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    Databook - Q2'2016 - Graphics (Rev0.0)

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    Speed Daemon
    This document is a Q2 2016 databook that provides specifications for graphics memory chips, including HBM, GDDR5 SDRAM, and DDR3 SDRAM. It lists the density, organization, speed, part number, package, features, and availability for each chip type. The document notes that databooks are typically updated by the 5th of the month for the starting quarter.

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    Databook - Q2'2016 - Graphics (Rev0.0)

    Uploaded by

    Speed Daemon
    67 views3 pages
    This document is a Q2 2016 databook that provides specifications for graphics memory chips, including HBM, GDDR5 SDRAM, and DDR3 SDRAM. It lists the density, organization, speed, part number, package, features, and availability for each chip type. The document notes that databooks are typically updated by the 5th of the month for the starting quarter.

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    Databook_Q2’2016_Graphics (rev0.0)

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    This document is a Q2 2016 databook that provides specifications for graphics memory chips, including HBM, GDDR5 SDRAM, and DDR3 SDRAM. It lists the density, organization, speed, part number, package, features, and availability for each chip type. The document notes that databooks are typically updated by the 5th of the month for the starting quarter.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    67 views3 pages

    Databook - Q2'2016 - Graphics (Rev0.0)

    Uploaded by

    Speed Daemon
    This document is a Q2 2016 databook that provides specifications for graphics memory chips, including HBM, GDDR5 SDRAM, and DDR3 SDRAM. It lists the density, organization, speed, part number, package, features, and availability for each chip type. The document notes that databooks are typically updated by the 5th of the month for the starting quarter.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    of 3

    *Note: Databooks are updated by the 5th of the month of the starting quarter.

    Q2’2016 DATABOOK
    Rev 0.0
    Graphics Memory
    HBM (High Bandwidth Memory)

    DENSITY ORG. SPEED PART NUMBER PKG. FEATURE AVAIL.

    1GB 128GB/s 1.0Gbps H5VR8GESM4R-20C 5mKGSD 4Hi stack, VDD/VDDQ=1.2V Now

    * 5mKGSD (5molded Known Good Stacked Die)

    GDDR5 SDRAM

    DENSITY ORG. SPEED PART NUMBER PKG. FEATURE AVAIL.

    8Gb 256Mx32 8.0Gbps H5GQ8H24MJR-R4C FBGA(170ball) 16Bank, 1.55V / 1.55V Now

    7.0Gbps 16Bank, 1.5V / 1.5V Now


    H5GC8H24MJR-R0C FBGA(170ball)
    6.0Gbps 16Bank, 1.35V / 1.35V Now

    6.0Gbps 16Bank, 1.5V / 1.5V Now


    H5GC8H24MJR-T2C FBGA(170ball)
    5.0Gbps 16Bank, 1.35V / 1.35V Now

    4Gb 128Mx32 8.0Gbps H5GQ4H24AJR-R4C FBGA(170ball) 16Bank, 1.55V / 1.55V Now

    7.0Gbps 16Bank, 1.5V / 1.5V Now


    H5GC4H24AJR-R0C FBGA(170ball)
    6.0Gbps 16Bank, 1.35V / 1.35V Now

    6.0Gbps 16Bank, 1.5V / 1.5V Now


    H5GC4H24AJR-T2C FBGA(170ball)
    5.0Gbps 16Bank, 1.35V / 1.35V Now

    DDR3 SDRAM

    DENSITY ORG. SPEED PART NUMBER PKG. FEATURE AVAIL.

    4Gb 256Mx16 1.1GHz (0.9ns) FBGA(96ball) 8Bank, 1.5V / 1.5V Now


    H5TC4G63CFR-N0C
    1.0GHz (1.0ns) FBGA(96ball) 8Bank, 1.35V / 1.35V Now

    1.1GHz (0.9ns) FBGA(96ball) 8Bank, 1.5V / 1.5V CS:Q2'16


    H5TC4G63EFR-N0C
    1.0GHz (1.0ns) FBGA(96ball) 8Bank, 1.35V / 1.35V CS:Q2'16

    2Gb 128Mx16 1.0GHz (1.0ns) FBGA(96ball) 8Bank, 1.5V / 1.5V Now


    H5TC2G63GFR-11C
    0.9GHz (1.1ns) FBGA(96ball) 8Bank, 1.35V / 1.35V Now

    Page 2

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