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Power Transistor: Cool MOS™

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SPU01N60S5

Preliminary data SPD01N60S5


Cool MOS™==Power Transistor COOLMOS
Power Semiconductors
•=New revolutionary high voltage technology
Product Summary
• Ultra low gate charge
VDS @ Tjmax 650 V
•=Periodic avalanche rated
RDS(on) 6 Ω
• Extreme dv/dt rated
ID 0.8 A
•=Optimized capacitances
P-TO252 P-TO251-3-1
•=Improved noise immunity
•=Former development designation:
SPUx7N60S5/SPDx7N60S5

D,2
Type Package Ordering Code Marking
SPU01N60S5 P-TO251-3-1 Q67040-S4193 01N60S5
SPD01N60S5 P-TO252 Q67040-S4188 01N60S5
G,1
S,3

Maximum Ratings,at Tj = 25 °C, unless otherwise specified


Parameter Symbol Value Unit
Continuous drain current ID A
TC=25°C 0.8
TC=100°C 0.5
Pulsed drain current 1) ID puls 1.6
TC=25°C

Avalanche energy, single pulse EAS 20 mJ


ID = 0.64 A, VDD = 50 V
Avalanche energy (repetitive, limited by Tjmax ) EAR 0.01
ID = 0.8 A , VDD = 50 V
Avalanche current (repetitive, limited by Tjmax ) IAR 0.8 A
Reverse diode dv/dt dv/dt 6 kV/µs
IS =0.8A, VDS<VDSS , di/dt=100A/µs, Tjmax =150°C

Gate source voltage VGS ±20 V


Power dissipation Ptot 11 W
TC=25°C

Operating and storage temperature Tj , Tstg -55... +150 °C

1 2001-07-24
SPU01N60S5
Preliminary data SPD01N60S5
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
Thermal Characteristics
Thermal resistance, junction - case RthJC - - 11 K/W
Thermal resistance, junction - ambient RthJA - - 75
(Leaded and through-hole packages)
SMD version, device on PCB: RthJA
@ min. footprint - - 75
@ 6 cm2 cooling area 2) - - 50

Static Characteristics, at Tj = 25 °C, unless otherwise specified


Drain-source breakdown voltage V(BR)DSS 600 - - V
VGS = 0 V, ID = 0.25 mA
Gate threshold voltage, VGS = VDS VGS(th) 2.3 3 3.7
ID = 250 µA, Tj = 25 °C
Zero gate voltage drain current, VDS=VDSS IDSS µA
VGS = 0 V, Tj = 25 °C - 0.5 1
VGS = 0 V, Tj = 150 °C - - 50
Gate-source leakage current IGSS - - 100 nA
VGS = 20 V, VDS = 0 V
Drain-source on-state resistance RDS(on) - 5.6 6 Ω
VGS = 10 V, ID = 0.5 A

1current limited by T
jmax
2 Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6 cm² (one layer, 70µm thick) copper area for drain
connection. PCB is vertical without blown air.

2 2001-07-24
SPU01N60S5
Preliminary data SPD01N60S5
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified
Parameter Symbol Conditions Values Unit
min. typ. max.
Dynamic Characteristics
Transconductance gfs VDS ≥2*ID *RDS(on)max , - 0.75 - S
ID =0.5A

Input capacitance Ciss VGS =0V, VDS =25V, - 100 - pF


Output capacitance Coss f=1MHz - 40 -
Reverse transfer capacitance Crss - 2.5 -
Turn-on delay time td(on) VDD =350V, VGS =10V, - 30 - ns
Rise time tr ID =0.8A, RG=100Ω - 25 -
Turn-off delay time td(off) - 55 82
Fall time tf - 30 45

Gate Charge Characteristics


Gate to source charge Qgs VDD =350V, ID =0.8A - 0.9 - nC
Gate to drain charge Qgd - 2.2 -
Total gate charge Qg VDD =350V, ID =0.8A, - 3.9 5
VGS =0 to 10V

Reverse Diode
Inverse diode continuous IS TC=25°C - - 0.8 A
forward current
Inverse diode direct ISM - - 1.6
current,pulsed
Inverse diode forward voltage VSD VGS =0V, IF =0.8A - 1 1.2 V
Reverse recovery time trr VR =100V, IF=lS, - 570 970 ns
Reverse recovery charge Qrr diF /dt=100A/µs - 0.75 - µC

3 2001-07-24
SPU01N60S5
Preliminary data SPD01N60S5
Power dissipation Drain current
Ptot = f (TC ) ID = f (TC )
parameter: VGS ≥ 10 V
SPU01N60S5 SPU01N60S5
12 0.9
W
A

10
0.7
9

8 0.6
Ptot

ID
7
0.5
6
0.4
5

4 0.3

3
0.2
2
0.1
1

0 0
0 20 40 60 80 100 120 °C 160 0 20 40 60 80 100 120 °C 160
TC TC

Safe operating area Transient thermal impedance


ID=f (VDS) ZthJC = f (tp )
parameter: D=0.01, TC =25°C parameter : D = tp /T
10 1 SPU01N60S5
10 2 SPU01N60S5

K/W

10 1
tp = 7.6µs

10 µs
Z thJC

10 0
D
/I
ID

10 0
DS
V
) =
on
(
DS

D = 0.50
R

-1
100 µs 10 0.20
-1 0.10
10
0.05
0.02
1 ms 10 -2
single pulse 0.01
10 ms
DC
-2
10 0 1 2 3
10 -3 -7 -6 -5 -4 -3 -2 0
10 10 10 V 10 10 10 10 10 10 10 s 10
VDS tp

4 2001-07-24
SPU01N60S5
Preliminary data SPD01N60S5
Typ. output characteristic Drain-source on-resistance
ID = f (VDS) RDS(on) = f (Tj )
Parameter: VGS, Tj = 25 °C parameter : ID = 0.5 A, VGS = 10 V
SPU01N60S5
2.5 34
20V Ω
10V
A 28
7V

RDS(on)
6.5V 24
ID

1.5 20

6V 16

1
12

5.5V
8 98%
0.5
typ
5V 4

0 0
0 5 10 15 V 25 -60 -20 20 60 100 °C 180
VDS Tj

Typ. transfer characteristics Typ. capacitances


ID = f ( VGS ) C = f (VDS)
VDS≥ 2 x ID x RDS(on)max parameter: VGS =0 V, f=1 MHz
2.5 10 3

pF
A

Ciss
10 2
ID

1.5

Coss
1
10 1

0.5

Crss

0 10 0
0 4 8 12 VGS 20 0 10 20 30 40 50 60 70 80 V 100
V VDS

5 2001-07-24
SPU01N60S5
Preliminary data SPD01N60S5
Avalanche energy Avalanche SOA
EAS = f (Tj ) IAR = f (tAR )
par.: ID =0.64A, VDD=50V par.: Tj ≤ 150 °C
22 0.8
mJ
A

18
0.6
16
E AS

IAR
14 0.5
Tj (START) =25°C
12
0.4
10 Tj (START) =125°C

8 0.3

6
0.2

4
0.1
2

0 0 -3 -2 -1 0 1 2 4
25 50 75 100 125 150 °C 200 10 10 10 10 10 10 µs 10
Tj tAR

Drain-source breakdown voltage Gate threshold voltage


V(BR)DSS = f (Tj ) VGS(th) = f (Tj)
parameter: VGS = VDS , ID = 250 µA
SPU01N60S5
720 5

V
V

4
V (BR)DSS

680
V GS(th)

3.5
660
3 98%
640
2.5
620 typ.
2

600
1.5 2%

580
1

560 0.5

540 0
-60 -20 20 60 100 °C 180 -60 -20 20 60 100 °C 180
Tj Tj

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SPU01N60S5
Preliminary data SPD01N60S5
Forward characteristics of reverse diode Typ. gate charge
IF = f (VSD ) VGS = f (QGate )
parameter: Tj , tp = 10 µs parameter: ID = 0.8 A pulsed
10 1 SPU01N60S5
16
SPU01N60S5

V
A

12
0
10

VGS
0,2 VDS max
0,8 VDS max
IF

10

6
10 -1
Tj = 25 °C typ
4
Tj = 150 °C typ
Tj = 25 °C (98%)
Tj = 150 °C (98%) 2

10 -2 0
0 0.4 0.8 1.2 1.6 2 2.4 V 3 0 1 2 3 4 nC 5.5
VSD Qg

7 2001-07-24
SPU01N60S5
Preliminary data SPD01N60S5

P-TO252 (D-Pak)

dimensions
symbol [mm] inch]
min max min max
A 6.40 6.73 0.2520 0.2650
B 5.25 5.50 0.2067 0.2165
C (0.65) (1.15) (0.0256) (0.0453)
D 0.63 0.89 0.0248 0.0350
E 2.28 0.2520
F 2.19 2.39 0.0862 0.0941
G 0.76 0.98 0.0299 0.0386
H 0.90 1.21 0.0354 0.0476
K 5.97 6.23 0.2350 0.2453
L 9.40 10.40 0.3701 0.4094
M 0.46 0.58 0.0181 0.0228
N 0.87 1.15 0.0343 0.0453
P 0.51 - 0.0201 -
R 5.00 - 0.1969 -
S 4.17 - 0.1642 -
T 0.26 1.02 0.0102 0.0402
U - - - -

P-TO251 (I-Pak)

dimensions
symbol [mm] [inch]
min max min max
A 6.47 6.73 0.2547 0.2650
B 5.25 5.41 0.2067 0.2130
C 4.19 4.43 0.1650 0.1744
D 0.63 0.89 0.0248 0.0350
E 2.29 typ. 0.0902 typ.
F 2.18 2.39 0.0858 0.0941
G 0.76 0.86 0.0299 0.0339
H 1.01 1.11 0.0398 0.0437
K 5.97 6.23 0.2350 0.2453
L 9.14 9.65 0.3598 0.3799
M 0.46 0.56 0.0181 0.0220
N 0.98 1.15 0.0386 0.0453

8 2001-07-24
SPU01N60S5
Preliminary data SPD01N60S5

Published by
Infineon Technologies AG,
Bereichs Kommunikation
St.-Martin-Strasse 53,
D-81541 München
© Infineon Technologies AG 1999
All Rights Reserved.

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characteristics.

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regarding circuits, descriptions and charts stated herein.

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For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list).

Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest Infineon Technologies Office.

Infineon Technologies Components may only be used in life-support devices or systems with the express
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device
or system Life support devices or systems are intended to be implanted in the human body, or to support
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health
of the user or other persons may be endangered.

9 2001-07-24

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