Datasheet

PFC Direct current resonance type

White LED Driver for Large LCD
BD94121F
General Description Key Specifications
BD94121F is a current resonance type LED Driver with  Operating Power Supply Voltage Range:
frequency-controlled LED current. It can connect to PFC 9.0V to 18.0V
directly and can use half-bridge structure reducing the  Minimum Oscillator Frequency: 67kHz
number of external components. (RRT=27kΩ,RADJ=44kΩ,VFB=3.2V)
It incorporates some protection functions against fault  Operating Current: 2.3mA (Typ)
conditions such as Over-Voltage Protection, LED Short  Operating Temperature Range: -40°C to +85°C
Detection (IS High Detection) and LED Open Detection
(IS Low Detection). Package W(Typ) x D(Typ) x H(Max)
SOP18 11.20mm x 7.80mm x 2.01mm
Features Pin pitch 1.27mm
 20V High Rating Process
 1 Channel Push-pull Control
 Current and Voltage Feedback by Driving
Frequency
 Adjustable Soft Start
 Adjustable Timer Latch
 Under-Voltage Detection for IC’s Power Line
 Output Over-Voltage Protection
 Output Error Signal from FAIL Terminal
 Shift to Save Mode by STB Terminal
 Burst Control by External PWM Signal
 Analog Dimming by External DC Signal
 Conversion Function from Pulse to DC

Applications
 TV, Computer Display, LCD Backlighting.

Figure. 1 SOP18

Typical Application Circuit

< Primary Side >

VCC VCC
GND GND

PDIM PDIM PVIN

STB ON/OFF GND
PWM PWMIN

ERR FAIL
T1

PDIM CSS CSDON

CFBVS RFBVS
RADJ
CFBIS RFBIS
CCP RS
RRT

< Secondary Side >

Figure. 2 Typical Application Circuit(s)

〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays
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BD9412F

Contents
General Description ....................................................................................................................................................1
Features .......................................................................................................................................................................1
Applications ................................................................................................................................................................1
Key Specifications ......................................................................................................................................................1
Package .......................................................................................................................................................................1
Typical Application Circuit .........................................................................................................................................1
Absolute Maximum Ratings.......................................................................................................................................3
Recommended Operating Conditions ......................................................................................................................3
External Components Recommended Range ..........................................................................................................3
Pin Configuration ........................................................................................................................................................3
Physical Dimension and Marking Diagram ..............................................................................................................3
Electrical Characteristics ...........................................................................................................................................4
Pin Description............................................................................................................................................................6
I/O Equivalent Circuits................................................................................................................................................7
Block Diagram .............................................................................................................................................................8
Typical Performance Curves .....................................................................................................................................9
Pin Function Description .........................................................................................................................................10
Detection Condition List of the Protection Functions ..........................................................................................15
Behavior List of the Protect Function ....................................................................................................................15
Application Example ................................................................................................................................................16
Timing Chart ..............................................................................................................................................................17
Operational Notes .....................................................................................................................................................20
Ordering Information ................................................................................................................................................22
Marking Diagrams .....................................................................................................................................................22
Physical Dimension, Tape and Reel Information ...................................................................................................23
Revision History .......................................................................................................................................................24

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BD9412F

Absolute Maximum Ratings (Ta = 25°C)

Parameter Symbol Rating Unit
Supply Voltage VCC 20 V
STB, PWM2DC, N2, N1
VSTB,VPWM2DC,VN2,VN1 20 V
Terminal Voltage
RT, FB, IS, VS, PWMCMP, CP, VRT,VFB,VIS,VVS,VPWMCMP,
PWMIN, ADIM, SS, FAIL, VCP,VPWMIN,VADIM,VSS, 5.5 V
COMPSD Terminal Voltage VFAIL,VCOMPSD
(Note 1)
Power Dissipation Pd 0.69 W
Operating Temperature Range Topr -40 to +85 °C
Junction Temperature Tjmax 150 °C
Storage Temperature Range Tstg -55 to +150 °C
(Note 1) Derating in done 5.5 mW/°C for operating above Ta≥25°C (Mount on 1-layer 70.0mm x 70.0mm x 1.6mm board)
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.

Recommended Operating Conditions (Ta= -40°C to +85°C)

Parameter Symbol Range Unit
Power Supply Voltage VCC 9.0 to 18.0 V
PWMIN Input Frequency Range fPWMIN 60 to 500 Hz
Oscillation Frequency fOUT 30 to 300 kHz
PWM2DC Input Voltage Range fPWM2DC 0.09 to 30 kHz
ADIM Input Voltage Range VADIM 0 to 5 V
ADIM Range with Linearity IS VADIMLIN 0.5 to 2.1 V

External Components Recommended Range (Ta= -40°C to +85°C)

Parameter Symbol Range Unit
RT Connection Resistance RRT 20 to 200 kΩ
(Note 2)
CP Connection Capacitance CCP 0.01 to 2.2 µF
(Note 2)
ADIM Connection Capacitance CADIM 0.22 to 10 µF
(Note 2)
SS Connection Capacitance CSS 0.01 to 0.1 µF
(Note 2) Please set connection capacitance above Min value of Recommended Range according to temperature characteristic and DC bias characteristic.

Pin Configuration Physical Dimension and Marking Diagram

(TOP VIEW) Product Name

(Max 11.55 (include.BURR))
SS_12
PWM2DC_15

ADIM_11

PWM_IN_10
FAIL_13
N2_17

COMPSD_14
N1_18

PGND_16

BD94121F
BD94121F
8_PWMCMP
1_VCC

2_STB

3_GND

9_CP
7_VS
4_RT

5_FB

6_IS

Figure. 3 Pin Configuration Lot No.

(UNIT : mm)

PKG : SOP18

Drawing No. : EX115-5001

SOP18(Unit:mm)

Figure. 4 Physical Dimension and Marking Diagram

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BD9412F

Electrical Characteristics (Unless otherwise specified Ta=25°C, VCC=12V)

Limit
Parameter Symbol Unit Conditions
Min Typ Max
【Whole Device】
fOUT=60kHz,
Circuit Current ICC1 － 2.3 5.0 mA
VPWMCOMP=0V
Circuit Current at Stand-by ICC2 － 0 20 µA VSTB=0V
【STB Block】
STB Pin High Voltage VSTH 2.0 － VCC V System ON
STB Pin Low Voltage VSTL -0.3 － +0.8 V System OFF
【VCC UVLO Block】
VCC Operation Voltage VVCCUVP 7.5 8.0 8.5 V
VCC UVLO Hysteresis ⊿VVCCUVP 0.37 0.50 0.63 V
【OSC Block】
RT Terminal voltage VRT 1.05 1.50 1.95 V
【PWMIN Block】
PWMIN Pin High Voltage VPWMINH 1.8 - 5.0 V
PWMIN Pin Low Voltage VPWMINL -0.3 - +0.8 V
【Soft Start Block】
Setting Current for Soft Start Timer
ISS 1.5 2.0 2.5 µA
and COMPSD Timer
Soft Start Ended Voltage VSSEND 2.30 2.50 2.70 V
Setting Voltage for COMPSD
VSDON 1.90 2.00 2.10 V
Timer
【Feed Back Block】
VADIM=2.1V,
IS Threshold Voltage 1 VIS1 0.466 0.477 0.488 V
VPWM2DC=12V
VADIM=1.1V,
IS Threshold Voltage 2 VIS2 0.239 0.250 0.261 V
VPWM2DC=12V
VADIM=0.5V,
IS Threshold Voltage 3 VIS3 0.102 0.114 0.126 V
VPWM2DC=12V
IS Threshold Voltage 4 VVS 1.212 1.250 1.288 V
IS Source Current 1 IIS1 － － 0.9 µA VPWMIN=2.5V
IS Source Current 2 IIS2 40 50 60 µA VPWMIN=0V, VIS=0.8V
VS Source Voltage IVS － － 0.9 µA
IS sweep down
IS COMP Detection Voltage 1 VISCOMP1 0.020 0.050 0.080 V
VADIM=0.4V
IS COMP Detection Voltage 2 VISCOMP2 0.90 1.00 1.10 V IS sweep up

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BD9412F

Electrical Characteristics – continued (Unless otherwise specified Ta=25°C, VCC= 12V)

Limit
Parameter Symbol Unit Conditions
Min Typ Min
【Output Block】
N1 Output Sink Resistance RN1SI 1.5 3.0 6.0 Ω
N1Output Source Resistance RN1SO 4.5 9.0 18.0 Ω
N2 Output Sink Resistance RN2SI 1.5 3.0 6.0 Ω
N2 Output Source Resistance RN2SO 4.5 9.0 18.0 Ω
MAX DUTY MAX DUTY 43.0 45.0 47.0 % fOUT=60kHz
N1-N2,N2-N1Dead Time tOFF 100 200 400 ns
Output Frequency RRT=27kΩ,RADJ=44kΩ,
fOUTMIN 60.3 67.0 73.7 kHz
(minimum frequency setting) VFB=3.2V
【Timer Block】
Setting Voltage for CP Time VCP 1.90 2.00 2.10 V
Setting Current for CP Time ICP 0.85 1.00 1.15 µA
【ADIM Block】
VADIM=2.2V,
ADIM Pin Inflow Current 1 IADIM1 -5 0 +5 µA
VPWM2DC=12V
VADIM=5V,
ADIM Pin Inflow Current 2 IADIM2 19 28 37 µA
VPWM2DC=12V
PWM2DC Pin Inflow Current IPWM2DC 4 6 8 µA VPWM2DC=3V
PWM2DC Pin High Voltage VPWM2DCH 1.8 - 5.0 V
PWM2DC Pin Low Voltage VPWM2DCL -0.3 - +0.8 V
PWM2DC Pin Selected Voltage to
VPWM2DCZ 7.5 8.0 8.5 V PWM2DC=sweep up
High Impedance
【COMPSD Block】
COMPSD Detection Voltage VCOMPSD 3.88 4.00 4.12 V
【FAIL Block】
FAIL Pin ON-Resistance RFAIL - 100 200 Ω

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BD9412F

Pin Description
Pin No. Pin Name IN/OUT Function Rating [V]
1 VCC IN Power Supply Pin for IC (Built-In UVLO Function) -0.3 to +20
Power ON/OFF Control Pin for IC
2 STB IN -0.3 to +20
Power OFF when STB=L and Power ON when STB=H.
3 GND IN Ground Pin for Internal Signal in IC -
Drive Frequency Setting Pin
Basic Frequency is set by the resistor between RT and
4 RT OUT -0.3 to +5.5
GND and Drive Frequency Modulation Range is set by
the resistor between RT and FB.
Error Amplifier Output pin for LED Current feedback and
5 FB OUT -0.3 to +5.5
LED Voltage feedback
6 IS IN Error Amplifier Input pin for LED Current feedback -0.3 to +5.5
7 VS IN Error Amplifier Input pin for LED Open Voltage feedback -0.3 to +5.5
PWM Comparator Input Pin which controls PWM
operation during brightness adjustment.
8 PWMCMP IN -0.3 to +5.5
N1 and N2 output stop when PWMCMP=L, and they
output Max Duty when PWMCMP=H
Timer Latch Setting Pin
In abnormal case, 1µA (Typ) will be charged to the
9 CP OUT -0.3 to +5.5
capacitor connected to CP, and IC becomes latch status
after output operation stops at CP>2V(Typ)
10 PWMIN IN PWM Signal Input Pin for burst brightness adjustment -0.3 to +5.5
11 ADIM IN DC Signal Input Pin for analog dimming -0.3 to +5.5
Soft Start timer and COMPSD timer Setting Pin
During start-up, 2µA (Typ) will be charged to connected
12 SS OUT capacitor. At SS>2.0V(typ), COMPSD can start to -0.3 to +5.5
detect. At SS>2.5V (typ), CP can accept charge
operation.
Error Indication Signal Output Pin
13 FAIL OUT -0.3 to +5.5
Normal : L, Error : Open
Abnormal Over Voltage Detection Pin
14 COMPSD IN When detecting abnormality, output operation stops and -0.3 to +5.5
IC becomes latch status after 2 clocks.
Pulse to DC converting pin
15 PWM2DC IN Pulse Signal is translated to flat dc level by 100kΩ -0.3 to +20
resistor in IC and the capacitor connected to ADIM.
16 PGND IN Power Ground for external MOSFET drive -
17 N2 OUT Output pin for external FET drive circuit (Channel N2) -0.3 to +20
18 N1 OUT Output pin for external FET drive circuit (Channel N1) -0.3 to +20

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BD9412F

I/O Equivalent Circuits

STB RT FB

VCC REF REF

REF
VCC

160KΩ 300KΩ 10KΩ

20Ω
STB
FB
RT
130KΩ

50KΩ
GND GND GND GND
GND GND
GND GND
GND GND

IS VS PWMCMP
REF REF
REF
REF
REF REF REF
REF
VCC

100KΩ 20Ω PWMCMP

1KΩ
VS 100kΩ
IS 10KΩ
10KΩ GND
GND
GND
GND GND GND GND
GND GND GND GND GND
GND

CP PWMIN ADIM

REF VCC 2.2V

REF VCC 100KΩ REF

350Ω 100KΩ
CP PWMIN 100KΩ
GND
GND
ADIM

GND GND
GND GND
GND GND GND GND GND

SS FAIL COMPSD
REF REF
REF VCC

350Ω 50Ω 100KΩ

SS FAIL COMPSD

GND GND GND

GND GND GND GND GND

PWM2DC N2 N1

VCC VCC VCC VCC

REF REF

PWM2DC
100KΩ
400KΩ
N2 N1
100KΩ
90KΩ 90KΩ

GND GND
GND GND
PGND PGND PGND PGND PGND PGND

Figure. 5 I/O equivalent circuit

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BD9412F

Block Diagram

VCC PWMIN RT

VCC
UVLO
BLOCK

PWM OSC
SYSTEM BLOCK
STB BLOCK
ON / OFF
STB BLOCK

CT

VCC

FB

IS N1
Feedback
VS
BLOCK DR V
LOGIC
BLOCK BLOCK
CT
SS PWM

BLOCK N2
PWMCMP

ADIM Analog
Dimming
PGND
PWM2DC

GND PROTECT
BLOCK

COMPSD CP FAIL

Figure. 6 Block Diagram

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BD9412F

Typical Performance Curves

5 70
Ta=25°C VCC=12V
68 RRT=100kΩ
RADJ=none
4 66

[kHz]
[mA]

fOUT[kHz]
: ICC[mA]

64

Frequency: f:OUT
: ICC1

3 62
Current
Current

Frequency
60
Operating

2 58
Operating

Output
56

Output
1 54
52
0 50
8 10 12 14 16 18 -40 -20 0 20 40 60 80 100
Supply
SupplyVoltage
Voltage: V: CC
Vcc[V]
[V] Temperature : Temp.
Temperature [℃]
: Ta [°C]

Figure 7. Operating Current vs Power Supply Voltage Figure 8. Output Frequency vs Temperature

50 1.0

VCC=12V Ta=25°C
RRT=100kΩ VCC=12V
48 VPWMCMP=OPEN 0.8
[V]
: VIS[V]
[%]
: [%]

46 0.6
Voltage: VIS
DUTY
Max Duty

Voltage
MAX

44 0.4
ISIS

42 0.2

40 0.0
-40 -20 0 20 40 60 80 100 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Temperature
Temperature : Ta [°C]
: Temp [deg] ADIMVoltage
ADIM Voltage::VVADIM [V]
ADIM [V]

Figure 9. MAX DUTY vs Temperature Figure 10. IS Voltage vs ADIM Voltage

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BD9412F

Pin Function Description

PIN.1 VCC
This is power supply pin for the IC. Normal operation range (Typ) is from 9V to 18V. Please place ceramic
capacitor bigger than 0.1µF as bypass capacitor between VCC and GND. It is for noise elimination.

PIN.2 STB
This PIN is for setting of ON/OFF. It is possible to use as reset when shutting down.
Please set the STB terminal voltage below VCC voltage. In addition, please set below 4V if the voltage is applied
earlier than VCC.
Depending on input voltage to STB pin, the status of IC might be switched (ON/OFF). Please avoid using between
the two status (0.8V to 2.0V)

PIN.3 GND
This is signal system GND for IC inside. Please make it independent from PGND as much as possible (We
recommend this because it has less influence with switching noise which comes from short circuit of PGND and
GND at connector close to GND pin.

Vin

GND_PIN

PGND
IC

N1 N2

GND

Figure. 11

PIN.4 RT
Set up the charge/discharge current by frequency of IC inside.
By changing the resistance value of resistor between RT pin and GND, it is possible to set up basic drive
frequency as following formula;
Basic frequency means output N1, N2 frequency which is determined only with resistor between RT pin and GND.

6000
f OUT  [kHz] ( f OUT  200 kHz)
RRT [k]
6673
f OUT  [kHz] ( f OUT  200 kHz)
RRT [k]  3.336

1,000
BD94121F

OSC Error Amp

100
Out put Frequency : f OUT [ k Hz]

RT FB IS VS
CFBIS RFBIS
10
CFBVS RFBVS
RRT

1
10 100 1,000
RT Resistance : RRT [kΩ] Figure. 13 RRT Resistor connection method

Figure. 12 RT Resistance vs Output Frequency

There is a discrepancy between theoretical formula and actual device. For frequency setting, please thoroughly
verify it with actual application. In addition, frequency may change upon resistor RADJ which is placed between
RT and FB pins

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BD9412F

PIN.5 FB
This is output pin for LED current feedback (IS pin) error amplifier and open LED voltage feedback (VS pin) error
amplifier. The capacitance between FB and IS (1500pF to 0.01µF) also determines start up time of LED current
necessary during phase compensation and brightness adjustment. Capacitance between FB and VS (1500pF to
0.01µF) is for phase compensation of error amplifier.

BD94121F

OSC Error Amp

Figure. 14 RRT and RADJ Resistor connection method

RT FB IS VS
CFBIS RFBIS
RADJ CFBVS RFBVS
RRT

Moduration width of Output Frequency

150
[kHz] OUT

125 As shown by left graph, by changing resistor RADJ

between FB and RT, it is possible to determine the
Modulation width of Output Frequency： Δf

108.1
modulation width of frequency.
100

Modulation width of frequency determined by the

75 resistor between FB and RT resistor (Theoretical
formula : Example)
When RADJ=100kΩ , Δ fOUT=108.1kHz
50

25
Figure. xx

0
10 100 1000
RADJ Resistance
Figure. 13 出力周波数変動幅 対: RR
ADJ [kΩ]
ADJ 抵抗値 特性

Figure. 15 Modulation width of Output Frequency vs RADJ Resistance

Output Frequency vs FB Voltage
200

180 167.8

160

140
Output Frequency : fOUT [kHz]

120
Modulation width of frequency determined by the
100 resistor between FB and RT resistor (Theoretical
formula : Example)
80
When RADJ=100kΩ , Δ fOUT=108.1kHz
60
59.7
40

20
0.5 3.2
0
0 1 2 3 4 5 6
FB Voltage : VFB [V]
Figure. 16 Output Frequency vs FB Voltage

The basic drive frequency is determined by resistor R RT which is connected from RT pin to GND. The basic
frequency is the one at VFB=1.5V, and operation frequency range will be fixed with frequency modulation width that
is determined by RADJ under this condition. When RRT=51kΩ, fOUT=127.7kHz becomes to basic drive frequency.

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PIN.6 IS
This is input pin of LED current feedback (IS pin) error amplifier. Please set up as normal voltage (ADIM/4.4)V
(Typ). When IS pin voltage becomes less than (ADIM/8.8)V (Typ) or higher than 1.0V, the output will be stopped
and latched.

50uA

FB

R2 IS
_
12kΩ
R1 + Error Amp
ADIM
Gain
1/4.4

Figure. 17 IS Block Diagram

50µA (Typ) current flows from IS pin to external resistor during OFF period of burst brightness adjustment.

Considering Min value of IS source current during burst brightness adjustment, please set that total resistance
from IS Pin to GND is from 8kΩ to 22kΩ. When R2 is 12kΩ in above diagram, please set 8kΩ < R1 + R2 < 22kΩ.

PIN.7 VS
This is input pin of Open LED voltage feedback (VS pin) error amplifier. It has to be 1.25V during LED is open.
When LED is ON, it will be 0.5V to 1.0V. When VS pin becomes over 1.25V, protection circuit will start operation,
and if it becomes more than CP timer set up time (Timer Latch), it will shut down.
Connector
8

7
6

FB

R1
Error Amp
VS _
R2 R3
+

1. 25 V

Figure. 18 VS Block Diagram

Please set C1, C2, R1, R2, and R3 value to input 1.25V to VS pin during LED bar’s connector disconnects.

PIN.8 PWMCMP
PWMCOMP pin voltage is fixed by DUTY of drive output N1, N2 in comparison with a saw wave of IC inside. This
pin has 100µA sink/source current capability and when external capacitor is connected between PWMCMP and
GND, IC will operate PWM at brightness start up stage. When N1 and N2 only drive at MaxDuty, please set
PWMCMP=open.

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BD9412F

PIN.9 CP
This pin sets up the time from the point of abnormal detection till shut down (Timer Latch). Having 1µA constant
current charges at external capacitor connected to CP pin, it will shut down when it becomes over 2.0V. During soft
start, there is no charge to CP external capacitor even fulfilling CP pin charge condition (timer latch). External
capacitor is set around 0.01µF to 2.2µF).

VCP CCP  2.0

TCP  CCP    2.0  10 6  CCP [sec]
I CP 1.0  10  6
Timer Latch Time TCP

1uA 100

10

Timer Latch Time : TCP[sec]

Timer latch
CCP Shut-down 1

2.0V
0.1
Timer Start

0.01

0.001
0.001 0.01 0.1 1 10

Figure. 19 CP Block Diagram CP Capacitance CCP[µF]

Figure. 20 Timer Latch Time vs CP Capacitance

PIN.10 PWMIN
By inputting PWM pulse signal at PWMIN pin, it is possible to adjust burst brightness. (High level: over 1.8V, Low
level: below 0.8V).

condition LED condition

PWMIN : 1.8V to 5.0V Turn On
PWMIN : -0.3V to 0.8V Turn Off

PIN.11 ADIM
ADIM pin is Input and Output Pin of DC signal for analog dimming. According to ADIM Input level, each pin’s
function is changed as the followings. Pulse-DC translation Circuit is shown in Figure.20.

Needed Signal
PWM2DCinput level PWM2DC function ADIM function
from External
Pulse Signal Input DC Signal Output DUTY Signal
-0.3V<PWM2DC<6.5V
for Analog Dimming for Analog Dimming for Analog Dimming
Mask PWM2DC’s DC Signal Input DC Signal Output
8.5V<PWM2DC<20V
Function for Analog Dimming for Analog Dimming

The voltage that ADIM voltage multiplies by (1/4.4) becomes IS threshold voltage and it has linear characteristic.
But, ADIM voltage becomes under 0.44V(Typ), IS threshold voltage is clamped at 0.44V/0.44=0.1V(Typ). And
ADIM voltage becomes over 2.2V(Typ), IS threshold voltage is clamped at 2.2V/0.44=0.5V(Typ). When you want
to use linear characteristic range, please set ADIM voltage from 0.5V to 2.1V.
And pulse signal inputs to PWM2DC terminal and IC can average it by IC internal 100kΩ and the capacitor
connected to ADIM terminal (This means pulse to DC signal transfer circuit.). At this time, ADIM ripple level is
changed by ADIM’s capacitance, therefore please set suitable capacitance according to set specification.
IS
PWM2DC
IS High Det
1.0V
Pulse
signal
8.0V/7.0V
0.5V

2.2V
Gain=1/4.4
ADIM RADIM
0.25V 100k

CADIM
0.1V
0.05V IS Low Det
ADIM
0.44V 2.2V
Figure. 21 IS threshold voltage vs ADIM voltage Figure. 22 Pulse to DC transfer block diagram

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BD9412F

PIN.12 SS
This is soft start time and SDON time set up pin. Constant current 2.0µA(Typ) is charged to external capacitor
(0.01µF to 0.1µF). When SS terminal voltage is higher than 2.0V, COMPSD can be detected. When SS terminal
voltage is less than 2.0V, latch protection circuit will not operate. When SS terminal voltage is higher than 2.5V,
soft start completes. When soft start is under operation (SS pin voltage is less than 2.5V), timer latch protection
circuit by CP charge will not operate.

2uA
Finish
ss SoftStart
Css
2.5V
Where:
POWER
Start CSS is the capacitance of SS pin
ON
COMPSD

2.0V

Figure. 23 SS Block Diagram

VSSEND C SS  2.5
TSSEND C SS    1.25  10 6  C SS [sec]
I SS 2.0  10 6
V C  2.0
TSDON C SS  SDON  SS 6
 1.0  10 6  C SS [sec]
I SS 2.0  10

PIN.13 FAIL
This is fail signal output pin of IC. At normal situation, it outputs GND Level and it becomes Open after timer latch
in case any abnormality is detected. The pull up voltage during Open must be set less than rated voltage 5.5V of
FAIL pin. Please connect about 0.1uF capacitor for noise reduction to FAIL pin.

Condition FAILOutput
Normal operation GND Level
FAIL
Abnormal operation Open

Figure. 24 FAIL Block Diagram

PIN.14 COMPSD
This is input pin for over voltage protection circuit comparator. The detection voltage of comparator is
4.0V(Typ),and will start to count 2CLK over voltage detection. After 2CLK count, it will shut down by timer latch.

PIN.15 PWM2DC
Pulse signal inputs to PWM2DC terminal and IC can average it by IC internal 100kΩ and the capacitor connected
to ADIM terminal (This means pulse to DC signal transfer circuit.). When the voltage that is higher than 8V(Typ)
forces to PWM2DC terminal, buffer output in the IC becomes high impedance, and IC function shifts to direct DC
input mode to ADIM. (Refer to the diagram of PIN11 ADIM.)

PIN.16 PGND
This is Power GND pin for output pin N1, N2 at driver part. Please make it independent from GND (Pin 3) pin on
inverter PCB. This pin is not connected to GND pin in IC inside.

PIN.17 N2
This is gate drive output pin for Low Side external Nch FET. Normally please connect it to FET gate through about
10Ω resistor. It is for noise reduction. Gate has to be pull-down to source by resistor of 1kΩ to 10kΩ.

PIN.18 N1
This is gate drive output pin for Low Side external Nch FET. Normally please connect it to FET gate through about
10Ω resistor. It is for noise reduction. Gate has to be pull-down to source by resistor of 1kΩ to 10kΩ.

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BD9412F

Detection Condition List of the Protection Functions (Typ Condition)

Protect Detection Detect Condition Timer Protection
Release Condition
Function Pin Detection Condition SS Operation Type
(ADIM<0.44V) (ADIM<0.44V)
IS < 0.05V IS > 0.05V
(0.44V<ADIM<2.2V) (0.44V<ADIM<2.2V)
LED OPEN IS SS>2.0V 2CLK Latch off
IS < ADIM/8.8 IS > ADIM/8.8
(ADIM>2.2V) (ADIM>2.2V)
IS < 0.25V IS > 0.25V
LED SHORT IS IS > 1.0V SS>2.0V IS < 1.0V 2CLK Latch off

OVP VS VS > 1.25V SS>2.5V VS < 1.25V CP Latch off

Restart by
VCC UVLO VCC VCC < 7.5V - VCC > 8.0V -
release
COMPSD COMPSD COMPSD > 4.0V SS>2.0V COMPSD < 3.8V 2CLK Latch off
To reset the latch type protection, please set STB logic to ‘L’ once. Otherwise the detection of VCCUVLO is required. The count number in the list is calculated
with double of output frequency.

Behavior List of the Protect Function

Operation of the Protect Function
Protect Function
N1,N2 Output SS pin FAIL pin
LED OPEN Stop after latch Low after latch High after latch
LED SHORT Stop after latch Low after latch High after latch
OVP Stop after latch Low after latch High after latch
VCC UVLO Stop immediately Low Immediately High Immediately
COMPSD Stop after latch Low after latch High after latch

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BD9412F

Application Example
Introduce an application example with BD94121F

< Secondary Side >

RS CCP
< Primary Side >

CSS CSDON

RFBVS

RFBIS
CFBVS

CFBIS
RADJ
GND

RRT
PVIN

T1
ON/OFF
PWMIN
VCC

PDIM

FAIL

PDIM
GND

PWM
STB
VCC
GND

ERR
PDIM

Figure. 25 Application Example

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BD9412F

Timing Chart
When it Detects Quick Detection Type Error

STB 2.0V

2.5V 2.5V 2.5V

2.0V 2.0V 2.0V
SS

FB

1.0V
ADIM/4.4 1 ADIM/4.4 2
IS
ADIM/8.8

1.25V 1.25V
VS

3
4.0V
COMPSD

2.0V
CP

FAIL

Figure. 26 Timing Chart 1

[The explanation of quick abnormal detection]

Due to the timing of ① to ③ in the above chart, the IC detects malfunction and starts the output-mute latch without CP
Charge . For ① to ③, the malfunction is detected according to the conditions in the table shown below.

No. Content of Abnormal Detection Condition of Abnormal Detection

① Abnormal LED current detection IS<(ADIM/8.8)V
② Abnormal LED short detection IS>1.0V
③ COMPSD Over Voltage detection COMPSD≥ 4.0V

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BD9412F

When it Detects Timer Latch Type Error

STB 2.0V

2.5V 2.5V
2.0V 2.0V
SS

3.2V
FB

1.0V
ADIM/4.4

IS ADIM/8.8

4
1.25V
1.25V
VS

COMPSD 1.80V

2.0V
CP

FAIL

Figure. 27 Timing Chart 2

[The explanation of Time latch type error detection]

Due to the timing of ④ in the above chart, the IC detects abnormal and starts the timer latch charging. For ④, the
abnormal is detected according to the conditions in the table shown below.

No. Content of Abnormal Detection Condition of Abnormal Detection

④ Abnormal LED voltage detection VS≥ 1.25V

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BD9412F

Output Timing Chart

BD94121F outputs the signal that operates the Push-Pull or Half-Bridge which is made up of Nch FET. The output
timing of drive signal is shown in the following chart

CT _ SYNC_ OUT
(can’t see it)

PWMIN

FB
FB=0.5V FB=0.5V

Internal CT
PWMCOMP
( can’t see it)
CT

N1
VCC

N2
VCC

Figure. 28 Output Timing Chart

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BD9412F

Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.

3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.

6. Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.

7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.

8. Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

9. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.

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BD9412F

Operational Notes – continued

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.

11. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.

12. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor Transistor (NPN)
Pin A Pin B B Pin B
C
Pin A E

P B C
P+ P+ P+ N P P+
N N N N Parasitic N N N
E
Elements
Parasitic
P Substrate P Substrate
Elements
GND GND GND GND
Parasitic Parasitic N Region
Elements Elements close-by
Figure xx. Example of monolithic IC structure

13. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.

14. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.

15. Over Current Protection Circuit (OCP)

This IC incorporates an integrated over current protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.

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BD9412F

Ordering Information

B D 9 4 1 2 1 F - E2

Part Number Package Packaging and forming specification

F:SOP18 E2: Embossed tape and reel

Marking Diagrams

SOP18(TOP VIEW)
Part Number Marking

BD94121F LOT Number

1PIN MARK

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BD9412F

Physical Dimension, Tape and Reel Information

Package Name SOP18

(Max 11.55 (include.BURR))

(UNIT : mm)
PKG : SOP18
Drawing No. : EX115-5001

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BD9412F

Revision History

Revision No. Date Page Changes

001 22.Feb.2016 All New Release

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 Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅡb
CLASSⅢ CLASSⅢ
CLASSⅣ CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification

Notice-PGA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.

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 Datasheet

General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.

Notice – WE Rev.001
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