Features General Description: Three-Zone Thermal Supervisor

MIC384 Micrel
MIC384
Three-Zone Thermal Supervisor
General Description Features

The MIC384 is a versatile digital thermal supervisor capable • Measures Local and Two Remote Temperatures
of measuring temperature using its own internal sensor and • 2-Wire SMBus-compatible Interface
two inexpensive external sensors or embedded silicon diodes • Programmable Thermostat Settings for All Three Zones
such as those found in the Intel Pentium III* CPU. A 2-wire • Open-Drain Interrupt Output Pin
serial interface is provided to allow communication with either • Interrupt Mask and Status Bits
I2C** or SMBus* masters. The open-drain interrupt output • Fault Queues to Prevent Nuisance Tripping
pin can be used as either an over-temperature alarm or a • Low Power Shutdown Mode
thermostatic control signal. • Failsafe response to diode faults
Interrupt mask and status bits are provided for reduced soft- • 2.7V to 5.5V Power Supply Range
ware overhead. Fault queues prevent nuisance tripping due • 8-Lead SOIC and MSOP Packages
to thermal or electrical noise. A programmable address pin Applications
permits two devices to share the bus. (Alternate base ad-
• Desktop, Server and Notebook Computers
dresses available – contact Micrel.) Superior performance,
• Power Supplies
low power and small size makes the MIC384 an excellent
• Test and Measurement Equipment
choice for multiple zone thermal management applications.
• Wireless Systems
*SMBus and Pentium III are trademarks of Intel Corporation. • Networking/Datacom Hardware
**I2C is a trademark of Philips Electronics, N.V.
Ordering Information
Part Number Base Address (*) Junction Temp. Range Package Availability
Standard Pb-Free
MIC384-0BM MIC384-0YM 100 100x -55°C to +125°C 8-Lead SOIC
MIC384-1BM MIC384-1YM 100 101x -55°C to +125°C 8-Lead SOIC Contact Factory
MIC384-0BMM MIC384-0YMM 100 100x -55°C to +125°C 8-Lead MSOP
MIC384-1BMM MIC384-1YMM 100 101x -55°C to +125°C 8-Lead MSOP Contact Factory
* The least-significant bit of the slave address is determined by the state of the A0 pin.
Typical Application
3.3V
0.1µF
3 × 10k
pull-ups
MIC384
DATA VDD
FROM
SERIAL BUS CLK T1 REMOTE
HOST DIODE
/INT T2 2200pF
GND A0
REMOTE
DIODE
2200pF
3-Channel SMBus Temperature Measurement System
Micrel, Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel + 1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com
September 2005 1 MIC384

MIC384 Micrel
Pin Configuration
DATA 1 8 VDD
CLK 2 7 A0
/INT 3 6 T1
GND 4 5 T2
Pin Description
Pin Number Pin Name Pin Function
1 DATA Digital I/O: Open-drain. Serial data input/output.
2 CLK Digital Input: The host provides the serial bit clock on this input.
3 /INT Digital Output: Open-drain. Interrupt or thermostat output.
4 GND Ground: Power and signal return for all IC functions.
5 T2 Analog Input: Connection to remote temperature sensor (diode junc-
tion)
6 T1 Analog Input: Connection to remote temperature sensor (diode junc-
tion)
7 A0 Digital Input: Slave address selection input. See Table 1. MIC384 Slave
Address Settings.
8 VDD Analog Input: Power supply input to the IC.
MIC384 2 September 2005

MIC384 Micrel
Absolute Maximum Ratings (Note 1) Operating Ratings (Note 2)

Power Supply Voltage, VDD .......................................... 6.0V Power Supply Voltage, VDD ......................... +2.7V to +5.5V
Voltage on Any Pin ................................ –0.3V to VDD+0.3V Ambient Temperature Range (TA) ............. -55°C to +125°C
Current Into Any Pin ................................................. ±10mA Package Thermal Resistance (θJA)
Power Dissipation, TA = +125°C ................................ 30mW SOP ................................................................. +152°C/W
Junction Temperature .............................................. +150°C MSOP .............................................................. +206°C/W
Storage Temperature ................................ –65°C to +150°C
ESD Ratings (Note 3)
Human Body Model ...................................................TBD V
Machine Model ..........................................................TBD V
Soldering
Vapor Phase (60 sec.) .............................. +220°C +5⁄–0°C
Infrared (15 sec.) ...................................... +235°C +5⁄–0°C
Electrical Characteristics
2.7V ≤ VDD ≤ 5.5; TA = +25°C, bold values indicate –55°C ≤ TA ≤ +125°C, Note 4; unless noted.
Symbol Parameter Condition Min Typ Max Units
Power Supply
IDD Supply Current /INT, open, A0 = VDD or GND, 350 750 µA
CLK = DATA = high, normal mode
/INT, open, A0 = VDD or GND, 3 µA
shutdown mode, CLK = 100kHz
/INT, open, A0 = VDD or GND, 1 10 µA
shutdown mode, CLK = DATA = high
tPOR Power-On Reset Time; Note 7 VDD > VPOR 200 µs
VPOR Power-On Reset Voltage all registers reset to default values, 2.0 2.7 V
A/D conversions initiated
VHYST Power-On Reset
Hysteresis Voltage 250 mV
Temperature-to-Digital Converter Characteristics
Accuracy—Local Temperature 0°C ≤ TA ≤ +100°C, /INT open, ±1 ±2 °C
Note 4, 9 3V ≤ VDD ≤ 3.6V
–55°C ≤ TA ≤ +125°C, /INT open, ±2 ±3 °C
3V ≤ VDD ≤ 3.6V
Accuracy—Remote Temperature 0°C ≤ TD ≤ +100°C, /INT open, ±1 ±3 °C
Note 5, 4, 9 3V ≤ VDD ≤ 3.6V, 0°C ≤ TA ≤ +85°C
–55°C ≤ TD ≤ +125°C, /INT open, ±2 ±5 °C
3V ≤ VDD ≤ 3.6V, 0°C ≤ TA ≤ +85°C
tCONV0 Conversion Time, local zone 50 80 ms
Note 7, 8
tCONV1 Conversion Time, remote zone
Note 7, 8 100 160 ms
Remote Temperature Inputs (T1, T2)
IF Current to External Diode high level, T1 or T2 forced to 1.5V 224 400 µA
Note 7 low level 7.5 14 µA
Address Input (A0)
VIL Low Input Voltage 2.7V ≤ VDD ≤ 5.5V 0.6 V
VIH High Input Voltage 2.7V ≤ VDD ≤ 5.5V 2.0 V
CIN Input Capacitance 10 pF
ILEAK Input Current ±0.01 ±1 µA

MIC384 Micrel
Symbol Parameter Condition Min Typ Max Units
Serial Data I/O Pin (DATA)
VOL Low Output Voltage IOL = 3mA 0.4 V
Note 6 IOL = 6mA 0.8 V
VIL Low Input Voltage 2.7V ≤ VDD ≤ 5.5V 0.3VDD V
VIH High Input Voltage 2.7V ≤ VDD ≤ 5.5V 0.7VDD V
ILEAK Input current ±0.01 ±1 µA
Serial Clock Input (CLK)
VIL Low Input Voltage 2.7V ≤ VDD ≤ 5.5V 0.3VDD V
VIH High Input Voltage 2.7V ≤ VDD ≤ 5.5V 0.7VDD V
ILEAK Input current ±0.01 ±1 µA
Status Output (/INT)
VOL Low Output Voltage, IOL = 3mA 0.4 V
Note 6 IOL = 6mA 0.8 V
tINT Interrupt Propagation Delay, from TEMPx > T_SETx or TEMPx < T_HYSTx tCONV+1 µs
Note 7, 8 to /INT < VOL, FQ = 00, RPULLUP = 10kΩ
tnINT Interrupt Reset Propagation Delay, from any register read to /INT > VOH, 1 µs
Note 7 RPULLUP = 10kΩ
T_SET0 Default T_SET0 Value tPOR after VDD > VPOR 81 81 81 °C
T_HYST0 Default T_HYST0 Value tPOR after VDD > VPOR 76 76 76 °C
Serial Interface Timing (Note 7)
t1 CLK (Clock) Period 2.5 µs
t2 Data In Setup Time to CLK High 100 ns
t3 Data Out Stable After CLK Low 0 ns
t4 DATA Low Setup Time to CLK Low start condition 100 ns
t5 DATA High Hold Time stop condition 100 ns
After CLK High
Note 1. Exceeding the absolute maximum rating may damage the device.
Note 2. The device is not guaranteed to function outside its operating rating.
Note 3. Devices are ESD sensitive. Handling precautions recommended.
Human body model: 1.5k in series with 100pF. Machine model: 200pF, no series resistance.
Note 4. Final test on outgoing product is performed at TA = TBD°C.
Note 5. TD is the temperature of the remote diode junction. Testing is performed using a single unit of one of the transistors listed in Table 6.
Note 6. Current into this pin will result in self-heating of the MIC384. Sink current should be minimized for best accuracy.
Note 7. Guaranteed by design over the operating temperature range. Not 100% production tested.
Note 8. tCONV = tCONV0 +(2 X tCONV1). tCONV0 is the conversion time for the local zone; tCONV1 is the conversion time for the remote zones.`
Note 9. Accuracy specification does not include quantization noise, which may be as great as ±1⁄ 2LSB (±0.5°C).

MIC384 Micrel
Timing Diagram
t1
SCL
t4 t2 t5
SDA Data In
t3
SDA Data Out
Serial Interface Timing

MIC384 Micrel
Functional Diagram
VDD
8-Bit Sigma-Delta ADC
T1
3:1
T2 MUX
Bandgap Digital Filter

Sensor 1-Bit and
and DAC Control
Reference Logic
Result
Registers
Temperature
A0 Setpoint State
2-Wire Registers Machine
Serial Bus and
Interface Digital
Temperature Comparator
Hysteresis
DATA Registers
Pointer
CLK Register
Configuration
Register
Open-Drain
Output /INT
MIC384
GND
Functional Description Power On" for more information. A0 determines the slave
address as shown in Table 1:
Pin Descriptions
I n p u ts MI C 3 8 4 S l a v e A d d r e s s
VDD: Power supply input. See electrical specifica- P a r t N u m be r
tions. A0 B ina r y Hex
GND: Ground return for all MIC384 functions. MI C 3 8 4 -0 0 100 1000b 48h
CLK: Clock input to the MIC384 from the two-wire serial 1 1 0 0 1 0 01 b 49h
bus. The clock signal is provided by the host, and is MI C 3 8 4 -1 0 100 1010b 4Ah
shared by all devices on the bus. 1 1 0 0 1 0 11 b 4B h
DATA: Serial data I/O pin that connects to the two-wire MI C 3 8 4 -2 0 100 1100b 4C h
serial bus. DATA is bi-directional and has an open-drain 1 1 0 0 1 1 01 b 4D h
output driver. An external pull-up resistor or current
source somewhere in the system is necessary on this MI C 3 8 4 -3 0 100 1110b 4E h
line. This line is shared by all devices on the bus. 1 1 0 0 1 1 11 b 4F h
A0: This inputs sets the least significant bit of the MIC384’s
7-bit slave address. The six most-significant bits are fixed and Table 1. MIC384 Slave Address Settings
are determined by the part number ordered. (See ordering /INT: Temperature events are indicated to external circuitry
information table above.) Each MIC384 will only respond to via this output. Operation of the /INT output is controlled by
its own unique slave address, allowing up to eight MIC384’s to the MODE and IM bits in the MIC384’s configuration register.
share a single bus. A match between the MIC384’s address See "Comparator and Interrupt Modes" below. This output
and the address specified in the serial bit stream must be is open-drain and may be wire-OR’ed with other open-drain
made to initiate communication. A0 should be tied directly signals. Most systems will require a pull-up resistor or current
to VDD or ground. See "Temperature Measurement and source on this pin. If the IM bit in the configuration register

MIC384 Micrel
is set, it prevents the /INT output from sinking current. In reported for the external zone will remain +127°C until the
I2C and SMBus systems, the IM bit is therefore an interrupt fault condition is cleared. This fault detection mechanism
mask bit. requires that the MIC384 complete the number of conversion
T1 and T2: The T1 and T2 pins connect to off-chip PN diode cycles specified by Fault_Queue (see below). The part will
junctions, for monitoring the temperature at remote locations. therefore require one or more conversion cycles following
The remote diodes may be embedded thermal sensing power-on or a transition from shutdown to normal operation
junctions in integrated circuits so equipped (such as Intel's before reporting an external diode fault.
Pentium III), or discrete 2N3906-type bipolar transistors with Serial Port Operation
base and collector tied together. The MIC384 uses standard SMBus Write_Byte and Read_Byte
Temperature Measurement operations for communication with its host. The SMBus
The temperature-to-digital converter is built around a switched Write_Byte operation involves sending the device’s slave
current source and an eight-bit analog-to-digital converter. The address (with the R/W bit low to signal a write operation),
temperature is calculated by measuring the forward voltage of followed by a command byte and a data byte. The SMBus
a diode junction at two different bias current levels. An internal Read_Byte operation is similar, but is a composite write and
multiplexer directs the current source’s output to either the read operation: the host first sends the device’s slave address
internal or one of the external diode junctions. The MIC384 followed by the command byte, as in a write operation. A
uses two’s-complement data to represent temperatures. If the new start bit must then be sent to the MIC384, followed by
MSB of a temperature value is zero, the temperature is zero a repeat of the slave address with the R/W bit (LSB) set to
or positive. If the MSB is one, the temperature is negative. the high (read) state. The data to be read from the part may
More detail on this is given in the "Temperature Data Format" then be clocked out.
section below. A “temperature event” results if the value in any The command byte is eight bits wide. This byte carries the
of the temperature result registers (TEMPx) becomes greater address of the MIC384 register to be operated upon, and is
than the value in the corresponding temperature setpoint stored in the part’s pointer register. The pointer register is
register (T_SETx). Another temperature event occurs if and an internal write-only register. The command byte (pointer
when the measured temperature subsequently falls below register) values corresponding to the various MIC384 registers
the temperature hysteresis setting in T_HYSTx. are shown in Table 2. Command byte values other than those
During normal operation the MIC384 continuously performs explicitly shown are reserved, and should not be used. Any
temperature-to-digital conversions, compares the results command byte sent to the MIC384 will persist in the pointer
against the setpoint and hysteresis registers, and updates register indefinitely until it is overwritten by another command
the state of /INT and the status bits accordingly. The remote byte. If the location latched in the pointer register from the
zones are converted first, followed by the local zone (T1⇒ last operation is known to be correct (i.e., points to the desired
T2⇒LOCAL). The states of /INT and the status bits are register), then the Receive_Byte procedure may be used. To
updated after each measurement is taken. perform a Receive_Byte, the host sends an address byte to
select the MIC384, and then retrieves the data byte. Figures
Diode Faults
1 through 3 show the formats for these procedures.
The MIC384 is designed to respond in a failsafe manner
to hardware faults in the external sensing circuitry. If the
connection to an external diode is lost or the sense line (T1
or T2) is shorted to VDD or ground, the temperature data
reported by the A/D converter will be forced to its full-scale
value (+127°C). This will cause a temperature event to occur
if the setpoint register for the corresponding zone is set to
any value less than 127°C (7Fh = 0111 1111b). An interrupt
will be generated on /INT if so enabled. The temperature
C o m m a n d _ B y te T a r g e t R e g i s te r
B ina r y Hex L a be l D e s c r i p ti o n
0000 0000b 00h T E MP 0 loc a l te mpe ra ture
0000 0001b 01h C O N F IG c onfigura tion re gis te r
0000 0010b 02h T _HY S T 0 loc a l te mpe ra ture hys te re s is
0000 0011b 03h T _S E T 0 loc a l te mpe ra ture s e tpoint
0001 0000b 10h T E MP 1 re mote z one 1 te mpe ra ture
0001 0010b 12h T _ H Y S T 1 re mote z one 1 te mpe ra ture hys te re s is
0001 0011b 13h T _S E T 1 re mote z one 1 te mpe ra ture s e tpoint
0010 0000b 20h T E MP 2 re mote z one 2 te mpe ra ture
0010 0010b 22h T _HY S T 2 re mote z one 2 te mpe ra ture hys te re s is
0010 0011b 23h T _S E T 2 re mote z one 2 te mpe ra ture s e tpoint
Table 2. MIC384 Register Addresses

MIC384
MIC384
MIC384 Slave Address Command Byte Data Byte to MIC384
DATA S 1 0 0 1 X X A0 0 A 0 0 X X X X X X A X X X X X X X X /A P
START R/W = WRITE ACKNOWLEDGE ACKNOWLEDGE NOT ACKNOWLEDGE STOP
CLK
Master-to-slave transmission Slave-to-master response
Figure 1. WRITE_BYTE Protocol
MIC384 Slave Address Command Byte MIC384 Slave Address Data Read From MIC384
DATA S 1 0 0 1 X X A0 0 A 0 0 X X X X X X A S 1 0 0 1 X X A0 1 A X X X X X X X X /A P
START R/W = WRITE ACKNOWLEDGE ACKNOWLEDGE START R/W = READ ACKNOWLEDGE NOT ACKNOWLEDGE STOP
8
CLK
Figure 2. READ_BYTE Protocol
MIC384 Slave Address Data Byte from MIC384
DATA S 1 0 0 1 X X A0 1 A X X X X X X X X /A P
START R/W = READ ACKNOWLEDGE NOT ACKNOWLEDGE STOP
CLK
Figure 3. RECEIVE_BYTE
September 2005
Micrel
MIC384
September 2005
MIC384 Slave Address First Byte of Transaction Last Byte of Transaction
S 1 0 0 1 X X X X A X X X X X X X X A … X X X X X X X X /A P
START R/W = DONT CARE ACKNOWLEDGE ACKNOWLEDGE NOT ACKNOWLEDGE
STOP
Conversion� A/D Converter� New Conversion�
in Progress in Standby in Progress
tCONV1
Conversion Interrupted New Conversion First
By MIC384 Acknowledge Begins Result�
Ready
Figure 4. A/D Converter Timing
9
MIC384 Slave Address Command Byte = 01h = CONFIG MIC384 Slave Address CONFIG Value*
S 1 0 0 0 X X A0 0 A 0 0 0 0 0 0 0 1 A S 1 0 0 0 X X A0 1 A X X X X X X X X /A P
START R/W = WRITE ACKNOWLEDGE ACKNOWLEDGE START R/W = READ NOT ACKNOWLEDGE STOP
ACKNOWLEDGE
t/INT tn/INT
INT
Temperature event occurs

* Status bits in CONFIG are cleared to zero following this operation
Figure 5. Responding to Interrupts
MIC384
Micrel
MIC384 Micrel
Temperature Data Format Comparator and Interrupt Modes
The LSB of each register represents one degree Centigrade. Depending on the setting of the MODE bit in the configura-
The values are in a two’s complement format, wherein the tion register, the /INT output will behave either as an interrupt
most significant bit (D7) represents the sign: zero for posi- request signal or a thermostatic control signal. Thermostatic
tive temperatures and one for negative temperatures. Table operation is known as comparator mode. The /INT output is
3 shows examples of the data format used by the MIC384 asserted when the measured temperature, as reported in any
for temperatures. of the TEMPx registers, exceeds the threshold programmed
A/D Converter Timing into the corresponding T_SETx register for the number of
conversions specified by Fault_Queue (described below).
Whenever the MIC384 is not in its low power shutdown mode,
In comparator mode, /INT will remain asserted and the
the internal A/D converter (ADC) attempts to make continuous
status bit(s) will remain high unless and until the measured
conversions unless interrupted by a bus transaction access-
temperature falls below the value in the T_HYSTx register
ing the MIC384.
for Fault_Queue conversions. No action on the part of the
Upon powering up or coming out of shutdown mode, the ADC host is required for operation in comparator mode. Note that
will begin acquiring temperature data starting with the first entering shutdown mode will not affect the state of /INT when
external zone, zone 1, then the second external zone, zone the device is in comparator mode.
2, and finally the internal zone, zone 0. Results for zone 1 will
In interrupt mode, once a temperature event has caused a
be valid after tCONV1, results for zone two will be ready after
status bit to be set and the /INT output to be asserted, they
another tCONV1, and for the local zone tCONV0 later. Figure
will not be automatically de-asserted when the measured
4 shows this behavior. The conversion time is twice as long
temperature falls below T_HYSTx. They can only be de-as-
for external conversions as it is for internal conversions. This
serted by reading any of the MIC384’s internal registers or
allws the use of a filter capacitor on T1 and/or T2 without a
by putting the device into shutdown mode. If the most recent
loss of accuracy due to the resulting longer settling times.
temperature event was an overtemperature condition, Sx will
Upon powering up, coming out of shutdown mode, or resum- not be set again, and /INT cannot be reasserted, until the
ing operation following a serial bus transaction, the ADC will device has detected that TEMPx < T_HYSTx. Similarly, if
begin aquiring temperature data with the first external zone the most recent temperature event was an undertemperature
(zone 1), followed by the second external zone (zone 2), and condition, Sx will not be set again, and /INT cannot be reas-
then the internal zone (zone 0). If the ADC in interrupted by a serted, until the device has detected that TEMPx > T_SETx.
serial bus transaction, it will restart the conversion that was This keeps the internal logic of the MIC384 backward compat-
interrupted and then continue in the normal sequence. This ible with that of the LM75 and similar devices. In both modes,
sequence will repeat indefinitely until the MIC384 is shut the MIC384 will be responsive to over-temperature events at
down, powered off, or is interrupted by a serial bus transac- power-up. See "Interrupt Generation", below.
tion as described above.
Shutdown Mode
Power On
Setting the SHDN bit in the configuration register halts the
When power is initially applied, the MIC384’s internal registers otherwise continuous conversions by the A/D converter. The
are set to their default states. Also at this time, the level on MIC384’s power consumption drops to 1µA typical in shutdown
the address input, A0, is read to establish the device’s slave mode. All registers may be read from or written to while in
address. The MIC384’s power-up default state can be sum- shutdown mode. Serial bus activity will slightly increase the
marized as follows: part’s power consumption.
• Normal mode operation (i.e., part is not in shut- Entering shutdown mode will not affect the state of /INT
down) when the device is in comparator mode (MODE = 0). It will
• /INT function is set to comparator mode retain its state until after the device exits shutdown mode and
• Fault queue depth = 1 (FQ=00) resumes A/D conversions.
• Interrupts are enabled (IM = 0) However, if the device is shut down while in interrupt mode,
the /INT pin will be unconditionally de-asserted and the internal
• T_SET0 = 81°C; T_HYST0 = 76°C
latches holding the interrupt status will be cleared. There-
• T_SET1 = 97°C; T_HYST1 = 92°C fore, no interrupts will be generated while the MIC384 is in
• T_SET2 = 97°C; T_HYST2 = 92°C
• Initialized to recognize overtemperature faults

MIC384 Micrel
T e m p e r a tu r e B ina ry Hex
+1 2 5 ° C 0 1 1 1 1 1 01 b 7Dh
+1 0 0 ° C 0110 0100 b 64h
+2 5 ° C 0001 1001b 19h
+1 . 0 ° C 0000 000 1b 01h
0° C 0000 0000 b 00h
– 1. 0° C 1111 1111b FFh
– 25° C 1 1 1 0 0 1 11 b E 7h
– 40° C 1 1 0 1 1 0 00 b D 8h
– 55° C 1 1 0 0 1 0 01 b C 9h
Table 3. Digital Temperature Format

MIC384 Micrel
shutdown mode, and the interrupt status will not be retained. S2, in CONFIG and assert its /INT output. These conditions
Since entering shutdown mode stops A/D conversions, the are listed in Table 5. When a temperature event occurs, the
MIC384 is incapable of detecting or reporting temperature corresponding status bit will be set in CONFIG. This action
events of any kind while in shutdown. Diode faults require cannot be masked. However, a temperature event will only
one or more A/D conversion cycles to be recognized, and generate an interrupt signal on /INT if it is specifically enabled
therefore will not be reported either while the device is in by the interrupt mask bit (IM =0 in CONFIG). Following an
shutdown (see "Diode Faults" above). interrupt, the host should read the contents of the configura-
tion register to confirm that the MIC384 was the source of the
interrupt. A read operation on any register will cause /INT to
Fault_Queue
be de-asserted. This is shown in Figure 5. The status bits
Fault queues (programmable digital filters) are provided will only be cleared once CONFIG has been read.
in the MIC384 to prevent false tripping due to thermal or
Since temperature-to-digital conversions continue while /INT
electrical noise. The two bits in CONFIG[4:3] set the depth
is asserted, the measured temperature could change between
of Fault_Queue. Fault_Queue then determines the number
the MIC384’s assertion of /INT and the host’s response. It
of consecutive temperature events (TEMPx > T_SETx,
is good practice for the interrupt service routine to read the
or TEMPx < T_HYSTx) which must occur in order for the
value in TEMPx, to verify that the over-temperature or under-
condition to be considered valid. There are separate fault
temperature condition still exists. In addition, more than one
queues for each zone. As an example, assume the part is
temperature event may have occurred simultaneously or in
in comparator mode, and CONFIG[4:3] is programmed with
rapid succession between the assertion of /INT and servic-
10b. The measured temperature in zone one would have to
ing of the MIC384 by the host. The interrupt service routine
exceed T_SET1 for four consecutive A/D conversions before
should allow for this eventuality. Keep in mind that clearing
/INT would be asserted or the S1 status bit set. Similarly,
the status bits and deasserting /INT is not sufficient to allow
TEMP1 would then have to be less than T_HYST1 for four
further interrupts to occur. TEMPx must become less than
consecutive conversions before /INT would be reset. Like
T_HYSTx if the last event was an over-temperature condition,
any filter, the fault queue function also has the effect of de-
or greater than T_SETx if the last event was an under-tem-
laying the detection of temperature events. In this example,
perature condition, before /INT can be asserted again.
it would take 4 x tCONV to detect a temperature event. The
depth of Fault_Queue vs. D[4:3] of the configuration register Putting the device into shutdown mode will de-assert /INT
is shown in Table 4. and clear the status bits (S0, S1, and S2). This should not
be done before completing the appropriate interrupt service
routine(s).
C O N F IG [4: 3] F a u l t_ Q u e u e D e p th
Polling
00 1 c onve rs ion* The MIC384 may either be polled by the host, or request the
01 2 c onve rs ions host’s attention via the /INT pin. In the case of polled opera-
10 4 c onve rs ions tion, the host periodically reads the contents of CONFIG to
check the state of the status bits. The act of reading CON-
11 6 c onve rs ions FIG clears the status bits. If more than one event that sets
* D e fa ult s e tting a given status bit occurs before the host polls the MIC384,
only the fact that at least one such event has occurred will be
Table 4. Fault_Queue Depth Settings apparent to the host. For polled systems, the interrupt mask
bit should be set (IM = 1). This will disable interrupts from the
Interrupt Generation MIC384 and prevent the /INT pin from sinking current.
Assuming the MIC384 is in interrupt mode and interrupts
are enabled, there are seven different conditions that will
cause the MIC384 to set one of the status bits, S0, S1, or

MIC384 Micrel
E v ent C o n d i ti o n * MI C 3 8 4 r e s p o n s e **
high te mpe ra ture , loc a l T E MP 0 > T _ S E T 0 s e t S 0 in C O N F I G , a s s e rt /I N T
high te mpe ra ture ,
T E MP 1 > T _ S E T 1 s e t S 1 in C O N F I G , a s s e rt /I N T
re mote z one 1
high te mpe ra ture ,
T E MP 2 > T _ S E T 2 s e t S 2 in C O N F I G , a s s e rt /I N T
re mote z one 2
low te mpe ra ture , loc a l T E MP 0 < T _ H Y S T 0 s e t S 0 in C O N F I G , a s s e rt /I N T
low te mpe ra ture ,
T E MP 1 < T _ H Y S T 1 s e t S 1 in C O N F I G , a s s e rt /I N T
re mote z one 1
low te mpe ra ture ,
T E MP 2 < T _ H Y S T 2 s e t S 2 in C O N F I G , a s s e rt /I N T
re mote z one 2
T 1 or T 2 ope n or s horte d to V D D or s e t S 1 a nd/or S 2 in C O N F I G , a s s e rt /I N T
diode fa ult
G ND a nd /C R I T ***
* C ondition mus t be true for F A U L T _ Q U E U E c onve rs ion to be re c ogniz e d
** A s s ume s inte rrupts e na ble d
*** A s s ume s the T _ S E T 1 a nd/or C R I T 1 a re s e t to a ny va lue le s s the n +1 2 7 ° C = 7 fh = 0 1 1 1 1 1 1 1 b
Table 5. MIC384 Temperature Events

MIC384 Micrel
Register Set and Programmer’s Model
Internal Register Set

Na me D e s c r i p ti o n C o m m a n d B y te O p e r a ti o n P o w e r -U p D e f a u l t
me a s ure d te mpe ra ture ,
T E MP 0 00h 8 -bit re a d only 0 0h ( 0° C ) (1)
loc a l z one
C O N F IG c onfigura tion re gis te r 01h 8 -bit re a d/write 0 0 h( 2 )
hys te re s is s e tting, loc a l
T _HY S T 0 02h 8 -bit re a d/write 4 C h ( +7 6 ° C )
z o ne
te mpe ra ture s e tpoint, loc a l
T _S E T 0 03h 8 -bit re a d/write 5 1 h ( +8 1 ° C )
z o ne
z o ne 1
T _HY S T 1 hys te re s is s e tting, z one 1 1 2h 8 -bit re a d/write 5 C h ( +9 2 ° C )
te mpe ra ture s e tpoint,
z o ne 1
z o ne 2
T _HY S T 2 hys te re s is s e tting, z one 2 22h 8 -bit re a d/write 5 C h ( +9 2 ° C )
te mpe ra ture s e tpoint,
z o ne 2
(1) TEMPx will contain measured temperature data after the completion of one conversion cycle.
(2) After the first Fault_Queue conversions are complete, status bits will be set if TEMPx > T_SETx.
Detailed Register Descriptions

Configuration Register
C O N F IG U R A T IO N R E G IS T E R (C O N F IG )
8 -B i t R e a d /W r i te
D [7] D [ 6] D [ 5] D [ 4] D [ 3] D [ 2] D [ 1] D [ 0]
re a d only re a d only re a d only re a d/write re a d/write re a d/write re a d/write
loc a l re mote /C R I T fa ult que ue inte rrupt C MP /I N T
S hutdown
s ta tus s ta tus s ta tus de pth ma s k mode
(S H DN )
(S 0) (S 1) (C R IT 1) ( F Q [1 : 0 ]) ( I M) ( MO D E )
B i ts F u n c ti o n O p e r a ti o n
S0 loc a l inte rrupt s ta tus ( re a d only) 1 = e ve nt oc c ure d, 0 = no e ve nt
S1 re mote inte rrupt s ta tus ( re a d only) 1 = e ve nt oc c ure d, 0 = no e ve nt
C R IT 1 re mote ove r-te mpe ra ture s ta tus ( re a d only) 1 = ove r-te mpe ra ture , 0 = no e ve nt
0 0 = 1 c onve rs ion, 0 1 = 2 c onve rs ions ,
F Q [1 : 0 ] F a ult_ Q ue ue de pth
1 0 = 4 c onve rs ions , 1 1 = 6 c onve rs ions
IM inte rrupt ma s k 1 = dis a ble d, 0 = inte rrupts e na ble d
c ompa ra tor/inte rrupt 1 = inte rrupt mode ,
MO D E
mode s e le c tion for /I N T pin 0 = c ompa ra tor mode
norma l/s hutdown 1 = s hutdown,
S HDN
ope ra ting mode s e le c tion 0 = norma l
CONFIG Power-Up Value: 0000 0000b = 00h(*)

• not in shutdown mode
• comparator mode
• Fault_Queue depth = 1
• interrupts enabled.
• no temperature events pending
CONFIG Command Byte Value: 0000 0001b = 01h
* Following the first Fault_Queue conversions, one or more of the status bits may be set.

MIC384 Micrel
Local Temperature Result Register
L O C A L T E MP E R A T U R E R E S U L T R E G I S T E R ( T E MP 0 )
D [7] D [ 6] D [ 5] D [ 4] D [ 3] D [ 2] D [ 1] D [ 0]
MS B bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 LS B
te mpe ra ture da ta from A D C *
me a s ure d te mpe ra ture da ta for the loc a l
D [7 : 0 ] re a d only
z o ne *
TEMP0 Power-Up Value: 0000 0000b = 00h (0°C)† * Each LSB represents one degree Centigrade. The values are
in a two's complement format such that 0°C is reported as
TEMP0 Command Byte Value: 0000 0000b = 00h
0000 0000b. See "Temperature Data Format" for more details.
† TEMP0 will contain measured temperature data after the
completion of one conversion.
Local Hysteresis Register

L O C A L T E MP E R A T U R E H Y S T E R E S I S ( T _ H Y S T 0 )
D [7] D [ 6] D [ 5] D [ 4] D [ 3] D [ 2] D [ 1] D [ 0]
loc a l te mpe ra ture hys te re s is s e tting
D [7 : 0 ] loc a l te mpe ra ture hys te re s is s e tting* re a d/write
T_HYST0 Power-Up Value: 0100 1100b = 4Ch (+76°C) * Each LSB represents one degree Centigrade. The values are
T_HYST0 Command Byte Value: 0000 0010b = 02h
Local Temperature Setpoint Register

L O C A L T E MP E R A T U R E S E T P O I N T ( T _ S E T 0 )
D [7] D [ 6] D [ 5] D [ 4] D [ 3] D [ 2] D [ 1] D [ 0]
loc a l te mpe ra ture s e tpoint
D [7 : 0 ] loc a l te mpe ra ture s e tpoint* re a d/write
T_SET0 Power-Up Value: 0101 0001b = 51h (+81°C) * Each LSB represents one degree Centigrade. The values are
T_SET0 Command Byte Value: 0000 0011b = 03h

MIC384 Micrel
Remote Zone 1 Temperature Result Register
R E MO T E Z O N E 1 T E MP E R A T U R E R E S U L T ( T E MP 1 )
8 -B i t R e a d O n l y
D [7] D [ 6] D [ 5] D [ 4] D [ 3] D [ 2] D [ 1] D [ 0]
re mote z one 1 te mpe ra ture da ta from A D C *
me a s ure d te mpe ra ture da ta for re mote
z o ne o ne *
† TEMP1 will contain measured temperature data for the se-
lected zone after the completion of one conversion.
Remote Zone 1 Hysteresis Register

R E MO T E Z O N E 1 T E MP E R A T U R E H Y S T E R E S I S R E G I S T E R ( T _ H Y S T 1 )
D [7] D [ 6] D [ 5] D [ 4] D [ 3] D [ 2] D [ 1] D [ 0]
re mote z one 1 te mpe ra ture hys te re s is *
D [7 : 0 ] re mote z one one te mpe ra ture hys te re s is * re a d/write
Remote Zone 1 Temperature Setpoint Register

R E MO T E Z O N E 1 T E MP E R A T U R E S E T P O I N T ( T _ S E T 1 )
D [7] D [ 6] D [ 5] D [ 4] D [ 3] D [ 2] D [ 1] D [ 0]
re mote z one 1 te mpe ra ture s e tpoint
D [7 : 0 ] re mote z one one te mpe ra ture s e tpoint* re a d/write

MIC384 Micrel
Remote Zone 2 Temperature Result Register
R E MO T E Z O N E 2 T E MP E R A T U R E R E S U L T S R E G I S T E R ( T E MP 2 )
8 -B i t R e a d O n l y
D [7] D [ 6] D [ 5] D [ 4] D [ 3] D [ 2] D [ 1] D [ 0]
re mote z one 2 te mpe ra ture da ta from A D C *
me a s ure d te mpe ra ture da ta for re mote
z o ne 2 *
† TEMP2 will contain measured temperature data for the se-
lected zone after the completion of one conversion.
Remote Zone 2 Hysteresis Register

R E MO T E Z O N E 2 H Y S T E R E S I S R E G I S T E R ( T _ H Y S T 2 )
D [7] D [ 6] D [ 5] D [ 4] D [ 3] D [ 2] D [ 1] D [ 0]
re mote z one 2 te mpe ra ture hys te re s is s e tting
re mote z one 2 te mpe ra ture hys te re s is
D [7 : 0 ] re a d/write
s e tting*
Remote Zone 2 Setpoint Register

R E MO T E Z O N E 2 T E MP E R A T U R E S E T P O I N T ( T _ S E T 2 )
D [7] D [ 6] D [ 5] D [ 4] D [ 3] D [ 2] D [ 1] D [ 0]
re mote z one 2 te mpe ra ture s e tpoint
D [7 : 0 ] re mote z one 2 te mpe ra ture s e tpoint* re a d/write

MIC384 Micrel
Applications against calculation in the final application environment. This

is especially true when dealing with systems for which some
Remote Diode Selection
of the thermal data (e.g., PC board thermal conductivity and
Most small-signal PNP transistors with characteristics similar ambient temperature) may be poorly defined or unobtainable
to the JEDEC 2N3906 will perform well as remote temperature except by empirical means.
sensors. Table 6 lists several examples of such parts that
Series resistance
Micrel has tested for use with the MIC384. Other transistors
equivalent to these should also work well. The operation of the MIC384 depends upon sensing the
ΔVCB-E of a diode-connected PNP transistor (“diode”) at two
Minimizing Errors
different current levels. For remote temperature measure-
Self-Heating
ments, this is done using external diodes connected between
One concern when using a part with the temperature accuracy T1, T2 and ground.
and resolution of the MIC384 is to avoid errors in measuring
Since this technique relies upon measuring the relatively
the local temperature induced by self-heating. Self-heating
small voltage difference resulting from two levels of current
is caused by the power naturally dissipated inside the device
through the external diodes, any resistance in series with
due to operating supply current and I/O sink currents (VDD ×
those diodes will cause an error in the temperature read-
IDD ) + (VOL × IOL). In order to understand what level of error
ing from the MIC384. A good rule of thumb is this: for each
this represents, and how to reduce that error, the dissipation
ohm in series with a zone's external transistor, there will be
in the MIC384 must be calculated and its effects reduced to
a 0.9°C error in the MIC384’s temperature measurement. It
a temperature offset.
isn’t difficult to keep the series resistance well below an ohm
The worst-case operating condition for the MIC384 is when (typically < 0.1Ω), so this will rarely be an issue.
VDD = 5.5V, MSOP-08 package. The maximum power dis-
Filter capacitor selection
sipated in the part is given in Equation 1 below.
It is sometimes desirable to use a filter capacitor between
In most applications, the /INT output will be low for at most
the T1 and/or T2 pins and the GND pin of the MIC384. The
a few milliseconds before the host resets it back to the high
use of these capacitors is recommended in environments
state, making its duty cycle low enough that its contribution to
with a lot of high frequency noise (such as digital switching
self-heating of the MIC384 is negligible. Similarly, the DATA
noise), or if long wires are used to attach to the remote di-
pin will in all likelihood have a duty cycle of substantially less
odes. The maximum recommended total capacitance from
than 25% in the low state. These considerations, combined
the T1 or T2 pin to GND is 2700pF. This typically suggests
with more typical device and application parameters, give a
the use of 2200pF NP0 or C0G ceramic capacitors with a
better system-level view of device self-heating in interrupt-
10% tolerance.
mode. This is illustrated in Equation 2.
If a remote diode is to be at a distance of more than ≈ 6"—12"
If the part is to be used in comparator mode, calculations
from the MIC384, using twisted pair wiring or shielded micro-
similar to those shown above (accounting for the expected
phone cable for the connections to the diode can significantly
value and duty cycle of IOL(INT)) will give a good estimate of
help reduce noise pickup. If using a long run of shielded
the temperature error due to self-heating.
cable, remember to subtract the cable’s conductor-to-shield
In any application, the best test is to verify performance capacitance from the 2700pF maximum total capacitance.
PD = [(IDD x VDD) + (IOL(DATA)) x VOL(DATA) + (IOL(/INT) x VOL(/INT))]

PD = [(0.75mA x 5.5V) + (6mA x 0.8V) + (6mA x 0.8V)]
PD = 13.73mW
Rq(j-a) of MSOP - 08 package is 206°C/W
Maximum ∆TJ relative to TA due to self heating is 13.73mW x 206°C/W = 2.83°C
Equation 1. Worst-Case Self-Heating
[(0.35mA IDD(typ) x 3.3V) + (25% x 1.5mA IOL(DATA)) x 0.3V) + (1% x 1.5mA IOL(/INT) x 0.3V)] = 1.27mW
∆TJ = (1.27mW x 206°C/W)
∆TJ = 0.262°C
Equation 2. Real-World Self-heating Example
Vendor Part Number Package

Fairchild MMBT3906 SOT-23
On Semiconductor MMBT3906L SOT-23
Phillips Semiconductor PMBT3906 SOT-23
Samsung KST3906-TF SOT-23
Table 6. Transistors Suitable for Remote Temperature Sensing Use

MIC384 Micrel
Layout Considerations 4. Due to the small currents involved in the mea-
The following guidelines should be kept in mind when design- surement of the remote diode’s ΔVBE, it is
ing and laying out circuits using the MIC384: important to adequately clean the PC board after
soldering to prevent current leakage. This is
1. Place the MIC384 as close to the remote diodes
most likely to show up as an issue in situations
as possible, while taking care to avoid severe
where water-soluble soldering fluxes are used.
noise sources such as high frequency power
transformers, CRTs, memory and data busses, 5. In general, wider traces for the ground and
and the like. T1/T2 lines will help reduce susceptibility to
radiated noise (wider traces are less inductive).
2. Since any conductance from the various volt-
Use trace widths and spacing of 10 mils wher-
ages on the PC Board to the T1 or T2 line can
ever possible and provide a ground plane under
induce serious errors, it is good practice to guard
the MIC384 and under the connections from
the remote diodes’ emitter traces with pairs of
the MIC384 to the remote diodes. This will help
ground traces. These ground traces should be
guard against stray noise pickup.
returned to the MIC384’s own ground pin. They
should not be grounded at any other part of their 6. Always place a good quality 0.1µF power supply
run. However, it is highly desirable to use these bypass capacitor directly adjacent to, or under-
guard traces to carry the diodes’ own ground neath, the MIC384. Surface-mount capacitors
return back to the ground pin of the MIC384, are preferable because of their low inductance.
thereby providing a Kelvin connection for the 7. When the MIC384 is being powered from par-
base of the diodes. See Figure 6. ticularly noisy power supplies, or from supplies
3. When using the MIC384 to sense the tempera- which may have sudden high-amplitude spikes
ture of a processor or other device which has an appearing on them, it can be helpful to add ad-
integral thermal diode, e.g., Intel’s Pentium III, ditional power supply filtering. This should be
connect the emitter and base of the remote sen- implemented as a 100Ω resistor in series with
sor to the MIC384 using the guard traces and the part’s VDD pin, and an additional 4.7µF,
Kelvin return shown in Figure 6. The collector 6.3V electrolytic capacitor from VDD to GND.
of the remote diode is typically inaccessible to See Figure 7.
the user on these devices. To allow for this, the
MIC384 has superb rejection of noise appearing
from collector to GND, as long as the base to
ground connection is relatively quiet.
MIC384
1 DATA VDD 8
2 CLK A0 7 GUARD/RETURN
REMOTE DIODE (T1)

3 /INT T1 6
GUARD/RETURN
4 GND T2 5
GUARD/RETURN
REMOTE DIODE (T2)
GUARD/RETURN
Figure 6. Guard Traces/Kelvin Ground Returns

MIC384 Micrel
100
3.3V
0.1µF 4.7µF
10k pull-ups
MIC384
DATA VDD
FROM
SERIAL BUS CLK T1
HOST
/ INT T2 Remote
GND A0 Diode
2200pF
Remote
Diode
2200pF
Figure 7. VDD Decoupling for Very Noisy Supplies

MIC384 Micrel
Package Information
8-Lead SOIC (M)
8-Lead MSOP (MM)

MIC384 Micrel
MICREL INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA

TEL + 1 (408) 944-0800 FAX + 1 (408) 474-1000 WEB http://www.micrel.com
This information furnished by

Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not
reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into
the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser's
use or sale of Micrel Pr
Micrel for any damages resulting from such use or sale.
© 2005 Micrel Incorporated

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MIC384 Micrel

General Description Features

3-Channel SMBus Temperature Measurement System

September 2005 1 MIC384

MIC384 2 September 2005

Absolute Maximum Ratings (Note 1) Operating Ratings (Note 2)

September 2005 3 MIC384

MIC384 4 September 2005

Serial Interface Timing

September 2005 5 MIC384

8-Bit Sigma-Delta ADC

Bandgap Digital Filter

MIC384 6 September 2005

Table 2. MIC384 Register Addresses

MIC384 Slave Address Command Byte Data Byte to MIC384

Master-to-slave transmission Slave-to-master response

Figure 1. WRITE_BYTE Protocol

Master-to-slave transmission Slave-to-master response

Figure 2. READ_BYTE Protocol

MIC384 Slave Address Data Byte from MIC384

Master-to-slave transmission Slave-to-master response

Figure 4. A/D Converter Timing

Temperature event occurs

Master-to-slave transmission Slave-to-master response

Figure 5. Responding to Interrupts

MIC384 10 September 2005

Table 3. Digital Temperature Format

September 2005 11 MIC384

MIC384 12 September 2005

Table 5. MIC384 Temperature Events

September 2005 13 MIC384

Register Set and Programmer’s Model

Internal Register Set

Detailed Register Descriptions

CONFIG Power-Up Value: 0000 0000b = 00h(*)

MIC384 14 September 2005

Local Hysteresis Register

Local Temperature Setpoint Register

September 2005 15 MIC384

Remote Zone 1 Hysteresis Register

Remote Zone 1 Temperature Setpoint Register

MIC384 16 September 2005

Remote Zone 2 Hysteresis Register

Remote Zone 2 Setpoint Register

September 2005 17 MIC384

Applications against calculation in the ﬁnal application environment. This

PD = [(IDD x VDD) + (IOL(DATA)) x VOL(DATA) + (IOL(/INT) x VOL(/INT))]

Equation 1. Worst-Case Self-Heating

Vendor Part Number Package

MIC384 18 September 2005

REMOTE DIODE (T1)

REMOTE DIODE (T2)

Figure 6. Guard Traces/Kelvin Ground Returns

September 2005 19 MIC384

Figure 7. VDD Decoupling for Very Noisy Supplies

MIC384 20 September 2005

8-Lead SOIC (M)

8-Lead MSOP (MM)

September 2005 21 MIC384