partial or Slumber mode.

1.6. Power Loss Protection: Flushing Mechanism (Optional)

Power Loss Protection is a mechanism to prevent data loss during unexpected power failure. DRAM is a
volatile memory and frequently used as temporary cache or buffer between the controller and the NAND
flash to improve the SSD performance. However, one major concern of the DRAM is that it is not able to

keep data during power failure. Accordingly, the PS3111 applies the GuaranteedFlush technology, which
requests the controller to transfer data to the cache. For PS3111, SDR performs as a cache, and its size is
32MB. Only when the data is fully committed to the NAND flash will the controller send acknowledgement
(ACK) to the host. Such implementation can prevent false-positive performance and the risk of power
cycling issues.
Additionally, it is critical for a controller to shorten the time the in-flight data stays in the cache. Thus,
Phison’s PS3111 applies an algorithm to reduce the amount of data resides in the cache to provide a better

4
performance. This SmartCacheFlush technology allows incoming data to only have a “pit stop” in the cache

and then move to the NAND flash at once. If the flash is jammed due to particular file sizes (such as random
4KB data), the cache will be treated as an “organizer”, consolidating incoming data into groups before
written into the flash to improve write amplification.

In sum, with Flush Mechanism, PS3111 proves to provide the reliability required by consumer, industrial,
and enterprise-level applications.

1.7. Advanced Device Security Features

1.7.1. Secure Erase

Secure Erase is a standard ATA command and will write all “0xFF” to fully wipe all the data on hard drives

and SSDs. When this command is issued, the SSD controller will erase its storage blocks and return to its
factory default settings.

1.7.2. Write Protect

When a SSD contains too many bad blocks and data are continuously written in, then the SSD might not be
usable anymore. Thus, Write Protect is a mechanism to prevent data from being written in and protect the
accuracy of data that are already stored in the SSD.

1.8. SSD Lifetime Management

1.8.1. Terabytes Written (TBW)

TBW (Terabytes Written) is a measurement of SSDs’ expected lifespan, which represents the amount of
data written to the device. To calculate the TBW of a SSD, the following equation is applied:
TBW = [(NAND Endurance) x (SSD Capacity) x (WLE)] / WAF
NAND Endurance: NAND endurance refers to the P/E (Program/Erase) cycle of a NAND flash.

SSD Capacity: The SSD capacity is the specific capacity in total of a SSD.
WLE: Wear Leveling Efficiency (WLE) represents the ratio of the average amount of erases on all the blocks
to the erases on any block at maximum.
WAF: Write Amplification Factor (WAF) is a numerical value representing the ratio between the amount of
data that a SSD controller needs to write and the amount of data that the host’s flash controller
writes. A better WAF, which is near 1, guarantees better endurance and lower frequency of data

5
 written to flash memory.

1.8.2. Thermal Monitor (Optional)

Thermal monitors are devices for measuring temperature, and can be found in SSDs in order to issue
warnings when SSDs go beyond a certain temperature. The higher temperature the thermal monitor
detects, the more power the SSD consumes, causing the SSD to get aging quickly. Hence, the processing

speed of a SSD should be under control to prevent temperature from exceeding a certain range. Meanwhile,
the SSD can achieve power savings.

1.9. An Adaptive Approach to Performance Tuning

1.9.1. Throughput
Based on the available space of the disk, PS3111 will regulate the read/write speed and manage the
performance of throughput. When there still remains a lot of space, the firmware will continuously perform
read/write action. There is still no need to implement garbage collection to allocate and release memory,
which will accelerate the read/write processing to improve the performance. Contrarily, when the space is
going to be used up, PS3111 will slow down the read/write processing, and implement garbage collection
to release memory. Hence, read/write performance will become slower.

1.9.2. Predict & Fetch

Normally, when the host tries to read data from the SSD, the SSD will only perform one read action after
receiving one command. However, PS3111 applies Predict & Fetch to improve the read speed. When the
host issues sequential read commands to the SSD, the SSD will automatically expect that the following will
also be read commands. Thus, before receiving the next command, flash has already prepared the data.

Accordingly, this accelerates the data processing time, and the host does not need to wait so long to
receive data.

1.9.3. SmartZIPTM
Write data to the NAND Flash costs time. To improve the write speed performance, PS3111 launches with
compression technique—SmartZIPTM
Whether a file could be compressed or not depending on the file type, for file types have redundancy data

6
pattern, through our embedded encode engine, we could reduce the amount of data that is actually

written to the Flash. Comparing to the SSD without the compression, write efficiency is raised and the SSD
endurance is also improved since Flash could be benefit from less data written for a longer SSD lifetime.

7
2. PRODUCT SPECIFICATIONS

 Capacity
 From 64GB up to 512GB (support 48-bit addressing mode)
 Electrical/Physical Interface

￭ SATA Interface
 Compliant with SATA Revision 3.2
 Compatible with SATA 1.5Gbps, 3Gbps and 6Gbps interface

 Support power management

 Support expanded register for SATA protocol 48 bits addressing mode
 Embedded BIST function for SATA PHY for low cost mass production
 Built-in 2-channel NAND flash interface controller
￭ Compliant with Toggle 1.0 and Toggle 2.0 NAND Flash interface
￭ Compliant with ONFI 4.0 interface:

 SDR up to mode 5
 NV-DDR up to mode 5
 NV-DDR2 up to mode 7

 NV-DDR3 up to mode 8
 Supported NAND Flash
￭ Support up to 16 Flash Chip Enables (CE) within single design

￭ Toshiba 24nm SLC; 15nm/3D-NAND MLC; 15nm/3D-NAND TLC

￭ Intel/Micron 16nm/3D-NAND MLC and TLC
￭ Hynix 16nm/3D-NAND
￭ Support all types of SLC/MLC/TLC/3D-NAND, 8KB/page and 16K/page NAND flash
￭ Support ONFI 2.3, ONFI 3.0, ONFI 3.2 and ONFI 4.0 interface: 2 channels at maximum
￭ Support 8-bit I/O NAND Flash

￭ Contain 1pcs to 4pcs of TSOP/BGA flash

 ECC Scheme
￭ PS3111 2.5”SSD applies the LDPC (Low Density Parity Check) of ECC algorithm.

 UART function
 GPIO
 Support SMART and TRIM commands

8
 Performance
Sequential
Flash
Capacity Flash Type Read Write
Structure
(MB/s) (MB/s)
60/64GB 16GB x 4 TSOP, TSB 15nm 560 335
120/128GB 32GB x 4 TSOP, TSB 15nm 560 465
240/256GB 64GB x 4 TSOP, TSB 15nm 560 465
480/512GB 128GB x 4 TSOP, TSB 15nm 560 465
NOTES:
1. The performance was measured using CrystalDiskMarkv5.0x64 with SATA 6Gbps host.
2. Samples were built using Toshiba 15nm Toggle MLC NAND.
3. Performance may differ according to flash configuration and platform.
4. The table above is for reference only. The criteria for MP (mass production) and for
accepting goods shall be discussed based on different flash configuration.

 TBW (Terabytes Written)

Capacity Flash Structure TBW

60/64GB 16GB x 4 90
120/128GB 32GB x 4 181
240/256GB 64GB x 4 262
480/512GB 128GB x 4 544
NOTES:
1. Samples were built using Toshiba 15nm Toggle MLC NAND.
2. The test followed JEDEC219A client endurance workload.
3. TBW may differ according to flash configuration and platform.
4. The endurance of SSD could be estimated based on user behavior, NAND endurance cycles,
and write amplification factor. It is not guaranteed by flash vendor.

9
3. ENVIRONMENTAL SPECIFICATIONS

3.1. Environmental Conditions

3.1.1. Temperature and Humidity

 Temperature:
 Storage: -40°C to 85°C
 Operational: 0°C to 70°C
 Humidity: RH 90% under 40°C (operational)
Table 3-1 High Temperature Test Condition
Temperature Humidity Test Time
Operation 70°C 0% RH 72 hours
Storage 85°C 0% RH 72 hours
Result: No any abnormality is detected.

Table 3-2 Low Temperature Test Condition

Temperature Humidity Test Time
Operation 0°C 0% RH 72 hours
Storage -40°C 0% RH 72 hours
Result: No any abnormality is detected.

Table 3-3 High Humidity Test Condition

Temperature Humidity Test Time
Operation 40°C 90% RH 4 hours
Storage 40°C 93% RH 72 hours
Result: No any abnormality is detected.

Table 3-4 Temperature Cycle Test

Temperature Test Time Cycle
0°C 30 min
Operation 10 Cycles
70°C 30 min
-40°C 30 min
Storage 10 Cycles
85°C 30 min
Result: No any abnormality is detected.

10
3.1.2. Shock
Table 3-5 PS3111 2.5’’ SATA SSD Shock Specification
Acceleration Force Half Sin Pulse Duration
Non-operational 1500G 0.5ms
Result: No any abnormality is detected when power on.

3.1.3. Vibration
Table 3-6 PS3111 2.5’’ SATA SSD Vibration Specification
Condition
Vibration Orientation
Frequency/Displacement Frequency/Acceleration
Non-operational 20Hz~80Hz/1.52mm 80Hz~2000Hz/20G X, Y, Z axis/60 min for each
Result: No any abnormality is detected when power on.

3.1.4. Drop
Table 3-7 PS3111 2.5’’ SATA SSD Drop Specification
Height of Drop Number of Drop
Non-operational 80cm free fall 6 face of each unit
Result: No any abnormality is detected when power on.

3.1.5. Bending
Table 3-8 PS3111 2.5’’ SATA SSD Bending Specification
Force Action
Non-operational ≥ 50N Hold 1min/5times
Result: No any abnormality is detected when power on.

3.1.6. Torque
Table 3-9 PS3111 2.5’’ SATA SSD Torque Specification
Force Action
Non-operational 1.263N-m or ±10 deg Hold 1min/5times
Result: No any abnormality is detected when power on.

11
3.1.7. Electrostatic Discharge (ESD)
Table 3-10 PS3111 2.5’’ SATA SSD Contact ESD Specification
Device Capacity Temperature Relative Humidity +/- 4KV Result
Device functions are affected, but
256GB
2.5’’ SSD 24.0°C 49% (RH) EUT will be back to its normal or PASS
512GB operational state automatically.

3.1.8. EMI Compliance

 FCC: CISPR22
 CE: EN55022
 BSMI 13438

3.2. MTBF
MTBF, an acronym for Mean Time Between Failures, is a measure of a device’s reliability. Its value
represents the average time between a repair and the next failure. The measure is typically in units of hours.
The higher the MTBF value, the higher the reliability of the device. The predicted result of Phison’s PS3111
2.5’’ SATA SSD is more than 2,000,000 hours.

3.3. Certification & Compliance

 RoHS
 SATA III (SATA Rev. 3.2)
 Up to ATA/ATAPI-8 (Including S.M.A.R.T)

12
 4. ELECTRICAL SPECIFICATIONS

4.1. Supply Voltage

Table 4-1 Supply Voltage of PS3111 2.5’’ SATA SSD
Parameter Rating
Operating Voltage 5V

4.2. Power Consumption

Table 4-2 Power Consumption of PS3111 2.5’’ SATA SSD
Capacity Flash Read Write Partial Slumber Idle DEVSLP
Flash Type
Structure (mW) (mW) (mW) (mW) (mW) (mW)
60/64GB 16GB x 4 TSOP, TSB 15nm 1,095 1,360 17 11 287 4.9
120/128GB 32GB x 4 TSOP, TSB 15nm 1,000 1,600 18 12.5 285 4.9
240/256GB 64GB x 4 TSOP, TSB 15nm 1,015 1,605 18 12.5 285 4.9
480/512GB 128GB x4 TSOP, TSB 15nm 1,565 1,910 19 13.5 295 4.9
NOTES:
1. The average value of power consumption is achieved based on 100% conversion efficiency.
2. The measured power voltage is 5V.
3. Samples were built using Toshiba 15nm Toggle MLC NAND.
It’s measured under ambient temperature.
4. Sequential R/W is measured while testing 4000MB sequential R/W 5 times by CyrstalDiskMark. DEVSLP is
measured while entering device sleep mode for 5 minutes.
5. Power Consumption may differ according to flash configuration and platform.

13
5. INTERFACE

5.1. Pin Assignment and Descriptions

Figure 5-1 PS3111 2.5’’ SATA SSD Pin Assignment

Table 5-1 Signal Segment Pin Assignment and Descriptions

Pin Number Function
S1 GND
S2 A+ (Differential Signal Pair A)
S3 A – (Differential Signal Pair A)
S4 GND
S5 B – (Differential Signal Pair B)
S6 B+ (Differential Signal Pair B)
S7 GND

Table 5-2 Power Segment Pin Assignment and Descriptions

Pin Number Function
P1 Not Used (3.3V)
P2 Not Used (3.3V)
P3 DEVSLP
P4 GND
P5 GND
P6 GND
P7 5V pre-charge
P8 5V
P9 5V
P10 GND
P11 Reserved
P12 GND
P13 Not Used (12V pre-charge)
P14 Not Used (12V)
P15 Not Used (12V)

14
6. SUPPORTED COMMANDS

6.1. ATA Command List

The following ATA command list table is followed by ATA8-ACS4 SPEC.
Table 6-1 ATA Command List
Op Code Description Op Code Description
00h NOP C9h Read DMA without Retry
06h Data Set Management CAh Write DMA
10h-1Fh Recalibrate CBh Write DMA without Retry
20h Read Sectors CEh Write Multiple FUA EXT
21h Read Sectors without Retry E0h Standby Immediate
24h Read Sectors EXT E1h Idle Immediate
25h Read DMA EXT E2h Standby
27h Read Native Max Address EXT E3h Idle
29h Read Multiple EXT E4h Read Buffer
2Fh Read Log EXT E5h Check Power Mode
30h Write Sectors E6h Sleep
31h Write Sectors without Retry E7h Flush Cache
34h Write Sectors EXT E8h Write Buffer
35h Write DMA EXT E9h READ BUFFER DMA
37h Set Native Max Address EXT EAh Flush Cache EXT
38h CFA Write Sectors Without Erase EBh Write Buffer DMA
39h Write Multiple EXT ECh Identify Device
3Dh Write DMA FUA EXT EFh Set Features
3Fh Write Long EXT EFh 02h Enable volatile write cache
40h Read Verify Sectors EFh 03h Set transfer mode
41h Read Verify Sectors without Retry EFh 05h Enable the APM feature set
42h Read Verify Sectors EXT EFh 10h Enable use of SATA features et
Enable DMA Setup FIS Auto-Activate
44h Zero EXT EFh 10h 02h
optimization
Enable Device-initiated interface
45h Write Uncorrectable EXT EFh 10h 03h
power state (DIPM) transitions
Enable Software Settings Preservation
47h Read Log DMA EXT EFh 10h 06h
(SSP)
Enable Device Automatic Partial to
57h Write Log DMA EXT EFh 10h 07h
Slumber transitions
60h Read FPDMA Queued EFh 10h 09h Enable Device Sleep
61h Write FPDMA Queued EFh 55h Disable read look-ahead
70h-7Fh Seek EFh 66h Disable reverting to power-on defaults

15
Op Code Description Op Code Description
90h Execute Device Diagnostic EFh 82h Disable volatile write cache
91h Initialize Device Parameters EFh 85h Disable the APM feature set
92h Download Microcode EFh 90h Disable use of SATA feature set
Disable DMA Setup FIS Auto-Activate
93h Download Microcode DMA EFh 90h 02h
optimization
Disable Device-initiated interface
B0h SMART EFh 90h 03h
power state (DIPM) transitions
Disable Software Settings Preservation
B0h D0h SMART READ DATA EFh 90h 06h
(SSP)
Disable Device Automatic Partial to
B0h D1h SMART READ ATTRIBUTE THRESHOLDS EFh 90h 07h
Slumber transitions
SMART ENABLE/DISABILE ATTRIBUTE
B0h D2h EFh 90h 09h Disable Device Sleep
AUTOSAVE
B0h D3h SMART SAVE ATTRIBUTE VALUES EFh AAh Enable read look-ahead
B0h D4h SMART EXECUTE OFF-LINE IMMEDIATE EFh CCh Enable reverting to power-on defaults
B0h D5h SMART READ LOG F1h Security Set Password
B0h D6h SMART WRITE LOG F2h Security Unlock
B0h D8h SMART ENABLE OPERATIONS F3h Security Erase Prepare
B0h D9h SMART DISABLE OPERATIONS F4h Security Erase Unit
B0h DAh SMART RETURN STATUS F5h Security Freeze Lock
SMART ENABLE/DISABILE AUTOMATIC
B0h DBh F6h Security Disable Password
OFF-LINE
B1h Device Configuration F8h Read Native Max Address
B4h Sanitize F9h Set Max Address
C4h Read Multiple F9h 01h SET MAX SET PASSWORD
C5h Write Multiple F9h 02h SET MAXLOCK
C6h Set Multiple Mode F9h 03h SET MAX UNLOCK
C8h Read DMA F9h 04h SET MAX FREEZE LOCIK

16
6.2. Identify Device Data
The following table details the sector data returned by the IDENTIFY DEVICE command of ATA8-ACS4 SPEC.

Table 6-2 List of Device Identification

F: Fixed
V: Variable
Word X: Default Value Description
retired/obsolete
/reserved
0 F 0040h General configuration bit-significant information
1 X *1 Obsolete
2 F C837h Specific configuration
3 X 0010h Obsolete
4-5 X 00000000h Retired
6 X 003Fh Obsolete
7-8 X 00000000h Reserved for assignment by the Compact Flash
Association
9 X 0000h Retired
10-19 V Varies Serial number (20 ASCII characters)
20-21 X 00000000h Retired
22 X 0000h Obsolete
23-26 V Varies Firmware revision (8 ASCII characters)
27-46 V Varies Model number (xxxxxxxx)
47 F 8010h 7:0- Maximum number of sectors transferred per
interrupt on MULTIPLE commands
48 F 4000h Trusted Computing feature set options(not support)
49 F 2F00h Capabilities
50 F 4000h Capabilities
51-52 X 000000000h Obsolete
53 F 0007h Words 88 and 70:64 valid
54 X *1 Obsolete
55 X 0010h Obsolete
56 X 003Fh Obsolete
57-58 X *2 Obsolete
59 F 5D10h Sanitize and Number of sectors transferred per
interrupt on MULTIPLE commands
60-61 V *3 Maximum number of sector ( 28bit LBA mode)
62 X 0000h Obsolete

17
 F: Fixed
V: Variable
Word X: Default Value Description
retired/obsolete
/reserved
63 F 0407h Multi-word DMA modes supported/selected
64 F 0003h PIO modes supported
65 F 0078h Minimum Multiword DMA transfer cycle time per
word
66 F 0078h Manufacturer’s recommended Multiword DMA
transfer cycle time
67 F 0078h Minimum PIO transfer cycle time without flow control
68 F 0078h Minimum PIO transfer cycle time with IORDY flow
control
69 F 1F00h Additional Supported (support download microcode
DMA)
70 X 0000h Reserved
71-74 X 000000000000 Reserved for the IDENTIFY PACKET DEVICE command
0000h
75 F 001Fh Queue depth
76 F 850Eh Serial SATA capabilities
77 F 0006h Serial ATA Additional Capabilities
78 F 004Ch Serial ATA features supported
79 F 0040h Serial ATA features enabled
80 F 0FF8h Major Version Number
81 F 0000h Minor Version Number
82 F 746Bh Command set supported
83 F 7D01h Command set supported
84 F 4163h Command set/feature supported extension
85 F 7469h Command set/feature enabled
86 F BC01h Command set/feature enabled
87 F 4163h Command set/feature default
88 F 007Fh Ultra DMA Modes
89 F 0003h Time required for security erase unit completion
90 F 001Eh Time required for Enhanced security erase completion
91 F 0000h Current advanced power management value
92 F FFFEh Master Password Revision Code
93 F 0000h Hardware reset result. For SATA devices, word 93 shall
be set to the value 0000h.

18
 F: Fixed
V: Variable
Word X: Default Value Description
retired/obsolete
/reserved
94 X 0000h Obsolete
95 F 0000h Stream Minimum Request Size
96 F 0000h Streaming Transfer Time – DMA
97 F 0000h Streaming Access Latency – DMA and PIO
98-99 F 00000000h Streaming Performance Granularity
100-103 V *4 Maximum user LBA for 48 bit Address feature set
104 F 0000h Streaming Transfer Time – PIO
105 F 0008h Maximum number of 512-byte blocks per DATA SET
MANAGEMENT command
106 F 4000h Physical sector size/Logical sector size
107 F 0000h Inter-seek delay for ISO-7779 acoustic testing in
microseconds
108-111 V Varies World Wide Name
112-115 X 000000000000 Reserved
0000h
116 X 0000h Reserved
117-118 F 00000000h Words per logical Sector
119 F 401Ch Supported settings
120 F 401Ch Command set/Feature Enabled/Supported
121-126 X 0h Reserved
127 X 0000h Obsolete
128 F 0021h Security status
129-140 V Varies Vendor specific
141 V Varies Vendor specific
142-159 V Varies Vendor specific
160 X 0000h Reserved for CFA
161-167 X 0h Reserved for CFA
168 V Varies Device Nominal Form Factor
169 F 0001h DATA SET MANAGEMENT command is supported
170-173 F 000000000000 Additional Product Identifier
000
0h
174-175 X 00000000h Reserved
176-205 F 0h Current media serial number

19
 F: Fixed
V: Variable
Word X: Default Value Description
retired/obsolete
/reserved
206 F 0000h SCT Command Transport
207-208 X 00000000h Reserved
209 F 4000h Alignment of logical blocks within a physical block
210-211 F 00000000h Write-Read-Verify Sector Count Mode 3 (not support)
212-213 F 00000000h Write-Read-Verify Sector Count Mode 2 (not support)
214-216 X 0h Obsolete
217 F 0001h Non-rotating media device
218 X 0000h Reserved
219 X 0000h NV Cache relate (not support)
220 V 0000h Write read verify feature set current mode
221 X 0000h Reserved
222 F 10FFh Transport major version number
223 F 0000h Transport minor version number
224-229 X 0h Reserved
230-233 F 000000000000 Extend number of user addressable sectors
0000h
234 F 0001h Minimum number of 512-byte data blocks per
DOWNLOAD MICROCODE command for mode 03h
235 F FFFEh Maximum number of 512-byte data blocks per
DOWNLOAD MICROCODE command for mode 03h
236-254 X 0h Reserved
255 F XXA5h Integrity word (Checksum and Signature)
XX is variable

Table 6-3 List of Device Identification for Each Capacity

Capacity *1 *2 *3 *4
(GB) (Word 1/Word 54) (Word 57 – 58) (Word 60 – 61) (Word 100 – 103)
8 3CA5h EEC9B0h EEC9B0h EEC9B0h
16 3FFFh FBFC10h 1DD40B0h 1DD40B0h
32 3FFFh FBFC10h 3BA2EB0h 3BA2EB0h
60 3FFFh FBFC10h 6FCCF30h 6FCCF30h
64 3FFFh FBFC10h 7740AB0h 7740AB0h
120 3FFFh FBFC10h DF94BB0h DF94BB0h
128 3FFFh FBFC10h EE7C2B0h EE7C2B0h

20
240 3FFFh FBFC10h FFFFFFFh 1BF244B0h
256 3FFFh FBFC10h FFFFFFFh 1DCF32B0h
480 3FFFh FBFC10h FFFFFFFh 37E436B0h
512 3FFFh FBFC10h FFFFFFFh 3B9E12B0

21
7. PHYSICAL DIMENSION

Dimension: 100mm (L) x 69.85mm (W) x 7.00mm (H)

22
8. PRODUCT WARRANTY POLICY

Warranty period of the Product is twelve (12) months from the date of manufacturing. In the event
the Product does not conform to the specification within the aforementioned twelve (12)-month
period and such non conformity is solely attributable to Phison’s cause, Phison agrees at its
discretion replace or repair the nonconforming Product. Notwithstanding the foregoing, the
aforementioned warranty shall exclude the nonconformity arising from, in relation to or associated
with:

(1) alternation, modification, improper use, misuse or excessive use of the Product;

(2) failure to comply with Phison’s instructions;

(3) Phison’s compliance with customer or user indicated instructions, technologies, designs,
specifications, materials, components, parts;

(4) combination of the Product with other materials, components, parts, goods, hardware,
firmware or software designated or provided by customer ; or

(5) alternation, modification made by customer (including customer’s suppliers or

subcontractors or downstream customers) ; or

(6) other error or failure not solely attributable to Phison’s cause (including without limitation,
normal wear or tear, manufacturing or assembly wastage, improper operation, virus,
unauthorized maintenance or repair).

EXCEPT FOR THE ABOVE EXPRESS LIMITED WARRANTY, THE PRODUCT IS PROVIDED “AS IS,” AND
PHISON MAKES NO OTHER WARRANTIES (WHETHER EXPRESS, IMPLIED, STATUTORY OR
OTHERWISE) REGARDING THE PRODUCT OR ANY PORTION OF IT. PHISON SPECIFICALLY DISCLAIMS
ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE,
NONINFRINGEMENT, OR ARISING FROM A COURSE OF DEALING OR USAGE OF TRADE.

23
9. REFERENCE

The following table is to list out the standards that have been adopted for designing the product.

Table 9-1 List of References

Title Acronym/Source
Restriction of Hazardous Substances Directive; for further information,
RoHS
please contact us at sales@phison.com or support@phison.com.
Serial ATA Revision 3.2 http://www.sata-io.org
ATA-8 spec http://www.t13.org
Federal Communications Commission; for further information, please
FCC: CISPR22
contact us at sales@phison.com or support@phison.com.
Consumer electronics certification; for further information, please
CE: EN55022
contact us at sales@phison.com or support@phison.com.
The Bureau of Standards, Metrology and Inspection; for further
BSMI: 13438 information, please contact us at sales@phison.com or
support@phison.com.

24
10. TERMINOLOGY

The following table is to list out the acronyms that have been applied throughout the document.

Table 10-1 List of Terminology

Term Definitions
ATTO Commercial performance benchmark application
DEVSLP Device sleep mode
DIPM Device initiated power management
HIPM Host initiated power management
LBA Logical block addressing
MB Mega-byte
MTBF Mean time between failures
NCQ Native command queue
SATA Serial advanced technology attachment
SDR Synchronous dynamic access memory
S.M.A.R.T. Self-monitoring, analysis and reporting technology
SSD Solid state disk

25