Samsung 16M X 8 Bit NAND Flash Memory Datasheet

K9F2808Q0B-DCB0,DIB0 K9F2808U0B-YCB0,YIB0
K9F2808U0B-VCB0,VIB0 K9F2808U0B-DCB0,DIB0 FLASH MEMORY
Document Title
16M x 8 Bit NAND Flash Memory
Revision History
Revision No. History Draft Date Remark
0.0 Initial issue. May 28’th 2001 Advance
0.1 K9F2808U0B(3.3V device)’s qualification is finished Jun. 30th 2001
0.2 K9F2808Q0B (1.8V device)

- Changed typical read operation current (Icc1) from 8mA to 5mA Jul. 30th 2001 K9F2808Q0B
- Changed typical program operation current (Icc2) from 8mA to 5mA : Preliminary
- Changed typical erase operation current (Icc3) from 8mA to 5mA
- Changed typical program time(tPROG) from 200us to 300us
- Changed ALE to RE Delay (ID read, tAR1) from 100ns to 20ns
- Changed CLE hold time(tCLH) from 10ns to 15ns
- Changed CE hold time(tCH) from 10ns to 15ns
- Changed ALE hold time(tALH) from 10ns to 15ns
- Changed Data hold time(tDH) from 10ns to 15ns
- Changed CE Access time(tCEA) from 45ns to 60ns
- Changed Read cycle time(tRC) from 50ns to 70ns
- Changed Write Cycle time(tWC) from 50ns to 70ns
- Changed RE Access time(tREA) from 35ns to 40ns
- Changed RE High Hold time(tREH) from 15ns to 20ns
- Changed WE High Hold time(tWH) from 15ns to 20ns
0.3 1. Device Code is changed

- TBGA package information : ’B’ --> ’D’ Aug. 23th 2001
ex) K9F2808Q0B-BCB0 ,BIB0 --> K9F2808Q0B-DCB0,DIB0
K9F2808U0B-BCB0 ,BIB0 --> K9F2808Q0B-DCB0,DIB0
2. V IH ,VIL of K9F2808Q0B(1.8 device) is changed
(before revision)
I/O pins VccQ-0.4 VccQ
Input High Voltage V IH
Except I/O pins V CC-0.4 - VCC
Input Low Voltage,
V IL - 0 - 0.4
All inputs
(after revision)
VccQ
I/O pins VccQ-0.4
+0.3
VCC
Except I/O pins V CC-0.4 -
+0.3
Input Low Voltage,
V IL - -0.3 - 0.4
All inputs
Note : For more detailed features and specifications including FAQ, please refer to Samsung’s Flash web site.
http://www.intl.samsungsemi.com/Memory/Flash/datasheets.html
The attached datasheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right
to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have
any questions, please contact the SAMSUNG branch office near you.
1
Revision History
Revision No. History Draft Date Remark
0.4 1. IOL (R/B) of 1.8V device is changed. Nov 5th 2001 Preliminary
-min. Value: 7mA -->3mA
-typ. Value: 8mA -->4mA
2. AC parameter is changed.
tRP(min.) : 30ns --> 25ns
0.5 1. Parameters are changed in 1.8V part(K9F2808Q0B) . Feb 15th 2002
- tCH is changed from 15ns to 20ns
- tCLH is changed from 15ns to 20ns
- tALH is changed from 15ns to 20ns
- tDH is changed from 15ns to 20ns
0.6 1. Parameters are changed in 1.8V part(K9F2808Q0B) . May 3rd 2002
- tRP is changed from 25ns to 35ns
- tWB is changed from 100ns to 150ns
- tREA is changed from 40ns to 45ns
Note : For more detailed features and specifications including FAQ, please refer to Samsung’s Flash web site.
http://www.intl.samsungsemi.com/Memory/Flash/datasheets.html
The attached datasheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right
to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have
any questions, please contact the SAMSUNG branch office near you.
2
16M x 8 Bit Bit NAND Flash Memory

PRODUCT LIST
Part Number Vcc Range Organization PKG Type

K9F2808Q0B-D 1.7 ~ 1.9V TBGA
K9F2808U0B-Y TSOP1
X8
K9F2808U0B-D 2.7 ~ 3.6V TBGA
K9F2808U0B-V WSOP1
FEATURES
• Voltage Supply • Command/Address/Data Multiplexed I/O Port
- K9F2808Q0B : 1.7~1.9V • Hardware Data Protection
- K9F2808U0B : 2.7 ~ 3.6 V - Program/Erase Lockout During Power Transitions
• Organization • Reliable CMOS Floating-Gate Technology
- Memory Cell Array : (16M + 512K)bit x 8bit - Endurance : 100K Program/Erase Cycles
- Data Register : (512 + 16)bit x8bit - Data Retention : 10 Years
• Automatic Program and Erase • Command Register Operation
- Page Program : (512 + 16)Byte • Package
- Block Erase : (16K + 512)Byte - K9F2808U0B-YCB0/YIB0 :
• 528-Byte Page Read Operation 48 - Pin TSOP I (12 x 20 / 0.5 mm pitch)
- Random Access : 10µs(Max.) - K9F2808X0B-DCB 0/ DIB0
- Serial Page Access 63- Ball TBGA ( 9 x 11 /0.8mm pitch , Width 1.0 mm)
- K9F2808Q0B : 70ns - K9F2808U0B-VCB0/VIB0
- K9F2808U0B : 50ns 48 - Pin WSOP I (12X17X0.7mm)
• Fast Write Cycle Time * K9F2808U0B-V(WSOPI ) is the same device as
- Program Time K9F2808U0B-Y(TSOP1) except package type.
- K9F2808Q0B : 300 µs(Typ.)
- K9F2808U0B : 200µs(Typ.)
- Block Erase Time : 2ms(Typ.)
GENERAL DESCRIPTION
The K9F2808X0B is a 16M(16,777,216)x8bit NAND Flash Memory with a spare 512K(524,288)x8bit. The device is offered in 1.8V or
3.3V Vcc. Its NAND cell provides the most cost-effective solution for the solid state mass storage market. A program operation pro-
grams the 528-byte page in typical 200µs and an erase operation can be performed in typical 2ms on a 16K-byte block. Data in a
page can be read out at 70ns/50ns(K9F2808Q0B:70ns, K9F2808U0B:50ns) cycle time per byte. The I/O pins serve as the ports for
address and data input/output as well as command input. The on-chip write control automates all program and erase functions
including pulse repetition, where required, and internal verification and margining of data. Even write-intensive systems can take
advantage of the K9F2808X0B’s extended reliability of 100K program/erase cycles by providing ECC(Error Correcting Code) with
real time mapping-out algorithm.
The K9F2808X0B is suitable for use in data memory of mobile communication system to reduce not only mount area but also power
consumption.
3
PIN CONFIGURATION (TSOP1)

K9F2808U0B-YCB0/YIB0
N.C 1 48 N.C
N.C 2 47 N.C
N.C 3 46 N.C
N.C 4 45 N.C
N.C 5 44 I/O7
GND 6 43 I/O6
R/B 7 42 I/O5
RE 8 41 I/O4
CE 9 40 N.C
N.C 10 39 N.C
N.C 11 38 N.C
Vcc 12 37 Vcc
Vss 13 36 Vss
N.C 14 35 N.C
N.C 15 34 N.C
CLE 16 33 N.C
ALE 17 32 I/O3
WE 18 31 I/O2
WP 19 30 I/O1
N.C 20 29 I/O0
N.C 21 28 N.C
N.C 22 27 N.C
N.C 23 26 N.C
N.C 24 25 N.C
PACKAGE DIMENSIONS
48-PIN LEAD PLASTIC THIN SMALL OUT-LINE PACKAGE TYPE(I)
48 - TSOP1 - 1220F Unit :mm/Inch
MAX
20.00± 0.20
0.004
0.10
0.787± 0.008
+0 .0 03
0 .00 8- 0.0 0 1
+0 .07
#1
0.20 -0 .0 3
#48
( 0 .25 )
0.010
MAX
12.00
0.472
12 .40
0.488
0.0 197
0.50
#24 #25
1.00± 0.05 0.05

MIN
0.039 ±0.002 0.002
1.20
0.010 TYP
+0 .07 5
18.40± 0.10 0.047 MAX

0.1 25 0 .03 5
+0 .00 3
0.005-0 .0 01
0.724± 0.004
0 .25
0~8¡Æ
0.45~0.75
( 0.50 )
0.018~0.030 0.020
4
PIN CONFIGURATION (TBGA)
K9F2808X0B-DCB0/DIB0
DNU DNU DNU DNU
DNU DNU DNU

/WP ALE NC /CE /WE R/B
NC /RE CLE NC NC NC
NC NC NC NC NC NC
NC NC NC NC NC NC
NC NC NC NC NC NC
NC I/O0 NC NC NC Vcc
NC I/O1 NC VccQ I/O5 I/O7
Vss I/O2 I/O3 I/O4 I/O6 Vss
DNU DNU DNU DNU
DNU DNU DNU DNU
(Top View)
PACKAGE DIMENSIONS
63-Ball TBGA (measured in millimeters)
Top View Bottom View

9.00 ±0.10 A
0.80 x9= 7.20
0.80 x5= 4.00
9.00 ±0.10 0.80 B

(Datum A) 6 5 4 3 2 1
0.80
#A1
A
B
(Datum B) 0.80 x11= 8.80
C
0.80 x7= 5.60
11.00 ±0.10
11.00 ±0.10
D
E
2.80
63-∅0.45 ±0.05
∅ 0.20 M A B 2.00
Side View
0.32 ±0.05
0.90 ±0.10
9.00 ±0.10
0.08MAX
0.45 ±0.05
5
PIN CONFIGURATION (WSOP1)

K9F2808U0B-VCB0/VIB0
N.C 1 48 N.C
N.C 2 47 N.C
DNU 3 46 DNU
N.C 4 45 N.C
N.C 5 44 I/O7
N.C 6 43 I/O6
R/B 7 42 I/O5
RE 8 41 I/O4
CE 9 40 N.C
DNU 10 39 DNU
N.C 11 38 N.C
Vcc 12 37 Vcc
Vss 13 36 Vss
N.C 14 35 N.C
DNU 15 34 DNU
CLE 16 33 N.C
ALE 17 32 I/O3
WE 18 31 I/O2
WP 19 30 I/O1
N.C 20 29 I/O0
N.C 21 28 N.C
DNU 22 27 DNU
N.C 23 26 N.C
N.C 24 25 N.C
PACKAGE DIMENSIONS
48-PIN LEAD PLASTIC VERY VERY THIN SMALL OUT-LINE PACKAGE TYPE (I)
48 - WSOP1 - 1217F Unit :mm
0.70 MAX
15.40± 0.10 0.58± 0.04
#1 #48
+0.0 7
-0 .03
0.16
+0 .0 7
- 0.0 3
1 2.0 0±0 .1 0
0 .20
(0.50± 0.0 6)
0.5 0TY P
#24 #25
(0.1Min)
75
-0 .03 5
0.10 +0.0
0°
~8
°
0.45~0.75
17.00 ±0.20
6
PIN DESCRIPTION
Pin Name Pin Function
DATA INPUTS/OUTPUTS
I/O0 ~ I/O7 The I/O pins are used to input command, address and data, and to output data during read operations. The
I/O pins float to high-z when the chip is deselected or when the outputs are disabled.
COMMAND LATCH ENABLE

CLE The CLE input controls the activating path for commands sent to the command register. When active high,
commands are latched into the command register through the I/O ports on the rising edge of the WE signal.
ADDRESS LATCH ENABLE

ALE The ALE input controls the activating path for address to the internal address registers. Addresses are
latched on the rising edge of WE with ALE high.
CHIP ENABLE
The CE input is the device selection control. When the device is in the Busy state, CE high is ignored, and
CE
the device does not return to standby mode in program or erase opertion. Regarding CE control during read
operation, refer to ’Page read’ section of Device operation.
READ ENABLE
RE The RE input is the serial data-out control, and when active drives the data onto the I/O bus. Data is valid
tREA after the falling edge of RE which also increments the internal column address counter by one.
WRITE ENABLE
WE The W E input controls writes to the I/O port. Commands, address and data are latched on the rising edge of
the WE pulse.
WRITE PROTECT
WP The WP pin provides inadvertent write/erase protection during power transitions. The internal high voltage
generator is reset when the WP pin is active low.
READY/BUSY OUTPUT
The R/B output indicates the status of the device operation. When low, it indicates that a program, erase or
R/B
random read operation is in process and returns to high state upon completion. It is an open drain output and
does not float to high-z condition when the chip is deselected or when outputs are disabled.
OUTPUT BUFFER POWER

VccQ V CCQ is the power supply for Output Buffer.
VccQ is internally connected to Vcc, thus should be biased to Vcc.
POWER
Vcc
V CC is the power supply for device.
Vss GROUND
NO CONNECTION
N.C
Lead is not internally connected.
GND INPUT FOR ENABLING SPARE AREA

GND To do sequential read mode including spare area , connect this input pin to Vss or set to static low state
or to do sequential read mode excluding spare area , connect this input pin to Vcc or set to static high state.
DO NOT USE
DNU
Leave it disconnected.
NOTE : Connect all VCC and V SS pins of each device to common power supply outputs.
7
Figure 1. FUNCTIONAL BLOCK DIAGRAM

V CC
V SS
A9 - A 23 X-Buffers
Latches 128M + 4M Bit
& Decoders NAND Flash
ARRAY
Y-Buffers
A0 - A7
Latches
& Decoders (512 + 16)Byte x 32768
Page Register & S/A

A8 Y-Gating
Command
Command
Register
I/O Buffers & Latches Vcc/V CCQ
V SS
CE Control Logic
RE & High Voltage I/0 0
WE Generator Output
Global Buffers
Driver I/0 7
CLE ALE WP
Figure 2. ARRAY ORGANIZATION
1 Block =32 Pages

= (16K + 512) Byte
1 Page = 528 Byte

1 Block = 528 Bytes x 32 Pages
32K Pages = (16K + 512) Byte
1st half Page Register 2nd half Page Register
(=1,024 Blocks) 1 Device = 528Byte x 32Pages x 1024 Blocks
(=256 Bytes) (=256 Bytes)
= 132 Mbits
8 bit
512B Byte 16 Byte
I/O 0 ~ I/O 7
Page Register
512 Byte 16 Byte
I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7

1st Cycle A0 A1 A2 A3 A4 A5 A6 A7 Column Address
2nd Cycle A9 A 10 A 11 A 12 A 13 A 14 A 15 A 16 Row Address
(Page Address)
3rd Cycle A 17 A 18 A 19 A 20 A 21 A 22 A 23 *L
NOTE : Column Address : Starting Address of the Register.
00h Command(Read) : Defines the starting address of the 1st half of the register.
01h Command(Read) : Defines the starting address of the 2nd half of the register.
* A 8 is set to "Low" or "High" by the 00h or 01h Command.
* L must be set to "Low".
* The device ignores any additional input of address cycles than reguired.
8
PRODUCT INTRODUCTION
The K9F2808X0B is a 132Mbit(138,412,032 bit) memory organized as 32,768 rows(pages) by 528 columns. Spare 16 columns are
located in 512 to 527 column address. A 528-byte data register is connected to memory cell arrays accommodating data transfer
between the I/O buffers and memory during page read and page program operations. The memory array is made up of 16 cells that
are serially connected like NAND structure. Each of the 16 cells resides in a different page. A block consists of the 32 pages formed
by one NAND structures, totaling 8448 NAND structures of 16 cells. The array organization is shown in Figure 2. Program and read
operations are executed on a page basis, while erase operation is executed on a block basis. The memory array consists of 1024
blocks, and a block is separately erasable by 16K-byte unit. It indicates that the bit by bit erase operation is prohibited on the
K9F2808X0B.
The K9F2808X0B has addresses multiplexed with 8 I/O ′s. This scheme dramatically reduces pin counts and allows systems
upgrades to future densities by maintaining consistency in system board design. Command, address and data are all written through
I/O ′s by bringing WE to low while CE is low. Data is latched on the rising edge of WE. Command Latch Enable(CLE) and Address
Latch Enable(ALE) are used to multiplex command and address respectively, via the I/O pins. All commands require one bus cycle
except Page Program command and Block Erase command which require two cycles: one cycle for setup and another for execution.
The 16M byte physical space requires 24 addresses, thereby requiring three cycles for byte-level addressing: column address, low
row address and high row address, in that order. Page Read and Page Program need the same three address cycles following
required command input. In Block Erase operation, however, only two row address cycles are used. Device operations are selected
by writing specific commands into command register. Table 1 defines the specific commands of the K9F2808X0B.
Table 1. COMMAND SETS

Function 1st. Cycle 2nd. Cycle Acceptable Command during Busy
Read 1 00h/01h (1) -
Read 2 50h -
Read ID 90h -
Reset FFh - O
Page Program 80h 10h
Block Erase 60h D0h
Read Status 70h - O
NOTE : 1. The 00h command defines starting address of the 1st half of registers.
The 01h command defines starting address of the 2nd half of registers.
After data access on 2nd half of register by the 01h command, start pointer is automatically moved to
1st half register(00h) on the next cycle.
Caution : Any undefined command inputs are prohibited except for above command set of Table 1.
9
ABSOLUTE MAXIMUM RATINGS

Rating
Parameter Symbol Unit
K9F2808Q0B(1.8V) K9F2808U0B(3.3V)
V IN/OUT -0.6 to + 2.45 -0.6 to + 4.6 V
Voltage on any pin relative to V SS V CC -0.2 to + 2.45 -0.6 to + 4.6 V
V CCQ -0.2 to + 2.45 -0.6 to + 4.6 V
Temperature K9F2808X0B-YCB0,DCB0 -10 to + 125

TBIAS °C
Under Bias K9F2808X0B-YIB0,DIB 0 -40 to + 125
Storage Temperature TSTG -65 to + 150 °C
NOTE:
1. Minimum DC voltage is -0.6V on input/output pins and -0.2V on Vcc and VccQ pins. During transitions, this level may undershoot to -2.0V for periods
<20ns. Maximum DC voltage on input/output pins is V CCQ +0.3V which, during transitions, may overshoot to VC C +2.0V for periods <20ns.
2. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to the conditions
as detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
RECOMMENDED OPERATING CONDITIONS

(Voltage reference to GND, K9F2808X0B-YCB0,DCB 0:TA=0 to 70°C, K9F2808X0B-YIB0,DIB0:T A=-40 to 85°C)
K9F2808Q0B(1.8V) K9F2808U0B(3.3V)
Min Typ. Max Min Typ. Max
Supply Voltage V CC 1.7 1.8 1.9 2.7 3.3 3.6 V
Supply Voltage V CCQ 1.7 1.8 1.9 2.7 3.3 3.6 V
Supply Voltage V SS 0 0 0 0 0 0 V
DC AND OPERATING CHARACTERISTICS (Recommended operating conditions otherwise noted.)

K9F2808Q0B(1.8V) K9F2808U0B(3.3V)
Parameter Symbol Test Conditions Unit
Min Typ Max Min Typ Max
CE=VIL, IOUT=0mA
Operat- Sequential Read ICC1 K9F2808Q0B: tRC=70ns - 5 15 - 10 20
ing K9F2808U0B: tRC=50ns
Current mA
Program ICC2 - - 5 15 - 10 20
Erase ICC3 - - 5 15 - 10 20
Stand-by Current(TTL) ISB1 CE=VIH, WP =0V/VCC - - 1 - - 1
Stand-by Current(CMOS) ISB2 CE=VCC-0.2, WP =0V/V CC - 10 50 - 10 50
Input Leakage Current ILI V IN=0 to Vcc(max) - - ±10 - - ±10 µA
Output Leakage Current ILO V OUT=0 to Vcc(max) - - ±10 - - ±10
VccQ+0
I/O pins VccQ-0.4 2.0 - V CCQ+0.3
.3
VCC
Except I/O pins V CC-0.4 - 2.0 - V CC+0.3
+0.3
Input Low Voltage, All inputs V IL - -0.3 - 0.4 -0.3 - 0.8 V
K9F2808Q0B :I OH=-100µ A
Output High Voltage Level V OH V CCQ-0.1 - - 2.4 - -
K9F2808U0B :I OH=-400µA
Output Low Voltage Level K9F2808Q0B :I OL=100uA
V OL - - 0.1 - - 0.4
K9F2808U0B :I OL =2.1mA
IOL K9F2808Q0B :V OL =0.1V
Output Low Current(R/B) 3 4 - 8 10 - mA
(R/B) K9F2808U0B :V OL =0.4V
10
VALID BLOCK
Parameter Symbol Min Typ. Max Unit
Valid Block Number NVB 1004 - 1024 Blocks
NOTE:
1. The K9F2808X0B may include invalid blocks when first shipped. Additional invalid blocks may develop while being used. The number of valid blocks
is presented with both cases of invalid blocks considered. Invalid blocks are defined as blocks that contain one or more bad bits . Do not erase or
program factory-marked bad blocks. Refer to the attached technical notes for a appropriate management of invalid blocks.
2. The 1st block, which is placed on 00h block address, is fully guaranteed to be a valid block, does not require Error Correcti on.
AC TEST CONDITION
(K9F2808X0B-YCB0, DCB0 :TA=0 to 70°C, K9F2808X0B-YIB0,DIB0:TA=-40 to 85°C
K9F2808Q0B : Vcc=1.7V~1.9V , K9F2808U0B : Vcc=2.7V~3.6V unless otherwise noted)
Parameter K9F2808Q0B K9F2808U0B
Input Pulse Levels 0V to VccQ 0.4V to 2.4V
Input Rise and Fall Times 5ns 5ns
Input and Output Timing Levels VccQ/2 1.5V
K9F2808Q0B:Output Load (VccQ:1.8V +/-10%)
1 TTL GATE and CL=30pF 1 TTL GATE and CL=50pF
K9F2808U0B:Output Load (VccQ:3.0V +/-10%)
K9F2808U0B:Output Load (VccQ:3.3V +/-10%) - 1 TTL GATE and CL=100pF
CAPACITANCE( TA=25°C, VCC =1.8V/3.3V, f=1.0MHz)

Item Symbol Test Condition Min Max Unit
Input/Output Capacitance C I/O V IL =0V - 10 pF
Input Capacitance C IN V IN=0V - 10 pF
NOTE : Capacitance is periodically sampled and not 100% tested.
MODE SELECTION
CLE ALE CE WE RE WP Mode
H L L H X Command Input
Read Mode
L H L H X Address Input(3clock)
H L L H H Command Input
Write Mode
L H L H H Address Input(3clock)
L L L H H Data Input
L L L H X Data Output
L L L H H X During Read(Busy) on K9F2808U0B_Y or K9F2808U0B_V
During Read(Busy) on the devices except K9F2808U0B_Y
X X X X H X
and K9F2808U0B_V
X X X X X H During Program(Busy)
X X X X X H During Erase(Busy)
(1)
X X X X X L Write Protect
X X H X X 0V/V CC(2) Stand-by
NOTE : 1. X can be VIL or V IH.
2. WP should be biased to CMOS high or CMOS low for standby.
Program/Erase Characteristics
Parameter Symbol Min Typ Max Unit
K9F2808Q0B:3 00
Program Time tPROG - 500 µs
K9F2808U0B:200
Number of Partial Program Cycles Main Array - - 2 cycles

Nop
in the Same Page Spare Array - - 3 cycles
Block Erase Time tBERS - 2 3 ms
11
AC Timing Characteristics for Command / Address / Data Input
K9F2808Q0B K9F2808U0B
Min Max Min Max
CLE Set-up Time tCLS 0 - 0 - ns
CLE Hold Time tCLH 20 - 10 - ns
CE Setup Time tCS 0 - 0 - ns
CE Hold Time tCH 20 - 10 - ns
WE Pulse Width tWP 25 (1) - 25 - ns
ALE Setup Time tALS 0 - 0 - ns
ALE Hold Time tALH 20 - 10 - ns
Data Setup Time tDS 20 - 20 - ns
Data Hold Time tDH 20 - 10 - ns
Write Cycle Time tWC 70 - 50 - ns
WE High Hold Time tWH 20 - 15 - ns
NOTE :
1. If tCS is set less than 10ns, tWP must be minimum 35ns, otherwise, tWP may be minimum 25ns.
AC Characteristics for Operation

K9F2808Q0B K9F2808U0B
Min Max Min Max
Data Transfer from Cell to Register tR - 10 - 10 µs
ALE to RE Delay( ID read ) tAR1 20 - 20 - ns
ALE to RE Delay(Read cycle) tAR2 50 - 50 - ns
CLE to RE Delay tCLR 50 - 50 - ns
Ready to RE Low tRR 20 - 20 - ns
RE Pulse Width tRP 35 - 25 - ns
WE High to Busy tWB - 150 - 100 ns
Read Cycle Time tRC 70 - 50 - ns
CE Access Time tCEA - 60 - 45 ns
RE Access Time tREA - 45 - 35 ns
RE High to Output Hi-Z tRHZ 15 30 15 30 ns
CE High to Output Hi-Z tCHZ - 20 - 20 ns
RE High Hold Time tREH 20 - 15 - ns
Output Hi-Z to RE Low tIR 0 - 0 - ns
WE High to RE Low tWHR 60 - 60 - ns
Device Resetting Time (Read/Program/Erase) tRST - 5/10/500(1) - 5/10/500 (1) µs
Last RE High to Busy
tRB - 100 - 100 ns
(at sequential read)
K9F2808U0B-Y CE High to Ready(in case of inter- tCRY
- 50 +tr(R/B) (3) - 50 +tr(R/B) (3) ns
only ception by CE at read)
CE High Hold Time(at the last
tCEH 100 - 100 - ns
serial read) (2)
NOTE :
1. If reset command(FFh) is written at Ready state, the device goes into Busy for maximum 5us.
2. To break the sequential read cycle, CE must be held high for longer time than tCEH.
3. The time to Ready depends on the value of the pull-up resistor tied R/B pin.
12
NAND Flash Technical Notes
Invalid Block(s)
Invalid blocks are defined as blocks that contain one or more invalid bits whose reliability is not guaranteed by Samsung. The infor-
mation regarding invalid block(s) is so called as the invalid block information. Devices ,regardless of having invalid block(s), have the
same quality level because all valid blocks have same AC and DC characteristics. An invalid block(s) does not affect the perfor-
mance of valid block(s) because it’s bit line and common source line is isolated by a select transistor. The system design must be
able to mask out invalid block(s) via address mapping. The 1st block, which is placed on 00h block address, is fully guaranteed to be
a valid block, does not require Error Correction.
Identifying Invalid Block(s)

All device locations are erased(FFh) except locations where the invalid block(s) information is written prior to shipping. The invalid
block(s) status is defined by the 6th byte in the spare area. Samsung makes sure that either 1st or 2nd page of every invalid block
has non-FFh data at the column address of 517. Since invalid block information is also erasable in most cases, it is impossible to
recover the information once it was erased. Therefore, system must be able to recognize the invalid block(s) based on the original
invalid block information and create invalid block table via the following suggested flow chart(Figure 3). Any intentional erasure of the
original invalid block information is prohibited.
Start
Set Block Address = 0
Increment Block Address
Check "FFh" at the column address 517

No
* of the 1st and 2nd page in the block
Create (or update) Check "FFh" ?
Invalid Block(s) Table
Yes
No
Last Block ?
Yes
End
Figure 3. Flow chart to create invalid block table.
13
NAND Flash Technical Notes (Continued)
Error in write or read operation
Within its life time, the additional invalid blocks may develop with NAND Flash memory. Refer to the qualification report for actual
data. The following possible failure modes should be considered to implement a highly reliable system. In the case of status read fail-
ure after erase or program, block replacement should be done. Because program status fail during a page program does not affect
the data of the other pages in the same block, block replacement can be executed with a page-sized buffer by finding an erased
empty block and reprogramming the current target data and copying the rest of the replaced block. To improve the efficiency of mem-
ory space, we recommend using ECC without any block replacement in read or verification failure due to single bit error case. Th e
said additional block failure rate does not include those reclaimed blocks.
Failure Mode Detection and Countermeasure sequence

Erase Failure Status Read after Erase --> Block Replacement
Write Status Read after Program --> Block Replacement

Program Failure Read back ( Verify after Program) --> Block Replacement
or ECC Correction
Read Single Bit Failure Verify ECC -> ECC Correction
ECC : Error Correcting Code --> Hamming Code etc.

Example) 1bit correction & 2bit detection
Program Flow Chart
If ECC is used, this verification

operation is not needed.
Start
Write 00h
Write 80h
Write Address
Write Address
Write Data Wait for tR Time
Write 10h No
*
Verify Data Program Error
Read Status Register

Yes
Program Completed
I/O 6 = 1 ? No
or R/B = 1 ?
: If program operation results in an error, map out
Yes
* the block including the page in error and copy the
* No
target data to another block.
Program Error I/O 0 = 0 ?
Yes
14
NAND Flash Technical Notes (Continued)
Erase Flow Chart Read Flow Chart
Start Start
Write 60h Write 00h
Write Block Address Write Address
Write D0h Read Data
Read Status Register ECC Generation
I/O 6 = 1 ? No No
Reclaim the Error Verify ECC
or R/B = 1 ?
Yes
Yes
* No Page Read Completed
Erase Error I/O 0 = 0 ?
Yes
Erase Completed
: If erase operation results in an error, map out

* the failing block and replace it with another block.
Block Replacement
Block A
1st
{
∼
(n-1)th 2
nth an error occurs.

(page) Buffer memory of the controller.
Block B
1st
{
∼
1
(n-1)th
nth
(page)
* Step1
When an error happens in the nth page of the Block ’A’ during erase or program operation.
* Step2
Copy the nth page data of the Block ’A’ in the buffer memory to the nth page of another free block. (Block ’B’)
* Step3
Then, copy the data in the 1st ~ (n-1)th page to the same location of the Block ’B’.
* Step4
Do not further erase Block ’A’ by creating an ’invalid Block’ table or other appropriate scheme.
15
Pointer Operation of K9F2808X0B
Samsung NAND Flash has three address pointer commands as a substitute for the two most significant column addresses. ’00h’
command sets the pointer to ’A’ area(0~255byte), ’01h’ command sets the pointer to ’B’ area(256~511byte), and ’50h’ command sets
the pointer to ’C’ area(512~527byte). With these commands, starting column address can be set to somewhere of a whole
page(0~527byte). ’00h’ or ’50h’ is sustained until another address pointer command is entered. But, ’01h’ command is effective only
for one time operation. After any operation of Read, Program, Erase, Reset, Power_Up following ’01h’ command, the address
pointer returns to ’A’ area by itself. To program data starting from ’A’ or ’C’ area, ’00h’ or ’50h’ command must be entered before ’80h’
command is written. A complete read operation prior to ’80h’ command is not necessary. To program data starting from ’B’ area,
’01h’ command must be entered right before ’80h’ command is written.
"A" area "B" area "C" area

(00h plane) (01h plane) (50h plane)
Table 2. Destination of the pointer 256 Byte 256 Byte 16 Byte
Command Pointer position Area

00h 0 ~ 255 byte 1st half array(A)
01h 256 ~ 511 byte 2nd half array(B)
"A" "B" "C"
50h 512 ~ 527 byte spare array(C)
Internal
Page Register
Pointer select
commnad Pointer
(00h, 01h, 50h)
Figure 4. Block Diagram of Pointer Operation
(1) Command input sequence for programming ’A’ area
The address pointer is set to ’A’ area(0~255), and sustained
Address / Data input Address / Data input
00h 80h 10h 00h 80h 10h
’A’,’B’,’C’ area can be programmed. ’00h’ command can be omitted.

It depends on how many data are inputted.
(2) Command input sequence for programming ’B’ area
The address pointer is set to ’B’ area(256~512), and will be reset to

’A’ area after every program operation is executed.
01h 80h 10h 01h 80h 10h
’B’, ’C’ area can be programmed. ’01h’ command must be rewritten before
It depends on how many data are inputted. every program operation
(3) Command input sequence for programming ’C’ area
The address pointer is set to ’C’ area(512~527), and sustained
50h 80h 10h 50h 80h 10h
Only ’C’ area can be programmed. ’50h’ command can be omitted.
16
System Interface Using CE don’t-care.
For an easier system interface, CE may be inactive during data-loading or sequential data-reading as shown below. The internal
528byte page registers are utilized as seperate buffers for this operation and the system design gets more flexible. In addition, for
voice or audio applications which use slow cycle time on the order of u-seconds, de-activating CE during the data-loading and read-
ing would provide significant saving in power consumption.
Figure 5. Program Operation with CE don’t-care.
CLE
CE don’t-care
CE
≈
WE
ALE
80h Start Add.(3Cycle) Data Input Data Input 10h

I/O0~7
t CS tCH tCEA
CE CE
tREA
tWP RE
WE
I/O0~7 out
Figure 6. Read Operation with CE don’t-care.
On K9F2808U0B_Y or K9F2808U0B_V
CLE CE must be held
low during tR
CE don’t-care
CE
≈
RE
ALE
R/B tR
WE
00h Start Add.(3Cycle) Data Output(sequential)

I/O0~7
17
* Command Latch Cycle
CLE
tCLS tCLH
tCS t CH
CE
tWP
WE
tALS t ALH
ALE
t DS t DH
I/O0 ~7 Command
* Address Latch Cycle
tCLS
CLE
t CS t WC tWC
CE
tWP t WP tWP
WE
tWH t WH
tALH tALS tALH tALS
tALS tALH
ALE
tDH t DH tDH
t DS tDS tDS
I/O 0~7 A0~A7 A9~A16 A17~A23
18
* Input Data Latch Cycle
t CLH
CLE
tCH
CE
t ALS tWC
ALE
≈
tWP tWP tWP
WE
tWH
t DH tDH tDH
tDS t DS t DS
≈ ≈
I/O 0~7 DIN 0 DIN 1 DIN 511
* Serial Access Cycle after Read(CLE=L, WE=H, ALE=L)
CE t RC
≈
tCHZ
tREH
t REA tREA t REA tOH
≈
tRP
RE
t RHZ t RHZ
t OH
≈
I/O0~7 Dout Dout Dout
tRR
≈
R/B
NOTES : Transition is measured ±200mV from steady state voltage with load.
This parameter is sampled and not 100% tested.
19
* Status Read Cycle
tCLR
CLE
tCLS
tCLH
tCS
CE
tCH
t WP
WE
tCEA tCHZ
t OH
tWHR
RE
t DH tREA tRHZ
tDS tIR tOH
I/O0 ~7 70h Status Output
READ1 OPERATION(READ ONE PAGE)
CLE
On K9F2808U0B_Y or K9F2808U0B_V 1)
CE must be held tCEH
low during tR
CE
t CHZ
tWC t OH
WE
t WB
t CRY
tAR2
ALE
tRHZ
tR tRC tOH
RE
≈
tRR
≈ ≈
I/O 0~7 00h or 01h A0 ~ A7 A9 ~ A1 6 A17 ~ A2 4 Dout N Dout N+1 Dout N+2 Dout N+3 Dout 527
Column Page(Row) tRB

Address Address
R/B Busy
1)
NOTE : 1) is only valid on K9F2808U0B_Y or K9F2808U0B_V
20
READ2 OPERATION (READ ONE PAGE)
CLE
CE must be held
low during tR
CE
WE
tR
t WB
t AR2
ALE
t RR
≈
RE
Dout Dout
≈
I/O0 ~7 50h A 0 ~ A7 A 9 ~ A1 6 A17 ~ A23
511+M 511+M+1 Dout 527
R/B Selected
M Address Row
A0 ~A 3 : Valid Address
A4 ~A 7 : Don′t care
512 16
Start
address M
PAGE PROGRAM OPERATION
CLE
CE
t WC tWC tWC
WE
tWB tPROG
ALE
RE
≈≈
Din Din Din

I/O0 ~7 80h A0 ~ A7 A 9 ~ A1 6 A17 ~ A2 3 10h 70h I/O0
N N+1 527
Sequential Data Column 1 up to 528 Byte Data Program Read Status
Input Command Address Page(Row) Command
Address Serial Input Command
R/B
≈
I/O0 =0 Successful Program

I/O0 =1 Error in Program
21
BLOCK ERASE OPERATION (ERASE ONE BLOCK)
CLE
CE
tWC
WE
t WB tBERS
ALE
RE
I/O0 ~7 60h A9 ~ A 16 A1 7 ~ A2 3 DOh 70h I/O 0
Page(Row)
Address
R/B Busy
≈
Auto Block Erase I/O 0=0 Successful Erase

Setup Command Erase Command Read Status I/O 0=1 Error in Erase
Command
MANUFACTURE & DEVICE ID READ OPERATION
t CLR
CLE
CE
WE
ALE
t AR1
RE
tREA
Device
I/O 0 ~ 7 90h 00h ECh
Code*
Read ID Command Address. 1cycle Maker Code Device Code
Device Device Code*

K9F2808Q0B 33h
K9F2808U0B 73h
22
DEVICE OPERATION
PAGE READ
Upon initial device power up, the device status is initially Read1 command(00h) latched. This operation is also initiated by writing
00h to the command register along with three address cycles. Once the command is latched, it does not need to be written for the fol-
lowing page read operation. Two types of operation are available : random read, serial page read. The random read mode is enabled
when the page address is changed. The 528 bytes of data within the selected page are transferred to the data registers in less than
10µ s(tR). The system controller can detect the completion of this data transfer(tR) by analyzing the output of R/B pin. Once the data
in a page is loaded into the registers, they may be read out by sequential RE pulse of 70ns/50n(K9F2808Q0B:70ns,
K9F2808U0B:50ns) period cycle. High to low transitions of the RE clock take out the data from the selected column address up to
the last column address.
Read1 and Read2 commands determine pointer which selects either main area or spare area. The spare area(512 to 527 bytes)
may be selectively accessed by writing the Read2 command. Addresses A0 to A3 set the starting address of spare area while
addresses A4 to A7 are ignored. To move the pointer back to the main area, Read1 command(00h/01h) is needed. Figures 7
through 8 show typical sequence and timing for each read operation.
Figure 7,8 details the sequence.
Sequential Row Read is available only on K9F2808U0B_Y or K9F2808U0B_V :

After the data of last column address is clocked out, the next page is automatically selected for sequential row read. Waiting 10µ s
again allows reading the selected page. The sequential row read operation is terminated by bringing CE high. Unless the operation
is aborted, the page address is automatically incremented for sequential row read as in Read1 operation and spare sixteen bytes of
each page may be sequentially read. The Sequential Read 1 and 2 operation is allowed only within a block and after the last page
of a block is readout, the sequential read operation must be terminated by bringing CE high. When the page address moves onto the
next block, read command and address must be given. Figures 7-1, 8-1 show typical sequence and timings for sequential row read
operation.
Figure 7. Read1 Operation
CLE
CE must be held
CE low during tR
WE
ALE
tR
R/B
RE
00h Start Add.(3Cycle) Data Output(Sequential)

I/O 0~7
A 0 ~ A7 & A9 ~ A23
(00h Command) (01h Command)*
1st half array 2st half array 1st half array 2st half array
Data Field Spare Field Data Field Spare Field
* After data access on 2nd half array by 01h command, the start pointer is automatically moved to 1st half array (00h) at next cycle.
23
Figure 8. Read2 Operation
CLE
CE must be held
CE low during tR
WE
ALE
R/B tR
RE
I/O0~7 50h Start Add.(3Cycle) Data Output(Sequential)
A0 ~ A 3 & A9 ~ A 2 3 Spare Field

( A4 ~ A7 :
Don′t Care)
1st half array 2nd half array
Data Field Spare Field
Figure 7-1. Sequential Row Read1 Operation (only for K9F2808U0B-Y and K9F2808U0B-V, valid within a block)
≈
tR tR tR
R/B
I/O0 ~ 7 00h Start Add.(3Cycle) Data Output Data Output Data Output
1st 2nd Nth

01h A0 ~ A 7 & A9 ~ A 2 4 (528 Byte) (528 Byte)
(GND input=L, 00h Command) (GND input =L, 01h Command) (GND input=H, 00h Command)
1st half array 2nd half array 1st half array 2nd half array 1st half array 2nd half array
1st 1st 1st

Block 2nd 2nd 2nd
Nth Nth Nth
Data Field Spare Field Data Field Spare Field Data Field Spare Field
24
Figure 8-1. Sequential Row Read2 Operation (GND Input=Fixed Low)

(only for K9F2808U0B-Y and K9F2808U0B-V, valid within a block)
≈
tR tR tR
R/B
I/O0~7 50h Start Add.(3Cycle) Data Output Data Output Data Output
1st 2nd Nth

A0 ~ A 3 & A9 ~ A 2 4 (16Byte) (16Byte)
(A 4 ~ A7 :
Don ′t Care)
1st
Block
Nth
Data Field Spare Field
PAGE PROGRAM
The device is programmed basically on a page basis, but it allows multiple partial page program of one byte or consecutive bytes up
to 528, in a single page program cycle. The number of consecutive partial page program operation within the same page without
intervening erase operation should not exceed 2 for main array and 3 for spare array. The addressing may be done in any random
order in a block. Page program cycle consists of a serial data loading(up to 528 bytes of data) into the page register, and prog ram of
loaded data into the appropriate cell. Serial data loading can start in 2nd half array by moving pointer. About the pointer operation,
please refer to the attached technical notes. Serial data loading is executed by entering the Serial Data Input command(80h) and
three cycle address input and then serial data loading. The bytes except those to be programmed need not to be loaded. The Page
Program confirm command(10h) initiates the programming process. Writing 10h alone without previously entering 80h will not initi ate
program process. The internal write controller automatically executes the algorithms and timings necessary for program and verif ica-
tion, thereby freeing the CPU for other tasks. Once the program process starts, the Read Status Register command may be entered,
with RE and CE low, to read the status register. The CPU can detect the completion of a program cycle by monitoring the R/B out-
put, or the Status bit(I/O 6) of the Status Register. Only the Read Status command and Reset command are valid while programming
is in progress. When the Page Program is completed, the Write Status Bit(I/O 0) may be checked(Figure 9). The internal write verifi-
cation detects only errors for "1"s that are not successfully programmed to "0"s. The command register remains in Read Status com-
mand mode until another valid command is written to the command register.
Figure 9 details the sequence.
Figure 9. Program & Read Status Operation
t PROG
R/B
I/O 0~7 80h Address & Data Input 10h 70h I/O0 Pass
A0 ~ A7 & A 9 ~ A2 3
528 Byte Data Fail
25
BLOCK ERASE
The Erase operation is done on a block(16K Bytes) basis. Block Erase is executed by entering Erase Setup command(60h) and 2
cycle block addresses and Erase Confirm command(D0h). Only address A14 to A23 is valid while A9 to A13 is ignored. This two-
step sequence of setup followed by execution command ensures that memory contents are not accidentally erased due to external
noise condition. At the rising edge of WE after erase confirm command input, internal write controller handles erase and erase-veri-
fication. When the erase operation is completed, the Write Status Bit(I/O 0) may be checked.
Figure 10 details the sequence.
Figure 10. Block Erase Operation
tBERS
R/B
I/O0~7 60h Address Input(2Cycle) D0h 70h I/O0 Pass
Block Add. : A 9 ~ A2 3
Fail
READ STATUS
The device contains a Status Register which may be read to find out whether program or erase operation is completed, and whether
the program or erase operation is completed successfully. After writing 70h command to command register, a read cycle takes out
the content of the Status Register to the I/O pins on the falling edge of CE or RE. This two line control allows the system to poll the
progress of each device in multiple memory connections even when R/B pins are common-wired. RE or CE does not need to be tog-
gled for updated status. Refer to table 3 for specific Status Register definitions. The command register remains in Status Read mode
until further commands are issued to it. Therefore, if the status register is read during a random read cycle, a read command(00 h or
50h) should be given before sequential page read cycle.
Table3. Read Status Register Definition
I/O # Status Definition

"0" : Successful Program / Erase
I/O 0 Program / Erase
"1" : Error in Program / Erase
I/O 1 "0"
I/O 2 "0"
Reserved for Future
I/O 3 Use "0"
I/O 4 "0"
I/O 5 "0"
I/O 6 Device Operation "0" : Busy "1" : Ready
I/O 7 Write Protect "0" : Protected "1" : Not Protected
26
READ ID
The device contains a product identification mode, initiated by writing 90h to the command register, followed by an address input of
00h. Two read cycles sequentially output the manufacture code(ECh), and the device code (73h) respectively. The command register
remains in Read ID mode until further commands are issued to it.
Figure 11 shows the operation sequence.
Figure 11. Read ID Operation
t CLR
CLE
t CEA
CE
WE
tAR1
ALE
t WHR
RE
tREA Device
I/O 0~7 90h 00h ECh Code*
Address. 1cycle Maker code Device code
Device Device Code*

K9F2808Q0B 33h
K9F2808U0B 73h
RESET
The device offers a reset feature, executed by writing FFh to the command register. When the device is in Busy state during random
read, program or erase mode, the reset operation will abort these operations. The contents of memory cells being altered are no
longer valid, as the data will be partially programmed or erased. The command register is cleared to wait for the next command, and
the Status Register is cleared to value C0h when W P is high. Refer to table 4 for device status after reset operation. If the device is
already in reset state, new reset command will not be accepted by the command register. The R/B pin transitions to low for tRST
after the Reset command is written. Reset command is not necessary for normal operation. Refer to Figure 12 below.
Figure 12. RESET Operation
tRST
R/B
I/O 0~7 FFh
Table4. Device Status
After Power-up After Reset

Operation Mode Read 1 Waiting for next command
27
READY/BUSY
The device has a R/ B output that provides a hardware method of indicating the completion of a page program, erase and random
read completion. The R/B pin is normally high but transitions to low after program or erase command is written to the command reg-
ister or random read is started after address loading. It returns to high when the internal controller has finished the operatio n. The pin
is an open-drain driver thereby allowing two or more R/B outputs to be Or-tied. Because pull-up resistor value is related to tr(R/ B) and
current drain during busy(ibusy) , an appropriate value can be obtained with the following reference chart(Fig 13). Its value c an be
determined by the following guidance.
Rp
ibusy
V CC
1.8V device - VOL : 0.1V, V OH : VCCq-0.1V
3.3V device - VOL : 0.4V, V OH : 2.4V
Ready Vcc
R/B
open drain output VOH
CL
VOL
Busy
tf tr
GND
Device
Fig 13 Rp vs tr ,tf & Rp vs ibusy

@ Vcc = 1.8V, Ta = 25°C , CL = 30pF @ Vcc = 3.3V, Ta = 25°C , CL = 100pF
2.4 400
Ibusy Ibusy
300n 3m 300n 3m
tr,tf [s]
tr ,tf [s]
Ibusy [A]
300
Ib usy [A]
1.2
200n 1.7 2m 200n 200 2m

0.8
0.85 120
tr 90 tr
30 60 100
100n 1m 100n 0.6 1m
0.57
0.43
3.6 tf 3.6 3.6 3.6
1.7 tf 1.7 1.7
1.7
1K 2K 3K 4K 1K 2K 3K 4K
Rp(ohm) Rp(ohm)
Rp value guidance
V CC(Max.) - V OL (Max.) 1.85V

Rp(min, 1.8V part) = =
IOL + Σ IL 3mA + ΣIL
V CC(Max.) - V OL(Max.) 3.2V

Rp(min, 3.3V part) = =
IOL + Σ IL 8mA + ΣIL
where IL is the sum of the input currents of all devices tied to the R/B pin.
Rp(max) is determined by maximum permissible limit of tr
28
Data Protection & Powerup sequence
The device is designed to offer protection from any involuntary program/erase during power-transitions. An internal voltage detector
disables all functions whenever Vcc is below about 1.1V/2V(K9F2808Q0B:1.1V, K9F2808U0B:2V). WP pin provides hardware pro-
tection and is recommended to be kept at VIL during power-up and power-down and recovery time of minimum 1µs is required
before internal circuit gets ready for any command sequences as shown in Figure 14. The two step command sequence for program/
erase provides additional software protection.
Figure 14. AC Waveforms for Power Transition
≈
K9F2808Q0B : ~ 1.5V K9F2808Q0B : ~ 1.5V
K9F2808U0B : ~ 2.5V K9F2808U0B : ~ 2.5V
VCC
High ≈
WP
≈
WE
10µs
≈
29

Samsung 16M X 8 Bit NAND Flash Memory Datasheet

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K9F2808Q0B-DCB0,DIB0 K9F2808U0B-YCB0,YIB0

K9F2808U0B-VCB0,VIB0 K9F2808U0B-DCB0,DIB0 FLASH MEMORY

0.1 K9F2808U0B(3.3V device)’s qualification is finished Jun. 30th 2001

0.2 K9F2808Q0B (1.8V device)

0.3 1. Device Code is changed

-min. Value: 7mA -->3mA

-typ. Value: 8mA -->4mA

tRP(min.) : 30ns --> 25ns

0.5 1. Parameters are changed in 1.8V part(K9F2808Q0B) . Feb 15th 2002

- tCH is changed from 15ns to 20ns

- tCLH is changed from 15ns to 20ns

- tALH is changed from 15ns to 20ns

- tDH is changed from 15ns to 20ns

0.6 1. Parameters are changed in 1.8V part(K9F2808Q0B) . May 3rd 2002

- tRP is changed from 25ns to 35ns

- tWB is changed from 100ns to 150ns

- tREA is changed from 40ns to 45ns

16M x 8 Bit Bit NAND Flash Memory

Part Number Vcc Range Organization PKG Type

PIN CONFIGURATION (TSOP1)

48 - TSOP1 - 1220F Unit :mm/Inch

1.00± 0.05 0.05

18.40± 0.10 0.047 MAX

DNU DNU DNU DNU

DNU DNU DNU

NC I/O1 NC VccQ I/O5 I/O7

Vss I/O2 I/O3 I/O4 I/O6 Vss

DNU DNU DNU DNU

DNU DNU DNU DNU

Top View Bottom View

9.00 ±0.10 0.80 B

PIN CONFIGURATION (WSOP1)

48 - WSOP1 - 1217F Unit :mm

15.40± 0.10 0.58± 0.04

COMMAND LATCH ENABLE

ADDRESS LATCH ENABLE

OUTPUT BUFFER POWER

GND INPUT FOR ENABLING SPARE AREA

Figure 1. FUNCTIONAL BLOCK DIAGRAM

Page Register & S/A

Figure 2. ARRAY ORGANIZATION

1 Block =32 Pages

1 Page = 528 Byte

I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7

Table 1. COMMAND SETS

ABSOLUTE MAXIMUM RATINGS

Temperature K9F2808X0B-YCB0,DCB0 -10 to + 125

RECOMMENDED OPERATING CONDITIONS

DC AND OPERATING CHARACTERISTICS (Recommended operating conditions otherwise noted.)

CAPACITANCE( TA=25°C, VCC =1.8V/3.3V, f=1.0MHz)

NOTE : Capacitance is periodically sampled and not 100% tested.

Number of Partial Program Cycles Main Array - - 2 cycles

AC Characteristics for Operation

Identifying Invalid Block(s)

Set Block Address = 0

Increment Block Address

Check "FFh" at the column address 517

Figure 3. Flow chart to create invalid block table.

Failure Mode Detection and Countermeasure sequence