All Flex Design Guide Rev Aug 2013 Master
All Flex Design Guide Rev Aug 2013 Master
All Flex Design Guide Rev Aug 2013 Master
Design Guide
Download from
www.allflexoinur website:
c.com
5. Dynamic Flexing.
• The thinness of the material makes
flexible circuitry the best candidate
for dynamic flexing applications up to
millions of flexures.
assist You
All Flex Circuit Design and Engineering
support will
Multi-Layer Construction Circuits WHEN TO USE • Ground and power • Increased circuit
MULTI-LAYER plane applications. density.
• Controlled impedance and shielding possible.
FLEX: • Used for shielding • EMI/RFI shielding.
applications. • Controlled impedance
• Required when circuit
COPPER density and layout can • Dense surface mount with shielding.
not be routed on a assembly.
PI (Polyimide) single or double layer.
ADHESIVE ADDED
BETWEEN EACH
0.005" FR-4
Inquire Within
All Flex has the unique capability to manufacture heaters and assemble components
All Flex can design, fabricate, and reverse engineer flexible heaters to meet customer’s exact requirements. Flexible
F L E X I B L E H E AT E R S
polyimide and silicone rubber heaters and heater component assemblies are fabricated with a variety of resistive metal
alloys to deliver custom solutions for heating capacity, watt density, and other application specific customer needs.
Typical lead times 2 – 3 weeks.
Reverse Engineer
All Flex support can Heaters can be designed and manufactured into virtually any
size and shape. Parts can be supplied with pressure sensitive
adhesive for easy attachment to heat sinks.
to meet exact requirements
All Flex engineering will work closely with you to ensure the proper design and layout. The following are typical
F L E X I B L E H E AT E R S
Design Parameters
CHARACTERISTICS TYPICAL PARAMETERS - POLYIMIDE TYPICAL PARAMETERS - SILICONE
* Note - these are standard parameters inquire within for requirements beyond this range
Size Range* Less than ½" square up to 10"x22" Less than ½" square up to 24"x30"
Temperature Range Up to 392° F (200° C) Up to 450° F (232° C)
Resistance Range Up to 250 Ω per sq in Up to 250 Ω per sq in
Metal Thickness Range* .0005" - .002" .0005" - .002"
Total Thickness Range* .0045" - .01" .03" - .06"
Dielectric Range/ Insulation Resistance 4000-5000 V/mil 400-600 V/mil
Example Power Densities 2.5 W/in²-low end, 5 W/in²-all purpose, 2.5 W/in²-low end, 5 W/in²-all purpose,
10 W/in²-rapid warmup 10 W/in²-rapid warmup
Resistance Tolerance* +/- 10% +/- 10%
Maximum Voltage Up to 115 V Up to 220 V
Standard Coverlay Thickness .001", .002", .003" and .005" .015"
Leads (if required) Length/AWG/Coating Length/AWG/Coating
HYBRID HEATERS
Now your single or double sided circuit assembly can have built-in heaters.
All Flex can take your electronic circuitry requirements and your heat requirements Advantages of a
and create a hybrid product. Typically the heater function is on one side of the Hybrid heater
base film and the electronics function is on the opposite side. By combining • Thinner overall profile
a copper layer for the electronics with a layer of resistive metal for the heater, • Reduces overall assembly weight
a hybrid circuit can be designed. Top to bottom electrical connection can be • More robust functionality
done with plated thru holes. All Flex has unique process and materials that can • Lower over all costs
accommodate even the most challenging hybrid requirements.
F L E X I B L E H E AT E R S
and thermal control in applications ITAR Registered, Mil-P-50884E Compliant. ITAR Registered, Mil-P-50884E Compliant.
where thermal management is
Heating technology is used extensively in All Flex Heaters provide an excellent solution
extremely important.
the Aeronautics and Aerospace industry due for high performance, densely packed
All Flex Understands: to the temperature extremes and the need electronics where space is a premium yet
for reduced weight and compact electronics. heating of components are needed.
• Medical quality requirements
All Flex heaters help to maintain high Numerous All Flex Flexible Circuits are used
• FDA traceability expectations reliability of electrical components by by prime contractors, NASA, developmental
• Medical device limiting exposure to high degrees of thermal laboratories, and government agencies.
qualification procedures contraction/expansion cycles.
Some Applications:
• Clean room/precision assembly All Flex Heaters also keep non-electrical
• Aircraft equipment
needs of medical customers components at constant temperatures for
both functional and convenience purposes. • Night vision
• Medical device product
The typical application for heaters in this • Sighting systems
development cycles
industry is not to heat devices to high • Ruggedized computers
• Small and medium volume temperatures, but to keep devices from
delivery needs getting cold. Our technology enables us to
Some Applications: fabricate heaters that remain flexible and
compliant at -55 degrees C (-67 degrees F)
• Incubator while heating to slightly above freezing.
• Operating room equipment Some Applications:
• Surgical tools • Helicopter controls
• Defibrillator • Aircraft controls
• Dialysis equipment • De-icing systems
• Blood analysis equipment • Satellite hardware
• Medical instrumentation and
• Cockpit systems Lab Analysis Heater
laboratory equipment
Breath Analyzer
• Hand-held scanners
Our Vision...
is to be your
for flex...
All Flex has the capability to AUTOMATED PICK AND Other All Flex Added
quickly design, manufacture PLACE CAPABILITY Value Capabilities
and deliver in volumes from PROVIDES Complex • Thru hole assembly
prototype to production. All Flex Assembly Combinations • Flexible circuit folding and forming
Including: (see page 15)
has manufactured hundreds of • Electrical testing
• Surface mount components down
designs for the military, medical to 0201 • Heat Sinks
and industrial markets. • Precise vision system allows placement • Nomenclature Screening
accuracy to .001" • Stiffener placement
• Fine pitch capability to .5mm pitch • Design and manufacturing
• Leaded devices support – concept to completion
• Tactile domes Circuit Testing Capability
• Staked terminals • Capability
Solderability • Microsections
• Unlimited component configurations • Ionic contamination
Solderability • Continuity
• RoHS Compliant assembly • Dimensional tolerance
Ionic contamination • Inductance
• Thermal testing
Dimensional tolerance • Capacitance
• Virtually all SMT components including
discretes, SOICs, PLCCs, QPPs, & BGA's • Dielectric net-to-net
Thermal testing • Resistance
• Auto fiducial correction • Insulation resistance (IR)
Microsections • Impedance
Potted Circuits
connector securely adhered with
potting compound to perform in rugged
applications where vibration is typical
Automated assembly
HAND ASSEMBLY • Solder Screener
Automated screening of solder onto
• Operators certified to J-STD arrays/panels using solder stencil
• Lead and lead free capability Lead and lead free capability
• ESD controls • Selective Soldering
Automated ability to solder leads on
through hole connector
Lead and lead free capability
FORMULA:
HOLE SIZE (FINISHED) + CUSTOMER REQUIRED TOLERANCES + ALL FLEX TOLERANCE = pad size required
.030" (.76mm) ±.003" (.07mm) .020" (.50mm) .053" (1.34mm)
TO INCORPORATE IN BENDING
AND FOLDING DESIGNS
Radiused Traces help Fold lines may be designated by Bend RaDius of a flex should
to alleviate breaking during folding “tick” marks which may be either in the be approximately 10 times the material
and bending. copper layers or silkscreen layers. These thickness and at least .050" away from the
features aid in bending and designating plated through hole.
I-Beam constructions occur when the bend locations.
conductors on both layers lie directly on r=10 x T
top of each other, increasing the stiffness
of the circuit through fold areas. A better
alternative is to stagger conductors,
alternating their location to retain the
maximum flexibility of the circuit.
CHARACTERISTIC IMPEDANCE:
Controlled impedance is important in high speed digital circuitry to avoid signal reflectance and
power loss. The impedence of a flexible printed circuit depends on dielectric constant of the
base material, conductor width, conductor thickness and dielectric thickness.
POLYMIDE COVERLAY
ADHESIVE
COPPER SIGNAL
ADHESIVE
POLYMIDE
T=Copper Thickness
H=Ground Plane Spacing ADHESIVE
W=Conductor Width
COPPER REFERENCE PLANE
POLYMIDE COVERLAY
LOCATION OF STIFFENER:
Stiffener and coverlay termination
points should overlap a minimum of
.030" (.76mm) to avoid stress points.
Eliminating stress points reduce the
(This is the PREFERRED METHOD because there is not common ending
chance of traces breaking. point of the coverlay and stiffener.)
Interconnection Point
Request
Sculptured (unsupported) Traces
quotes, samples,
and design consults online
www.allflexinc.com
.150 MP
3.0 A
7.0
P
AM
MP
.100 2.5 A T
6.0
P
AM
W
FLAT CONDUCTOR WIDTH, W (INCHES)
5.0
.070 MP
2.0 A
.050 MP
CONDU
CTOR W 1.5 A
.030 IDTH/
TH ICKNE MP
SS, W/
T=5 1.0 A
.020 EQUIV
ALENT
ROUN 1/2
.015 D WIR OZ
E CUR A COP
MP
RENT
RATIN
P ER
(T= 0.5 A
.010 G 1O .00
Z CO 07”
2O PPE )
.007 Z CO R (T
B PPER =.0 AMP
(T= 014 0.25
.005 .00 ”)
28”
.003 )
10° C RISE AT 20° C AMBIENT
.002
SINGLE COPPER CONDUCTOR
.0015 WITH .010” THICK INSULATION
.001
10 15 20 30 50 70 100 150 200 300 500 700 1000 1500 2000 3000
CONDUCTOR RESISTANCE ° (OHMS/1000 FEET)
Relation between current rating and size of a single conductor for constant temperature rise in air. Conductor dimensions above the line
“WIDTH/THICKNESS = 5" are preferred for ease of manufacture.
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