Lm7121 235-Mhz Tiny Low Power Voltage Feedback Amplifier: 1 Features 3 Description
Lm7121 235-Mhz Tiny Low Power Voltage Feedback Amplifier: 1 Features 3 Description
Lm7121 235-Mhz Tiny Low Power Voltage Feedback Amplifier: 1 Features 3 Description
LM7121
SNOS750A – AUGUST 1999 – REVISED OCTOBER 2014
Typical Circuit for AV = +1 Operation Unity Gain Frequency vs. Supply Voltage
(VS= 6 V)
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM7121
SNOS750A – AUGUST 1999 – REVISED OCTOBER 2014 www.ti.com
Table of Contents
1 Features .................................................................. 1 6.8 ±5V AC Electrical Characteristics ............................. 7
2 Applications ........................................................... 1 6.9 +5V DC Electrical Characteristics ............................. 8
3 Description ............................................................. 1 6.10 +5V AC Electrical Characteristics ........................... 8
6.11 Typical Characteristics ............................................ 9
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3 7 Application and Implementation ........................ 21
7.1 Application Information............................................ 21
6 Specifications......................................................... 4
7.2 Typical Applications ................................................ 22
6.1 Absolute Maximum Ratings ...................................... 4
6.2 Handling Ratings....................................................... 4 8 Device and Documentation Support.................. 26
8.1 Trademarks ............................................................. 26
6.3 Recommended Operating Conditions....................... 4
8.2 Electrostatic Discharge Caution .............................. 26
6.4 Thermal Information .................................................. 4
8.3 Glossary .................................................................. 26
6.5 ±15V DC Electrical Characteristics ........................... 5
6.6 ±15V AC Electrical Characteristics ........................... 6 9 Mechanical, Packaging, and Orderable
6.7 ±5V DC Electrical Characteristics ............................. 6
Information ........................................................... 26
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
• Added, updated, or renamed the following sections: Device Information Table, Pin Configuration and Functions,
Application and Implementation; Power Supply Recommendations ; Layout; Device and Documentation Support;
Mechanical, Packaging, and Ordering Information................................................................................................................. 1
• Deleted TJ = 25°C from Electrical Characteristics tables ....................................................................................................... 5
Pin Functions
PIN
NUMBER I/O DESCRIPTION
NAME
DBV D0008A
-IN 4 2 I Inverting input
+IN 3 3 I Non-inverting input
N/C –– 5, 8 –– No connection
OUTPUT 1 6 O Output
V- 2 4 I Negative supply
V+ 5 7 I Positive supply
6 Specifications
6.1 Absolute Maximum Ratings (1)
(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
(2)
Differential Input Voltage ±2 V
Voltage at Input/Output Pins (V+)−1.4, V
(V−)+1.4
Supply Voltage (V+–V−) 36 V
(3)
Output Short Circuit to Ground Continuous
Lead Temperature (soldering, 10 sec) 260 °C
Junction Temperature (4) 150 ˚C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
(3) The maximum power dissipation is a function of TJ(max), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(max)–TA)/RθJA. All numbers apply for packages soldered directly into a PC board.
(4) Typical Values represent the most likely parametric norm.
(1) JEDEC document JEP155 states that 2000-V HBM allows safe manufacturing with a standard ESD control process. Human body
model, 1.5 k in series with 100 pF.
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Figure 3. Input Offset Voltage vs. Temperature Figure 4. Input Bias Current vs Temperature
Figure 5. Input Offset Voltage vs. Common Mode Voltage Figure 6. Input Offset Voltage vs. Common Mode Voltage
at VS = ±15 V at VS = ±5 V
Figure 7. Short Circuit Current vs. Temperature (Sourcing) Figure 8. Short Circuit Current vs Temperature (Sinking)
Figure 9. Output Voltage vs Output Current Figure 10. Output Voltage vs Output Current
(ISINK, VS = ±15 V) (ISOURCE, VS = ±15 V)
Figure 11. Output Voltage vs Output Current Figure 12. Output Voltage vs Output Current
(ISOURCE, VS = ±5 V) (ISINK, VS = ±5 V)
Figure 13. Output Voltage vs. Output Current Figure 14. Output Voltage vs Output Current
(ISOURCE, VS = +5 V) (ISINK, VS = +5 V)
Figure 15. CMRR vs. Frequency Figure 16. PSRR vs. Frequency
Figure 19. Open Loop Frequency Response Figure 20. Open Loop Frequency Response
Figure 21. Unity Gain Frequency vs. Supply Voltage Figure 22. GBWP at 10 MHz vs. Supply Voltage
Figure 23. Large Signal Voltage Gain vs. Load, VS = ±15 V Figure 24. Large Signal Voltage Gain vs. Load, VS = ±5 V
Figure 25. Input Voltage Noise vs. Frequency Figure 26. Input Current Noise vs. Frequency
Figure 27. Input Voltage Noise vs. Frequency Figure 28. Input Current Noise vs. Frequency
Figure 29. Slew Rate vs. Supply Voltage Figure 30. Slew Rate vs. Input Voltage
Figure 31. Slew Rate vs. Input Voltage Figure 32. Slew Rate vs. Load Capacitance
Figure 33. Large Signal Pulse Response, Figure 34. Large Signal Pulse Response,
AV = -1 VS = ±15 V AV = -1, VS = ±5V
Figure 35. Large Signal Pulse Response, Figure 36. Large Signal Pulse Response,
AV = -1, VS = +5 V AV = +1, VS = ±15 V
Figure 41. Large Signal Pulse Response, Figure 42. Small Signal Pulse Response,
AV = +2, VS = +5 V AV = -1, VS = ±15 V, RL = 100 Ω
Figure 43. Small Signal Pulse Response, Figure 44. Small Signal Pulse Response,
AV = - 1, VS = ±5 V, RL= 100 Ω AV = -1, VS = +5 V, RL = 100 Ω
Figure 45. Small Signal Pulse Response, Figure 46. Small Signal Pulse Response,
A V = +1, VS = ±15 V, RL = 100 Ω A V = +1, V S = ±5 V, RL = 100 Ω
Figure 47. Small Signal Pulse Response, Figure 48. Small Signal Pulse Response,
AV = +1, VS = +5 V, RL = 100 Ω AV = +2, VS = ±15 V, RL = 100 Ω
Figure 49. Small Signal Pulse Response, Figure 50. Small Signal Pulse Response,
AV = +2, VS = ±5 V, RL = 100 Ω AV = +2, VS = +5 V, RL = 100 Ω
Figure 51. Closed Loop Frequency Response vs. Figure 52. Closed Loop Frequency Response
Temperature, vs. Temperature
VS = ±15 V, AV = +1, RL = 100 Ω VS = ±5 V, AV = +1, RL = 100 Ω
Figure 53. Closed Loop Frequency Response Figure 54. Closed Loop Frequency Response
vs. Temperature, vs. Temperature,
VS = +5 V, AV = +1, RL= 100 Ω VS = ±15 V, AV = +2, RL= 100 Ω
Figure 55. Closed Loop Frequncy Response Figure 56. Closed Loop Frequency Response
vs. Temperature, vs. Temperature,
VS = ±5 V, AV = +2 , RL = 100 Ω VS = +5 V, AV = +2, RL = 100 Ω
Figure 57. Closed Loop Frequency Response Figure 58. Closed Loop Frequency Response
vs. Capacitance Load vs. Capacitive Load
(AV = +1, VS = ±15 V) (AV = +1, VS = ±5 V)
Figure 59. Closed Loop Frequency Response Figure 60. Closed Loop Frequency Response
vs. Capacitive Load vs. Capacitive Load
(AV = +2, VS = ±15 V) (AV = +2, VS = ±5 V)
Figure 61. Total Harmonic Distortion vs. Frequency Figure 62. Total Harmonic Distortion vs. Frequency
Figure 63. Total Harmonic Distortion vs. Frequency Figure 64. Total Harmonic Distortion vs. Frequency
Figure 65. Undistorted Output Swing vs. Frequency Figure 66. Undistorted Output Swing vs. Frequency
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
Stable unity gain operation is possible with supply voltage of 5 V for all capacitive loads. This allows the
possibility of using the device in portable applications with low supply voltages with minimum components around
it.
Above a supply voltage of 6 V (±3 V Dual supplies), an additional resistor and capacitor (shown in Figure 69)
should be placed in the feedback path to achieve stability at unity gain over the full temperature range.
The package power dissipation should be taken into account when operating at high ambient temperatures
and/or high power dissipative conditions. Refer to the power derating curves in the data sheet for each type of
package.
In determining maximum operable temperature of the device, make sure the total power dissipation of the device
is considered; this includes the power dissipated in the device with a load connected to the output as well as the
nominal dissipation of the op amp.
The device is capable of tolerating momentary short circuits from its output to ground but prolonged operation in
this mode will damage the device, if the maximum allowed junction temperation is exceeded.
Figure 70. Simple Circuit to Improve Linearity and Output Drive Current
Figure 71. AV = -1
CC = 2 pF for RL = 100 Ω
CC = Open for RL = Open
Figure 72. AV = +2
Figure 74. AV = +1
CAUTION
If RL is removed, the current balance at the output of LM7121 would be disturbed and
it would have to supply the full amount of load current. This might damage the part if
power dissipation limit is exceeded.
8.3 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 1-Oct-2014
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 1-Oct-2014
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
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continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
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